Category Archives: Packaging and Testing

With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022. Driven by the automotive applications and the introduction of the magnetoresistive technologies, it is showing a steady growth. The industry is step by step undergoing a consolidation process. According to Yole Développement (Yole), future mergers and acquisitions are expected to allow companies to ensure their market positioning and penetrate new market segments.

The “More than More” market research and strategy consulting company, proposes today a dedicated technology & market report related to semiconductor magnetic sensors industry: Magnetic Sensors Market & Technologies. Magnetic sensors functions included in this new analysis are switches/latches, position (angle/linear), speed, current and electronic compass. With this new report, Yole’s analysts are offering a comprehensive overview of the magnetic technologies such as Hall Effect, magneto resistive (AMR, GMR and TMR) and others, combined with market data and competitive landscape. Based on its strong knowledge of the semiconductor industry and its technical expertise, Yole’s team investigated the magnetic sensor ecosystem, conducted numerous interviews with leading players and gathered lot of strategic information. This report presents the key driving forces and restraints for each magnetic sensor market and provides accurate market forecasts in dollars, units and number of wafers.

magnetic sensor market

Magnetic sensors is becoming a key enabling technology for the growing automotive and IoT industries, announces the consulting company.

“Automotive market is the 1st magnetic sensors business thanks to a huge number of magnetic sensors per vehicle, as well as the large volume showed by the automotive sector,” said Yann de Charentenay, Technology & Market Analyst at Yole.

Therefore automotive is the biggest magnetic sensor business by far, accounting for more than 50% of the overall market’s US$1.64 billion value in 2016. Today, 20-30 magnetic sensors are used in a traditional ICE car. This could rise to 35 in hybrid cars, which require additional current sensors. Magnetic sensors can be used for position and speed sensing, switching, current sensing, and have the advantage of being contactless and thus very robust. Thus magnetic sensors already contribute significantly to car electrification. This will continue in coming years, in both powertrain and auxiliary brushless motors, and as reliability requirements increase for autonomous cars.

In parallel, Yole’s analysts consider a 2nd market segment including industrial plants, transportation, homes, appliances and consumer electronics. “The market is clearly very fragmented, with smaller volumes and more dedicated products than in automotive, which are thus also higher priced”, details Yann de Charentenay from Yole. But similar trends as in automotive are currently driving the market growth. And the transition to brushless motors and IoT are boosting the market by providing intelligence and connectivity to objects either for ‘industry 4.0’ or for consumer smart homes. “At Yole, we therefore expect this business will have double digit growth, the highest in the magnetic sensor market,” added Yann de Charentenay.

The ‘ecompass’ electronic compass market is stabilizing after several years of shrinkage due to rapid price erosion and smartphone market saturation. Ecompasses that use 3D magnetic sensors equip a majority of smartphones to precisely give pedestrians directions in digital maps, and for a few years have assisted GPS when satellite signals are unavailable. Market growth will come back thanks to new applications such as wearable, robots and drones, but will be moderate compared to other businesses.

The magnetic sensors market evolution is also pushed by a dynamic technology landscape. Indeed, the presence of magnetoresistive technologies, named xMR grows and reinforces the increasing complexity of the technology environment. It includes AMR, GMR, and more recently TMR. Their growth comes at the expense of, or combination with, historical Hall Effect technology.
xMR technologies’ main advantage is better sensitivity and thus they are mainly used for position measurement, especially for precise angles. Most big Hall players have introduced xMR technologies into their product portfolios and intend to grow this business. Yole’s analysis identified: AKM, Infineon Technologies, Allegro Microsystems, Melexis, TDK (especially with the acquisition of Micronas end of 2015), Diodes and Honeywell. According to Yole, xMR technologies will increase their market share from 27% to 33% from 2016 to 2022.

Leti announced today that a team of its researchers is participating in a U.S.-funded project to develop a safe, implantable neural interface system to restore vision by stimulating the visual cortex.

Funded by the U.S. Defense Advanced Research Projects Agency (DARPA), the Neural Engineering System Design program (NESD) sets out to expand neurotechnology capabilities and provide a foundation for future treatments of sensory deficits.

Scientists from Leti and Clinatec, Leti’s biomedical research center focused on applying micro- and nanotechnology innovations to health care, are part of a consortium conducted by the Paris Vision Institute under the leadership of Prof. José-Alain Sahel and Dr. Serge Picaud. The Vision Institute is a leading European research center in eye diseases, and is part of the Seeing and Hearing Foundation (Fondation Voir et Entendre, FVE), which was awarded the DARPA grant.

The FVE team project, called CorticalSight, is part of the six projects selected by DARPA to participate in the groundbreaking NESD program. CorticalSight will apply techniques from the field of optogenetics to enable communication between neurons in the visual cortex and a camera-based, high-definition artificial retina worn over the eyes. Leti will lead the development of the active implantable medical device that will interface with the visual cortex.

Clinatec and its Leti partners will focus on developing a safe, wireless, implantable system that restores vision through light stimulation of optogenetically modified neurons in the visual cortex. Leti is tasked with designing an implantable device, as well as creating hermetic packaging and radiofrequency links for the implantable system, and subsequently conducting technical test benches. The Leti implant will enable visual cortex optical-stimulation patterns, and integrate the underlying control electronics within a minimally invasive cortical implant.

“Clinatec’s integrated approach to high-tech, medical-device R&D, extending from Leti’s technological development to in-house clinical expertise and testing capabilities, allows our teams to address cutting-edge medtech development challenges,” said Prof. Alim-Louis Benabid, Clinatec’s chairman of the board, and co-investigator of the CorticalSight project. “This contribution to the CorticalSight consortium will pave the way to new therapeutic devices for vision restoration thanks to the NESD program.”

Partners of the CorticalSight project also include the French companies Chronocam and Gensight®, Stanford University, Inscopix and the Friedrich Miescher Institute of Switzerland.

By Ajit Manocha, president and CEO, SEMI

Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding. Early in SEMI’s history, SEMI’s always intelligent members worked together to introduce International Standards that enabled different pieces of equipment to collect and later pass data.  At first, it was for basic interoperability and equipment state analysis.  Later, SEMI data protocol Standards allowed process and metrology data to be used locally and across the fab to approach the goals of Smart Manufacturing and AI – for the equipment itself to make adjustments based on incoming wafer data.

Ajit--photo 1--sample.e.XL3A5483 (from pdg)As a part of this evolution, SEMI members developed the latest sensors and computational hardware that could ever better sense, analyze and act on the environment. Often first to use its own newly developed hardware, progress in this area was critical toward improving the likelihood of success for one of the world’s most complicated production processes – and coping with the breakneck speed of Moore’s Law – by accelerating capabilities that would later be regarded as the basis for machine learning and “thinking” systems.

Since then, process steps have increased from about 175 to as many as 1,000 for the leading technology nodes. By the time 300mm wafers were introduced, manufacturing intelligence and automation sharply increased productivity while reducing fab labor by more than 25 percent. Employing adaptive models, modern leading-edge factories are fully automated and operate at nearly 60 percent autonomous control.

Today, AI is akin to where IoT was yesterday in the hype cycle – popping up everywhere as a major consideration for the future. Neither IoT nor AI is hype, though – they’re the future.  There is ever more at stake for SEMI members with AI.  AI appears to be the next wave helping to maintain double-digit growth for the foreseeable future.

As part of its appeal for the global supply chain, AI can be a key silicon driver for three inflections that should benefit society. First, there is a massive increase in the amount of compute needed. Half of all the compute architectures shipping in 2021 will be supporting and processing AI.

Second, the Cloud will flourish and the Edge will bloom. By 2021, 50 percent of enterprise infrastructure will employ cognitive and artificial intelligence.

Third, new species of chips will emerge, such as the devices fueling IC content and electronics for the rapid growth of disruptive capabilities in vehicles and autonomous cars (as well as medical and agricultural applications, for example). There are also many more advantages created with and for AI as SEMI members enable new materials and advanced packaging.

What results can be measured from these changes for the global electronics manufacturing supply chain? More apps, more electronics, more silicon and more manufacturing.

On the other hand, the technologies alone create relatively little business value if the problems in our factories and markets are not well understood. There’s a great need to anticipate and guide AI. This requires a new kind of collaboration.

To address this need, SEMI’s vertical application platforms have been created for Smart Data (which is all about AI), and also for Smart MedTech, Smart Transportation, Smart Manufacturing and IoT. This higher degree of facilitated collaboration serves to cultivate multiple “smart communities” that accelerate progress for AI, better directing how connected networks and data mining can step up the pace for advancement of global prosperity. This process also provides members with access to untapped business opportunities and new players.​​

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We at SEMI are learning right along with our members. If you attended SEMICON West in July, several lessons about AI were presented by the Executive Panel (“Meeting the Challenges of the 4th Industrial Revolutions along the Microelectronics Supply Chain”) with Mary Puma (Axcelis), Shaheen Dayal (Intel), Lori Ciano (Brooks Automation) and Regenia Sanders (Ernst & Young). This very timely and excellent panel discussed how and where predictive analytics can have the biggest impact and the implications of sharing (and not sharing) data for problem solving and process optimization.

Ensuring that the SEMI staff gleans everything possible from the experts, we hosted an “encore” of the Executive Panel in October in our headquarters for an even more in-depth discussion about how to enhance collaboration across the supply chain in support of AI.

Going forward, these SEMI vertical platform communities will help to simplify and accelerate supply chain engagement for member value. Collaboration will play an ever greater role for using AI to master the making of advanced node semiconductor devices and enabling limitless cognitive computing. As a result, AI as we know it today, has a big head start over the previous pace of evolution for one of our great trendsetters, Moore’s Law.

Join the conversation.  Find out how you can work with SEMI to advance the AI – and especially AI in semiconductor manufacturing.  Frank Shemansky Jr., Ph.D., is heading up SEMI’s formation of SEMI’s Smart Data vertical application platform.  Let Frank know ([email protected]) you’re interested and he’ll give you more information on what’s to come.  As always, please let me know your thoughts.

 

The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

BY STACY WEGNER, Ottawa, Canada, and JEONGDONG CHOE, Ottawa, Canada

TechInsights analysts have been keeping an intent watch on where technology has progressed, how it’s changing, and what new developments are emerging. At the end of the first quarter, our analysts shared their insights and thoughts about what to keep an eye on as the year unfolds. In this article, they provide an update on what 2017 has delivered so far.

Intelligent, connected devices

As we wrote earlier this year, in 2016, wearables were extremely interesting mainly because there was so much uncertainty around whether or not the market would be viable. Some, no, many, say the wearables market will cool off and possibly just expire. At TechInsights, we do will not speculate about whether this market is going to survive. We will report what we find and analyze what is currently being sold. Apple, Samsung, and Huawei have all released smartwatches for what would parallel a “flagship” in the mobile market (FIGURE 1). Fitness bands are becoming even ”smarter” and combining sensors where possible. Perhaps one of the most notable developments is Nokia’s acquisition and complete integration of Withings into its existing brands.

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We are witnessing the “rise of the machines,” in products from scales and hair brushes to rice cookers. Primarily these devices offer consumers convenience. For example, with a connected scale, instead of recording your weight manually, the smart scales do the job for you, syncing with various health apps so you can track your weight over time. The connected hair brush provides insights into your hair’s manageability, frizziness, dryness, split ends and breakage to provide a hair quality score. Brushing patterns, pressure applied and brush stroke counts are analyzed to measure effectiveness of brushing habits and a personal diagnosis is provided with tips and real-time product recommendations. The most common connected devices include refrigerators, lights, washing machines, thermostats, and televisions.

One dominant example is the ever-popular Amazon Echo, which has taken on a life of its own and is generating spin-off markets and competition. In July, it was reported that Amazon’s Alexa voice platform passed 15,000 skills — the voice-powered apps that run on devices like the Echo speaker, Echo Dot, newer Echo Show and others. The figure is up from the 10,000 skills Amazon officially announced in February. Amazon’s Alexa is building out an entire voice app ecosystem putting it much further ahead than its nearest competitor. The success seen with Echo has motivated other companies like Google, Lenovo, LG, Samsung and Apple to release compet- itive speakers, however it is estimated that Amazon is expected to control 70 percent of the market this year. In addition, Amazon and Microsoft recently announced a partnership to better integrate their digital assistants. This cross-platform integration provides users with access to Cortana features that Alexa is missing, and vice versa. Finally, the high- performance far-field microphones found in Amazon Echo products may soon find their way to other hardware companies as Amazon announced that the technology is available to those who want to integrate into the Alexa Experience. With its new reference solution, it’s never been easier for device makers to integrate Alexa and offer their customers the same voice experiences.

In the mobile market overall, we are seeing a strong emergence of devices targeted for the very hot market of India. The mobile devices for this market range from supporting 15 or more cellular bands to as few as five cellular bands, and that is for smart- phones. At TechInsights, we will be analyzing OEMs in India like Micromax, Intex, and Lava to see how they approach dealing with strong competitors like Samsung and Xiaomi.

Memory devices

In early 2017, 32L and 48L 3D NAND products were common and all the NAND players were eager to develop next generation 3D NAND products such as 64L and 128L. 3D NAND has been jumping into 64L (FIGURE 2). Samsung, Western Digital, Toshiba, Intel, and Micron already revealed CS or mass-products on the market. SK Hynix also showed their 72L NAND die as a CS product. In the second half of this year, we will see 64L and 72L NAND products on the commercial market. For n+1 generation with 96L or 128L, we expect that two-stacked cell array architecture for 3D NAND would be adopted in 2018. Micron/Intel will keep their own FG based 3D NAND cell structure for the next generation.

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Referring to DRAM, all the major players already used their advanced process technology for cell array integration such as an advanced ALD for high-k dielectrics, low damage plasma etching and honeycomb capacitor structure. Buried WL, landing pad and plug for a capacitor node, and MESH structure are still main stream. Samsung 18nm DRAM products for DDR4 and LPDDR4X are on the market. SK Hynix and Micron will reveal the same tech node DRAM products in this year. n+1 gener- ation with 15nm or 16nm node will be next in 2018. Once 6F2 15nm DRAM cell technology is successful, 4F2 DRAM products such as a capacitorless DRAM might be delayed. In 2018, 18nm and 15nm DRAM technology will be used for GDDR6 and LPDDR5.

When it comes to emerging memory, 3D XPoint memory technology is a hot potato (FIGURE 3). The XPoint products from Intel are on the market as an Optane SSD with 16GB and 32GB. Performance including retention, reliability and speed are not matched as expected, but they used a double stacked memory cell between M4 and M5 on the memory array. It’s a PCM with GST based material. An OTS with Se-As-Ge-Si is added between the PCM and the electrode (WL or BL). We expect to see multiple (triple or quadruple) stacked XPoint memory architecture within a couple years. For other emerging memory such as STT-MRAM, PCRAM and ReRAM, we’re waiting on some commercial products from Adesto (CBRAM 45nm, RM33 series) and Everspin (STT-MRAM pMTJ 256Mb, AUP-AXL-M128).

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Conclusion

The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing. As our analysts continue to examine and reveal the innovations others can’t inside advanced technology, we will continue to share our findings on these and new technologies as they emerge, including how they are used, how they impact the market, and how they will be changed by the next discovery or invention.

SEMI-MSIG’s MEMS & Sensors Executive Congress (MSEC) held November 1-2 in San Jose, CA, challenged industry executives to see beyond traditional dividing lines of human-machine interaction. MEMS and sensors were hailed as the enablers for pervasive, connected and contextually aware computing and seen as drivers for an explosion of new applications and possibilities. Securing autonomous vehicles from hackers and improving crop yields to feed the 10 billion people we will have on the planet by 2050 were two popular examples of new applications.

Keynote Speaker Intel’'s Lama Nachman discussed contextually aware systems.

Keynote Speaker Intel’’s Lama Nachman discussed contextually aware systems.

Lama Nachman, Intel fellow and director of the company’s Anticipatory Computing Lab, explored contextually aware systems during her keynote. Lachman said that technology needs to be more proactive, anticipating our needs, e.g., Google Now. One challenge lies in using sensors to measure things for which they were not designed, such as emotions and physiology. Lachman exhorted MSEC attendees to develop more configurable systems and sensors so that they can be used for other applications and possibly drive the next “killer app.”

Lars Reger, CTO, NXP Automotive Business Unit, described the essential and extensive use of MEMS and sensors in automotive connectivity, autonomy, electrification, and safe and secure mobility during his keynote. Reger noted that “motion sensors are the key to increasing security in keyless entry systems, reducing hacking.” He concluded that “entering a new era of automated driving requires functional safety and security,” telling MSEC attendees, “we need the best sensors to achieve a failure-free model in autonomous vehicles.”

Alissa Fitzgerald, founder and managing member, A.M. Fitzgerald & Associates, noted that the pipeline for emerging technologies generally begins with university labs turning out proof-of-concept devices. “The next $1B product is lurking in a lab somewhere,” said Fitzgerald. She also encouraged attendees to look for key trends in emerging technologies, citing “ultra-low power, a migration from capacitive MEMS to piezoelectric sensors and actuators, the stagnation of silicon sensors, and a movement toward paper and plastic sensors.” She drew her results from a review of more than 500 papers from academic conferences, filtered for commercial viability.

Henri Hekman, CEO and president of SoilCares BV, explained how his company is using MEMS near infrared (NIR) devices to scan soil samples. “To feed a surging global population, we cannot increase arable land so we must increase agricultural productivity. The place to start is in the soil.” Hekman said that SoilCares is conducting trials in Africa and North America as it launches in 20 countries in 2017.

SEMI-MSIG Executive Director Frank Shemansky expanded upon themes from MEMS & Sensors Executive Congress. “From device-makers to commercial application developers, there was a collective buzz around ubiquitous intelligent sensing,” said Shemansky. “Speakers explored the critical role of sensing in more natural and immersive user interfaces, including voice, in interpreting emotion, in anticipating needs, in managing medication, and in providing safer, more secure ways to build autonomous vehicles that will actually save human lives. As we look toward 2018 and beyond, the MEMS and sensors industry will continue to work closely with the consumers of our products, as we help them to further advance human-machine interaction in meaningful ways.”

Technology Showcase Winner and Hall of Fame Recognitions
A highly anticipated event at the Executive Congress, the Technology Showcase, was a forum where four finalists competed for attendees’ votes and the title of “winner.” The 2017 Technology Showcase winner, Menlo Digital-Micro-Switch Technology by Menlo Micro, demonstrates fundamental materials’ advancements that improve the size, speed, power handling and reliability of MEMS switches. Menlo Micro’s MEMS-based switching element is the width of a human hair, enabling RF switching 1,000 times faster and lasts 1,000 times longer than traditional mechanical switches.

SEMI-MSIG also inducted two new members into the SEMI-MSIG Hall of Fame: Raji Baskaran, pathfinding lead, Hardware and Software Co-optimization, Intel Corporation: Saffron Technology Group, and Kevin Crofton, executive vice president and COO, SPTS Technologies, an Orbotech Company.

 

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 – 2022.

Under this dynamic context, Yole Group of Companies including Yole and its sister company System Plus Consulting proposes today a comprehensive review of the technology evolution, market trends and competitive landscape, with two reports, MEMS Packaging and MEMS Packaging: Reverse Technology Review.

The MEMS packaging report offers a deep understanding of the packaging over the years, detailed roadmap for future solutions, related market metrics and detailed analysis of the supply chain. In parallel, the MEMS Packaging: Reverse Technology Review details a comparative technology review and discloses insights into the packaging structure and technology of 80+ consumer and 20+ automotive MEMS devices developed by leading players: Robert Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…

The MEMS packaging market is becoming more and more attractive, offering important business opportunities for advanced packaging companies. What are the market needs? What are the conditions to penetrate this market? Are the technologies “ready to use”? Through its analyses, Yole Group believes that companies which will be successful, are the ones that will adapt their technologies portfolio to match with the market evolution and ensure their market shares. Yole and System Plus Consulting’s analysts put a spotlight today on MEMS packaging.

MEMS devices are characterized by a wide range of different designs and manufacturing technologies, with no standardized processes. As a consequence, many technical challenges are in place and create a strong competition between packaging companies.

“Players have to take into account specifies of each component as well as many application constraints, from the need to low cost packaging for consumer applications to the ability to withstand high temperature and harsh environment for automotive and aeronautics packaging,” explained Dr. Eric Mounier, Senior Technology & Market Analylst at Yole.

MEMS application scope is broad, very fragmented and diversified. Therefore, under its annual report, Status of the MEMS Industry, Yole’s MEMS & Sensors team analyzed more than 200+ applications. Thus, MEMS packaging must always cope with different end-application requirements. It includes for example, protection in different media, hermeticity, interconnection type, and thermal management. This context creates many issues within the packaging industry, which faces different package configurations (open/ closed package).

Under System Plus Consulting’s report, MEMS Packaging: Reverse Technology Review, the company analyzed more than 100 MEMS components developed by the major manufacturers. This review is a relevant comparison between the main existing packaging solutions. It includes the encapsulation processes, the preferred interconnection methods as well as the latest innovations. System Plus Consulting also evaluated the components in term of integration and functionalities.

“No tremendous changes in packaging platforms are expected,” commented Audrey Lahrach, in charge of costing analyses at System Plus Consulting.“But we rather see a change in the complexity of existing platforms to respond to the growing needs of sensor fusions.” Therefore, combining inertial and pressure sensors is now a reality. For example TDK/InvenSense released this month a high-performance “7-Axis” motion tracking device targeting drone applications and based on an exclusive assembly step stacking the 3-axis gyroscope, the 3-axis accelerometer and a barometric pressure sensor (1).

Driven by the complexity associated with the move to 5G and therefore the increasing demand for RF filters in 4G/5G, the largest MEMS growth will be for RF MEMS, especially BAW filters (2).
“The real opportunity of MEMS packaging is carried by RF MEMS devices as the number of units could be multiplied by five by 2022,” confirmed Dr. Mounier from Yole. Optical MEMS including micro mirrors and micro bolometers are second with a 28.5% CAGR, driven by consumer, automotive, and security applications.

Acoustic and ultrasonic sensors including microphones are third. Demand for audio processing is particularly strong, with high unit growth for MEMS microphones targeted at increasingly sophisticated applications that use the microphone to continuously sense what is happening around it.

But why is the MEMS packaging industry becoming so attractive? Yole identified several reasons:
“OSATs already have very low package margins due to fierce competition” asserted Emilie Jolivet, Technology & Market Analyst at Yole. And she added: “And it will be difficult for such companies to lower the cost further.”

The second factor is related to the importance of testing steps. Because every MEMS is different, testing strategies defined by MEMS devices manufacturers are usually dedicated to one device type and account for a significant fraction of the final cost.

The third reason is focused on the packaging’s material cost that is playing a key role within the attractiveness of the MEMS packaging business.

At the end, the strong CAGR of certain devices such as RF MEMS devices, also directly impacts the MEMS packaging industry with numerous opportunities to ensure larger volumes and better margins.

More than a dozen product categories in optoelectronics, sensors and actuators, and discretes semiconductors (O-S-D) are on track to set record-high annual sales this year, according to a new update of IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discrete Semiconductors.  Driven by the expansion of the Internet of Things (IoT), increasing levels of intelligent embedded controls, and some inventory replenishment in commodity discretes, the diverse O-S-D marketplace is having a banner year with combined sales across all three semiconductor segments expected to grow 10.5% in 2017 to a record-high $75.0 billion, says the O-S-D Report update.

In 2017, above average sales growth rates are being achieved in all but one major O-S-D product category—lamp devices, which are now expected to be flat in 2017 because of continued price erosion in light-emitting diodes (LEDs) for solid-state lighting applications.  Figure 1 compares annual growth rates in five major O-S-D product categories, based on the updated 2017 sales projection.

Figure 1

Figure 1

For the first time since 2014, all three O-S-D market segments are on pace to see sales growth in 2017. Moreover, 2017 is expected to be the first year since 2011 when all three O-S-D market segments set record-high annual sales volumes, according to IC Insights’ update.

The 2017 double-digit percent increase will be the highest growth rate for combined O-S-D sales since the strong 2010 recovery from the 2009 semiconductor downturn that coincided with the 2008-2009 financial crisis and global economic recession.  Total O-S-D revenues are now forecast to reach a ninth consecutive annual record high level of $80.5 billion in 2018, which will be a 7.4% increase from 2017 sales, says the O-S-D Report update.

After a rare decline of 3.6% in 2016, optoelectronics is recovering this year with sales now projected to grow 8.1% in 2017 to an all-time high of $36.7 billion, thanks to strong double-digit sales increases in CMOS image sensors (+22%), light sensors (+19%), optical-network laser transmitters (+15%), and infrared devices (+14%).

Meanwhile, record-high revenues for sensors and actuators are being fueled by the expansion of IoT and new automated controls in a wide range of systems—including more self-driving features in cars. Sensors/actuator sales are now expected to climb 17.5% in 2017 to $13.9 billion, marking the strongest growth year for this market segment since 2010.  Sales of sensors and actuators made with microelectromechanical systems (MEMS) technology are forecast to rise by 18.5% in 2017 to a record-high $11.6 billion.  The O-S-D Report update shows all-time high sales being reached in 2017 with strong double-digit growth in actuators (+20%), pressure sensor, including MEMS microphone chips (+18%), and acceleration/yaw sensors (+17%).

Even the commodity-filled discretes market is thriving in 2017 with worldwide sales projected to rise 10.3% to $24.1 billion, which will finally surpass the current peak of $23.4 billion set in 2011.  Sales of power transistors, which account for more than half of the discretes market segment, are forecast to grow 9.0% in 2017 to a record-high $14.0 billion, according to the new O-S-D Report update.

The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit (Nasdaq: INFO).

In a new free ebook entitled “The Internet of Things: a movement, not a market,” IHS Markit details how the IoT is revolutionizing the competitive landscape by transforming everyday business practices and opening new windows of opportunity.

According to the ebook, global data transmissions are expected to increase from 20 to 25 percent annually to 50 percent per year, on average, in the next 15 years.

“The emerging IoT movement is impacting virtually all stages of industry and nearly all market areas — from raw materials to production to distribution and even the consumption of final goods,” said Jenalea Howell, research director for IoT connectivity and smart cities at IHS Markit. “This represents a constantly evolving movement of profound change in how humans interact with machines, information and even each other.”

IHS Markit has identified four foundational, interconnected pillars at the core of the IoT movement: connect, collect, compute and create. The entire IoT is built upon these four innovational pillars:

  • New connections of devices and information
  • Enhanced collection of data that grows from the connections of devices and information
  • Advanced computation that transforms collected data into new possibilities
  • Unique creation of new interactions, business models and solutions.

“While internet-connected devices hold tremendous potential, many companies are having difficulty identifying a consistent IoT strategy,” Howell said. “The four Cs of IoT — connect, collect, compute, create — offer a pathway to navigate and take advantage of the changes and opportunities brought about by the IoT revolution.”

The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel, may go down as one of the most memorable editions for the sheer variety and depth of its talks, sessions, courses and events.

Among the most-anticipated talks are presentations by Intel and Globalfoundries, which will each detail their forthcoming competing FinFET transistor technology platforms in a session on Wednesday morning. FinFET transistors are a major driver of the continuing progress of the electronics industry, and these platforms are as important for their commercial potential as they are for their technical innovations.*

Each year at the IEDM, the world’s best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

“Those who attend IEDM 2017 will find much that is familiar, beginning with a technical program describing breakthroughs in areas ranging from mainstream CMOS technology to innovative nanoelectronics to medical devices. The Sunday Short Courses are also a perennial favorite because they are not only comprehensive but are also taught by accomplished world experts,” said Dr. Barbara De Salvo, Scientific Director at Leti. “But we have added some new features this year. One is a fourth Plenary session, on Wednesday morning, featuring Nobel winner Hiroshi Amano. Another is a revamped Tuesday evening panel. Not only will it focus on a topic of great interest to many people, it is designed to be more open and less formal.”

Other features of the IEDM 2017 include:

  • Focus Sessions on the following topics: 3D Integration and Packaging; Modeling Challenges for Neuromorphic Computing; Nanosensors for Disease Diagnostics; and Silicon Photonics: Current Status and Perspectives.
  • A vendor exhibition will be held, based on the success of last year’s event at the IEDM.
  • The IEEE Magnetics Society will again host a joint poster session on MRAM (magnetic RAM) in the exhibit area. New for this year, though, is that the Society will also hold its annual MRAM Global Innovation Forum on Thursday, Dec. 7 at the same hotel, enabling IEDM attendees to participate. (Refer to the IEEE Magnetics Society website.) The forum consists of invited talks by leading experts and a panel discussion.

Here are details of some of the events that will take place at this year’s IEDM:

90-Minute Tutorials – Saturday, Dec. 2
These tutorials on emerging technologies will be presented by leading technical experts in each area, with the goal of bridging the gap between textbook-level knowledge and cutting-edge current research.

  • The Evolution of Logic Transistors Toward Low Power and High Performance IoT Applications, Dr. Dae Won Ha, Samsung Electronics
  • Negative Capacitance Transistors, Prof. Sayeef Salahuddin, UC Berkeley
  • Fundamental, Thermal, and Energy Limits of PCM and ReRAM, Prof. Eric Pop, Stanford University
  • Hardware Opportunities in Cognitive Computing: Near- and Far-Term, Dr. Geoffrey Burr, Principal Research Staff Member, IBM Research-Almaden
  • 2.5D Interposers and High-Density Fanout Packaging as Enablers for Future Systems Integration, Dr. Venkatesh Sundaram, Associate Director, Georgia Tech 3D Systems Packaging Research Center
  • Silicon Photonics for Next-Generation Optical Interconnects, Dr. Joris Van Campenhout, Program Director Optical I/O, Imec

Short Courses – Sunday, Dec. 3
The day-long Short Courses provide the opportunity to learn about important developments in key areas, and they enable attendees to network with the industry’s leading technologists.

Boosting Performance, Ensuring Reliability, Managing Variability in Sub-5nm CMOS, organized by Sandy Liao of Intel, will feature the following sections:

  • Transistor Performance Elements for 5nm Node and Beyond, Gen Tsutsui, IBM
  • Multi-Vt Engineering and Gate Performance Control for Advanced FinFET Architecture, Steve CH Hung, Applied Materials
  • Sub-5nm Interconnect Trends and Opportunities, Zsolt Tokei, Imec
  • Transistor Reliability: Physics, Current Status, and Future Considerations, Stephen M. Ramey, Intel
  • Back End Reliability Scaling Challenges, Variation Management, and Performance Boosters for sub-5nm CMOS,Cathyrn Christiansen, Globalfoundries
  • Design-Technology Co-Optimization for Beyond 5nm Node, Andy Wei, TechInsights

Merged Memory-Logic Technologies and Their Applications, organized by Kevin Zhang of TSMC, will feature the following sections:

  • Embedded Non Volatile Memory for Automotive Applications, Alfonso Maurelli, STMicroelectronics
  • 3D ReRAM: Crosspoint Memory Technologies, Nirmal Ramaswamy, Micron
  • Ferroelectric Memory in CMOS Processes, Thomas Mikolajick, Namlab
  • Embedded Memories Technology Scaling & STT-MRAM for IoT & Automotive, Danny P. Shum, Globalfoundries
  • Embedded Memories for Energy-Efficient Computing, Jonathan Chang, TSMC
  • Abundant-Data Computing: The N3XT 1,000X, Subhasish Mitra, Stanford University

Plenary Presentations – Monday, Dec. 4

  • Driving the Future of High-Performance Computing, Lisa Su, President & CEO, AMD
  • Energy-Efficient Computing and Sensing: From Silicon to the Cloud, Adrian Ionescu, Professor, EPFL
  • System Scaling Innovation for Intelligent Ubiquitous Computing, Jack Sun, VP of R&D, TSMC

Plenary Presentation – Wednesday, Dec. 6

  • Development of a Sustainable Smart Society by Transformative Electronics, Hiroshi Amano, Professor, Nagoya University. Dr. Amano received the 2014 Nobel Prize in Physics along with Isamu Akasaki and Shuji Nakamura for the invention of efficient blue LEDs, which sparked a revolution in innovative, energy-saving lighting. His talk will be preceded by the Focus Session on silicon photonics.

Evening Panel Session – Tuesday evening, Dec. 5

  • Where will the Next Intel be Headquartered?  Moderator: Prof. Philip Wong, Stanford

Entrepreneurs Lunch
Jointly sponsored by IEDM and IEEE EDS Women in Engineering, this year’s Entrepreneurs Lunch will feature Courtney Gras, Executive Director for Launch League, a local nonprofit focused on developing a strong startup ecosystem in Ohio. The moderator will be Prof. Leda Lunardi from North Carolina State University. Gras is an engineer by training and an entrepreneur by nature. After leaving her job as a NASA power systems engineer to work for on own startup company, she discovered a passion for building startup communities and helping technology-focused companies meet their goals. Named to the Forbes ’30 Under 30′ list in 2016, among many other recognitions and awards, Gras enjoys sharing her stories of founding a cleantech company with young entrepreneurs. She speaks on entrepreneurship, women in technology and clean energy at venues such as TEDx Budapest, the Pioneers Festival, and the IEEE WIE International Women’s Leadership Conference.

 

From lifesaving smart headsets for truck drivers to gliding electric skateboards, five companies using MEMS and sensors will compete for audience votes during the Technology Showcase at the SEMI | MSIG MEMS & Sensors Executive Congress on November 1-2 in Napa Valley, Calif. As a featured event at the MEMS & Sensors Industry Group (MSIG) annual professional forum for executives from MEMS/sensors manufacturing and their end-user customers, the Technology Showcase highlights the newest and most unique MEMS/sensors-enabled applications in the industry.

“This year’s Technology Showcase finalists at the MEMS & Sensors Executive Congress are as fascinating as they are diverse,” said Frank Shemansky, CTO of SEMI | MSIG. “Imagine, for example, a MEMS-based switching element the width of a human hair, enabling RF switching that is 1,000 times faster and lasts 1,000 times longer than traditional mechanical switches. That is the kind of MEMS technology that could dramatically improve wireless applications, and it is just one of our Tech Showcase finalists ─  the others are equally compelling. The Tech Showcase is always a big draw at the Executive Congress because it gives attendees the chance to personally interact with the finalists’ demos to decide their vote for the winner – one of whom will be ‘crowned’ at the close of the conference.”

Tech Showcase Finalists

The LEIF eSnowboard by LEIF Technologies is the world’s first light electric vehicle that moves just like a snowboard. The LEIF brings to the pavement the smooth, sliding moves only found on a mountain or a wave — up to 23 mph and 15 miles per battery pack.

The Maven Co-Pilot by Maven Machines is the first smart headset for truck drivers. Employing MEMS, sensor fusion, wearable technology, machine intelligence and mobile-cloud architecture, the Maven Co-Pilot monitors drivers’ fatigue and distraction levels 50 times per second to provide accurate instantaneous early warnings to both drivers and fleet managers.

Menlo Digital-Micro-Switch Technology by Menlo Micro demonstrates fundamental materials’ advancements that improve the size, speed, power handling and reliability of MEMS switches. Smaller than the width of a human hair, Menlo Micro’s switching elements are so small that hundreds of them fit in a space smaller than 10mm2. Menlo Micro switches operate 1,000x faster than traditional mechanical switches — in a few microseconds rather than milliseconds. Their scalable architecture allows the handling of 100s of volts and 10s of amps without arcing. Menlo Micro’s devices last 1,000x longer than traditional mechanical switches, supporting billions of cycles without performance degradation.

The Berries Smart Sensor series by eLichens are patented autonomous non-dispersive infrared (NDIR) gas sensors offered in a 2 x 2 x 1cm package. These sensors integrate a dual-channel feature for a calibration-free long-life cycle. The miniaturized optical gas sensor is a complete system in package (SIP) integrating a proprietary infrared MEMS emitter and detectors, a highly efficient patented optical sampling chamber, and signal processing. The Berries series address the demanding requirements of the gas-sensing industries, where accuracy, auto-calibration and low power consumption are essential for new generations of gas- and air-detection products.

Coupled Time Domain Simulation for MEMS Sensors and System Integration by PZFlex lets engineers model and simulate a wide range of physics in new MEMS areas such as piezoelectric micromachined ultrasonic transducers (PMUTs) for fingerprint sensing. Engineers can conduct large-scale time-domain finite element analysis (FEA) simulation using PZFlex to gain insights into discrete device performance, device array performance, and full system performance for a PMUT fingerprint sensor embedded within a smartphone touch-display stackup.

MEMS & Sensors Executive Congress 2017 will take place November 1-2 at the Silverado Resort and Spa in Napa Valley, Calif. For more information, please contact SEMI via email: [email protected] or visit: www.semi.org/en/mems-sensors-executive-congress-2017.