Category Archives: Semicon West

SEMI today announced that Mike Allison, president of the Semiconductor Division at Edwards, and Daisuke Murata, president and CEO of Murata Machinery, were elected as new directors to the SEMI International Board of Directors in accordance with the association’s by-laws.

Four current board members were re-elected for two-year terms: Bertrand Loy, president and CEO of Entegris; Stephen Schwartz, president and CEO of Brooks Automation; Kyu Dong (KD) Sung, CEO of EO Technics; and Xinchao Wang, chairman of JCET.

Additionally, the SEMI Executive Committee confirmed Tetsuo Tsuneishi, chairman of the Board of Tokyo Electron, Ltd., as chairman of the SEMI Executive Committee. SEMI also confirmed Bertrand Loy, president and CEO of Entegris, as vice-chairman.

The leadership appointments and the elected board members’ tenure become effective at the annual SEMI membership meeting on July 12, during SEMICON West 2017 in San Francisco, Calif.

“The SEMI Board of Directors is comprised of recognized global business leaders who represent SEMI members and the industry, ensuring that SEMI develops and delivers member value in all regions,” said SEMI president and CEO Ajit Manocha.  “We congratulate the re-elected members, welcome Mike Allison and Murata-san to the Board, and are greatly appreciative for all of our board members’ contributions to the industry.”

SEMI’s 19 voting directors and 11 emeritus directors represent companies from Europe, China, Japan, Korea, North America, and Taiwan, reflecting the global scope of the association’s activities. SEMI directors are elected by the general membership as voting members of the board and can serve a total of five two-year terms.

200mm fabs thriving


July 11, 2017

Today, at SEMICON West in San Francisco, Calif., SEMI issued an update to its 200mm Fab Outlook report, with improved and expanded report forecasting of 200mm fab trends out to 2021.  SEMI’s analysts updated information on over 100 facilities, including the latest new facilities and investment projects in China. The extensive new report “Global 200mm Fab Outlook to 2021” by SEMI tracks production, pilot, and R&D 200mm facilities worldwide with special attention on capacity expansions and new facilities.

Examining 200mm capacity over the years, the highest level of 200mm capacity was recorded in 2007 and the lowest following this peak in 2009 (see figure). The capacity decline from 2007 to 2009 was driven by the 2008-2009 global financial crisis, which caused the closure of many facilities, and by the transition of memory and MPU fabrication to 300mm fabs from 200mm.

Since 2009, installed 200mm fab capacity has increased, and by 2020, 200mm capacity is expected to reach almost 5.7 million wafers per month (wpm), and poised to surpass the 2007 peak.  According to SEMI’s World Fab Forecast data, by the end of this year, installed capacity will reach close to 5.4 million wpm.

200mm fab count

Driven by mobile and wireless applications, IOT, and automotive, the 200mm market is thriving.  Many of these products found their niche on 200mm wafers, so companies are expanding capacity in their facilities to the limit, and nine new 200mm facilities are in the pipeline. Looking only at IC volume fabs, the report shows 188 fabs in production in 2016 and expanding to 197 fabs by 2021.

China will add most of the 200mm capacity through 2021 with 34 percent growth rate from 2017 to 2021, followed by South East Asia with 29 percent and the Americas with 12 percent.

The Global 200mm Fab Outlook to 2021, published by SEMI in July 2017, includes two files: a 92-page pdf file featuring trend charts, tables and summaries and an Excel file covering 2010 to 2021 detailing on quarterly basis and fab-by-fab developments.  This is the third update since the report was first launched in 2015.  Since the last report was published in November 2016, the SEMI analyst team has made 232 changes or updates to 132 fabs. The report tracks over 300 facilities using 200mm wafers from R&D, EPI, LED fabs to volume IC fabs.  For more information, visit: http://info.semi.org/semi-200mm-fab-outlook

 

MEMS & Sensors Industry Group® (MSIG), the industry association advancing MEMS and sensors across global markets, is hosting a TechXPOT program today, titled “What’s Next for MEMS & Sensors: Big Growth of Disruptive Applications for Smart Sensing Changes the Business.” Speakers from industry and academia will explore the disruptive influence of MEMS and sensors on applications that span human-machine interfaces, disposable wireless electronics, and wireless sensor nodes for smart cities. They will also discuss advancements in piezoelectric materials for emerging applications as well as MEMS foundry process technologies that speed time to market.

“From smart autos and smart manufacturing to smart cities and smart health monitoring, emerging markets for MEMS and sensors are creating greater demand for integrated intelligence,” said Karen Lightman, vice president, MEMS & Sensors Industry Group, SEMI. “MSIG speakers at SEMICON West will help MEMS and sensors suppliers to more ably respond to this demand, as they learn how to add value through technological innovation and integration.”

Topics and presenters at the MEMS program at the TechXPOT include:

  • What’s Next for the MEMS Industry? ─ Jean-Christophe Eloy, CEO and founder, Yole Développement
  • New MEMS Opportunities from Piezoelectric Technology ─ David Horsley, professor, Mechanical & Aerospace Engineering, University of California Davis
  • Smart IT Systems and Development Protocols Enable Faster Time-to-Market in MEMS ─ Tomas Bauer, senior VP, sales/business development, Silex Microsystems
  • Waggle and the Future of Edge Computing and Smart Cities ─ Pete Beckman, co-director, Northwestern-Argonne Institute for Science and Engineering
  • Roll-up Implementation of Gesture Sensing and Voice Isolation Sensing Wall for Future Human-Machine Interface ─ James Sturm, professor, Electrical Engineering, Princeton University
  • Three Bit NFC Sensor Labels Based on a Flexible, Hybrid Printed CMOS TFT Process ─ Arvind Kamath, VP of Engineering, Thin Film Electronics

MSIG also invites members to attend the MEMS/NEMS Committee Meeting, including a Task Force on microfluidics, from 3:30-5:30 pm on July 13 at the San Francisco Marriott Marquis.

The Linde Group is expanding production of the rare gases used by the semiconductor industry, including xenon, which is in increasing demand for etching 3D semiconductor structures.

This quarter, Linde expects to complete a xenon expansion project at its Alpha, N.J. plant, part of a xenon supply network that spans three continents. Of the three rare gases – neon, krypton, and xenon – xenon is the rarest. Besides extracting xenon from the atmosphere, Linde provides numerous services to conserve and optimize their process use of xenon, said Matt Adams, head of sales and marketing, electronic gases & specialty products. “We have been developing specialized solutions around xenon for 30 years. Recycling xenon can actually make some applications viable that may not have been previously, because there’s not enough product in the world,” he said.

Lithography gas expansions

With increasing demand for neon from DUV (deep UV) multi-patterning lithography and other excimer laser applications, Linde is expanding neon capacity at a newly installed neon production facility in La Porte, Texas.

Linde works with its customers to supply mixtures of neon, fluorine, and other gases for excimer laser patterning applications At SEMICON West, Linde (Bridgewater, N.J.) is discussing its expansion of lithography gas processing capacity at its Medford, Ore. facility.

“By investing in Medford for lithography gas production, it gives us another site and increases our business continuity plan. We work with the OEMs to make sure that we are changing as needed, to make sure that the tools and the fabs are working optimally,” Adams said.

Besides adding purification capacity, Adams said its continuity planning includes strengthening Linde’s supply chain in Europe and managing a portfolio of third-party sources.

With more than 60,000 employees worldwide and around $20 billion in annual revenues, Linde leads the industry in rare gases. “We continue to invest globally in our own sources, and at the same time develop additional supply capacity with our partners,” said Andreas Weisheit, head of Linde Electronics. For example, Linde has more than 35 captive air separation units (ASUs) for rare gas production, and manages a network of external suppliers.

The major lithography equipment and chip manufacturers work with Linde engineers to develop new technologies at Linde’s Centers of Excellence, including a center for laser gases in Alpha, N.J.

Linde spans the gamut of rare gas capabilities, including the design and manufacture of air separation units (ASUs) and rare gas extraction equipment, cryogenic engineering, purification capabilities for neon, krypton and xenon, and high-volume mixing and blending capabilities.

Rare gas production is a multi-stage process, Adams said. For example, a steel company that needs oxygen will have a Linde air separation unit onsite to extract the rare gases. This crude mixture, sometimes referred to as a soup of materials, is further refined — and in some cases undergoes cryogenic distillation — to extract the xenon, krypton and neon.

Because neon is the highest-volume rare gas, Linde has multiplesneon purifiers strategically located around the world. “That speaks to our business continuity planning, that we have these at separate locations. We’re able to process this crude neon into semiconductor grade neon. Of course, it’s similar with xenon and krypton,” he said.

Adams said the neon shortage has been addressed and supply and demand has come back into balance. “That can change with new and different applications. We are starting to see some tightening in the xenon market, due to some applications that are coming online that have a high xenon demand. Which is one of the reasons why we’re making the investment in Alpha, New Jersey,” he said.

Linde Electronics will be exhibiting at SEMICON West, booth number 5952 in the North hall in the Moscone Center. Its focus will be on the leadership that Linde Electronics brings to the semiconductor industry through such offerings as electronic specialty gases, on-site solutions, materials recycling and recovery and SPECTRA® nitrogen plants.

For more information, see The Linde Group online at www.linde.com/electronics.

Alpha Plant

Alpha Plant

By Dave Lammers

Integrating data from various sensors in semiconductor fabs is a key focus in the industry now, and the sub-fab is an increasingly important part of the equation. As process steps become ever more sophisticated and expensive, keeping pumps and other sub-fab equipment running optimally involves integrating multiple pieces of data into useful information.

Paul Rawlings, president of the SEMI Service Division at Edwards, Ltd., said while the semiconductor industry has a history of analyzing tool data and relating it to end processes, more progress is needed in considering the entire fab as an ecosystem.

“The sub-fab equipment also has a bearing, not just in terms of how efficiently we are using data to manage the sub-fab efficiently, but also in terms of improving overall fab performance and yields,” Rawlings said.

Edwards is developing “a structured approach to the kinds of data that we have, and how we use it,” Rawlings said, including a database of best known methods (BKMs) which includes the optimum configurations for pumps, abatements and other systems.

Edwards currently is launching EdCentra, a fault detection and classification (FDC) software platform aimed at the sub-fab. It provides a comprehensive solution to vacuum security, to take one example, by combining equipment monitoring, data acquisition, and analysis of operational data.

EdCentra, Edwards Sub-Fab FDC platform, provides process-critical vacuum and abatement equipment information, complementing Fab-based platforms and supporting industry efforts to create integrated Fab data-management systems.

EdCentra, Edwards Sub-Fab FDC platform, provides process-critical vacuum and abatement equipment information, complementing Fab-based platforms and supporting industry efforts to create integrated Fab data-management systems.

Besides monitoring the performance of the equipment, the EdCentra sub-fab information management system has built-in predictive capabilities. And it complements another Edwards tools, which records service activities.

When a pump is taken back to an Edwards service center, it is stripped down and serviced. “Then we update all of that on to our central database on the lifetime and the performance of our equipment. We have an ecosystem there,” he said.

The company’s overall goal, Rawlings said, is to connect what have been “fairly separate systems,” maximizing up-times in part by comparing the performance of different tools in the same area.

By extending the data analysis ecosystem, Edwards can increase up-times and refine service scheduling. “The data is there. When we connect these systems, that’s where we get all of the benefits from the data. It’s no longer about taking data at individual points along the life cycle. It’s about connecting the data across the journey of the equipment and then looking for optimization, adjustments, and maybe upgrades on the equipment,” he said.

Engineers and data scientists throughout the semiconductor industry are developing more fab-level techniques, using multi-variate analysis of data coming off the tools, as well as other inputs.

For Edwards, that involves looking at data coming from pressure gauges, temperature sensors, the power spectrum, and, increasingly, the very useful information derived from vibration monitoring.

“What we are finding is that by looking at the combinations of data, that’s when things become really interesting. Rather than just relying on one or two points of data on the equipment, we’re starting to build up a library of different parameters. Then we are looking to see how we combine those to give us the most accurate predictions of tool lifetime,” he said.

Edwards is working closely with two fabs to develop data-sharing protocols that allow for optimum monitoring of the sub-fab equipment. “We are looking at it both from their point of view, and ours, discussing different ways of processing the data and the analysis of the performance of the equipment.”

Because of the huge amounts of data involved, Rawlings said “we only transmit data, if you like, that moves. It’s not worth sending data at 10+ Hertz when that particular parameter is not moving. It’s only worth sending that data when a change occurs.”

The work with customers is done within strict limits to ensure data security. “Clearly, you would never want to share any data that could give any indication of what customers do in their fabs and we go to great lengths to safeguard this” he said.

One encouraging sign is that, industry wide, cloud security is becoming more effective, reducing concerns about moving data to the cloud. “The way that end-user data is segregated, the built-in security, is resulting in a little bit more openness in terms of using this data,” Rawlings said.

That said, it is still a difficult area to work with customers. “I won’t mention names, but there are a few folks where we are engaged, so we can move to the next level of validation. I think it’s going to be an area of development over the next few years, as we really focus on the right parameters to measure to predict lifetimes.”

A lot of sub-fab equipment is affected by the processes, more than the basic mechanics of the equipment. It is fairly rare to have a bearing failure on a pump, for example. What is more likely is that the pump will have some process-related issues, such as corrosion or condensate build-up from materials in the fab.

“We spend a lot of time studying the process materials, temperature settings, and those kinds of things to extend equipment lifetimes, but there’s obviously always a limit to what can be achieved. What we are now doing is looking at how the different types of sensors that we have, both already on the equipment, and other ones that we’re developing, can give us the best combination, the best ways of predicting lifetimes. That’s an area that we’ll be working hard on over the next few years for our customers,” Rawlings said.

The Moscone Center will be undergoing major construction during Semicon West week. The major impact to attendees is that the South Hall will be closed to allow for new construction, so Semicon will take place in the North Hall and the first floor of the West Hall. The crosswalks at the corner of 3rd and Howell will also be closed.  The Intersolar North America show will occupy the West Hall Floor3 and half of the West Hall Floor2. ees North America – The International Exhibition for Batteries and Energy Storage Systems – will occupy the other half of Floor2. Expect heavy demolition operations to be underway nearby.

The Moscone Expansion Project plans to meet that need by expanding contiguous exhibition space as well as increasing the amount of flexible meeting and ballroom spaces.

In addition to adding new rentable square footage, the project architects – Skidmore, Owings and Merrill – seek to create an iconic sense of arrival that enhances Moscone’s civic presence on Howard Street and reconnects it to the surrounding neighborhood through the creation of reintroduced lost mid-block passageways. As such, the project proposes two new, enclosed pedestrian bridges connecting the upper levels of the new Moscone North and Moscone South as well as an upgrade to the existing pedestrian bridge across Howard Street. This would help to frame the main public arrival space between the two new buildings, provide enhanced circulation for Moscone convention attendees, and reduce on-street congestion all while maintaining full-time elevated public access across Howard Street from Yerba Buena Gardens to the cultural facilities.

Architect's Sketch of New Moscone

Architect’s Sketch of New Moscone

SEMI added a new high-profile program on China to its 2017 conference lineup for SEMICON West. Today at the Yerba Buena Theater, the China Strategic Innovation & Investment Forum will focus on the extensive business opportunities resulting from the semiconductor industry’s largest regional growth spurt now occurring in China.

While the global semiconductor industry continues to consolidate through large-scale mergers and acquisitions, China is embarking on a new round of expansion with heavy investment from public and private funding. China’s semiconductor industry is growing at an explosive rate, leading the rest of the world with a projected increase of 68 percent in fab equipment spending year-over-year (2017 to 2018), according to the May 2017 SEMI World Fab Forecast. China will be equipping over 50 facilities through 2018, and is forecast to spend more than US$11 billion.

The rise of the semiconductor industry in China need not be viewed as a threat to other global players, says SEMI, but rather as a significant driver of growth and business opportunity for suppliers worldwide. With its low indigenous market share for chips and nascent technical breadth in IC design, manufacturing, packaging, testing, equipment, and materials, China has become an enormous market for suppliers across the supply chain. In fact, ICs still top the list of all Chinese bulk imports in terms of U.S. dollar value.

At the China Strategic Innovation & Investment Forum, semiconductor and investment executives, as well as key China government and trade officials will share their views on the industry’s evolution and offer insights on growth, investment opportunities, M&A, and the latest innovations emerging in China. Attendees will hear from C-Level executives from Ali Cloud, AMEC, Applied Materials Venture Capital Group, Goldman Sachs, Verisilicon, Walden International, SEMI China, and more. An hour-long panel discussion, moderated by Lung Chu, president of SEMI China, will feature speakers and a Q&A session. With access to China experts presenting and multiple networking opportunities, the China forum will offer a collaborative platform where markets, technology, talent, and funding can meet up for mutual benefit.

Yerba Buena

SEMI has enriched this year’s SEMICON West by offering new, timely programs and forums for attendees to engage with peers and presenters at the three-day industry event.

“As our industry changes, we’re changing too,” said Dave Anderson, president, SEMI Americas. “Our programs are now organized around specific “Smart” applications, technologies, and adjacencies such as Smart Automotive, Advanced Packaging, 5G, and IoT, making it easy for attendees to focus on their specific needs,” he added. “We’ve reenergized the entire exposition and conference to put a laser focus on addressing challenges, finding solutions, and giving attendees everything they need to thrive in today’s disruptive business environment.”

SEMICON West offers 115 hours of advanced programming and more than 600 exhibits. The industry’s flagship event, re-imagined for 2017, will also feature inaugural programs, including:

  • China Strategic Innovation & Investment Forum — China’s semiconductor industry is going through an explosive growth phase. IC and investment executives will share their views on the industry’s evolution and offer insights on investment and M&A trends in China.
  • Meeting the Challenges of the 4th Industrial Revolution along the Microelectronics Supply Chain — The executive panel will address the opportunities and challenges facing the industry as the era of Big Data fuses the physical and digital worlds.
  • Smart Automotive, 5G Communications, MEMS & Sensors, MedTech and more will be discussed in the expanded TechXPOT sessions on the show floor.
  • IEEE Embedded Systems Training Workshops for IoT —Two exclusive IEEE workshops will cover embedded system software development, the key to optimizing performance and power in IoT devices and applications.
  • New Ways to Engage & Network — The new SMART Journey on the exposition floor will deliver stunning, hyper-visual insights into the microelectronics innovations that are revolutionizing the manufacturing supply chain, automotive, and everyday living. At the Journey’s Meet the Experts Theater, attendees will hear how breakthroughs in processes, packaging, and AI are changing the world.
  • Career Development — Amid competition from trendy companies like Google and Facebook, the semiconductor industry also needs to attract the best and the brightest. At the MicroE Career Development & Recruitment Forum, job seekers will learn about opportunities at some of the leading names in electronics.
  • On the fun front, the Summerfest at AT&T Park, home of the San Francisco Giants, will provide a bit of R&R as conference attendees network and watch the All-Star Game live on the stadium’s Big Screen.

In addition, SEMICON West features keynote talks from industry luminaries including Tetsuro Higashi of TEL, Tom Caulfield of GLOBALFOUNDRIES, Kathy Winters of Intel, and special guest Jim Morgan of Applied Materials. The World of IoT: Understanding Risks and Opportunities in Transformative Technologies — focuses on key IoT applications, big data and security, including solutions for home automation, smart cities, industrial monitoring, medical and healthcare, environmental monitoring, agriculture, and more. All of this, along with traditional favorites such as the SEMI/Gartner Bulls & Bears Industry Outlook, will be held at SEMICON West 2017.

To increase engagement with speakers and colleagues and enhance the overall Expo experience, attendees are encouraged to download the new SEMICON West Mobile App at the App Store or Google Play.

How low can we go?


July 11, 2017

By Ed Korczynski

In the advanced CMOS technology programs ongoing in the Belgium city of Leuven, imec works to extend the building-blocks of integrated circuits (IC). On the day before the opening of SEMICON West 2017, the invitation-only imec Technology Forum provided an update on the emerging opportunities in semiconductor technology and smart electronics systems. An Steegen, Executive VP Semiconductor Technology & Systems, provided the update on how small we can scale CMOS devices over the next 5-10 years. Taller finFETs will likely be used along with nano-wire FETs (NW-FET) by industry, and researchers see ways to cost-effectively combine both in future optimized System-on-Chips (SoC).

“Existing finFET technology can scale to the 5nm-node,” explained An Steegen at ITF 2017 in Antwerp, Belgium. “However, at the 3nm-node it looks like the nano-wire is comparable in performance to the finFET, but it has an additional advantage in that the nanowire is a better electro-statically controlled device so it enables gate-length scaling more than the finFET. So the contacted gate pitch (CGP) of a nano-wire can scale further than a finFET, because below ~40 nm CGP a finFET loses electro-static control which a nano-wire does not.”

While it is given that a nanowire has better electro-static control compared to a finFET, the basic trade-off is that of reduced drive current. The Figure shows that IMEC sees the possibility of System-Technology Co-Optimization (STCO) of future system-on-chip (SoC) designs using hybrid semiconductor technologies. imec’s basic process flow for NW-FETs starts with forming fins and so could be relatively easily integrated with finFETs for co-integrated hybrid CMOS.

System-Technology Co-Optimization (STCO) for future System-on-Chip (SoC) designs could integrate finFETs with Nano-Wire FETs (NW-FET) and Magnetic Random Access Memory (MRAM) for optimized performance. (Source: imec)

System-Technology Co-Optimization (STCO) for future System-on-Chip (SoC) designs could integrate finFETs with Nano-Wire FETs (NW-FET) and Magnetic Random Access Memory (MRAM) for optimized performance. (Source: imec)

“Today, this SoC is processed in one technology which means it’s sub-optimal for certain blocks on the SoC,” explained Steegen. “So imagine a future where you can choose the preferred technology for each block. I would choose finFETs for those blocks that need drive current, while I would choose nano-wire-FETs for those blocks that need more density and lower power. I would for example choose a magnetic RAM to replace my cache memory. I can optimize each sub-block for a preferred technology. Now I can do more, like sprinkle in low-energy devices like tunnel-FETs or spin-devices or 2D-materials as low-energy switches.”

Super-vias and Rutherails

Design-Technology Co-Optimization (DTCO) is imec’s term for new interconnect technologies to allow for simpler or more-compact designs. IDTCO process-scaling boosters are needed to stay with the pace of aggressive design rule targets. “We’re working on super-vias that connect more than one metal to the other and can jump a number of levels, and buried rails to support finFETs in standard-cell libraries,” explained Steegen during ITF2017.

Super-vias could be cobalt plugs that connect more than two metal levels within on-chip multi-level interconnects. The cobalt plugs would be nominally 20nm diameter and 105nm deep, and connected to a dual-damscene upper metal line. Low-k dielectric of k=2.55 uses thin silicon carbon nitride (SiCN) for definition between the damascene levels.

Ruthenium rails (Rutherails) would be buried in a front-end dielectric layer to provide electrical contacts below finFETs for 42nm CGP and 21nm MP needed for imec 3nm-Node (I3N) devices. Ruthenium rails 30nm deep and 10nm wide do not need complex barrier layers and should provide sufficient current flow for either finFETs or NW-FETs.

imec is also working on materials R&D to extend the performance of 3D-NAND. Steegen said,

“At imec we are working on improving the performance of that Flash device by introducing high-mobility channels, also by engineering the dielectric trapping layer with a barrier that can help improve the erase window and also the retention.”

9:05 am – 9:35 am
KEYNOTE: The Semiconductor Industry: Changed and Unchanged
Tetsuro Higashi, TEL
Yerba Buena Theater

9:35 am – 10:05 am
KEYNOTE: Accelerating Innovation: Intelligent is the New Smart
Thomas Caulfield, GLOBALFOUNDRIES

10:30 am – 4:00 pm
World of IoT
Understanding Risks and Opportunities
San Francisco Marriott Marquis

10:30 am – 12:45 pm
What’s next for MEMS & Sensors
Big Growth of Disruptive Applications
Moscone Morth, TechXPOT North

2:00 pm – 5:00 pm
China Strategic Innovation & Investment Forum
The Rise of the China IC Industry
Yerba Buena Theater

3:00 pm – 4:30 pm
Advanced Packaging
Meet the Experts, Day 1
Meet the Expert Theater, Moscone West

5:00 pm – 10:00 pm
Summerfest at AT&T Park
Hors d’oeuvres, beverages and MLB All-Star Game

5:00pm – 9:00pm
Leti Workshop
W Hotel – 181 3rd St., San Francisco