Category Archives: Semiconductors

By Emmy Yi

Technologies promising huge growth such as Artificial intelligence (AI), 5G, machine learning, high-performance computing, and telematics are ratcheting up pressure on semiconductor manufacturers in the race among product makers to accelerate time to market and capture share. To support rapidly evolving end markets for these and other technologies that are key drivers of industry growth, chipmakers are boosting semiconductor performance, producing more wafer sizes and improving manufacturing efficiency.

At the same time, chip manufacturers must enable unprecedented end-product reliability for exploding markets such as automotive and healthcare markets where, with lives at stake, products can’t afford even the slightest lapse in reliability. In response, chip suppliers are retooling their manufacturing processes to support 3D stacking, package-level integration and miniaturization. But they must do more. Bringing high efficiency to all phases of manufacturing including design and materials is the new imperative.

The key to quality management is not in the traditional post-production testing and damage control but in prevention. Delivering the highest quality and reliability must start in the earliest stages of production with manufacturing and testing design – an approach that reduces not only the cost of downstream testing but minimizes product defects that can damage a supplier’s credibility and lead to lost business.

To that end, SEMI has launched its Quality Assurance Task Force consisting of representatives from industry leaders such as Infineon, NXP, TSMC, UMC, ASE, Unimicron, and GCE. The task force’s goal is to establish quality requirements spanning the supply chain to meet new, higher reliability standards and help safeguard Taiwan’s competitive edge in the global microelectronics industry. Meeting for the first time earlier this month, the companies exchanged ideas for improving quality management in semiconductor manufacturing and ultimately deliver the reliability the market needs.

The company representatives unanimously agreed that the first step is to ensure a QA-friendly environment with quality requirements for various stages of chipmaking ranging from design, manufacturing, packaging and testing to even PCB and CCL production. The SEMI Quality Assurance Task Force this year plans to build on its current membership by enlisting companies from various fields to address critical areas of reliability including statistical process control, surface-mount-technology-based board level reliability control, and 0 dppm quality control for automotive chips.

SEMI Quality Assurance Task Force consists of leading companies in the industry, including Infineon, NXP, TSMC, UMC, ASE, Unimicron, and GCE.

“SEMI’s comprehensive platform of exhibitions, programs, forums, trade meetings and matchmaking events is instrumental in bringing together key industry players to enhance quality management practices and meet the growing reliability requirements of the end markets we serve,” said Terry Tsao, chief marketing officer at SEMI and president of SEMI Taiwan. “The Quality Assurance Task Force is a shining example of how SEMI continues to support the crucial role of Taiwan’s semiconductor industry in the international community.”

For more information about the SEMI Quality Assurance Task Force or to become a member, please contact Emmy Yi at [email protected].

Emmy Yi is a marketing specialist at SEMI Taiwan.  

The IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers.  In its recently released Global Wafer Capacity 2019-2023 report, IC Insights shows that due to the surge of merger and acquisition activity in the middle of this decade and with more companies producing IC devices on sub-20nm process technology, suppliers are eliminating inefficient wafer fabs. Over the past ten years (2009-2018), semiconductor manufacturers around the world have closed or repurposed 97 wafer fabs, according to findings in the new report.

Figure 1 shows that since 2009, 42 150mm wafer fabs and 24 200mm wafer fabs have been shuttered. 300mm wafer fabs have accounted for only 10% of total fab closures since 2009.  Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009.

Figure 1

Three 150mm wafer fabs were closed or repurposed in 2018.  Two of these fabs belonged to Renesas.  Renesas closed one fab in Konan, Kochi, Japan that produced analog, logic, and some older microcomponent devices.  A second Renesas fab in Otsu, Shiga, Japan was repurposed and now makes only optoelectronic devices.  A third fab, Fab 1 belonging to Polar Semiconductor (now Sanken) in Bloomington, Minnesota, also was closed.  This fab manufactured analog, discretes, and offered some foundry services.

Given the skyrocketing cost of new wafer fabs and manufacturing equipment, and as more IC companies transition to a fab-lite or fabless business model, IC Insights anticipates there will be additional fab closures in the next few years.  Five closures/repurposed fabs have already been publicly announced. Samsung’s 300mm memory fab (Line 13) will be fully converted this year to produce image sensors and TI’s 200mm analog GFAB in Greenock, Scotland, is expected to close by June 2019.  Renesas plans to close two 150mm fabs (Otsu, Shiga and Ube, Yamaguchi, Japan) in 2020 or 2021, and Analog Devices plans to close its 150mm wafer fab in Milpitas, California in February 2021.

Semiconductor suppliers in Japan have closed a total of 36 wafer fabs since 2009, more than any other country/region.   In the same period, 31 fabs were closed in North America, 18 fabs were shuttered in Europe, and 12 wafer fabs were closed throughout the Asia-Pacific region (Figure 2).  With 36 fab closures and very few new fabs going up there, it is little wonder that Japan now accounts for only 5% of worldwide semiconductor capital spending.

Figure 2

ON Semiconductor (Nasdaq: ON) today announced its top distribution partners for 2018. These awards honor the distributor in each region that led overall channel sales, grew market share, captured increased sales of products and scored highly on overall process excellence in an evolving semiconductor market.

The top 2018 distribution partners are:

  • Americas: Future Electronics
  • APAC: WPI
  • EMEA: Avnet/Silica
  • Japan: OS Electronics
  • Global High Service Distributor: Mouser Electronics
  • Global Distributor: Avnet

ON Semiconductor is an industry leader in leveraging partnerships in the global distribution channel. Approximately 60 percent of the company’s business results from distribution sales, and distribution remains the fastest channel to market. Over the past few years, ON Semiconductor has grown distribution sales, which has attributed to over half of the company’s revenue dating back to 2015.

“Distribution sales accounted for approximately 60 percent of ON Semiconductor’s 2018 annual revenues,” said Jeff Thomson, vice president of global channel sales for ON Semiconductor. “The support of our worldwide distribution partners is fundamental to the success of our company’s ongoing plans to increase market penetration and continue revenue growth at a faster pace than the industry. The collaborative relationships and progressive sales programs we foster with our channel partners are an integral part of comprehensive solution selling. As advocates of these goals, each of the 2018 distribution partner award winners successfully grew product sales, generated significant new business, and effectively supported both our customers’ needs and our company initiatives for operational excellence. We thank our outstanding channel partners for their valuable contributions throughout 2018 and look forward to continued success in the coming year.”

In the third quarter of 2018, ON Semiconductor announced a monumental milestone in the company’s history by reaching over $1 billion in distribution resales. ON Semiconductor distribution partners, and this year’s honorees, have been instrumental to this tremendous milestone. In addition to this accomplishment, ON Semiconductor was recognized in 2018 as a Fortune 500 company, was named as one of Fortune’s 100 Fastest Growing Companies, was listed on the Dow Jones Sustainability Index and received recognition from Ethisphere for the fourth year in a row as one of the World’s Most Ethical Companies.

Nova (NASDAQ: NVMI) today announced that its co-authored paper with GLOBALFOUNDRIES on ‘Implementation of machine learning for high volume manufacturing metrology challenges’ has been selected as the winner of the Diana Nyyssonen award for ‘best paper at SPIE‘s 2018 Advanced Lithography Symposia.’ The award was granted to Nova and GF on the opening day of the 2019 Conference. The paper is a result of the continuous partnership between the companies and demonstrates the innovation Nova promotes in advanced process control utilizing its unique and differentiated software solutions. The methodology described in the paper was already installed and is utilized by GF in high volume manufacturing.

The joint effort demonstrates that predictive metrology based on machine learning is an advantageous and complementary technique for high volume semiconductor manufacturing. The collaborative work of Nova and GF examined the suitability of machine learning to address high volume manufacturing metrology requirements for applications in both front end of line (FEOL) and back end of line (BEOL) in advanced technology nodes. Feasibility to predict CD values from an inline measurement using machine learning engines was demonstrated, as well as the usage of machine learning data to directly predict electrical parameters.

“We are honored to be selected for this prestigious award in collaboration with our partners at GF,” said Dr. Shay Wolfling, Chief Technology Officer of Nova. “This innovative metrology solution is enabled by our NOVAFitTM technology that enhances traditional modeling capabilities with advanced machine learning algorithms. The joint work with GF has demonstrated once more that through collaboration with our customers our most advanced machine-learning solutions can quickly proliferate and be validated in high volume production in advanced technology nodes.”

The IBM (NYSE:IBM) board of directors today elected Admiral Michelle J. Howard to the board, effective March 1, 2019.

Admiral Howard, 58, is a former United States Navy officer and the first woman to become a four-star admiral. She was the first African-American woman to command a ship in the United States Navy (the USS Rushmore). Admiral Howard was also the first African-American and the first woman to be named Vice Chief of Naval Operations when she was appointed to that role by the President in July 2014. She retired in December 2017 as the commander of United States Naval Forces in Europe and Africa and the Allied Joint Forces Command in Naples, Italy, after a distinguished 35-year career.

Admiral Howard is currently the J.B. and Maurice C. Shapiro Visiting Professor of International Affairs at George Washington University, where she teaches in the areas of cybersecurity and international policy.

Ginni Rometty, IBM chairman, president and chief executive officer, said: “Admiral Howard is a groundbreaking leader with a distinguished career in military service. Her leadership skills, international perspective and extensive experience with cybersecurity and information technology will make her a great addition to the IBM board.”

Admiral Howard graduated from the United States Naval Academy in 1982 and from the United States Army’s Command and General Staff College in 1998 with a master’s degree in military arts and sciences. She was the first female graduate of the Naval Academy to be promoted to flag officer.

She has received honorary degrees from Rensselaer Polytechnic Institute, American Public University and North Carolina State University, and is the recipient of many honors, including the NAACP Chairman’s Image Award, the French Legion of Honor and the KPMG Inspire Greatness Award.

Qualcomm Incorporated and Samsung Electronics have named two executives to join the Silicon Integration Initiative board of directors. Si2 is a global research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Udi Landen is Vice President of Engineering at Qualcomm Technologies, Inc. In his current role, Landen provides technical, management and business leadership for engineering teams at various international sites that focus on mobile and computing design enablement and CAD methodology automation roadmaps. Prior to joining Qualcomm in 2013, Landen held executive and leadership roles at Altera Corp., Mercury Interactive and Cadence Design Systems. He is a graduate of the Technion, Israel Institute of Technology.

Seungbum Ko is Vice President of the Samsung Electronics Design Technology Team. He is responsible for all memory design methodology activities for the Samsung memory division, and also manages the relationships between memory division and EDA vendors. A 21-year veteran at Samsung, Ko’s expertise includes development of SDRAM, DDR, DDR2, DDR3, LPDD2, LPDDR3 and LPDDR4 devices. His internal honors include the Proud Samsung Award, the Jang Young-sil Award, and the Memory Award.

Landen and Ko were approved by a vote of the Si2 board, which represents leading semiconductor manufacturers and foundries, fabless companies, and EDA software providers.

Qualcomm and Samsung are active members of the Si2 OpenAccess and Compact Model Coalitions. OpenAccess is a standard application programming interface and reference source code for the design database used by all major chip design software suppliers. It provides end-user chip designers with inter-tool interoperability. Si2 standard, compact SPICE simulation models selected and supported by the Compact Model Coalition are used by every major circuit simulator in the semiconductor industry.

Micron Technology, Inc. (Nasdaq: MU) today added a new cost-efficient solid-state drive (SSD) to its client computing portfolio. The Micron 1300 SSD makes flash storage accessible to more users, enabling its adoption in a broader set of personal computing devices for a better mobile computing experience. Consumers who are eager to move from rotating media to solid state drives value fast performance, quick startup, and reliability — whether for desktop, mobile or workstation PCs. SSDs address these needs better than power-hungry hard disk drives (HDDs), yet their higher prices have kept users from shifting to SSDs. Micron redesigned the 1300 SSD series to close the price gap.

“The deployment of advanced 3D NAND technologies has led the client SSD market to branch into value and higher-performance storage segments,” said Gregory Wong, president of Forward Insights. “Micron’s latest client SSD solutions provide a coherent migration path from HDD to value-oriented SSDs.”

The new Micron 1300 SATA SSD is one of the industry’s first 96-layer triple-level cell (TLC) 3D NAND-based SSDs, available in capacities up to 1TB (in M.2) and 2TB (in 2.5-inch). This product introduction extends Micron’s leadership in high-density SSD design and high-volume manufacturing of performance 3D NAND-based flash drives. The ability to build drives with very small footprints like the M.2 SSD form factor, which is as small as a stick of gum, also hinges on Micron’s leadership in 3D NAND technology.

“We are driving innovation to deliver on the personal computing needs of users who want thinner, lighter and less power-hungry devices,” said Roger Peene, vice president of product planning and strategy for Micron’s Storage Business Unit. “Expanding our broad SSD portfolio with high-density 96-layer NAND storage delivers greater performance, form factors and efficiency at lower cost to meet the demanding needs of today’s mobile workers.”

The Micron 1300 SSD enhances storage performance for mobile, desktop and workstation PCs with 2.7x higher read throughput over HDDs.* It delivers sequential reads/writes up to 530MB/520MB per second and random reads/writes up to 90,000/87,000 input/output operations per second (IOPS).

In addition, the Micron 1300 SSD, designed to be power efficient, extends battery life between charges for the mobile worker. It uses 75 milliwatts (mW) of power, which is only 45 percent of the active (read/write) power of an average HDD.** The Micron 1300 SSD also supports Microsoft® Windows® 10 Modern Standby requirements including adaptive thermal management and near-instant transmission to low-power mode for increased productivity. The SSD also offers important features to protect valuable data such as asynchronous power-loss protection for data at rest and optional Opal 2.0 self-encryption.

The Micron 1300 SSD is an extension of the popular Micron 1100 SATA client SSD. Continuing the widely adopted SATA connectivity, Micron’s 1300 SSD series offers compelling price-to-value ratios at a range of capacities.

By Serena Brischetto

The SEMI Europe Industry Strategy Symposium (ISS Europe) returns in Milan, Italy, this year from 31st March to 2nd April, 2019 to explore new opportunities and challenges in the digital economy. Serena Brischetto of SEMI spoke with GreenWaves Technologies CEO and co-founder Loïc Lietar about the semiconductor start-up and its Internet of Things (IoT) ultra-low-power processing technology ahead of the summit.

SEMI: What are the mission and vision of GreenWaves Technologies?

Lietar: GreenWaves Technologies is a fabless semiconductor start-up that is designing disruptive ultra-low power embedded solutions for image, sound and vibration artificial intelligence (AI) processing in sensing devices. It was founded in late 2014 with the mission to enable the market for intelligent in-device sensors using ultra-low energy and cost-efficient computing solutions. As a result, the GreenWaves GAP8 is the industry’s first ultra-low-power processor to enable battery-operated AI in Internet of Things (IoT) applications.

SEMI: How did you move from the semiconductor industry to the start-up ecosystem?

Lietar: I worked 25 years for STMicroelectronics then four years ago left because a project didn’t materialize. At the same time, I became involved a bit by chance in the founding of GreenWaves, which turned out to be an amazing journey that I rapidly got entirely – and deadly – committed to.

SEMI: Semiconductors are usually not associated with the idea of start-up. What is the key to the success of GreenWaves and its positioning?

Lietar: Start-ups have played a significant role in the formation of our industry and in bringing innovations and disruptions to the market. But as it became more complicated to finance start-ups because of exploding development costs, the number of semiconductor start-ups shrank significantly in the past 10 years.

At GreenWaves we develop and sell IoT application processors – processors tuned for a given class of applications. In our case, we focused on machine learning inference processors and more generally signal processing and IoT for ultra-low power. We typically process and analyze images, sounds and vibrations and our technology is more than one order of magnitude more energy efficient than existing processors. For example, our processor, coupled with an infra-red sensor, can count the number of people present in a room once a minute for more than five years on a single charge.

Our architecture uses RISC-V cores. This free and open Instruction Set Architecture is seeing huge momentum and a rapidly growing community. Second, we leverage an open source project called PULP developed by the Italian Università di Bologna and the Federal Polytechnical School ETH in Zurich. While open source is a well-established model for software, this is pretty unchartered territory in the semiconductor industry. It is working very well for us, as we benefit from robust technology we can incrementally innovate on. This is why we have been able to develop our first product with 4 million Euro.

Competition is now emerging, and this is a good sign: We are not alone in believing in this market but we remain very differentiated!

SEMI: One of the reasons why semiconductor start-ups were no longer attractive to VCs is the amount of capital that start-ups need to invest. Did public funding help you too?

Lietar: Yes, public funding played a crucial role at the beginning. We received rather classically 300K Euro of French grants and then we were lucky enough to win a very selective H2020 grant, the SME instrument, for 1.2M€. In France there is a very powerful scheme of research tax credit that covers more than 30 percent of our R&D costs and French banks know how to lend money to start-ups, with a state warranty.

Source: SEMI Blog

Future technologies based on the principles of quantum mechanics could revolutionize information technology. But to realize the devices of tomorrow, today’s physicists must develop precise and reliable platforms to trap and manipulate quantum-mechanical particles.

In a paper published Feb. 25 in the journal Nature, a team of physicists from the University of Washington, the University of Hong Kong, the Oak Ridge National Laboratory and the University of Tennessee, report that they have developed a new system to trap individual excitons. These are bound pairs of electrons and their associated positive charges, known as holes, which can be produced when semiconductors absorb light. Excitons are promising candidates for developing new quantum technologies that could revolutionize the computation and communications fields.

The team, led by Xiaodong Xu, the UW’s Boeing Distinguished Professor of both physics and materials science and engineering, worked with two single-layered 2D semiconductors, molybdenum diselenide and tungsten diselenide, which have similar honeycomb-like arrangements of atoms in a single plane. When the researchers placed these 2D materials together, a small twist between the two layers created a “superlattice” structure known as a moiré pattern — a periodic geometric pattern when viewed from above. The researchers found that, at temperatures just a few degrees above absolute zero, this moiré pattern created a nanoscale-level textured landscape, similar to the dimples on the surface of a golf ball, which can trap excitons in place like eggs in an egg carton. Their system could form the basis of a novel experimental platform for monitoring excitons with precision and potentially developing new quantum technologies, said Xu, who is also a faculty researcher with the UW’s Clean Energy Institute.

Excitons are exciting candidates for communication and computer technologies because they interact with photons — single packets, or quanta, of light — in ways that change both exciton and photon properties. An exciton can be produced when a semiconductor absorbs a photon. The exciton also can later transform back into a photon. But when an exciton is first produced, it can inherit some specific properties from the individual photon, such as spin. These properties can then be manipulated by researchers, such as changing the spin direction with a magnetic field. When the exciton again becomes a photon, the photon retains information about how the exciton properties changed over its short life — typically, about a hundred nanoseconds for these excitons — in the semiconductor.

In order to utilize individual excitons’ “information-recording” properties in any technological application, researchers need a system to trap single excitons. The moiré pattern achieves this requirement. Without it, the tiny excitons, which are thought to be less than 2 nanometers in diameter, could diffuse anywhere in the sample — making it impossible to track individual excitons and the information they possess. While scientists had previously developed complex and sensitive approaches to trap several excitons close to one another, the moiré pattern developed by the UW-led team is essentially a naturally formed 2D array that can trap hundreds of excitons, if not more, with each acting as a quantum dot, a first in quantum physics.

A unique and groundbreaking feature of this system is that the properties of these traps, and thus the excitons, can be controlled by a twist. When the researchers changed the rotation angle between the two different 2D semiconductors, they observed different optical properties in excitons. For example, excitons in samples with twist angles of zero and 60 degrees displayed strikingly different magnetic moments, as well as different helicities of polarized light emission. After examining multiple samples, the researchers were able to identify these twist angle variations as “fingerprints” of excitons trapped in a moiré pattern.

In the future, the researchers hope to systematically study the effects of small twist angle variations, which can finely tune the spacing between the exciton traps — the egg carton dimples. Scientists could set the moiré pattern wavelength large enough to probe excitons in isolation or small enough that excitons are placed closely together and could “talk” to one another. This first-of-its-kind level of precision may let scientists probe the quantum-mechanical properties of excitons as they interact, which could foster the development of groundbreaking technologies, said Xu.

“In principle, these moiré potentials could function as arrays of homogenous quantum dots,” said Xu. “This artificial quantum platform is a very exciting system for exerting precision control over excitons — with engineered interaction effects and possible topological properties, which could lead to new types of devices based on the new physics.”

“The future is very rosy,” Xu added.

Sigma Labs, Inc., a provider of quality assurance software under the PrintRite3D® brand, was named a member of the Manufacturing Technology Centre (MTC) located at Ansty Park, Coventry, UK. Membership of the MTC enables Sigma Labs to share and provide expertise and solutions for a number of the Centre’s projects and also network with the Centre’s existing members, including some of the UK’s leading aerospace companies.

The MTC was established as part of the UK government’s national manufacturing strategy with the aim of bridging the gap between academic discoveries and real-time industry innovation. It houses some of the most advanced manufacturing equipment in the world, providing integrated manufacturing system solutions for customers across sectors that include automotive, aerospace, rail, construction/civil engineering, oil & gas and defense.

John Rice, CEO of Sigma Labs, said, “The MTC manufacturing research center model uses public and private funding to bring academia and industry together, to pursue challenging, industrially relevant development projects. As a member of the MTC, Sigma Labs will extend its industry footprint further into the exciting research and commercialization in additive manufacturing today. With Europe at the forefront of many innovative and major developments in the metal AM industry, we believe this agreement, our second major research alliance with a European center of excellence, holds great promise for us and the future of AM. We look forward to interacting with the other member companies in the MTC, and particularly to collaborating with researchers at the National Centre for Additive Manufacturing to demonstrate the capabilities and potential of the PrintRite3D® INSPECT®technology.”

MTC technology director Ken Young said, “I am delighted to welcome Sigma Labs to the MTC community. Quality assurance in additive manufacturing is a critical topic that requires significant attention. Gaining insights into the part quality during the additive manufacturing build process reduces effort for post-build inspection and ultimately provides the foundation for closed loop process control for improved robustness. Sigma Labs’ advanced capabilities on this topic will provide expertise for a number of the MTC’s projects and network with our membership base, focusing on qualification and certification of the additive manufacturing process.”

Sigma Labs will install its PrintRite3D® INSPECT® In-Process Quality Monitoring and Control technology at the MTC’s National Centre for Additive Manufacturing and participate in various member-sponsored programs with a focus on qualification and certification of the additive manufacturing process.

PrintRite3D® INSPECT®, which comprises software for in-process inspection of metallurgical properties, uses sensor data and establishes in-process metrics for each product’s design specifications and metal. It provides manufacturing engineers with information in real time that can permit them to avert a part that is beginning to display discontinuities from going on to become a rejected part. INSPECT® also generates quality reports based on rigorous statistical analysis of manufacturing process data and allows for interrogation of suspect part data that can be used for process improvement and optimization.