Category Archives: New Products

COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL simulation platform. The latest version of COMSOL Multiphysics, version 4.3b, introduces five new application-specific modules and expanded modeling and analysis tools.

With the introduction of the five new modules, users now have access to the new modeling and simulation tools offered by COMSOL.

  • Multibody Dynamics Module – Provides users with the ability to analyze the assembly of rigid and flexible bodies. Transitional and rotational displacements, as well as locking, can be simulated for a variety of joint types, including prismatic, hinge, cylindrical, screw, planar, ball, slot, and reduced slot joints.
  • Wave Optics Module – Allows users to analyze electromagnetic wave propagation in optically large structures, such as optical fibers and sensors, bidirectional couplers, plasmonic devices, metamaterials, laser beam propagation, and non-linear optical components.
  • Molecular Flow Module – Offers the capability to simulate rarefied gas flow in complex CAD geometries of vacuum systems. This includes such applications as mass spectrometers, semiconductor processing, satellite technology, particle accelerators, shale gas exploration, and flow in nanoporous materials.
  • Semiconductor Module – Enables the detailed analysis of semiconductor device operations at the fundamental physics level allowing for the modeling of PN junctions, bipolar transistors, MOSFETs, MESFETs, thyristors, and Schottky diodes.
  • Electrochemistry Module – Tailored user interfaces are now available for electroanalysis, electrolysis, and electrodialysis. Typical applications include: glucose sensors, gas sensors, chlor-alkali electrolysis, desalination of seawater, waste water treatment, and control of electrochemical reactions in biomedical implants.
multiphysics simulation on helicopter rotor blades
This model of the swashplate mechanism used to control helicopter rotor blades was developed using the Multibody Dynamics Module. Transient simulations with both rigid and flexible blade designs provide insight into useful performance metrics, such as blade deformation and lift force. Results show von Mises stress and deformation of the rotor blades.

The new features delivered with the COMSOL product suite include enhancements to CAD importing and geometry handling, meshing, physics, solvers, results, and productivity tools that offer increased usability and performance throughout the product development process. COMSOL Multiphysics 4.3b brings enhancements to features in existing modules, thus augmenting simulation speed and the capabilities of the entire product suite.

“It is the mission of COMSOL to provide engineers and scientists with the right tools needed to design reliable and safe products,” says Ed Fontes, chief technology officer at COMSOL.

Other new features to COMSOL Multiphysics simulation software include:

  • Geometry and Mesh – A new feature allows users to make quick what-if studies by taking a 2D geometry from the cross-section of a 3D geometry. A new curvilinear coordinate system tool makes it easier to define anisotropic materials in curved geometric shapes. Additionally, increased automated swept meshing capabilities allow for faster modeling.
  • Interfacing and Productivity – The new One Window Interface with LiveLink for Inventor allows users to work with COMSOL Multiphysics from within the Inventor environment. New updates in LiveLink for Excel allow the import of multiple models and export of material data from Excel to COMSOL.
  • Electrical – A new magnetics solver facilitates faster stationary and time-dependent magnetics simulations. A new electrical contact feature is added to the AC/DC Module; the electric current flowing between two surfaces now varies according to surface properties and contact pressure. The periodic structures for electromagnetic waves feature is now available in the RF Module.
  • Mechanical – Bolt pre-tension and beam cross-section analysis can now be simulated in the Structural Mechanics Module. Cumulative damage for fatigue analysis with random amplitude loads is now available in the Fatigue Module. The Heat Transfer Module has been enhanced with multi-wavelength surface-to-surface heat radiation, heat transfer with phase change, and thermal contact features.
  • Fluid – The new frozen rotor feature in the CFD Module efficiently solves for the pseudo-steady flow field in rotating machinery for laminar and turbulent flow. A new thin screen feature for thin permeable barriers allows the simulation of wire gauzes, grills, and perforated plates. Additionally, the SST turbulence model and a new CFD solver are now available.
  • Chemical – The new thin impermeable barrier for mass transport feature allows users to represent thin walls as interior boundaries with a no-mass-flux condition on both sides.
silicon chip in multiphysics simulation
This model of a silicon chip soldered onto a circuit board was meshed using the enhanced swept meshing feature available in COMSOL Multiphysics. Element quality is shown where red represents a completely symmetric element.

In keeping with the modeling simplicity and effectiveness that users have come to expect from COMSOL, the new modules and features implemented in the simulation platform follow the same intuitive modeling process. Since the modeling environment remains the same, both the new and existing modules can be combined and coupled to create simulations specifically designed by the user to address their unique simulation needs.

COMSOL Multiphysics 4.3b is now available worldwide for download. On-subscription license holders of the RF Module, Structural Mechanics Module, or Microfluidics Module will receive the Wave Optics Module, Multibody Dynamics Module, or Molecular Flow Module, respectively, and for free.

Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications. The new laser delivers high finesse with exceptional beam quality (M2< 1.2), high stability (<1% rms over 100 hours), and short pulse widths (13 ps). The laser is also highly flexible with user-adjustable repetition rates from single shot to 1 MHz and an integrated pulse picker for fast pulse selection and power control. With >10 W average power, the laser is ideal for precision picosecond micromachining applications such as semiconductor and LED manufacturing, flat panel display processing, thin film ablation, and nano structuring.

“The Spirit ps laser’s precise beam shape, pulse duration, and energy translate into high-precision application results,” says Herman Chui, senior director of product marketing for Spectra-Physics. “Combined with its flexibility in repetition rate and pulse energy, this rugged industrial laser is ideal for a wide range of critical picosecond micromachining applications.”

Spectra-Physics’ Spirit ps 1040-10 laser is based on the field-proven Spirit industrial ultrafast laser platform. With high quantities of deployed systems in demanding 24/7 applications, this rugged product platform has consistently demonstrated high reliability.

The new Spirit ps 1040-10 laser will be featured at LASER World of Photonics in Munich, Germany, May 13-16, 2013.

Newport Corporation is a global supplier of advanced-technology products and systems to customers in the scientific research, microelectronics manufacturing, aerospace and defense/security, life and health sciences and precision industrial manufacturing markets. 

Spirit picosecond industrial laser

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM. The patent pending ecoAmp is a solution for high-power applications of 1000+ amperes.

The ecoAmp specifically responds to the challenging requirements of high voltage/high current test. All typical packages and modules for power applications are covered by the ecoAmp, including MOSFETs, drivers, IGBTs, power modules, and power packages such as TO, SO and DIP.

In order to achieve equal current symmetry over I/Os within the contactor, the contacting resistance is held low and stable. Resistance stability is influenced by the contact spring itself AND the condition of the device pin. The ecoAmp is designed for an electrical performance of 500+ amperes with an inductance of 1.0 nH and below for 0.5 mm pitch.

The high power contactor allows for testing at the full temperature range from -60°up to 175°C, which is a standard requirement for automotive applications. The ecoAmp is able to stand the high thermal stress and support temperature stability during test. Thermal energy dissipation requires thermal management within the contactor.

“We received very positive feedback from this customer about the results of the evaluation in the HVM environment,” said Gerhard Gschwendtberger, business unit manager. “The ecoAmp leverages our long-term experience in the automotive market for the new requirements of high power applications for automotive as well as energy efficiency, energy harvesting and green energy applications.”

Multitest ecoAmp

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG120 automated resist processing system.  Incorporating new features and improved productivity in an ultra-small footprint design, the EVG120 system supports coating and developing applications for a variety of markets, including microelectromechanical systems (MEMS), advanced packaging and compound semiconductors.  The flexible tool can be configured with combined spin and spray coating modules—a unique feature that maximizes productivity and optimizes cost of ownership (CoO).

EVG wafer bonding

Dr. Thomas Glinsner, head of product management for EV Group, noted, "Our new EVG120 system reflects EVG’s 15 years of experience in resist coating and developing, and our unique process skills.  In independent surveys, our customers consistently attribute the highest scores to EVG’s lithography equipment, and we’ve listened to their feedback to create a more optimized system.  Based on a proven platform, the next-generation EVG120 coater/developer offers increased functionality and reliability in a highly customizable and economical package."

The EVG120 automated resist processing system features a new robot with dual arms for fast wafer swapping and additional processing chambers, which result in enhanced throughput and overall productivity.  To further optimize throughput and overall productivity, the new EVG120 runs the same EVG CIM Framework software as EVG’s high-end XT Frame systems and offers full software integration with SECS/GEM standards.  Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes.  Like its predecessor, the EVG120 system can accommodate wafers up to 200 mm in diameter. 

Other new features of the EVG120 system include EVG’s innovative CoverSpin rotating bowl cover that allows improved coating uniformity across the substrate regardless of substrate shape.  A new, temperature-controlled chuck further enhances EVG’s proprietary OmniSpray coating technology, which specifically allows conformal coating of high-topography surfaces via its proprietary ultrasonic nozzle.  OmniSpray coating is ideally suited for ultra-thin, fragile or perforated wafers and can result in an 80-percent or greater reduction in material consumption compared to traditional spin coating.

Further improved serviceability and low CoO make the EVG120 system a versatile, high-quality production tool for an entry-level budget.  The EVG120 system is ideally suited for a wide variety of markets and applications, including: high-topography coating and spray coating for MEMS; thick-film resists and bumping for advanced packaging; and passivation, dielectrics and thick-film processing for compound semiconductor devices.

EV Group (EVG) is a supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors and power devices, and nanotechnology devices.  Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.  Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. 

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device. These manual measurements of trenches, pillars, lines and spaces can also be inaccurate and there is frequently inconsistency between how engineers do the manual measurements. The collection of data is often very time-consuming as well.

With the new PCI-AM (Automated Measurement) module engineers simply click inside the feature and the measurement is done automatically with increased accuracy and consistency among all engineers. The measurement results are displayed on the image and in a spreadsheet grid. The data in the grid can be easily exported into a CSV file suitable for importation into other software such as Microsoft Excel. The images and data can also be easily included in standard Quartz PCI reports with just a few clicks.

Quartz Imaging has worked closely with semiconductor companies since it was founded in 1993, including the development of the Failure Analysis LIMS system (FA-LIMS) and is in the process of developing a LIMS system for semiconductor Reliability Labs (REL-LIMS). Quartz Imaging has more than 2,000 customers in 38 countries utilizing our industry leading solutions for Digital Image Acquisition and Processing (for most image producing instruments including SEMs, TEMs, STEMs, Tabletop SEMs, Cameras, PC Based Instruments, Scanners); 21 CFR Part 11 Compliance; Laboratory Information Management Systems (LIMS); Instrument Access Control; Instrument Remote Control; Automated Inspection Systems for Nanotechnology; X-ray Microanalysis (EDX/EDS) Systems and more.

 

Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters.  The Purion XE is an evolution of the industry leading Optima XEx, combining the process and productivity advantages of the Optima XEx linear accelerator and beamline technology with the reliability, precision, process flexibility, and performance options that define the Purion platform. The Axcelis single wafer LINAC technology is the industry benchmark for high energy productivity and lowest cost of ownership, while providing customers remarkable manufacturing flexibility with true medium current capability. Each member of the Purion family shares a common, powerful 500+ wafers per hour end station, industry leading source technology and an innovative and productive ultra-pure beam line.

"The Purion platform redefines what chipmakers have come to expect from an ion implanter,” Bill Bintz, senior vice president of marketing said.  “It represents the most significant advance in next generation ion implanter platform design, and we’re excited to expand the Purion into the high energy segment. We developed the Purion platform in response to customer requirements for absolute beam purity and the most precise dopant placement possible, while ensuring the highest levels of productivity and capital efficiency.  Each product in the platform is designed to be the leader in its segment, in every measurable way, and together provide a powerful solution to chip manufacturers’ challenges in the sub 16nm era and beyond."

The Purion Platform enables high yield manufacture of sub 16nm planar and 3-D devices.  All Purion implanters incorporate industry leading advanced filtration systems, for unsurpassed beam purity, so even the most sensitive devices are implanted for optimized device performance.  The platform’s industry leading angle control system and constant focal length scanning deliver the most precise and repeatable dopant placement available today.  The scanned spot beam architecture designed into the platform enables control of damage engineering as well as other advanced process enabling implants using materials modification techniques required in leading edge device processes.

The common elements of the Purion platform were designed to drive manufacturing flexibility and lower the total cost of fab operations.  Common platform architecture and system options enable ease of process transfer between systems, simplified maintenance, and improved reliability.

Axcelis Purion high energy implanter

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

EMS CA-105 is approximately half the cost of a pure silver filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, has low extractable ionics and high adhesion to silver and copper lead frames. CA-105 has a dispensing open time (pin transfer) greater than 24 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for pin transfer or needle dispensing.

CA-105 is the latest addition to Engineered Material Systems’ line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines.

LED die attach adhesive

MoSys, a provider of semiconductor solutions, today announced that Macnica Americas, a provider of semiconductor distribution and design services, will support the GigaChip Interface in its distribution and technology innovation business.

The GigaChip Interface (GCI) is a scalable, high-performance, serial protocol for chip-to-chip communications that is differentiated in efficiency and reliability, resulting in system-level benefits of reduced power, cost and complexity. Current implementations built with compatible CEI-11G or XFI SerDes electrical transport standards deliver up to 144Gb per second (Gbps) of full duplex data throughput using 16 SerDes lanes when running at a 10G rate. A key differentiator for the GCI protocol is high transport efficiency, even for small payloads. Alternative serial interfaces are typically less than 50 percent efficient when transferring 8 bit and 16 bit data, which means that they deliver less than half the performance at a given bandwidth. The combination of 90 percent transport efficiency, from small to large payloads, with power efficient short reach physical interconnect makes GCI ideal for co-processor, memory, or multi-chip communication. The interface also includes CRC error detection and automatic error recovery provisions to meet the high reliability requirements of enterprise, service provider, and mission-critical communications and compute applications. GCI is an open, royalty-free interface specification designed for use with MoSys’ Bandwidth Engine family of ICs and is suitable for any chip-to-chip interconnect.

“As a provider of turnkey FPGA design services, we have substantial expertise in high-speed communications protocols and networking, and have seen firsthand the pain points caused by the limitations of more traditional interface protocols,” said Marc Levy, Chief Technical Officer for Macnica Americas. “We believe that leveraging the GigaChip Interface for chip-to-chip communications in high-speed, high-density complex FPGA designs provides the performance, efficiency and reliability necessary to enable 100G systems and beyond.”

“Macnica Americas is one of North America’s leading providers of high-performance semiconductor design and distribution services. We are delighted to have Macnica’s support of the GigaChip Interface in its FPGA design services and technology innovation business,” said John Monson, Vice President of Marketing for MoSys. “Through our collaboration and combined expertise in high-speed communications protocols and networking, MoSys and Macnica are poised to provide powerful solutions that connect MoSys’ Bandwidth Engine ICs with leading FPGAs through the GigaChip Interface, while delivering on fast time-to-market requirements.”

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide,  announces that the new Access+ contact unit holder (CUH) for the MT9510 significantly shortens the downtime of the test cell.

The Access+ CUH has been developed for quick and easy access to the contactors, centering plate and adapter board. The number of fixtures to open has been reduced by more than 80 percent. The new design substantially simplifies the demounting and mounting of the CUH

Access+ reduces the time for maintenance on the test floor and directly improves cost of test and return on investment.

Gerhard Gschwendtberger, Business Unit Manager, Contactors explains: “The Access+ was developed as a joint effort of Multitest’s contacting and handler kit experts. We already have successfully evaluated this new design on the test floor. For customers with an installed base of several MT9510s, the time savings for maintenance can easily add up to several days per year.”

Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications. The 300mm cluster design is based on the company’s fully automated, multifunctional PICOPLATFORM ALD deposition unit for parallel, simultaneous execution of several different processes for high-k and metal/metal nitride films.

The first models of the PICOPLATFORM ALD cluster tool entered the market the year 2008 and since then, this revolutionary versatile and efficient multi-chamber thin film processing system has gained praise from customers across the world.

 The fully automated PICOPLATFORM 300 ALD cluster unit is comprised of several individual PICOSUN P-series high throughput ALD reactors, capable of single wafer or batch processes. As all features in PICOSUN ALD tools, the control and automation software has been optimized to guarantee the ultimately simple, intuitive and user-friendly operation and programming of the tool. In addition to ALD reactors, also other thin film deposition units, pre- or post-treatment equipment or integrated substrate handling systems for complete cassette-to-cassette loading of wafers can be incorporated into the same PICOPLATFORM 300 ALD unit.

"PICOPLATFORM ALD cluster system design is solely based on the requirements of ALD, and thus provides distinct advantages over competing products. Realization of easy, cost-effective and clean production is the key for building successful ALD solutions for new memory applications. We are extremely proud and honored to be selected as the technology provider for the next generation of ALD-enabled memories," said Dr. Wei-Min Li, CEO of Picosun Asia.

Picosun Oy is a Finland-based, globally operating manufacturer of state-of-the-art ALD systems, representing continuity to almost four decades of pioneering, exclusive and groundbreaking ALD reactor design and manufacturing. Today, PICOSUN ALD systems are in daily production use in numerous prominent industries across the globe.