Category Archives: Packaging

Ever shrinking transistors are the key to faster and more efficient computer processing. Since the 1970s, advancements in electronics have largely been driven by the steady pace with which these tiny components have grown simultaneously smaller and more powerful–right down to their current dimensions on the nanometer scale. But recent years have seen this progress plateau, as researchers grapple with whether transistors may have finally hit their size limit. High among the list of hurdles standing in the way of further miniaturization: problems caused by “leakage current.”

Leakage current results when the gap between two metal electrodes narrows to the point that electrons are no longer contained by their barriers, a phenomenon known as quantum mechanical tunnelling. As the gap continues to decrease, this tunnelling conduction increases at an exponentially higher rate, rendering further miniaturization extremely challenging. Scientific consensus has long held that vacuum barriers represent the most effective means to curtail tunnelling, making them the best overall option for insulating transistors. However, even vacuum barriers can allow for some leakage due to quantum tunnelling.

In a highly interdisciplinary collaboration, researchers across Columbia Engineering, Columbia University Department of Chemistry, Shanghai Normal University, and the University of Copenhagen have upended conventional wisdom, synthesizing the first molecule capable of insulating at the nanometer scale more effectively than a vacuum barrier. Their findings are published online today in Nature.

“We’ve reached the point where it’s critical for researchers to develop creative solutions for redesigning insulators. Our molecular strategy represents a new design principle for classic devices, with the potential to support continued miniaturization in the near term,” said Columbia Engineering physicist and co-author Latha Venkataraman, who heads the lab where researcher Haixing Li conducted the project’s experimental work. Molecular synthesis was carried out in the Colin Nuckolls Lab at Columbia’s Department of Chemistry, in partnership with Shengxiong Xiao at Shanghai Normal University.

The team’s insight was to exploit the wave nature of electrons. By designing an extremely rigid silicon-based molecule under 1 nm in length that exhibited comprehensive destructive interference signatures, they devised a novel technique for blocking tunnelling conduction at the nanoscale.

“This quantum interference-based approach sets a new standard for short insulating molecules,” said lead author Marc Garner, a chemist in the University of Copenhagen’s Solomon Lab, which handled the theoretical work. “Theoretically, interference can lead to complete cancellation of tunneling probability, and we’ve shown that the insulating component in our molecule is less conducting than a vacuum gap of same dimensions. At the same time, our work also improves on recent research into carbon-based systems, which were thought to be the best molecular insulators until now.”

Destructive quantum interference occurs when the peaks and valleys of two waves are placed exactly out of phase, annulling oscillation. Electronic waves can be thought of as analogous to sound waves–flowing through barriers just as sound waves “leak” through walls. The unique properties exhibited by the team’s synthetic molecule mitigated tunneling without requiring, in this analogy, a thicker wall.

Their silicon-based strategy also presents a potentially more factory-ready solution. While recent research into carbon nanotubes holds promise for industrial applications over the next decade or so, this insulator–compatible with current industry standards–could be more readily implemented.

“Congratulations to the team on this breakthrough,” said Mark Ratner, a pioneer in the field of molecular electronics and professor emeritus at Northwestern University who was not involved in the study. “Using interference to create an insulator has been ignored up to this date. This paper demonstrates the ability of interference, in a silicon-based sigma system, which is quite impressive.”

This breakthrough grew out of the team’s larger project on silicon-based molecule electronics, begun in 2010. The group arrived at their latest discovery by bucking the trend. Most research in this field aims to create highly conducting molecules, as low conductance is rarely considered a desirable property in electronics. Yet insulating components may actually prove to be of greater value to future optimization of transistors, due to the inherent energy inefficiencies caused by leakage currents in smaller devices.

As a result, their work has yielded new understanding of the fundamental underlying mechanisms of conduction and insulation in molecular scale devices. The researchers will build on this insight by next clarifying the details of structure-function relationships in silicon-based molecular components.

“This work has been extremely gratifying for us, because in the course of it we have repeatedly discovered new phenomena,” said Venkataraman. “We have previously shown that silicon molecular wires can function as switches, and now we’ve demonstrated that by altering their structure, we can create insulators. There is a lot to be learned in this area that will help shape the future of nanoscale electronics.”

ROHM, a supplier of power semiconductors, and GaN Systems, a developer of GaN power semiconductors, today announced their collaboration in the GaN (gallium nitride) Power Semiconductor business, with the goal of contributing to the continuing evolution of power electronics.

This strategic partnership leverages GaN Systems’ industry leading capabilities in power GaN transistors along with ROHM’s comprehensive footprint in semiconductor and considerable resources in the design and manufacture of electronic components. The companies have agreed to jointly develop form-, fit-, and function-compatible products using GaN semiconductor dies in both GaN Systems’ GaNPX® packaging and ROHM’s traditional power semiconductor packaging. GaN Systems and ROHM customers will now have the advantage of having two possible sources for package-compatible GaN power switches, presenting the widest selection of dual-sourced GaN devices.

Customers will also benefit from greater access to GaN products and resources globally, especially in Asia, one of the fastest growing market for GaN. In addition, GaN Systems and ROHM will work together on GaN semiconductor research and development activities to propose ground-breaking solutions for the industrial, automotive, and consumer electronics fields. And to contribute to greater energy savings and increased power densities in the power electronics market, both companies will continue to collaborate to expand their line-up of GaN products and broaden the range of choices.

“GaN has rapidly made its ascent into power electronics applications and this partnership exemplifies how important GaN has become in a complete power electronics offering,” said Jim Witham, CEO of GaN Systems. “We’re proud to partner with ROHM, a company well-known for developing industry-leading technologies. By combining our joint expertise and capabilities, we’re enabling more businesses to access and experience the benefits of GaN in achieving higher power, more efficient, smaller, and lighter power electronics.”

“ROHM has targeted the power device business as one of our growth strategies. We offer leading-edge products such as SiC (Silicon Carbide) power devices and provide power solutions that integrate control technologies, including gate drivers that maximize device performance. We are also developing GaN for next-generation power devices. By leveraging the superior technologies and expertise of both companies, we are able to accelerate the development of high-performance solutions to solve the needs of the power market,” said Katsumi Azuma, Senior Managing Director of ROHM Semiconductor.

Ease of use and design re-use across frequencies have not traditionally been associated with RF power solutions — until now. Today, NXP Semiconductors N.V. (NASDAQ:NXPI), a developer of RF power, introduces two new power blocks that promise to become a new standard for years to come.

The simplicity of these new devices lies in the availability of laterally diffused metal oxide semiconductor (LDMOS) technology for RF transistors in ubiquitous TO-247 and TO-220 power packages, that come with well established assembly processes. This is augmented with the simultaneous availability of very compact reference circuits that can be reused from 1.8 Megahertz (MHz) to 250 MHz. This results in considerable savings, fast time to market and optimized supply chain for most High Frequency (HF) and Very High Frequency (VHF) power systems.

Removing Barrier to Entry for RF Power
NXP’s new RF solutions include the MRF101AN 100 watt (W) transistor that is housed in the TO-220 package, and the MRF300AN 300 W transistor that is housed in the TO-247 package. While current plastic packages for high power RF require a precise solder reflow process, these transistors can be assembled to a printed circuit board (PCB) using a standard through-hole technology, reducing costs. Heatsinking is also simplified since the transistors can be mounted vertically to a chassis, or in more creative and versatile ways such as under the PCB. This opens many options for the mechanical design, contributing to lower the Bill of Materials (BoM) and reduce time to market.

“RF Power is moving increasingly into new applications, where the requirements for ease of use, high performance and versatility are essential,” said Pierre Piel, senior director and general manager for multi-market RF power at NXP. “We continue our mission to ease the use of RF Power by delivering solutions that minimize design requirements, reduce time to market and simplify the supply chain for our customers.”

Flexibility Without Compromise on Performance
At 40.68 MHz, the MRF300AN outputs 330 W Continuous Wave (CW), with 28 decibels (dB) of gain and 79 percent efficiency. As part of NXP’s series of extremely rugged transistors, the family is designed for use in unforgiving industrial applications and can withstand 65:1 Voltage Standing Wave Ratio (VSWR).

This performance is supported by 2 x 3 inch (5.1 x 7.1 centimeters) power block reference designs that use cost-effective PCB material. With only a change of coils and discrete components, and no change to the PCB layout, the board can be adapted to support any other frequency from 1.8 to 250 MHz. This ensures quick design cycle for RF designers to develop power amplifiers that address new markets.

For even more flexibility, each transistor comes in two configurations. For example, the MRF101BN mirrors the pin-out of the MRF101AN, enabling a compact push-pull layout to address wideband applications without compromise on efficiency.

The MRF101AN and MRF300AN target Industrial, Scientific and Medical (ISM) applications as well as HF and VHF communications. A new market is also expected with switch-mode power supply, since this technology enables switching at higher frequencies than existing solutions, reducing the size of other components of the BoM. The devices are part of NXP’s Product Longevity Program guaranteeing availability for 15 years.

Availability
The MRF300AN is available now. The MRF101AN is currently sampling, with production expected in September 2018. Reference circuits for the MRF300AN are available for 27 MHz, 40.68 MHz, 81.36 MHz and 230 MHz. For pricing or additional information, please contact your local NXP sales office or approved distributor.

IEEE, the world’s largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today announced Dr. William Chen as the recipient of the 2018 IEEE Electronics Packaging Award. The IEEE Electronics Packaging Award and the society’s other annual awards were presented on 31 May in San Diego, California, at the 2018 IEEE Electronic Components and Technology Conference (ECTC), the society’s flagship event.

Dr. Chen is an IEEE Life Fellow and Fellow of ASE Group in Sunnyvale, California. He is a former president of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, as which the IEEE EPS was formerly known, and a prominent leader in the packaging community since his early years at IBM. He was recognized for his pioneering contributions to electronic packaging—from research and development through industrialization—and for his leadership in strategic roadmapping efforts in heterogeneous integration. Dr. Chen has been instrumental in the industrialization of game-changing packaging technologies which enabled miniaturization, cost reduction and performance enhancements for today’s pervasive, all-powerful electronic devices. He has been previously recognized for his work in the field and was the recipient of the IEEE CPMT David Feldman Outstanding Contribution Award in 2010.

At the IEEE Electronic Components and Technology Conference, IEEE EPS also honored other packaging leaders and innovators driving the research, design and development of revolutionary electronic microsystem packaging and integration technology:

In addition, Annette Teng of Promex Industries Inc., Gilles Poupon of CEA-LETI in France and Yoshitaka Fukuoka of Worldwide Electronic Integrated Substrate Technology Inc. in Japan received the 2018 IEEE EPS Regional Contributions Awards.

“The electronics industry is experiencing tremendous expansion and revolutionary change, repositioning electronic packaging as a value creator and product differentiator for broad domains of the semiconductor industry. Our members are at the forefront of this transformation, driving innovation in microsystem packaging in key areas such as heterogeneous integration, 3D packaging and the IoT (Internet of Things),” said Avram Bar-Cohen, IEEE EPS president. “This ECTC EPS luncheon showcased their efforts and the outstanding leadership of William Chen, to strengthen and expand the society as the leading global authority on packaging and integration and to help define the future of the electronics industry.”

IEEE EPS (https://eps.ieee.org) represents current and future technologists in electronics packaging, spanning every nuance from earliest-stage research, through design and prototyping, to assembly and manufacturing, and ultimately to ensuring safe and reliable operation. IEEE EPS is also increasingly serving as a focal point for information transfer and collaboration for other IEEE societies, as technologists in those technology areas seek to derive value from microsystem packaging.

Dow Performance Silicones further enhanced design flexibilities and processing options for consumer device and display OEMs today with the addition of DOWSIL™ SE 9100 and DOWSIL™ SE 9160 Adhesives to its portfolio of one-part, room-temperature cure (RTV) silicone solutions. In addition to offering versatile processing options, the two new silicone adhesives bond well to most substrates, deliver excellent rework ability with no residue, exhibit high flow to fill narrow gaps, and enable cure-in-place-gaskets (CIPG) that offer effective seals compatible with IPX7-rated water resistance.

DOWSIL™ SE 9100 Adhesive is a one-part silicone formulation that achieves fast tack-free processing at room temperature with the option to accelerate cure with the application of heat. It demonstrates low (< 1 percent) shrinkage by volume after cure to minimize internal stress for optimal sealing, and offers cost-effective processing and repairability during the assembly of mobile and display modules and other consumer devices.

DOWSIL™ SE 9160 Adhesive exhibits many of these same properties, yet its dual-cure formulation offers the option of faster in-line processing through irradiation with ultraviolet (UV) energy at densities as low as 4,000mJ/cm2 to component assembly to continue within seconds. Higher densities (10,000mJ/cm2) enable the material to quickly achieve full, deep section cure. In addition, in designs where the silicone adhesive is partially “in shadow” from the UV lamp, Dow’s new innovative silicone adhesive will still secure rapid moisture cure.

DOWSIL™ SE 9160 Adhesive is suitable for sealing small- to medium-sized consumer devices such as smart phones, tablets and displays. It is particularly effective at sealing air gaps or holes between LCD or OLED display panels and their plastic cover frames.

“Consumer device manufactures are under constant pressure to make their products more reliable, more profitable and packed with ever more features,” said Jayden Cho, global marketing segment leader, Consumer Devices at Dow Performance Silicones. “These two highly innovative silicone adhesives aim to help our global customers successfully address all three of these challenges as they push the boundaries of their next-generation device designs.”

Dow’s two new adhesives are available globally under the new DOWSIL™ label, which builds on seven decades of innovation and proven performance from the heritage Dow Corning silicone technology platform.

Synopsys, Inc. (Nasdaq: SNPS) today announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation’s BiCS FLASH vertically stacked three-dimensional (3D) flash memory. By working closely with Toshiba Memory Corporation, Synopsys introduced innovative simulation algorithms in its FineSim® Pro FastSPICE tool to address the increased design complexity of 3D NAND Flash memory. These new technologies improve simulation speed by an average of 2X, thereby reducing multi-day simulation runs to less than a day.

Compared to traditional Flash devices, 3D Flash devices have much larger memory arrays, more complex analog and programming circuits, and extensive power distribution network.  Additionally, due to the stacked memory array structure, 3D Flash designs must deal with increased coupling effects due to layout parasitic elements. This increased complexity results in multi-day simulation times when using existing circuit simulation technology. Through close collaboration with Toshiba Memory Corporation, the latest release of FineSim Pro FastSPICE delivers several key technologies specifically optimized for 3D Flash simulation, for efficient handling of massive array structures, large power distribution network, increased layout parasitic elements, and high-precision analog circuits.

“FineSim has been our signoff circuit simulator since early 2000. Our long collaboration with Synopsys has enabled us to develop best-in-class Flash memory products for a broad range of applications,” said Shigeo (Jeff) Ohshima, Technology Executive SSD Application Engineering of Toshiba Memory Corporation. “By working closely with Synopsys we’re able to deploy FineSim Pro for verification of our latest BiCS Flash memories and meet our stringent quality and reliability requirements.”

“Advanced flash memory designs require extensive circuit simulation to ensure design robustness, reliability, and cost competitiveness,” said Paul Lo, corporate vice president of Engineering in the Design Group at Synopsys. “Our team is committed to continuing our close collaboration with Toshiba Memory Corporation to deliver novel circuit simulation technologies to meet the challenging needs of simulating complex 3D NAND Flash memories and enable Super Chips with Synopsys.”

Consumer demand and government mandates for electronic systems that improve vehicle performance, that add comfort and convenience, and that warn, detect, and take corrective measures to keep drivers safe and alert are being added to new cars each year. This system growth, along with rising prices for memory components within them, are expected to raise the automotive IC market 18.5% this year to a new record high of $32.3 billion, surpassing the previous record of $27.2 billion set last year (Figure 1), according to IC Insights’ soon to be released Update to the 2018 IC Market Drivers report.  If the forecast holds, it would mark the third consecutive year of double-digit growth for the automotive IC market.

Figure 1

Over the past several years, the global automotive IC market has experienced some extraordinary swings in growth. After increasing 11.5% in 2014, the automotive IC market declined 2.5% in 2015, but then rebounded with solid 10.6% growth in 2016. It is worth noting that the sales decline experienced in 2015 was primarily the result of falling ASPs across all the key automotive IC product categories—microcontrollers, analog ICs, DRAM, flash, and general- and special-purpose logic ICs, which offset steady unit growth for automotive ICs that year.

IC Insights’ recently updated automotive IC market forecast shows the automotive IC market growing to $43.6 billion in 2021, which represents a compound annual growth rate (CAGR) of 12.5% from 2017 to 2021, highest among the six major end-use applications (Figure 2).

Figure 2

Collectively, automotive ICs are forecast to account for only about 7.5% of the total IC market in 2018, although that share is forecast to increase to 9.3% in 2021.  Analog ICs—both general-purpose analog and application-specific automotive analog—are expected to account for 45% of the 2018 automotive IC market, with MCUs capturing 23% share. There are many suppliers of automotive analog devices but a rash of acquisitions among them in recent years has reduced the number of larger manufacturers. Some of the acquisitions that have impacted the automotive analog market include NXP, which acquired Freescale in 2015 and is now itself in the process of being acquired by Qualcomm; Analog Devices, which acquired Linear Technology in March 2017; and Renesas, which acquired Intersil.

Global sales of smartphones to end users returned to growth in the first quarter of 2018 with a 1.3 percent increase over the same period in 2017, according to Gartner, Inc. Compared to the first quarter of 2017 sales of total mobile phones stalled and reached 455 million units in the first quarter of 2018.

Nearly 384 million smartphones were sold in the first quarter of 2018, representing 84 percent of total mobile phones sold (see Table 1). “Demand for premium and high-end smartphones continued to suffer due to marginal incremental benefits during upgrade,” said Anshul Gupta, research director at Gartner. “Demand for entry-level smartphones (sub-$100) and low midtier smartphones (sub-$150) improved due to better-quality models.”

Continued weakness in Greater China’s mobile phone market also limited growth potential for the top global brands, including Chinese brands such as OPPO and Vivo, with over 70 percent of their sales coming from Greater China.

Table 1

Worldwide Smartphone Sales to End Users by Vendor in 1Q18 (Thousands of Units)

Vendor

1Q18

Units

1Q18 Market Share (%)

1Q17

Units

1Q17 Market Share (%)

Samsung

78,564.8

20.5

78,776.2

20.8

Apple

54,058.9

14.1

51,992.5

13.7

Huawei

40,426.7

10.5

34,181.2

9.0

Xiaomi

28,498.2

7.4

12,707.3

3.4

OPPO

28,173.1

7.3

30,922.3

8.2

Others

153,782.1

40.1

169,921.1

44.9

Total

383,503.9

100.0

378,500.6

100.0

Source: Gartner (May 2018)

Samsung Growth Slows, Apple Share Increases

Samsung’s midtier smartphones faced continued competition from Chinese brands, which led to unit sales contraction year on year. This is despite the earlier launch of its flagship Galaxy S9/S9+ compared to the S8/S8+ in 2017, and despite the Note 8 having a positive impact on Samsung sales in the first quarter of 2018. Samsung’s smartphone growth rate will remain under pressure through 2018, with Chinese brand’s growing dominance and expansion into Europe and Latin America markets. Samsung is challenged to   raise the average selling price (ASP) of its smartphones, while facing increasing competition from Chinese brands that are taking more market share.

The delayed sales boost for Apple from last quarter materialized. Apple’s smartphone unit sales returned to growth in the first quarter of 2018, with an increase of 4 percent year on year.

“Even though demand for Apple’s iPhone X exceeded that of iPhone 8 and iPhone 8 Plus, the vendor struggled to drive significant smartphone replacements, which led to slower-than-expected growth in the first quarter of 2018,” said Mr. Gupta. “With its exclusive focus on premium smartphones, Apple needs to significantly raise the overall experience of its next-generation iPhones to trigger replacements and lead to solid growth in the near future.”

Huawei and Xiaomi Remained the Big Winners

Huawei’s refreshed smartphone portfolio helped strengthen its No. 3 global smartphone vendor position.

“Achieving 18.3 percent growth in the first quarter of 2018 helped Huawei close the gap with Apple,” said Mr. Gupta. “However, its future growth increasingly depends on the vendor ramping up share in Emerging Asia/Pacific and resolving issues in the U.S. market, through the development of a stronger consumer brand. Huawei’s attempt to grow its premium smartphone portfolio with its recent launches of the P20, P20 Pro and Honor 10 helps raise its competitiveness and growth potential.”

Xiaomi was the clear winner of the first quarter, achieving a growth of 124 percent year on year. Xiaomi’s refreshed portfolio of smartphones and aggressive pricing strategy helped it hold the No. 4 spot in the first quarter of 2018. “This strategy led Xiaomi to achieve 330 percent growth in the Emerging Asia/Pacific region,” said Mr. Gupta.

In the smartphone operating system (OS) market, Google’s Android and Apple’s iOS achieved growth in units in the first quarter of 2018, but Android saw its share slightly contract (see Table 2).

Table 2

Worldwide Smartphone Sales to End Users by Operating System in 1Q18 (Thousands of Units)

Operating System

1Q18

Units

1Q18 Market Share (%)

1Q17

Units

1Q17 Market Share (%)

Android

329,313.9

85.9

325,900.9

86.1

iOS

54,058.9

14.1

51,992.5

13.7

Other OS

131.1

0.0

607.3

0.2

Total

383,503.9

100.0

378,500.6

100.0

Source: Gartner (May 2018)

Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends. “Megatrend will probably be the key word for the next 10-years within the advanced packaging industry, and more generally in the semiconductor industry”, comments Emilie Jolivet, Semiconductor & Software Division Director at Yole Développement (Yole).“AI , IoT , 5G, mobility, and more… all major applications of our century are today the new drivers of these industries.”

What exactly is the impact of the megatrends on the advanced packaging industry? Could we expect a strong move of the advanced packaging companies: from their traditional activities to innovative services/products to answer to the specificities of the mega market segments? How will the advanced packaging supply chain evolve?

NCAP China, part of JITRI, and Yole today invite you to discover the 4th Advanced Packaging & System Integration Technology Symposium. The 2018 edition takes place in Wuxi, China, on June 20&21. It is a 2-day conference to answer strategic questions and get the opportunity to meet the leaders in the advanced packaging industry. After the last four successful events, Yole Développement & NCAP have decided to continue and strengthen their collaboration to once again provide a powerful program including Panel Level, FO , SiP , advanced substrates, 3D technology. Megatrends will be at the heart of the conference hosted by NCAP CHINA. Advanced packaging is on the move. Don’t miss it!
• Click program & registration to see the schedule, list of speakers, abstracts, and much more.
• The 2018 symposium is sponsored by DIPSOL, ERS, Nordson, SPTS (An Orbotech Company), and SEMSYSCO.

First held in 2014, the Advanced Packaging & System Integration Technology Symposium attracts more than 180 worldwide executive attendees each year. The program, designed by both partners Yole and NCAP China, brings together numerous valuable discussions, short courses, meetings and business collaborations. The list of executive speakers is impressive (Full list of speakers). The 2018 program welcomes two keynotes, among the numerous presentations: 
• Impact of the industry trends on advanced packaging – Jean-Christophe Eloy, President, Yole Group of Companies. Yole Group of Companies includes Yole Développement, System Plus Consulting, KnowMade and PISEO. 
• The industrialization road of innovative Wafer Level Fan-Out technology: eSiFO – Dr. Daquan Yu, VP, Huatian Technology Electronic … And much more. The list of speakers, biographies and abstracts are available on i-micronews.com. To download the PDF version, click Program – Abstracts.

Amongst the numerous sessions of the Advanced Packaging & System Integration Technology, 2018 edition, FOWLP will be deeply covered by a significant list of speakers: Klemens Reitinger, CEO, ERS electronic, Stephen Hiebert, Sr Director of Marketing, KLA-Tencor and David Butler, EVP General Manager, SPTS Technologies. Currently FOWLP is the fastest growing packaging platform and is directly impacted by the megatrends. From mobile to automotive to medical, for both low-end (e.g. audio codecs) and high-end devices (e.g. APU), Yole analyzes daily the technology evolution and market drivers. “Today, cost is still a concern compared to other more mature packaging platforms”, assert Yole’s Sr Analyst, Santosh Kumar (1). Market trends and technical challenges will be detailed in a presentation proposed by Santosh Kumar in the dedicated session. Santosh also recently invited Albert Koller, Head of Advanced Packaging Business Unit at Evatec, to discuss its activities and present its vision of the advanced packaging industry. This interview is available on i-micronews.com, advanced packaging news section.

Dr Cao LiQiang, NCAP’s CEO asserts: “In recent years, many aspects of advanced packaging worldwide remained focused on FI, FO, TSV and WLP… As for China, we have identified major changes to FO technology development and commercialization in the next five years. Potential packaging houses will be established here, in China. NCAP is preparing FI & FO manufacturing mass production, together with our partners of several years…With Yole, NCAP is exploring possible collaborations with worldwide equipment and material suppliers. The symposium is a real opportunity to interact with OSAT and end-users as well. At NCAP, we believe the NCAP- Yole collaboration will positively influence the advanced packaging industry and encourage its development. During the symposium, we especially expect many debates on the numerous challenges facing the domestic packaging materials and equipment market, the 5G requirements, the development of innovative technologies by OSATs and much more.”

The symposium represents an exciting opportunity for advanced packaging companies to expand their activities in China and in all other countries. NCAP and Yole are very enthusiastic about this 2018 edition. Make sure you attend the symposium and book your place immediately on i-micronews.com or click: Registration.
To see the full schedule, please click here: Program.

TowerJazz, the global specialty foundry leader, and Gpixel, Inc., a fast-growing CMOS image sensor (CIS) provider focusing on professional applications, announced today that Gpixel’s GMAX0505, a new 25Mp global shutter sensor has been developed based on TowerJazz’s 2.5um global shutter pixel in a 1.1″ optical format with the highest resolution in C-mount optics. This type of lens mount is commonly found in closed-circuit television cameras, machine vision and scientific cameras. Gpixel’s new product is optimal for high resolution industrial, machine vision, intelligent transport systems (ITS) and surveillance applications. According to an IC Insights report, the industrial CMOS sensor market is growing at a CAGR of about 18% from $400M in 2015 to $910M in 2020.

TowerJazz’s new offering is the smallest in the world; the otherwise currently available smallest pixel for such high-end applications used in the market is 3.2um (65% larger) and demonstrates overall lower performances. TowerJazz’s 2.5um global shutter pixel is integrated with a unique light pipe technology, offers great angular response, more than 80dB shutter efficiency in spite of the extreme small size, and extremely low noise (one electron). Gpixel has started prototyping its GMAX0505 using TowerJazz’s state of the art, 65nm technology on a 300mm platform in its Uozu, Japan facility.

“TowerJazz has been an important and strategic fab partner of Gpixel for many years. We are very pleased with the support of great technology innovation from TowerJazz with our current global shutter sensor families, backside illuminated scientific CMOS sensor solutions and today, the next generation global shutter industrial sensor product family,” said Dr. Xinyang Wang, CEO of Gpixel, Inc. “The GMAX0505 is our second product after our first 2.8um pixel product that is already ramped up into production at TowerJazz’s Arai fab in Japan. We are very excited and looking forward to seeing more products using this pixel technology in the near future. The successful introduction of the new 25Mp product will bring our customers a unique advantage in the growing demand of machine vision applications.”

Dr. Avi Strum, TowerJazz Senior VP and General Manager of CMOS Image Sensor Business Unit, said, “We are very excited to be the first and only foundry in the world to offer this new technology – the smallest global shutter pixel available. Through our collaboration with Gpixel, we are able to create acompact package design which allows for miniature camera design. We are pleased with our long term relationship with Gpixel and with the way our technology combined with their excellent products allow us to target and gain market share in the growing high resolution industrial markets.”