In 1959 renowned physicist Richard Feynman, in his talk “Plenty of Room at the Bottom,” spoke of a future in which tiny machines could perform huge feats. Like many forward-looking concepts, his molecule and atom-sized world remained for years in the realm of science fiction.

And then, scientists and other creative thinkers began to realize Feynman’s nanotechnological visions.

In the spirit of Feynman’s insight, and in response to the challenges he issued as a way to inspire scientific and engineering creativity, electrical and computer engineers at UC Santa Barbara have developed a design for a functional nanoscale computing device. The concept involves a dense, three-dimensional circuit operating on an unconventional type of logic that could, theoretically, be packed into a block no bigger than 50 nanometers on any side.

“Novel computing paradigms are needed to keep up with the demand for faster, smaller and more energy-efficient devices,” said Gina Adam, postdoctoral researcher at UCSB’s Department of Computer Science and lead author of the paper “Optimized stateful material implication logic for three dimensional data manipulation,” published in the journal Nano Research. “In a regular computer, data processing and memory storage are separated, which slows down computation. Processing data directly inside a three-dimensional memory structure would allow more data to be stored and processed much faster.”

While efforts to shrink computing devices have been ongoing for decades — in fact, Feynman’s challenges as he presented them in his 1959 talk have been met — scientists and engineers continue to carve out room at the bottom for even more advanced nanotechnology. A nanoscale 8-bit adder operating in 50-by-50-by-50 nanometer dimension, put forth as part of the current Feynman Grand Prize challenge by the Foresight Institute, has not yet been achieved. However, the continuing development and fabrication of progressively smaller components is bringing this virus-sized computing device closer to reality, said Dmitri Strukov, a UCSB professor of computer science.

“Our contribution is that we improved the specific features of that logic and designed it so it could be built in three dimensions,” he said.

Key to this development is the use of a logic system called material implication logic combined with memristors — circuit elements whose resistance depends on the most recent charges and the directions of those currents that have flowed through them. Unlike the conventional computing logic and circuitry found in our present computers and other devices, in this form of computing, logic operation and information storage happen simultaneously and locally. This greatly reduces the need for components and space typically used to perform logic operations and to move data back and forth between operation and memory storage. The result of the computation is immediately stored in a memory element, which prevents data loss in the event of power outages — a critical function in autonomous systems such as robotics.

In addition, the researchers reconfigured the traditionally two-dimensional architecture of the memristor into a three-dimensional block, which could then be stacked and packed into the space required to meet the Feynman Grand Prize Challenge.

“Previous groups show that individual blocks can be scaled to very small dimensions, let’s say 10-by-10 nanometers,” said Strukov, who worked at technology company Hewlett-Packard’s labs when they ramped up development of memristors and material implication logic. By applying those results to his group’s developments, he said, the challenge could easily be met.

The tiny memristors are being heavily researched in academia and in industry for their promising uses in memory storage and neuromorphic computing. While implementations of material implication logic are rather exotic and not yet mainstream, uses for it could pop up any time, particularly in energy scarce systems such as robotics and medical implants.

“Since this technology is still new, more research is needed to increase its reliability and lifetime and to demonstrate large scale three-dimensional circuits tightly packed in tens or hundreds of layers,” Adam said.

MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November 9-11, 2016 in Scottsdale, AZ) highlights some of the newest and most unique MEMS/sensors-enabled applications in the industry. MSIG today announced the shortlist of finalists who will compete for the title of winner at this year’s event.

i-BLADES’ Smartplatform
i-BLADES’ mobile Smartcase is a new modular accessory that dramatically accelerates time to market and reach for MEMS and Internet of Things (IoT) technologies. It lets new technologies quickly reach mass-market mobile consumers through one integrated smartphone accessory — a mobile phone case. It not only provides protection but also a Smartplatform that forms a “hard-wired” smartphone connection, enabling add-on MEMS and IoT technologies. Developers can add new sensors to Smartcase directly or through snap-on Smartblade modules.

With i-BLADES, technologies can quickly go onto hundreds of millions of smartphones as an after-market opportunity, making smartphones “smarter.” i-BLADES partnered with Bosch to deploy successfully the BME680 sensor faster than via other routes. For more information, visit: www.i-blades.com or watch video: https://www.youtube.com/watch?v=dVcOewMhopE&feature=youtu.be

Chirp Microsystems’ MEMS-Based Ultrasonic Sensing Solution
Today’s VR and gaming systems are limited by their reliance on complex computer vision techniques for controller tracking, resulting in higher cost, limited tracking area and lack of mobility due to high power consumption. Chirp Microsystems’ ultrasonic tracking technology addresses these limitations, offering solutions that enable truly mobile VR and AR systems at attractive price points suitable for multiple tiers of products.

Chirp Microsystems’ new ultrasonic time-of-flight (ToF) technology uses pulses of ultrasound to measure an object’s range with millimeter accuracy. This ultra-low power ultrasonic ToF technology enables low-latency, millimeter-accurate 6 degrees of freedom (DOF) inside-out controller tracking for VR/AR and gaming systems. This system solution is enabled by Chirp’s ultra-low power ultrasonic ToF sensor, which offers ultra-wide field-of-view, noise and light immunity, fast sample rate, and small package size. The ToF sensor is a system in package (SiP) that combines a MEMS ultrasound transducer with a power-efficient digital signal processor (DSP) on a custom integrated circuit. In wearable applications, Chirp’s ultrasonic SiP provides a transformative and intuitive touchless gesture interface. For more information, visit: www.chirpmicro.com

Integrated Device Technology’s Gas Sensor for Air Quality and Breath Detection
Integrated Device Technology’s (IDT’s) new highly sensitive gas sensor family based on the ZMOD3250 targets indoor air quality with a roadmap that includes environmental (outdoor) air quality and breath detection. The ZMOD3250 family detects total volatile organic compounds (VOCs) and odors, and can be used to selectively identify several VOCs, including formaldehyde, ethanol and toluene. The company is promoting several features and applications of this new gas sensor product line, including the off-gassing detection of chemicals from common home and office materials, odor detection, selective measurements among VOCs and detection of several breath components.

IDT’s flagship product, the ZMOD3250, features a unique silicon microhotplate with nanostructured sensing material that enables a highly sensitive measurement of gas. The accompanying ASIC provides a flexible solution for integration of the sensor with various consumer devices, including mobile phones, wearables and appliances. Packaged in a 12 pin LGA assembly (3.0 mm x 3.0 mm x 0.7 mm), the sensor emulates a sensor array with a single sensor element. Suitable for a wide range of applications, the sensor features programmable-measurement sequence and highly integrated CMOS design. To request more information about the ZMOD3250, visit: www.idt.com or watch video: http://www.idt.com/video/uv-sensor-and-gas-sensor-demonstration-idt

Valencell’s Biometric Gaming
Biometric input adds a new element to gaming. For example, fitness games can use heart rate as a key control measure, or action games can require users to hold their breath while their characters are swimming. Audio earbuds, headsets, armbands and wrist devices — all of which make good use of MEMS/sensors — are natural peripherals for gaming — and as well as for exercising.

Valencell has created a demonstration game that not only involves real-time biometric data to affect the gaming experience, but also collects meaningful health metrics in the background. This has implications not only for the gaming industry, but also for healthcare and medical markets. In fact, healthcare practitioners are integrating biometric game play into physical therapy and surgery recovery protocols to measure and manage recovery processes. Valencell will demonstrate the game as well as its biometric output and analysis. For more information, visit: www.valencell.com or watch video: https://www.youtube.com/watch?v=QMTJP6OBmjA

Vesper’s Wake-on Sound MEMS Microphone
Always-listening MEMS microphones may signal a new era of ubiquitous sensors that can run indefinitely on small batteries. That’s good news for developers of TV remote controls, smart speakers, smartphones, intelligent sensor nodes, hearables and other electronic devices. It’s even better news for consumers who want to cut the power cord but end up incessantly charging devices or replacing batteries, even when those devices aren’t in regular use.

Vesper — developer of the world’s only piezoelectric MEMS microphones — will demonstrate VM1010, the first quiescent-sensing MEMS microphone, during MEMS & Sensors Technology Showcase. VM1010 alleviates the heavy power consumption typical of speech recognition–which consumes up to 1000 µW or more. Because it supports wake-on sound at practically zero power draw (a mere 3 µA of current while in listening mode), VM1010 reduces standby power by two orders of magnitude and can increase standby time by a factor of 100.

Vesper will also demonstrate the extremely fast response time of VM1010, showing how it can go to full power within microseconds, quick enough to record what a user is saying and capture keywords and other acoustic event triggers. For more information, visit: www.vespermems.com or watch video: https://www.youtube.com/watch?v=KhFtrjbpffE

SiTime Corporation, a MEMS and analog semiconductor company and a wholly owned subsidiary of MegaChips Corporation (Tokyo Stock Exchange: 6875), today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators. These precision devices are engineered to solve long-standing timing problems in telecommunications and networking equipment.

“Network densification is driving rapid deployment of equipment in uncontrolled environments such as basements, curbsides, rooftops, and on poles. Precision timing components in these systems must now operate in the presence of high temperature, thermal shock, vibration and unpredictable airflow. Service providers are questioning if quartz technology is up to this challenge,” said Rajesh Vashist, CEO at SiTime. “Customers have enthusiastically validated SiTime’s MEMS-based Elite Platform, as it uniquely solves such environmental issues. We believe that our new Elite solutions will transform the $1.5 billiontelecommunications and networking timing market.”

Elite timing solutions are based on an innovative DualMEMS architecture with TurboCompensation. This architecture delivers exceptional dynamic performance with three key elements:

• Robust, reliable, and proven TempFlat MEMS that eliminates activity dips and enables 30 times better vibration immunity than quartz
• DualMEMS temperature sensing with 100% accurate thermal coupling that enables 40 times faster temperature tracking, which ensures the best performance under airflow and rapid temperature changes
• Highly integrated mixed-signal circuits with on-chip regulators, a TDC (temperature to digital converter) and a low-noise PLL that deliver 5 times better immunity to power-supply noise, 30 uK temperature resolution that is 10 times better than quartz, and support for any frequency between 1 and 700 MHz

“New telecom infrastructure uses 4G/5G small cells and Synchronous Ethernet to increase network data capacity; the high-power components that are used in such systems will have high and constantly changing heat loads,” said Joe Madden, founder and principal analyst at Mobile Experts. “The dynamic performance of precision timing components during rapid temperature change will become a critical requirement in such equipment. MEMS technology inherently performs better in the presence of dynamic environmental conditions, and has become a very interesting alternative to quartz technology.”