Category Archives: OLEDs

A major decrease in manufacturing cost gap between organic light-emitting diode (OLED) display and liquid crystal display (LCD) panel is expected to support the expansion of OLED TVs, according to new analysis from IHS Markit (Nasdaq: INFO).

The OLED Display Cost Model analysis estimates that the total manufacturing cost of a 55-inch OLED ultra-high definition (UHD) TV panel — at the larger end for OLED TVs — stood at $582 per unit in the second quarter of 2017, a 55 percent drop from when it was first introduced in the first quarter of 2015. The cost is expected to decline further to $242 by the first quarter of 2021, IHS Markit said.

The manufacturing cost of a 55-inch OLED UHD TV panel has narrowed to 2.5 times that of an LCD TV panel with the same specifications, compared to 4.3 times back in the first quarter of 2015.

55-inch_UHD_TV_panel_manufacturing_cost_v2

“Historically, a new technology takes off when the cost gap between a dominant technology and a new technology gets narrower,” said Jimmy Kim, principal analyst for display materials at IHS Markit. “The narrower gap in the manufacturing cost between the OLED and LCD panel will help the expansion of OLED TVs.”

However, it is not just the material that determines the cost gap. In fact, when the 55-inch UHD OLED TV panel costs were 2.5 times more than LCD TV panel, the gap in the material costs was just 1.7 times. Factors other than direct material costs, such as production yield, utilization rate, depreciation expenses and substrate size, do actually matter, IHS Markit said.

The total manufacturing cost difference will be reduced to 1.8 times from the current 2.5 times, when the yield is increased to a level similar to that of LCD panels. “However, due to the depreciation cost of OLED, there are limitations in cost reduction from just improving yield,” Kim said. “When the depreciation is completed, a 31 percent reduction in cost can be expected from now.”

As organic light-emitting diode (OLED) displays are used in more smartphones and high-end flat panel TVs, panel makers have boosted their investments in new OLED display fab construction. As a result, the global production capacity of AMOLED panels — including both red-green-blue (RGB) OLED and white OLED (WOLED) — is forecast to surge 320 percent from 11.9 million square meters in 2017 to 50.1 million square meters in 2022, according to new analysis from IHS Markit (Nasdaq: INFO).

The production capacity of RGB OLED panels for mobile applications will increase from 8.9 million square meters in 2017 to 31.9 million square meters in 2022, while the OLED capacity for TVs, mainly WOLED but including printing OLED, is set to grow from 3.0 million square meters in 2017 to 18.2 million square meters in 2022, says the latest Display Supply Demand & Equipment Tracker by IHS Markit.

The two market leaders — Samsung Display and LG Display — have taken different paths: Samsung is focusing on RGB OLED panels for mobile devices, and LG on WOLED displays for TVs. To cope with the trend of RGB OLED replacing the liquid crystal display (LCD) in smartphones and other mobile devices, especially for the full-screen and flexible feature of OLED panels, LG Display has started to manufacture RGB OLED panels in 2017. Meanwhile, Chinese panel makers, including BOE, ChinaStar, Tianma, Visionox, EverDisplay, Truly and Royole, are all expanding the production capacity of RGB OLED panels, targeting the mobile market.

OLED_panel_production_capacity_outlook

“It takes more than $11.5 billion to build a Gen 6 flexible OLED factory with a capacity of 90,000 substrate sheets per month, and this is a much larger investment required than building a Gen 10.5 TFT LCD fab with the same capacity,” said David Hsieh, senior director at IHS Markit. “The learning curve costs for the mass production of flexible OLED panels are also high. The financial and technological risks associated with the AMOLED panels have hampered Japanese and Taiwanese makers from entering the market aggressively,” Hsieh said. “In other words, the capacity expansion of AMOLED display, whether it is RGB OLED or WOLED, is only apparent in China and South Korea.”

Samsung Display will remain the dominant supplier of the RGB OLED panels for smartphones. Its RGB OLED panel capacity will grow from 7.7 million square meters in 2017 to 16.6 million square meters in 2022, IHS Markit says. Even though many Chinese panel makers are building RGB OLED fabs, each of their production capacity is much smaller than that of Samsung Display. Due to the gap in their production capacities, they will target different customers: Samsung Display will mainly focus on two major customers — Samsung Electronics (the Galaxy) and Apple (the iPhone), while Chinese makers will be targeting at Chinese smartphone makers at a smaller scale. These include Huawei, Xiaomi, Vivo, Oppo, Meizu, Lenovo and ZTE, and white box makers.

South Korea’s panel makers are estimated to account for 93 percent of the global AMOLED production capacity in 2017, and their share is expected to drop to 71 percent in 2022. Chinese players (BOE, ChinaStar, Tianma, Visionox, EverDisplay and Royole) will account for 26 percent in 2022 from 5 percent in 2017.

“Many interpret the strong expansion of RGB OLED capacity in China as a threat to South Korean makers. It is indeed a threat. However, while South Korean companies have high capacity fabs with high efficiencies, China’s OLED fabs are relatively small and dispersed across multiple regions and companies,” Hsieh said. “Also, while the Chinese makers could expand fabs with government subsidies, the operating performance will completely depend on the panel makers themselves. How long it will take until they could sustain the business, getting over the challenges with learning curve costs, initial low yield rates and capacity utilization, is still an open question.”

 

“As TV makers struggle to trigger replacement cycles, WCG and HDR and their notable picture quality improvements are the next growth drivers for the TV industry,” announced Eric Virey, Senior Market & Technology Analyst, LED, Sapphire & Displays at Yole Développement (Yole).

Various technologies are competing to deliver those features. In the short and mid-term, the best-positioned ones are OLED and the well-established, dominant, LCD technology supercharged with narrow-band phosphor LEDs or QD color converters in the backlight unit. Yole analysts delivered a deep analysis of the WCG display and QD technologies, status and prospects, roadblocks and key players with a dedicated technology & market report titled: Quantum Dots & Wide Color Gamut Display Technologies.

What is the status and benefits of QD technologies? After QD-Vision demise, what are the companies that can answer to the demand of the fast growing LCD market? How will the competitive landscape evolve, especially with OLED solutions?

wide color gamut

The “More than Moore” market research and strategy consulting company Yole offers you a snapshot of the QD technologies, its applications and the players involved.

Quantum Dots enable drastic enhancements of display color gamut. They do so with high efficiency, giving display makers headroom to increase brightness, contrast and gamut without increasing power consumption.

Their most common implementation is as color conversion films located in the LCD backlight unit. In this form, QDs are drop-in solutions that can be easily deployed on all sizes of displays without any process change or CapEx . QDs therefore enable the LCD industry to boost the performance of its products without major investment. This contrasts with OLEDs, which require building multibillion-dollar dedicated fabs.

However, QDs do not solve some of LCD shortcomings. Mostly, LCD still lag behind OLEDs in terms of response times, black levels and viewing angles. Also, LCDs cannot deliver pixel-level dimming, the strongest selling point for OLED displays. In the near future, QDs could substitute for LCD color filters. Unlike films, this configuration requires some process changes in LCD manufacturing.

However, it would double the display efficiency, further improve color gamut and provide viewing angles similar to OLED.

In the longer term, EL-QD could deliver OLED-like characteristics and performance, with improved brightness and stability.

“QDs and related technologies will take advantage of OLED TV capacity constraints,” says Dr Eric Virey from Yole.

LG Display is currently the only OLED TV panel manufacturer. The company announced that it will stop investing in LCD and build two new OLED TV manufacturing lines in Korea and China, slated to start production in late 2019. Cost and technology barriers to entry are high, and few other companies will be able to manufacture OLED TV panels in that timeframe. Unless OLED printing technologies progress fast enough to enable cost efficient manufacturing of large, full RGB displays, OLED TV adoption will therefore remain capacity-constrained to less than 12 million units per year until 2022.

QDs will take advantage of this window of opportunity to capture the lion’s share of the WCG and HDR TV market. Rapidly improving performance and decreasing cost is already enabling adoption to spread into mid-range, sub-US$1000 models opening a high volume markets still forbidden to OLED for cost and capacity reasons. Display makers will use QDs to keep extracting more value from existing LCD fab. For the long term, many are hedging their bets and looking at both RGB printed OLED and EL-QDs.

In the mid-term however, QDCF configurations represent an attractive opportunity to close the gap with OLED in term of viewing angles and widen it in term of gamut and efficiency. QDCF however requires some LCD manufacturing process changes. Although moderate compared to a new OLED fab, not every LCD maker will want to commit the required CapEx or even develop the technology.
In the longer term, both OLED and QD-enhanced LCD could face competition from new, disruptive technologies such as the already mentioned electroluminescent QDs or even microLEDs, which could drive a potential paradigm shift, offering alternatives to OLED in self-emissive display technologies. Other technological innovations could also disrupt the QD market. For example, commercialization of a narrow-band green phosphor could eliminate the performance gap between phosphors and QD films and enable a more cost-effective solution.

Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for a JetStep G lithography system from a second customer in China for pilot line manufacturing of next-generation AMOLED (active-matrix organic light-emitting diode) displays.

The use of AMOLED displays in smartphones and wearables is growing rapidly because of their superior performance and form factor. Given the wide variety and rapid proliferation of consumer devices, an R&D or pilot line facility that can quickly and cost-effectively implement new processes allows manufacturers to bring new products to market faster. As these products continue to evolve, the need persists for low-power, low-cost, and conformity. Rudolph’s lithography solutions provide customers with the ability to develop these new processes with lower tooling costs and quicker product change-over.

Elvino da Silveira, vice president of marketing at Rudolph Technologies, said, “The AMOLED panel market is currently experiencing rapid growth, and in fact, UBI Research expects it to grow by close to 40 percent on an annual basis until 2020. We are seeing more and more companies enter this market by developing their own intellectual property, especially in China.”

“Customers continue to invest in Rudolph’s unique lithography solution for their R&D and pilot lines because it enables them to prove-out new processes more easily and at lower cost,” da Silveira continued. “The JetStep system is especially beneficial in pilot line environments where there is a high level of product change-over and pressure to minimize cost. A JetStep mask set, for example, is a fraction of the cost of a mask set for scanner-based photolithography tools, making it an ideal choice for new product development.”

The JetStep G lithography system addresses the AMOLED displays’ requirement for higher performance transistors by delivering finer resolution and tighter overlay. Additionally, the proprietary real-time magnification compensation and autofocus capabilities enable flexible substrate lithography. These capabilities are exactly what FPD manufacturers in China are looking for as they invest in capacity for next-generation AMOLED. Beyond the technology, Chinese manufacturers are looking for comprehensive and localized services. Rudolph is expanding capabilities in this area through the use of localized partnerships.

“With these technological advantages and local presence, we are poised to capture orders from additional China-based manufacturers,” da Silveira concluded.

A major bottleneck in the commercialization of Micro LED displays is the mass transfer of micron-size LEDs to a display backplane. Research by LEDinside, a division of TrendForce, reveals that many companies across industries worldwide have entered the Micro LED market and are in a race to develop methods for the mass transfer process. However, their solutions have yet to meet the standard for commercialization in terms of production output (in unit per hour, UPH), transfer yield and size of LED chips (i.e. Micro LED is technically defined as LEDs that are smaller than 100 microns). These research findings can be found in LEDinside’s 3Q17 Micro LED Next Generation Display Industry Member Report: Analyses on Mass Transfer and Inspection/Repair Technologies.

Currently, entrants in the Micro LED market are working towards the mass transfer of LEDs sized around 150 microns. LEDinside anticipates that displays and projection modules featuring 150-micron LEDs will be available on the market as early as 2018. When the mass transfer for LEDs of this size matures, market entrants will then invest in processes for making smaller products.

Development of mass transfer solutions faces seven major challenges

“Mass transfer is one of the four main stages in the manufacturing of Micro LED displays and has many highly difficult technological challenges,” said Simon Yang, assistant research manager of LEDinside. Yang pointed out that developing a cost-effective mass transfer solution depends on advances in seven key areas: precision of the equipment, transfer yield, manufacturing time, manufacturing technology, inspection method, rework and processing cost.

LED suppliers, semiconductor makers and companies across the display supply chain will have to work together to develop specification standards for materials, chips and fabrication equipment used in Micro LED production. Cross-industry collaboration is necessary since each industry has its own specification standards. Also, an extended period of R&D is needed to overcome the technological hurdles and integrate various fields of manufacturing.

Mass transfer has to achieve five-sigma level before mass production of Micro LED displays is feasible

Using Six Sigma as the model for determining the feasibility of mass production of Micro LED displays, LEDinside’s analysis indicates that the yield of the mass transfer process must reach the four-sigma level to make commercialization possible. However, the processing cost and the costs related to inspection and defect repair are still quite high even at the four-sigma level. To have commercially mature products with competitive processing cost available for market release, the mass transfer process has to reach the five-sigma level or above in transfer yield.

As progress on mass transfer solutions continues, true Micro LED products are expected to first enter applications such as indoor displays and wearables

Even though no major breakthroughs have been announced, many technology companies and research agencies worldwide continue to invest in the R&D of mass transfer process. Some of the well-known international enterprises and institutions working in this area are LuxVue, eLux, VueReal, X-Celeprint, CEA-Leti, SONY and OKI. Comparable Taiwan-based companies and organizations include PlayNitride, Industrial Technology Research Institute, Mikro Mesa and TSMC.

There are several types of mass transfer solutions under development. Choosing one of them will depend on various factors such as application markets, equipment capital, UPH and processing cost. Additionally, the expansion of manufacturing capacity and the raising of the yield rate are important to product development.

According to the latest developments, LEDinside believes that the markets for wearables (e.g. smartwatches and smart bracelets) and large indoor displays will first see Micro LED products (LEDs sized under 100 microns). Because mass transfer is technologically challenging, market entrants will initially use the existing wafer bonding equipment to build their solutions. Furthermore, each display application has its own pixel volume specifications, so market entrants will likely focus on products with low pixel volume requirements as to shorten the product development cycle.

Thin film transfer is another away of moving and arranging micron-size LEDs, and some market entrants are making a direct jump to developing solutions under this approach. However, perfecting thin film transfer will take longer time and more resources because equipment for this method will have to be designed, built and calibrated. Such an undertaking will also involve difficult manufacturing related issues.

By Michaël Tchagaspanian, Vice President of Sales and Marketing, Leti

Digital disruption begets innovation. Challenges equal opportunities. Those were clear messages during Leti Innovation Days recently in Grenoble, France. Over two days at the annual event, which this year coincided with Leti’s 50th anniversary, speakers and exhibitions highlighted challenges of the digital revolution and presented specific current-and-anticipated solutions for industry, healthcare and energy and the environment.

Coinciding with the launch of the administration of French President Emmanuel Macron, who has already talked of France becoming “a start-up nation”, Leti also noted the importance of creating and supporting startups that will help consumers, companies and countries address the challenges and opportunities of the digital revolution.

Citing challenges in the energy sector, Thierry Lepercq, executive vice president of research, technology and innovation at the international French energy company ENGIE, warned of potential energy blackouts and financial problems for traditional energy providers due to the growing penetration of alternative energy sources, the switch from fossil fuels – and energy sharing by households.

These developments, which ENGIE calls “Full 3D” – decarbonization, decentralization and digitalization – have destabilized traditional power systems and providers.

For example, a German residential battery-storage supplier allows residents to store energy at home and swap it on the grid, cutting out traditional electricity providers. Lepercq also noted that the rapid growth in the use of electric vehicles can load the grid with demand that was not anticipated even a few years ago. But the digital revolution also has prompted entrepreneurial responses. EV-Box, the Dutch company that has deployed more than 40,000 vehicle-charging stations in 20 countries, is gathering usage data, which will help officials understand the vehicles’ demands on the grid.

ENGIE acquired EV-Box this year as a strategic step towards operating in a completely new global energy paradigm.

Driving toward a new economy

Last month, Intel released a study that predicted autonomous vehicles will create a “Passenger Economy” – with mobility-as-a-service – that could grow to $800 billion in 2035 and to $7 trillion by 2050.

With autonomous vehicles, the car will no longer be a “stand-alone vehicle”, but “something that reacts with the environment”, said Mike Mayberry, corporate vice president and managing director of Intel Labs. Intel has opened advanced vehicle labs in the U.S. and Germany to explore the various requirements related to self-driving vehicles and the future of transportation. That includes sensing, in-vehicle computing, artificial intelligence, connectivity, and supporting cloud technologies and services.

When a panel discussion on driverless cars was asked when these vehicles will be in general use, Jean-François Tarabbia, CTO of Valeo, the automotive supplier to automakers worldwide, said “the better question is ‘why’”. And that depends in part on the industry’s ability to demonstrate vehicle safety. He said that traffic jams could be reduced by 30 percent with autonomous cars. Still, the cars will require a driver inside who will do something other than driving until he or she is needed to operate the vehicle.

Pierrick Cornet, brand incubator at Renault Nissan, said autonomous cars also will have to accommodate owners who occasionally want to drive their vehicles. For carmakers like Renault Nissan, the challenges are managing the cost and weight of the vehicles, which are loaded with batteries, as well as computing and sensing gear – and making them able to charge quickly.

Fabio Marchiò, automotive digital general manager at STMicroelectronics, noted that cars are the least-used appliance/machine in the household. He agreed with Tarabbia that safety and consumer resistance are primary roadblocks for the vehicles, but added that government regulations could slow down their widespread use.

Moore’s Law obtains

Outlining some of Intel’s R&D programs, Mayberry brushed aside frequent predictions that Moore’s Law has run its course. He said Intel expects Moore’s Law to be in effect at least through the next decade, because of the industry’s continued evolution to smaller technology nodes with new IC technologies.

In addition to focusing on enabling Moore’s Law going forward, Intel’s research on components and hardware includes developing novel integration techniques. But Intel Labs also is focused on enabling future product capabilities and “imagining what’s next”.

As part of that effort, Intel Labs has partnered with Princeton University to decode digital brain data, which is scanned using functional magnetic resonance imaging (fMRI). The goal is to reveal how neural activity gives rise to learning, memory and other cognitive functions such as human attention, control and decision-making.

Leti and Intel agreed last year to collaborate on strategic research programs, including the Internet of Things, high-speed wireless communication, security technologies and 3D displays.

Quantum computing

Also peering into the more-distant future, Leti CEO Marie Semeria noted development of Leti’s Si-CMOS quantum-technology platform.

“The quantum topic has recently become central, thanks to the huge advances made in solid-state implementation, both in superconducting systems and in silicon technologies,” she said. “Interest in silicon-based technologies is huge because of their reliability and their capability to reproduce industrial standards along with the low-noise characteristics and low variability of CMOS devices.”

Noting that the University of New South Wales recently demonstrated a promising two-qubit logic gate based on the silicon-28 isotope, Semeria said Leti had demonstrated the compatibility of such circuits with state-of-the-art CMOS processes.

“From an architectural point of view, it is clear that the future quantum computer will be hybrid. It will combine a quantum engine with a classical digital computer,” she explained. “The program that will run on such a machine will need to combine at least two computing models: a classical part, to prepare data and process results, and a quantum one. A tight connection between the two programming models will be necessary.”

With its history of pioneering in technology and its culture of spinning out new companies to further develop and commercialize innovative technologies, Leti is poised to help France achieve Macron’s goal: “I want France to be a ‘start-up nation’, meaning both a nation that works with and for the start-ups, but also a nation that thinks and moves like a start-up.”

Leti has launched 64 startups, including 13 in the past four years.

Digital innovations in healthcare

Jai Hakhu, president & CEO of HORIBA International Corporation (U.S.), explained how the digital revolution is creating in vitro diagnostics business potential by enabling delivery of preventive healthcare services in even remote regions of the world. In one of HORIBA and Leti’s joint projects, they are developing a hematology, microfluidics-based, lensfree, point-of-care and home-testing system that can be used in underdeveloped countries.

The collaboration is helping realize HORIBA’s vision of providing preventive self-testing anywhere in the world.

Leti’s start-up Avalun has developed a portable medical device for multiple-measurement capabilities using point-of-care testing. Other recent healthcare-related startups include Diabeloop, which is in the final stages of testing an artificial pancreas, and Aryballe Technologies, which is developing olfactory and gustatory sensors.

Routes to innovation

Those new companies were among the presenters at Leti’s immersive exhibition, “Routes to Innovation”, which was the focus of day two of the event. Entrepreneurs and Leti scientists offered more than 60 demonstrations of patented technologies, to show with concrete examples how Leti’s technological know-how and industrial transfer expertise can help French and international companies innovate and become more competitive.

The three “Digital Revolution” topics included “Micro-Nano Pathfinding”, showing how the diversity of Leti’s digital technologies are available to all economic sectors; “Cyber Physical Systems”, and “Business-Model Disruption”.

The “Environmental Transition” demos covered “Sustainable Activities”, “Monitoring Our World’ and “More with Less”. The “New Frontiers for Healthcare” demos covered “Prevention, Independence, Well Being”, “New Therapies” and “Analysis & Diagnosis”. 

Collaborating for technological sovereignty

During the event, Semeria and Fraunhofer Group for Microelectronics Chairman Hubert Lakner announced a wide-ranging collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in their countries and strengthen European strategic and economic sovereignty.

The two institutes will initially focus on extending CMOS and More-than-Moore technologies to enable next-generation components for applications in the Internet of Things, augmented reality, automotive, health, aeronautics and other sectors, as well as systems to support French and German industries.

‘Smart everything everywhere’

Over the two days, a record number of guests, including CEOs, CTOs, journalists and special guests and speakers heard and saw examples of Leti’s advanced technology platforms, its commitment to research excellence and its vision for applying innovative technologies to challenges of the digital era.

Max Lemke, head of the Components and Systems Unit at the European Commission, noted that Leti’s contributions extend beyond microelectronics to cyber-physical systems, 5G, the Internet of Things, photonics and post-CMOS technologies. By supporting the digital transformation of industry, Leti plays a leading role in “smart everything everywhere”, Lemke said.

“Leti is excellently positioned to continue doing forward-looking research” on components and systems to build the foundation for Europe’s future competitiveness, and to play an instrumental role in supporting French and European industry in their digital transformation, he said.

By Pete Singer

Luc Van den Hove, president and CEO of imec

Luc Van den Hove, president and CEO of imec

Speaking at imec’s International Technology Forum USA yesterday afternoon at the Marriott Marquis, Luc Van den Hove, president and CEO of imec, provided a glimpse of society’s future and explained how semiconductor technology will play a key role. From everything the IoT to early diagnosis of cancer through cell sorters, liquid biopsies and high-performance sequencing, technology will enable “endless complexity increase,” he said.

Other developments, almost all of which are being worked on at imec, include self-learning neuromorphic chips, brain implants, artificial intelligence, 5G, IoT and sensors, augmented and virtual reality, high resolution (5000 ppi) OLED displays, EOG based eye tracking and haptic feedback devices. He also acknowledged the critical importance of security issues, but suggested a solution. He noted that each chip has its own fingerprint due to nanoscale variability. That’s been a problem for the industry but we could “turn this limitation into an advantage,” he said, with an approach called PUFs — Physical Unclonable Functions (Figure 1).

Figure 1. Nanoscale variability has been a problem for the industry but we could be turned into an advantage with PUFs -- Physical Unclonable Functions.

Figure 1. Nanoscale variability has been a problem for the industry but we could be turned into an advantage with PUFs — Physical Unclonable Functions.

At the forum, imec also announced that its researchers, in collaboration with scientists from KU Leuven in Belgium and Pisa University in Italy, have performed the first material-device-circuit level co-optimization of field-effect transistors (FETs) based on 2D materials for high-performance logic applications scaled beyond the 10nm technology node. Imec also presented novel designs that would allow using mono-layer 2D materials to enable Moore’s law even below 5nm gate length. Additionally, imec announced that it demonstrated an electrically functional 5nm solution for Back-End-of-Line interconnects.

FETs based on 2D materials

2D materials, a family of materials that form two-dimensional crystals, may be used to create the ultimate transistor with a channel thickness down to the level of single atoms and gate length of few nanometers. A key driver that allowed the industry to follow Moore’s Law and continue producing ever more powerful chips was the continued scaling of the gate length. To counter the resulting negative short-channel effects, chip manufacturers have already moved from planar transistors to FinFETs. They are now introducing other transistor architectures such as nanowire FETs. The work reported by imec looks further, replacing the transistor channel material, with 2D materials as some of the prime candidates.

Figure 2. 2D materials, with the atomically-precise dimension control they enable, promise to become key materials for future innovations.

Figure 2. 2D materials, with the atomically-precise dimension control they enable, promise to become key materials for future innovations.

In a paper published in Scientific Reports, the imec scientists and their colleagues presented guidelines on how to choose materials, design the devices and optimize performance to arrive at circuits that meet the requirements for sub-10nm high-performance logic chips. Their findings demonstrate the need to use 2D materials with anisotropicity and a smaller effective mass in the transport direction. Using one such material, monolayer black-phosphorus, the researchers presented novel device designs that pave the way to even further extend Moore’s law into the sub-5nm gate length. These designs reveal that for sub-5nm gate lengths, 2D electrostatics arising from gate stack design become more of a challenge than direct source-to-drain tunneling. These results are very encouraging, because in the case of 3D semiconductors, such as Si, scaling gate length so aggressively is practically impossible.

“2D materials, with the atomically-precise dimension control they enable, promise to become key materials for future innovations. With advancing R&D, we see opportunities emerging in domains such as photonics, optoelectronics, (bio)sensing, energy storage, photovoltaics, and also transistor scaling. Many of these concepts have already been demonstrated in the labs,” says Iuliana Radu, distinguished member of technical staff at imec. “Our latest results presented in Scientific Reports, show how 2D materials could be used to scale FETs for very advanced technology nodes.”

5nm Solution for BEOL

The announced electrically functional solution for 5nm back-end-of-line (BEOL) is a full dual-damascene module in combination with multi-patterning and multi-blocking. Scaling boosters and aggressive design rules pave the way to even smaller dimensions.

As R&D progresses towards the 5nm technology node, the tiny Cu wiring schemes in the chips’ BEOL are becoming more complex and compact. Shrinking the dimensions also reduces the wires cross-sectional area, driving up the resistance-capacitance product (RC) of the interconnect systems and thus increasing signal delay. To overcome the RC delay challenge and enable further improvements in interconnect performance, imec explores new materials, process modules and design solutions for future chip generations.

One viable option is to extend the Cu-based dual-damascene technology – the current workhorse process flow for interconnects – into the next technology nodes. Imec has demonstrated that the 5nm BEOL can be realized with a full dual-damascene module using multi-patterning solutions. With this flow, trenches are created with critical dimensions of 12nm at 16nm. Metal-cuts (or blocks) perpendicular to the trenches are added in order to create electrically functional lines and then the trenches are filled with metal. Area scaling is further pushed through the introduction of fully self-aligned vias. Moreover, aggressive design rules are explored to better control the variability of the metal tip-to-tips (T2Ts).

Figure 3. Dense-pitch blocks enabled by a dual damascene flow and multi-patterning. The pattern is etched into the low-k and metallized.

Figure 3. Dense-pitch blocks enabled by a dual damascene flow and multi-patterning. The pattern is etched into the low-k and metallized.

Beyond 5nm, imec is exploring alternative metals that can potentially replace Cu as a conductor. Among the candidates identified, low-resistive Ruthenium (Ru) demonstrated great promise. The imec team has realized Ru nanowires in scaled dimensions, with 58nm2 cross-sectional area, exhibiting a low resistivity, robust wafer-level reliability, and oxidation resistance – eliminating the need for a diffusion barrier.

“The emergence of RC delay issues started several technology nodes ago, and has become increasingly more challenging at each node. Through innovations in materials and process schemes, new BEOL architectures and system/technology co-optimization, we can overcome this challenge as far as the 5nm node”, said Zsolt Tokei, imec’s director of the nano-interconnect program. “Imec and its partners have shown attainable options for high density area scaled logic blocks for future nodes, which will drive the supplier community for future needs.”

For the longer term, imec is investigating different options including but not limited to alternative metals, insertion of self-assembled monolayers or alternative signaling techniques such as low-energy spin-wave propagation in magnetic waveguides, exploiting the electron’s spin to transport the signal. For example, the researchers have experimentally shown that spin waves can travel over several micrometers, the distance required by short and medium interconnects in equivalent spintronic circuits.

Renewed investigation of a molecule that was originally synthesized with the goal of creating a unique light-absorbing pigment has led to the establishment of a novel design strategy for efficient light-emitting molecules with applications in next-generation displays and lighting.

Researchers at Kyushu University’s Center for Organic Photonics and Electronics Research (OPERA) demonstrated that a molecule that slightly changes its chemical structure before and after emission can achieve a high efficiency in organic light-emitting diodes (OLEDs).

In addition to producing vibrant colors, OLEDs can be fabricated into everything from tiny pixels to large and flexible panels, making them extremely attractive for displays and lighting.

In an OLED, electrical charges injected into thin films of organic molecules come together to form packets of energy – called excitons – that can produce light emission.

The goal is to convert all of the excitons to light, but three-fourths of the created excitons are triplets, which do not produce light in conventional materials, while the remaining one-fourth are singlets, which emit through a process called fluorescence.

Inclusion of a rare metal, such as iridium or platinum, in a molecule can enable rapid emission from the triplets through phosphorescence, which is currently the dominant technology for highly efficient OLEDs.

An alternative mechanism is the use of heat in the environment to give triplets an energetic boost that is sufficient to convert them into light-emitting singlets.

This process, known as thermally activated delayed fluorescence (TADF), easily occurs at room temperature in appropriately designed molecules and has the added advantage of avoiding the cost and reduced molecular design freedom associated with rare metals.

However, most TADF molecules still rely on the same basic design approach.

“Many new TADF molecules are being reported each month, but we keep seeing the same underlying design with electron-donating groups connected to electron-accepting groups,” says Masashi Mamada, lead researcher on the study reporting the new results.

“Finding fundamentally different molecular designs that also exhibit efficient TADF is a key to unlocking new properties, and in this case, we found one by looking at the past with a new perspective.”

Currently, combinations of donating and accepting units are primarily used because they provide a relatively simple way to push around the electrons in a molecule and obtain the conditions needed for TADF.

Although the method is effective and a huge variety of combinations is possible, new strategies are still desired in the quest to find perfect or unique emitters.

The mechanism explored by the researchers this time involves the reversible transfer of a hydrogen atom – technically, just its positive nucleus – from one atom in the emitting molecule to another in the same molecule to create an arrangement conducive to TADF.

This transfer occurs spontaneously when the molecule is excited with optical or electrical energy and is known as excited-state intramolecular proton transfer (ESIPT).

This ESIPT process is so important in the investigated molecules that quantum chemical calculations by the researchers indicate that TADF is not possible before transfer of the hydrogen.

After excitation, the hydrogen rapidly transfers to a different atom in the molecule, leading to a molecular structure capable of TADF.

The hydrogen transfers back to its initial atom after the molecule emits light, and the molecule is then ready to repeat the process.

Although TADF from an ESIPT molecule has been reported previously, this is the first demonstration of highly efficient TADF observed inside and outside of a device.

This vastly different design strategy opens the door for achieving TADF with a variety of new chemical structures that would not have been considered based on previous strategies.

Interestingly, the molecule the researchers used was most likely a disappointment when first synthesized nearly 20 years ago by chemists hoping to create a new pigment only to discover that the molecule is colorless.

“Organic molecules never cease to amaze me,” says Professor Chihaya Adachi, Director of OPERA. “Many paths with different advantages and disadvantages exist for achieving the same goal, and we have still only scratched the surface of what is possible.”

The advantages of this design strategy are just beginning to be explored, but one particularly promising area is related to stability.

Molecules similar to the investigated one are known to be highly resistant to degradation, so researchers hope that these kinds of molecules might help to improve the lifetime of OLEDs.

To see if this is the case, tests are now underway.

While only time will tell how far this particular strategy will go, the continually growing options for OLED emitters certainly bode well for their future.

Pixelligent Technologies, a nanocomposite advanced materials manufacturer, announced today that it has been awarded grant funding from the Department of Energy SBIR program and the Department of Defense STTR program, that totals a combined $2.15 million. This funding will be used to accelerate and further develop a diverse range of applications leveraging Pixelligent’s core PixClear® nanocomposite technology.

“The grants from the Dept. of Energy will help to extend our technology leadership in OLED lighting applications. These SBIR Phase I and Phase IIB grants will allow Pixelligent to further extend our OLED light extraction materials to enable next generation flexible OLED lighting applications. The STTR Phase II grant from the Dept. of Defense will support our continued collaboration with the University of Pennsylvania and Argonne National Laboratory to further the development of PixClear — enabled gear oils for improving the lifetime and energy-efficiency of gear boxes and drive trains,” said Gregory Cooper, PhD, CTO & Founder of Pixelligent.

“We are proud to have been selected for these three grant awards from the Department of Energy and Department of Defense. These are highly competitive programs and theses awards point to the broad applicability of our materials, which can deliver unparalleled efficiency gains in applications ranging from OLED technology to lubricant additives,” said Craig Bandes, President & CEO of Pixelligent.

Through grant awards and private funding, Pixelligent has emerged as one of the only companies that has developed a truly disruptive manufacturing and advanced material technology platform for commercializing the promise of nanotechnology. This was recently recognized by Frost & Sullivan who honored Pixelligent with the 2017 Manufacturer of the Year award for SMB under $1B in revenues.

Pixelligent Technologies, a developer of high-index advanced materials (PixClear) for displays, solid state lighting and optical components, announces that it has been named the 2017 Manufacturer of the Year by Frost & Sullivan. It won this award in the small/midsize company category for companies with revenues under $1B, for its PixClearProcess that is revolutionizing chemical composite technology. The winner for the large company 2017 Manufacturer of the Year was Dow Chemical.

Over the past five years, Pixelligent has invested over $20 million in designing and building its advanced product development and manufacturing platform, the PixClearProcess. This proprietary platform has enabled Pixelligent to scale from a manufacturing capacity of grams-per-year, to one of the most sophisticated and highly capital efficient manufacturing lines in the world, capable of mass production volumes in the tons.

“We are deeply honored to be named the 2017 Manufacturer of the Year by Frost & Sullivan. It’s especially gratifying as we competed against some of the most respected high-tech manufacturers in the world. This award is also a great recognition of what we are most proud of, namely the balanced approach we have executed in developing both one of the most innovative materials in the world alongside one of the most advanced manufacturing lines in the world,” remarked Craig Bandes, CEO, Pixelligent Technologies.

The Company’s breakthrough PixClearProcess allows its customers to more efficiently tune and magnify the desired optical, mechanical, and electrical properties of their formulations with unprecedented levels of precision. Depending on product performance requirements, incorporating PixClear can deliver the highest possible light extraction, near perfect transmission, increased mechanical strength, and dramatic improvements in overall operating efficiencies. We enable our customers to deliver unprecedented levels of performance for OLED and HD displays, LED and OLED lighting devices, and optical components.