Category Archives: Semiconductors

The lithography metrology equipment market is riding on the high wave of the semiconductor industry. The 2x and 1x nodes of memory and logic devices, coupled with the sensor and connected devices required to support the growth in IoT, self-driving cars, and ARs are among the key drivers which will drive the lithography metrology market. Worth $957.9 million in 2016, the market is expected reach revenue of $ 1370.1 million by 2021 at a CAGR of 7.4% although each product segment will vary in growth rate. The overlay and OCD segment will witness high growth driven primarily by the technical capability to measure at required specification and high throughput for the sub-28nm nodes.

The study focuses on both dimensional and placement metrology systems used for the process control in patterning the wafers and reticles in semiconductor fabs and mask shops, particularly after mask and etch processes of the process flow.

The metrology systems covered in the study includes:
• CD-SEM
• OCD
• Overlay

The market size of each product segment is provided for 2016 and forecasted up to 2021. The competitive landscape of each segment and the market share of key competitors such as Hitachi High-Technologies, KLA-Tencor, and ASML are also provided along with their strategic approach towards the market. The market participants are working towards enhancing the current capabilities to stay valid with device miniaturization and growing complexity of the architecture. A comparison of the current technological capability of each product is also provided. Furthermore, an insight into new technologies being developed to meet the future needs of the industry is also provided.

The study highlights and analyzes the factors that will enable market growth and the challenges that the industry will face during 2017 to 2021. In addition, the study covers a geographical analysis of the market with revenue in 2016 and an analysis of forecasted growth until 2021.

Key Questions this Study will Answer
• Which product segment will grow the fastest in the next 5 years and what is the market size in terms of revenue for each of the segments?
• What impact will IoT and industry inflection will have on the market?
• What are the key market and technology trends?
• What are the competitive landscape and dynamics influencing the growth and development of the market?

Read the full report: http://www.reportlinker.com/p05075852/Analysis-of-Global-Lithography-Metrology-Equipment-Market-Forecast-to.html

Transition metal silicides, a distinct class of semiconducting materials that contain silicon, demonstrate superior oxidation resistance, high temperature stability and low corrosion rates, which make them promising for a variety of future developments in electronic devices. Despite their relevance to modern technology, however, fundamental aspects of the chemical bonding between their transition metal atoms and silicon remain poorly understood. One of the most important, but poorly known, properties is the strength of these chemical bonds — the thermochemical bond dissociation energy.

With funding from the National Science Foundation, a team of researchers from the University of Utah has investigated this property, and in this week’s The Journal of Chemical Physics, from AIP Publishing, they present their valuable findings for a number of specific compounds. These include precise values of the bond dissociation energies of the group four and five transition metal silicide molecules: TiSi, ZrSi, HfSi, VSi, NbSi and TaSi.

“The team measured the energy at which the diatomic silicides fall apart more quickly than they can be ionized by absorption of a second photon. This amount of energy is called the predissociation threshold. It provides an upper limit to the bond dissociation energy. However, the researchers have found that for molecules with certain electron configurations, if the molecule is cold, then the observation of a sharp predissociation threshold provides an accurate value of the thermochemical bond dissociation energy, and not simply an upper limit.”

“What I’m so pleased about with this new technique that we’ve developed is that it’s not just applicable to a small set of molecules,” said Michael Morse, one of the work’s authors. “It’s based on the fact that these small transition metal molecules have a density of electronic states that increases very rapidly as you get close to the dissociation limit, and that’s key in causing the molecule to fall apart as soon as you get above that limit […] The peculiarities of the transition metals make the method broadly applicable to that entire class of molecules, which are quite difficult to investigate by other means.”

This sharp threshold observation in a dense vibronic spectrum provides a new and highly effective means of estimating the bond dissociation energy for transition metals bonded to other p-block elements. According to the researchers, the uncertainties using this new method are much smaller than those seen with previous approaches.

Along with measuring the bond dissociation values for these molecules, the researchers were also able to use the predissociation thresholds to determine other fundamental values for certain molecules using thermochemical cycles, namely enthalpies of formation and ionization energies.

The data acquired can be used by chemists to develop more accurate computational methods regarding transition metal chemical bonding, along with bettering our understanding of these bonds.

“Quantum chemists are trying to develop new, efficient and accurate means of calculating these systems, and they’ve been quite successful with main group systems, and especially organic compounds,” Morse said. “But, the transition metals are much more difficult because there are so many more ways the electrons can be arranged. Another problem is that in the past, there hasn’t been as much highly accurate data available that can be used to compare theory and experiment. Without accurate data, it’s hard to tell how good a computational method may be.”

The research team has plans to work with other diatomic molecules containing transition metals. In fact, they already have results for the bond dissociation energies of TiC, ZrC, HfC, VC, NbC, TaC, WC, WSi, WS, WSe, and WCl that are in preparation for publication. By examining series of chemically related molecules, like these studies of the metal-carbon and tungsten-halogen molecules, the team intends to develop a broad picture of chemical bonding in the transition metal molecules.

“There’s a big advantage that comes from this sort of wide-ranging, systematic study. It allows us to develop what I like to call ‘chemical intuition’ about chemical bonds,” said Morse.

nLIGHT, Inc., a U.S. company in high-power semiconductor and fiber lasers, today announced the appointment of Gary Locke to its board of directors effective immediately.

The experience that Locke brings will help nLIGHT continuing its growth and expansion, including the addition of key manufacturing jobs at its locations in Vancouver, Washington, and Hillsboro, Oregon. With more than $100 million in sales in 2016, the company has experienced over 30 percent growth, more than half of which comes in the form of U.S. exports.

“Gary’s broad experience in both the public and private sector will add a valuable perspective to our board of directors,” said Scott Keeney, co-founder and chief executive officer. “We are honored to have him serve as a director and look forward to benefiting from his judgment and counsel.”

As two-term Governor of Washington State from 1997 to 2005, Locke fostered economic relations between China and the state, helping to more than double Washington’s exports to China. Under his leadership, the State of Washingtonranked as one of the nation’s four best-managed states.

From 2009 to 2011, Locke served as Secretary of Commerce of the United States where he led export control reform effort that both strengthened national security and eased licensing burdens for high-tech exports to partners, allowing U.S. companies to be more competitive in the global market.

As U.S. Ambassador to China from 2011 to 2014, Locke worked to open markets for U.S.-made goods and services.

 

Since leaving public office, Locke has remained steadfastly committed to facilitating American business and trade. As legal counsel for the Seattle-based international law firm Davis Wright Tremaine, Locke currently consults clients on issues regarding international trade, regulatory and investment policies.

Locke holds a Bachelor of Arts degree in political science from Yale University and a Juris Doctor degree from Boston University.

“I am excited to join the board of nLIGHT,” said Locke. “nLIGHT has a long track record of innovation in lasers and is well positioned for continued strong growth in global markets.”

North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in July 2017 was $2.27 billion. The billings figure is 1.4 percent lower than the final June 2017 level of $2.30 billion, and is 32.8 percent higher than the July 2016 billings level of $1.71 billion.

“We observed softening in the equipment billings in July following the strong surge in the first half of the year,” said Ajit Manocha, president and CEO of SEMI. “However, overall, equipment billings remain significantly up year-over-year, with 2017 on-track to be a record spending year.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)
Year-Over-Year
February 2017
$1,974.0
63.9%
March 2017
$2,079.7
73.7%
April 2017
$2,136.4
46.3%
May 2017
$2,270.5
41.8%
June 2017 (final)
$2,300.3
34.1%
July 2017 (prelim)
$2,268.4
32.8%

Source: SEMI (www.semi.org), August 2017

SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus, (NASDAQ: RMBS) to make Rambus cryptography technology available for the SiFive Freedom platforms. To speed time to market and remove the barriers that traditionally have blocked smaller players from developing custom silicon, leading companies in the semiconductor ecosystem have developed a new DesignShare concept, which offers IP at a reduced cost.

The DesignShare model gives any company, inventor or maker the ability to harness the power of custom silicon, enabling an entirely new range of applications. Companies like SiFive, Rambus and other ecosystem partners provide low- or no-cost IP to emerging companies, lowering the upfront engineering costs required to bring a custom chip design based on the SiFive Freedom platform to realization.

“To fulfill our mission to democratize access to custom silicon and upend the stagnant semiconductor industry, SiFive is committed to recruiting leading-edge companies like Rambus to help us revolutionize SoC design,” said Naveed Sherwani, CEO of SiFive. “The growing ecosystem of DesignShare IP providers ensures that aspiring system designers have a catalog of IP from which to choose when designing their SoC. We’re thrilled that Rambus has joined us in enabling innovation through DesignShare, and we look forward to future success together.”

Rambus will collaborate with SiFive to provide critical security components such as cryptographic cores, hardware root-of-trust, key provisioning and high-value services that are enabled by design.

“Rambus and SiFive share a similar philosophy of easing the path to designing innovative and cost-effective SoCs,” said Martin Scott, senior vice president and general manager of Rambus Security Division. “SiFive and Rambus have agreed to partner with an intent of providing chip-to-cloud-to-crowd security solutions that easily integrate with the SiFive Freedom platform and support the open and growing RISC-V hardware ecosystem. Our security cores embedded in Freedom Platform SOCs will enable secure in-field device connection and attestation for updates and diagnostics.”

SiFive was founded by the inventors of RISC-V – Yunsup Lee, Andrew Waterman and Krste Asanovic – with a mission to democratize access to custom silicon. In its first six months of availability, more than 1,000 HiFive1 software development boards have been purchased and delivered to developers in over 40 countries. Additionally, the company has engaged with multiple customers across its IP and SoC products, started shipping the industry’s first RISC-V SoC in November 2016 and announced the availability of its Coreplex RISC-V based IP earlier this month. SiFive’s innovative “study, evaluate, buy” licensing model dramatically simplifies the IP licensing process, and removes traditional road blocks that have limited access to customized, leading edge silicon.

SiFive is located in Silicon Valley and has venture backing from Sutter Hill Ventures, Spark Capital and Osage University Partners.

Silego Technology today announced shipping three billion units since its introduction of the pioneering Configurable Mixed-signal ICs (CMICs). In addition, Silego announced it shipped more than one hundred million units in the month of July.

Silego created not only the world’s first family of Configurable Mixed-signal ICs but also enabled a paradigm shift for designers. Reaching these dual milestones are further validation of the Configurable Mixed-signal IC category and how enthusiastically customers have embraced this novel approach to Mixed-signal design for volume applications.

John Teegen, Silego’s CEO, remarked, “Reaching these milestones was made possible by the innovative Silego team and our dedicated manufacturing and channel partners. It also demonstrates the trust our customers have put in Silego’s world-class operations team to get them to market quickly with quality and volume.”

Mike Noonen, Silego’s VP of WW Sales and Business Development added, “Over the past year, we have grown our business with existing customers and introduced CMICs to many new customers. These customers have discovered Silego’s clever combination of analog, digital, Non-Volatile Memory and software tools and are benefiting from a better way to design, prototype and go to production.”

Silego’s CMICs use Non-Volatile Memory to configure each device and integrate analog, digital logic, and power functions, which allows design engineers to eliminate traditional standard linear, passive and discrete components from their system. CMICs enable original equipment manufacturers, or OEMs, in high-volume applications to cost-effectively deliver their products to market faster and with greater design flexibility.

Since the introduction of the CMIC, Silego has developed five generations of CMIC silicon and design tools.

Recently Silego announced the new SLG46580, further expanding the GreenPAK™ (GPAK) family of Configurable Mixed-signal Integrated Circuits (CMICs). This newest GPAK is targeted to support power systems in wearable and handheld market segments. This device is both highly integrated and highly flexible, and can provide a rich set of features, including voltage monitoring, power sequencing, reset functions and low drop-out regulators (LDOs), that are configurable in settings and interconnect. This device is the second in the series of parts designed to create “Flexible Power Islands” (FPI).

 

 

 

LTX-Credence shipped the 600th PAx test system to Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things. The PAx platform has been specifically designed to address the high volume manufacturing test challenges of suppliers of advanced front end RF devices such as Multiband RF Power amplifiers, RF Front End Modules, RF Analog System in Package and RF discrete devices. The PAx platform is shipped in two main configurations, PAx and PAx-ac, which are deployed at most IDM, Fabless and OSAT companies specializing in the high volume manufacturing and test of these types of devices.

“Our goal with the PAx platform was to offer semiconductor manufacturers of RF front end devices an alternative to deploying their own in house test systems.” Steve Wigley, Vice President of the semiconductor tester group of Xcerra, commented: “Our approach was to leverage LTX-Credence RF manufacturing test technology and use our systems expertise to package it in a compact footprint to offer the required levels of performance, fast test times and operational availability. The shipment of the 600th of these test systems demonstrates the value of this approach, and has established the PAx platform as the clear market leader for testing RF front end applications with an estimated market share greater than 70%”.

MRSI Systems, a manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and MRSI Systems is shipping to customers worldwide.

Scaling imperatives

Today, high volume manufacturing of photonic, sensor, and semiconductor devices demands a die bonding system that can deliver industry leading speed without sacrificing high precision and superior flexibility. The new MRSI-HVM3, a high speed, flexible, 3 micron die bonder, has been built to address this challenge. This new system leverages a well-defined set of MRSI’s core competencies, built up over 30 years, in the areas of system design, software development, machine vision, motion control, industrial automation, and process solutions.

Customer outcomes

As Dr. Yi Qian, Vice President of Product Management, states, “The new MRSI-HVM3 incorporates the latest hardware and software innovations. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes. Used across all products, MRSI’s platform software makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine. Ultimately the system will generate great ROIs for customers. The MRSI-HVM3 high speed die bonder supports many applications including chip-on-carrier (CoC), chip-on-submount (CoS), and chip-on-baseplate or board (CoB).”

“MRSI Systems has been serving optoelectronic and microelectronic customers for the past 33 years and understands their requirement to scale efficiently in today’s fast paced marketplace. MRSI is pleased to meet these needs with the launch of our new high speed die bonder for high volume manufacturing of photonics packaging,” said Mr. Michael Chalsen, President, MRSI Systems.

Private demonstrations at CIOE

MRSI Systems is exhibiting at CIOE with their Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017. There will be private demonstrations of the MRSI-HVM3 performing CoC eutectic and epoxy bonding. Please reach out to your MRSI contact to ensure you have an opportunity to see the capabilities of this new product.

MRSI Systems is a manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems.

IC Insights has revised its outlook for semiconductor industry capital spending and presented its new findings in the August Update to The McClean Report 2017.  IC Insights’ latest forecast is for semiconductor industry capital spending to climb 20% this year.

Figure 1 shows the steep upward trend of quarterly capital spending in the semiconductor industry since 1Q16. Although there was a slight pause in the upward trajectory in 1Q17, 2Q17 set a new record for quarterly spending outlays.   Moreover, 1H17 semiconductor industry spending was 48% greater than in 1H16.  IC Insights believes that whether industry-wide capital spending in the second half of 2017 can match the first half of the year is greatly dependent upon the level of Samsung’s 2H17 spending outlays.

Not only has Samsung Semiconductor been on a tear with regard to its semiconductor sales, surging into the number one ranking in 2Q17, but the company has also been on a tremendous capital spending spree for its semiconductor division this year.  As depicted in Figure 2, Samsung spent a whopping $11.0 billion in capital outlays for its semiconductor group in 1H17, more than 3x greater than the company spent in 1H16 and only $300 million less than the company spent in all of 2016!   In fact, Samsung’s capital expenditures in 1H17 represented 25% of the total semiconductor industry capital spending and 28% of the outlays in 2Q17.

While the company has publicly reported that it spent $11.0 billion in capital outlays for its semiconductor division in 1H17 (a $22.0 billion annual run-rate), Samsung has been very secretive about revealing its full-year 2017 budget for its semiconductor group (it might be afraid of shocking the industry with such a big number!).  In 2012, the year of Samsung’s previous first half spending surge before 1H17, the company cut its second half capital outlays by more than 50%, from $8.5 billion in 1H12 to $3.7 billion in 2H12.  Will the company follow the same pattern in 2017?  At this point, it is impossible to tell.  IC Insights believes that Samsung’s full-year 2017 capital expenditures could range from $15.0 billion to $22.0 billion!

Figure 1

Figure 1

If Samsung spends $22.0 billion in capital outlays this year, total semiconductor industry capital spending could reach $85.4 billion, which would represent a 27% increase over the $67.3 billion the industry spent in 2016.

It is interesting to note that two of the major spenders, TSMC and Intel, are expected to move in opposite directions with regard to their 2H17 capital spending plans. TSMC spent about $6.8 billion in capital outlays in 1H17. If it sticks to its $10.0 billion budget this year, which it reiterated in its second quarter results, it would only spend about $3.2 billion in 2H17, less than half its outlays in 1H17. In contrast, Intel spent only about $4.7 billion in 1H17, leaving the company to spend about $7.3 billion in 2H17 in order to reach its stated full-year 2017 spending budget of $12.0 billion.

Figure 2

Figure 2

TowerJazz, the global specialty foundry, and Tacoma Technology Ltd and Tacoma (Nanjing) Semiconductor Technology Co., Ltd (collectively known as “Tacoma”) announced today that Tower has received a first payment of $18 million net, rendering phase one of the framework agreement with Tacoma binding. This agreement maps the establishment of a new 8-inch semiconductor fabrication facility in Nanjing, China. According to the terms of the framework agreement, TowerJazz will provide technological expertise together with operational and integration consultation, for which the Company shall receive additional payments based on milestones during the next few years, subject to a definitive agreement specifying all terms and conditions.

In addition, from the start of production at the facility, TowerJazz will be entitled to capacity allocation of up to 50% of the targeted 40,000 wafer per month fab capacity, which it may decide to use at its discretion. This capacity will provide TowerJazz with additional manufacturing capability and flexibility to address its growing global demand.

Tacoma will be responsible to source funds for all activities, milestones and deliverables of the entire project, including the construction, commissioning and ramp of this facility, with the project being fully supported by Nanjing Economic and Technology Development Zone through its Administration Committee, Credito Capital as well as through potential funding from other third party investors and entities.

“This agreement with Tacoma is in line with our business strategy to focus on growing markets such as China. The fabless business in China has grown rapidly in the past years. The new 8-inch fabrication facility in Nanjing will provide us with a strategic footprint in China and the opportunity to extend our offerings in advanced specialty process technologies by enabling customers in China to optimize their product performance and time to market,” said Dr. Itzhak Edrei, TowerJazz President.

Russell Ellwanger, TowerJazz Chief Executive Officer, commented, “We are exploring multiple opportunities in China, and determined this agreement with Tacoma to be a good fit for TowerJazz, providing a roadmap for a meaningful long-term strategic partnership. China’s focus to develop its domestic semiconductor industry with full infrastructure presents additional opportunities for TowerJazz, as a global analog leader, to expand our served markets and geographic presence. This partnership will enable us to further fulfill our customers’ needs through additional available capacity as well as to be an active player in the growing Chinese market.”

Joseph Lee, Tacoma Chairman, stated: “Deeply engraved in the corporate culture of both Tacoma and TowerJazz is the core belief in working ‘SMART’ with ‘PASSION.’ Our people are committed to contributing to our business partners, the global semiconductor industry and society with the best endeavor and integrity. Tacoma will fully fund this project together with Credito Capital and other entities. This venture will become a dominant player in Asia and will raise the standard in the semiconductor industry to another level.”

A groundbreaking and signing ceremony took place in Nanjing, China, attended by TowerJazz Chairman Mr. Amir Elstein, President Dr. Itzhak Edrei, Business Development Vice President Mr. Erez Imberman, as well as the then Israeli Ambassador to China the Honorable Mr. Matan Vilnai. Pictured, the signing between Tacoma Chairman, Mr. Joseph Lee and TowerJazz CEO Mr. Russell Ellwanger, with among others the above cited attendees.