Category Archives: Semicon West

By Dr. Adam He, director of Industry Research and Consulting, SEMI China

In June 2014, the State Council of China issued the “National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures. It has echoed strongly across the semiconductor industry and attracted global attention due to the ambitious development targets and sizeable support for a national IC industry investment fund.

What’s new?

(1) The Ambitious Development Target

According to the Guideline, the China IC industry revenue should reach RMB350 billion in 2015, and maintain a CAGR of more than 20 percent through 2020. In other words, 2020 revenues are expected to reach US$143 billion, which is 3.5 times that of the US$40.5 billion in 2013. (Note: China IC Industrial revenue refers to the total IC companies’ sales revenue within China, including IC design companies, foundries, IDMs and OSAT companies.)

SEMI--Adam He--for China article

 

Technical and product targets in each segment of the IC industry are clearly defined in the Guideline. The major targets of each segment are listed below.

  • IC manufacturing: mass production for 32/38 nm process shall be realized by 2015 and 16/14 nm process shall be realized by 2020.
  • IC design: certain key technologies (e.g. mobile smart terminal, network communication) shall approach international first-tier level by 2015, and other strategic technologies shall achieve international leading edge by 2020.
  • IC packaging and test: revenue from mid-end to high-end technologies shall be more than 30% of total revenue by 2015, and key technologies shall achieve international leading edge by 2020.
  • Material: 12-inch silicon wafers produced in China shall be ready for use in device production by 2015, and enter global supply chain by 2020.
  • Equipment: 65-45nm key equipment manufactured in China shall be used into production line by 2015, and enter global supply chain by 2020.

(2) National IC Industry Investment Fund Establishment

The manner of industry support has markedly changed from previous policies. The new policy will be adopted with a market-based approach and implemented through national IC industry investment funds to support industry development.

As of December 16, 2014, the latest information indicates that ordinary share-raising for a national IC industry investment fund has been completed and RMB 98.72 billion (US$ 15.9 billion) has been raised. Preferred shares amounting to RMB 40 billion (US$ 6.5 billion) will be further issued in the first quarter of 2015, accumulating to more than RMB130 billion (US$ 21 billion).

Meanwhile, local IC industry investment funds have been established by the cities of Beijing, Shanghai, Wuhan, and Hefei. Of these, Beijing took the lead in establishing a fund in June 2014, totaling RMB 30 billion (US$ 4.8 billion). It is structured as a “fund of funds” and two sub-funds. One sub-fund, supporting for IC manufacturing and semiconductor equipment, is managed by CGP Investment (the “fund of funds” is also managed by CGP); the other sub-fund, supporting IC design and packaging, is managed by Hua Capital.  In addition, the Shanghai IC industry fund, named Shanghai Summitview Capital IC information industry merger fund, totaling RMB10 billion (US$ 1.6 billion) was established in November 2014.

The total government funds are estimated to reach to US$100 billion with the implementation of local industry funds.

What will happen?

It is anticipated that the new policies will exert a significant influence on the semiconductor ecosystem in China.

China’s semiconductor industry will be dramatically expanded given the scale of industry equity funds that are leveraged by government investments. The existing semiconductor industry in China is estimated to have more than 10 percent of global fab capacity and more than 20 percent of global packaging capacity. The new investments will contribute to a powerful expansion in China-based capacity and create a stronger and more globally prominent semiconductor industry in China.

Secondly, the investment and merger activity in the semiconductor industry in China has been very dynamic and will continue to be so with the new investment funds. These newly established national and local IC industry investment funds will not only directly focus on the Fab and IC design companies, but also stimulate the IC industry merger and acquisition activity in and outside of China. For example, shortly after its establishment, Hua Capital (the investment company of IC design and packaging sub-fund of Beijing IC industry fund) proposed to buy Omnivision with Shanghai Pudong Science and Technology Investment Co. Ltd.

In addition, the new policies will also promote marketization development and global cooperation beyond previously implemented investment activities. In the 1990s, the Chinese government established two semiconductor production lines directly through National Engineering Project 908 and 909. In the beginning of the 21st century, SMIC was co-established by state-owned enterprises and an entrepreneurial team. Now, relying on the new capital, the Chinese government is going to support the industry development through equity funds, which is in line with the marketization reform philosophy of the new government and places investors and entrepreneurs at center stage in implementing industry growth. Experienced investors and entrepreneurs with international vision will lead China’s semiconductor industry to a broader global cooperation.

How should international companies respond?

China IC industry investment funds will likely drive market share gains for China players and also more buyout offers from China. Therefore, it is increasingly critical for international companies to consider their strategy and cooperation objectives with China’s semiconductor industry in the light of a huge application market and a dynamic industry ecosystem.

The first step is to better understand China. Companies need to recognize that China is not only the largest semiconductor market — and not just a manufacturing base with a cost advantage. The most important point is that China’s economy and semiconductor industry is changing dramatically, and this will affect the global semiconductor industry ecosystem. Second, China is a diversified economic body, with the developed metropolitan areas such as Shanghai, Beijing and Shenzhen, and the to-be-developed middle and west regions.  Each of these regions will offer specific opportunities for companies in the semiconductor supply chain.

To participate in China’s industry ecosystem, it is essential to establish connections with the stakeholders in China, such as government, customers, suppliers, and even competitors, and to seek opportunities in cooperation and development through mutual understanding and engagement.

During SEMICON China 2015 (March 17-19), SEMI China will host the Tech Investment Forum-China 2015 on March 18. The Tech Investment Forum has already become an important platform between investment and pan-semiconductor industry in China. This year, Mr. Wenwu Ding, the CEO of China National IC Investment Fund will give a keynote speech. There will also be a session where startup companies can pitch to venture investors for project funding.

SEMI China’s Industry Research and Consulting team provides market research, supply chain surveys, investment site evaluations, and partner matching services (visit www.semi.org.cn/marketinfor/exclusive.aspx) or visit the SEMI Industry Research and Statistics website at www.semi.org/en/MarketInfo.

SEMI today announced a “Call for Papers” for SEMICON West, North America’s premier microelectronics event, to be held July 14-16 at the Moscone Center in San Francisco, Calif. The “Call for Papers” includes the Semiconductor Technology Symposium and the popular TechXPOT programs. Presentation abstracts are due March 20, 2015.

SEMICON West 2015 will be attended by nearly 27,000 semiconductor and related microelectronics industry professionals and feature more than 60 hours of technical sessions, led by the most informed and influential experts in the world. For 2015, SEMICON West will feature two “Generation Next” Pavilions — a new concept in topic-based engagement, which will connect exhibits, technical sessions, and networking events to current, critical industry topics, engaging exhibitors and visitors in an immersive exhibition experience.  In addition, the “standing-room only” success of the SEMICON West TechXPOT programs prompted the creation of the Semiconductor Technology Symposium (STS) at the 2014 event.

In 2015, the STS program continues with programs on leading-edge chip manufacturing held in a classroom setting with reserved seating adjacent to the show floor in the North Hall of Moscone Center. STS will offer technology trends, developments and new technology information in the areas of advanced materials and processing, lithography, metrology, 450mm, advanced packaging, and 3D-IC.  Test Vision 2020, the leading semiconductor test conference focusing on ATE and high-volume manufacturing, is part of the STS program in Moscone Center.

TechXPOT programs in the Moscone Center North and South Halls will continue focusing on special topics in semiconductor manufacturing, and adjacent and related microelectronics technologies.

For the Semiconductor Technology Symposium and for TechXPOT sessions, SEMI is soliciting technical presentations in the following areas:

  • Advanced lithography/Advanced films
  • Advanced materials and processes
  • Contamination control for advanced materials
  • New and advanced metrology solutions
  • Interconnect challenges at sub-10nm
  • Substrates: Materials research beyond Silicon
  • Other process implications for manufacturing next-generation transistors
  • Accelerating and improving yield
  • Silicon Photonics
  • Disruptive compound semiconductor technologies
  • Manufacturing advanced power semiconductors
  • Improving Yield on Non-Planar ICs
  • Failure analysis
  • Advanced packaging
  • Design for packaging
  • Semiconductor test
  • Design for test
  • Application Level Testing
  • Technologies for Emerging Markets & Applications
  • What’s next in MEMS?
  • How manufacturing of IoT devices will impact IC fabrication
  • How IoT and 3D printing will be used in IC manufacturing in the future
  • Printed and flexible electronics
  • Packaging of MEMS and Sensors
  • SiP for Power and RF
  • Heterogeneous Integration for SiP and Modules

“There are many exciting challenges facing the industry today,” said Karen Savala, President of SEMI Americas. “We are pleased that SEMICON West continues to serve as the premier forum where industry leaders share their insight on these issues.”

SEMICON West 2015 “Call for Participants”:  Prospective presenters are invited to submit abstracts (maximum 500 words) on key industry issues and topics in the areas listed above for consideration. Presentations should focus on the latest developments and innovations in these technology areas, inclusive of supporting data. Submissions may be made online from the “Call for Participants” website at: www.semiconwest.org/Participate/SPCFP. The deadline is March 20.

“Generation Next” Pavilions (Advanced Substrate Engineering; Packaging): These two new Generation Next Pavilions will be held in conjunction with technical sessions (STS and TechXPOTs) at SEMICON West — addressing critical issues, challenges, and opportunities. For more information about exhibiting opportunities within these new Pavilions, contact Nick Antonopoulos at [email protected] or +1.408.943.6986.

Silicon Innovation Forum (SIF) “Call for Startups”:  SEMI will host its 3rd Annual Silicon Innovation Forum at SEMICON West 2015 and is now accepting early applications to participate. The Silicon Innovation Forum (SIF) provides a stage for new and emerging innovators, industry leaders, strategic investors, and venture capitalists to discuss the needs and requirements of the industry’s innovation engine. Participants will gain insights into technology, capital, partnership, and collaboration strategies necessary for mutual success. For more information, please email Ray Morgan, director of Outreach at [email protected].  SIF application: 2015 SIF Showcase Request for Participation. The deadline is March 20.

About SEMICON West

SEMICON West is the flagship annual event for the global microelectronics industry, showcasing the people, products, and technologies driving the design and manufacture of advanced microelectronics. SEMICON West attracts the world’s leading technology companies serving the microelectronics supply chain and the largest audience of influential buyers, industry leaders, decision-makers, technologists, analysts, and media of any industry event in North America. SEMICON West 2015 is projected to bring together more than 27,000 international attendees, more than 700 global companies, and feature more than 60 hours of technical, business, and networking programs. For more information, visit www.semiconwest.org.

What’s next for MEMS?


December 16, 2014

By Paula Doe, SEMI

The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

While the IoT may be all about sensors, it is not necessarily a bonanza for most traditional MEMS sensor makers. “The surprising winner turns to be optical MEMS for optical cross connect for the data center, where big growth is coming,” said Jérémie Bouchaud, IHS Director and Sr. Principal Analyst, MEMS & Sensors, at the recent MEMS Industry Group (MIG) “MEMS Executive Congress” held in Scottsdale, Arizona from November 5-7.

The market for wearables will also see fast growth for the next five years, largely for smart watches, driving demand for motion sensors, health sensors, sensor hubs and software –but even in 2019 the market for sensors in wearables will remain <5% the size of the phone/tablet market, IHS predicts.  The greater IoT market may reach billions of other connected devices in the next decade, but sensor demand will be very fragmented and very commoditized. Smart homes may use 20 million sensors in 2018, but many other industrial applications will probably each use only 100,000 to 2-3 million sensors a year, Bouchaud noted.

And most of this sensor market will be non-MEMS sensors, some mature and some emerging, including light sensors, fingerprint sensors, pulse sensors, gas sensors, and thermal sensors, all requiring different and varied manufacturing technologies.  Much of the new sensor demand from automotive will be also be for non-MEMS radar and cameras, though they will also add MEMS for higher performance gyros, lidar and microbolometers, according to IHS. Expect major MEMS makers to diversify into more of these other types of sensors.

MEMS Exec Bouchaud - IHS - MIG US 2014_Page_22_Resized

Yole Développement CEO Jean Christophe Eloy looked at how the value in the IoT would develop.  While the emerging IoT market is initially primarily a hardware market, with hardware sales climbing healthily for the next five years or so, it will quickly become primarily a software and services market.  In five to six years hardware sales will level off, and the majority of the value will shift to data processing and value added services.  This information service market will continue to soar, to account for 75% of the $400 Billion IoT market by 2024.

MEMS Exec JC Eloy_Market Panel_MIG 2014 V1_Page_28_Resized

Re-thinking the business models?

The IoT will bring big changes to the electronics industry, from new technologies to new business models, and new leaders, suggested George Liu, TSMC Director of Corporate Development.  He of course also argued that the high volume and low costs required for connected objects would drive sensor production to high volume foundries, and drive more integration with CMOS for smart distributed processing at CMOS makers.

Liu projected these changes would mean a new set of companies would come out on top. Few leading system makers managed to successfully transition from the PC era to the mobile handset era, or from the mobile handset era to the smart phone era, as both the key technologies and the winning business models changed, and chip makers faced disruption as well. “For one thing, the business model changed from making everything in house to making nothing,” he noted. “The challenge is to focus on where one is most efficient.”

“The odds of Apple or Google being the dominant players in the next paradigm is zero,” concurred Chris Wasden, Executive Director, Sorenson Center for Discovery and Innovation at the University of Utah.

Lots of other things will have to change to enable the IoT as well. Liu projected that devices will need to operate at near threshold or even sub-threshold voltages, with “thinner” processing overhead, while the integration of more different functions will redefine the system-in-a-chip. Smaller and lower cost devices will require new materials and new architectures, new types of heterogenous integration and wafer-level packaging, and an ecosystem of standard open platforms to ease development. TSMC’s own MEMS development kit has layout rules, but not yet behaviorial rules, always the more challenging issue for these mechanical structures. “That’s the next big thing for us,” he asserted. “These huge gaps mean huge opportunities.”

IDMs and systems companies still likely to dominate                     

Still, the wide variety, and sometimes tricky mechanics and low volumes, of many MEMS devices have been a challenge for the volume foundries.  The fabless MEMS model has seen only limited success so far and is unlikely to see much in the next decade either, countered Jean Christophe Eloy, CEO of Yole Développement, who pointed out that some 75% of the MEMS business is dominated by the four big IDMs who can drive costs down with volumes and diversified product lines. To date, only two fabless companies—InvenSense and Knowles—are among the top 30 MEMS suppliers.

Most of the rest of the top 30 are system makers with their own fabs, making their own MEMS devices to enable higher value system products of their own, which is likely to continue to remain a successful approach, as the opportunities for adding value increasingly come from software, processers, and systems.  “MEMS value has always been at the system level,” noted Eloy.

GE’s recent introduction of an improved MEMS RF switch to significantly reduce the size and cost of its MRI systems is one compelling example, with the potential of the little MEMS component to greatly extend the use of this high-contrast soft-tissue imaging technology.  Though the company sold off its general advanced sensors unit last year to connector maker Amphenol Corp., it is still making its unique RF switch using a special alloy in house in small volumes as a key enabler of its high value MRI systems. These imagers work by aligning the spin of hydrogen nuclei with a strong magnet, tipping them off axis with a strong RF pulse from an antenna, then measuring how they snap back into alignment with lots of localized antennas with low power RF switches close to the body.  “We’re now launching a new receive chain using MEMS RF switches,” reported Tim Nustad, GM and CTO, Global Magnetic Resonance, GE Healthcare. “Later we can see a flexible, light weight MRI blanket.”

Opportunity for smaller, lower power, lower cost technologies

So far, MEMS makers have driven down the cost of devices by continually shrinking the size of the die.  But that may be about to change, as the mechanical moving structures have about reached the limit of how much smaller they can get and still produce the needed quality signal.  That’s opening the door for a new generation of devices using different sensing structures and different manufacturing processes.  For inertial sensors, options include bulk acoustic wave sensing from Qualtre, piezoresistive nanowires from Tronics and CEA/Leti, and even extrapolating gyroscope-like data with software from accelerometers and magnetometers. MCube’s virtual gyro with this approach, now in production with some design wins, claims to save 80% of the power and 50% of the cost of a conventional MEMS gyro.

Piezoelectric sensing, often with PZT films, is also drawing attention, with products in development  for timing devices and microphones. Sand9 claims lower noise and lower power for its piezoelectric MEMS timing, now starting volume manufacturing for Intel and others for shipments in 1Q15.  It has also recently received a patent for piezo microphone, while startup Vesper (formerly known as Baker-Calling and then Sonify) also reports working with a major customer for its piezoelectric MEMS microphone.

More open platforms ease development of new applications of established devices

The maturing ecosystem of open development platforms across the value chain is helping to ease commercialization of new applications. The two latest developments in this infrastructure are a standard interface to connect all kinds of different sensors to the controller, and an open library of basic sensor processing software. The MIPI Alliance brought together major users and suppliers—ranging across STMicroelectronics and InvenSense, to AMD and Intel, to Broadcom and Qualcomm, to Cadence and Mentor Graphics—to agree on an interface specification to make it easier for system designers to connect and manage a wide range of sensors from multiple suppliers while minimizing power consumption of the microcontroller.  Meanwhile, sensor makers and researchers are making a selection of baseline algorithms available for open use to ease development of new products.  Offerings include Freescale’s inertial sensor fusion and PNI Sensors’ heart rate monitoring algorithms, along with other contributions from Analog Devices, Kionix, NIST, UC Berkeley and Carnegie Mellon to start. The material will be available through the MIG website.

Plenty of companies have also introduced their own individual platforms to ease customer development tasks as well, ranging from MEMS foundries’ inertial sensor manufacturing platforms to processor makers’ development boards and kits. Recently STMicroelectronics also adding its sensor fusion and other software blocks to its development platform.

KegData is one example of a company making use of these platforms to enable development of a solution for a niche problem – an automated system for telling pub owners how much beer is left in their kegs, using a Freescale pressure sensor and development tools. Currently the only way to know when a beer keg is empty is to go lift and weigh or shake it, a problem for efficiently managing expensive refrigerated inventory.  Adding a pressure sensor in the coupler on top of the keg allows the height of the beer to be measured by the differential pressure between the liquid and the gas above it. The sensor then sends the information to a hub controller that communicates with the internet, letting the pub manager know to order more, or even automatically placing the order directly with the distributor.  The startup’s business model is to give the system to distributors for free, but sell them the service of automating inventory management for their customers, saving them the significant expense of sending drivers around to shake the kegs and take pre-orders.

More broadly, MEMS microphones are poised to continue to find a wide range of new applications. IHS’ Bouchaud  pointed out that cars will soon each be using 12-14 MEMS microphone units, to listen for changes in different conditions, while home security applications will use them to detect  security breaches from unusual patterns of sounds, from people in the house to dogs barking. Startup MoboSens says it converts its chemical water quality data into audio signals to feed it into the phone’s mic port for better quality.

Opportunities still for new types of MEMS devices

Growth will also continue to come from new MEMS devices that find additional ways to replace conventional mechanical parts with silicon. Eloy noted that MEMS autofocus units may finally be the next breakout device, as they have started shipping in the last few weeks, and aim at shipping for products in 2015.  MEMS microspeakers are also making progress and could come soon. But ramping new devices to the high volumes demanded by consumer markets is particularly challenging. “The only way to enter the market is with new technology, but high volume consumer markets make entry very hard for new devices,” he said. “The market is saturated, wins depend on production costs, and not everyone can keep up…. The last significant new device was the MEMS microphone, and that was ten years ago.”

But innovative new MEMS technologies also continue to be developed for initial applications in higher margin industrial and biomedical fields. One interesting platform is the MEMS spectrometer from VTT Technical Research Center of Finland.  This robust tunable interferometer essentially consists of an adjustable air gap between two mirrors, made of alternating ALD or LPCVD bands of materials with different defraction indexes, explained Anna Rissanen, VTT research team leader for MOEMS and bioMEMS instruments. The structure can be tuned by different voltages to filter particular bands of light, while a single-point detector, instead of the usual array, enables very small and low cost spectrometers or hyper spectral cameras. VTT spinout Spectral Engines is commercializing near-IR and mid-IR sensors aimed at detecting moisture, hydrocarbons and gases in industrial applications.  Other programs have developed sensors for environmental analysis by flyover by nano satellites and UAVs, sensors for monitoring fuel quality to optimize energy use and prevent engine damage, and sensors that can diagnose melanoma from a scan of the skin.

Keep up with these changing manufacturing technology demands at upcoming MEMS events at SEMICON China 2015SEMICON Russia 2015SEMICON West 2015, and at the new European MEMS Summit planned for Milan in September.

Chad Industries, owned by Jabil Circuit, Inc., announced today that it will demonstrate flexible automated wafer handling for 450mm wafers during SEMICON West 2014 in San Francisco.

“We are excited to expand the WaferMate product family to include a robust and flexible handler for 450mm wafers.  This is an important part of the development roadmap for many of our OEM customers as they chart a path to support the launch of 450mm wafer production lines,” said Scott Klimczak, Senior Director of Engineering Services.  “It is extremely important to JABIL-CHAD that we move in-step with our OEM partners and provide them with reliable, cost effective, automation solutions that they need to support their expanding process tool requirements.”

Jabil engineers will be exhibiting their WaferMate450-2, a highly configurable, BOLTS-compatible robotic wafer-handling workcell that integrates high performance with cost competitiveness. The latest WaferWare software is a flexible software suite that allows wide-ranging application and unique user interface control.

The WaferMate450 workcell can act as a bridge tool, handling either 300mm or 450mm wafers using BOLTS compliant loadports.  The flexible operating system and tooling allow for wafer size change over without any tooling changes.  This allows customers to transition to 450mm production while retaining the ability to run 300mm wafers.

SEMI today announced that SEMICON West 2014 will feature Bob Metcalfe, professor at the University of Texas at Austin, as the Silicon Innovation Forum’s keynote speaker.  The Silicon Innovation Forum (SIF) is where strategic investors and key decision makers are introduced to new and emerging early stage companies looking for support in developing the future of microelectronics. SIF returns to San Francisco at SEMICON West 2014 (July 8-10, Moscone Center).  Coordinated by SEMI, SIF is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Intel Capital, Micron Ventures, Dow Chemical, TEL Venture Capital, Samsung Venture Investment, and BASF Venture Capital.

Metcalfe, who will keynote at SIF, is a professor of Innovation and Murchison Fellow of Free Enterprise in the Cockrell School of Engineering at the University of Texas at Austin.  Metcalfe was an Internet pioneer at MIT, Harvard, and Stanford, and then he invented Ethernet in 1973 at Xerox Palo Alto Research Center (Parc). He founded the 3Com Corporation in 1979.   More recently, Metcalfe was a general partner of the venture capital firm Polaris Venture Partners near Boston.

As silicon is ubiquitous in our lives, the objective of the SIF (www.semiconwest.org/sif) is to bring together early-stage technology companies and prospective investors from the venture capital and the high-tech industry investment communities, providing a forum for companies to share their technologies and plans with investors to identify new business opportunities. “Innovation and new ideas need investment; traditional venture capital and private funding of advanced semiconductor technology development has significantly declined in recent years, threatening the future of microelectronics innovation and the industry as a whole,” said Denny McGuirk, president and CEO of SEMI.

The Silicon Innovation Forum will be held Tuesday July 8 from 9:15 – 6:00pm in room 134 of the Moscone Center. Following is a snapshot of the program agenda:

“Investor Pitch” Session: Unique semi-private period for SIF exhibitors and investors only; SIF showcase exhibitors will have the opportunity to present directly to a panel of top investors.
General Session: Open to all SEMICON West 2014 attendees. Includes the keynote by Metcalfe on Innovating with Startups; a Strategic Investor Panel; and “Game-Changer Presentations.”
Innovation Showcase and Reception: An exclusive networking session for investors and SIF exhibitors; registration is required for qualified investors and partners for a fee.
Attendees to the Silicon Innovation Forum will include entrepreneurs engaged in silicon innovation, early- to mid-stage growth companies with novel capabilities, investment professionals from the angel, venture, corporate and institutional communities, R&D, purchasing, supply chain managers and manufacturing senior executives from the microelectronics industries.

For information on exhibiting at the Silicon Innovation Forum held at SEMICON West 2014, contact Ray Morgan, SEMI Americas at [email protected] or visit www.semiconwest.org/sif.