Category Archives: Semiconductors

Brewer Science has been awarded a 2018 Top Workplaces honor by the St. Louis Post-Dispatch. Based solely on feedback obtained through an anonymous employee survey, the designation recognizes St. Louis-area employers that offer dynamic work environments to satisfied employees.

The survey, which measured various aspects of workplace culture, was administered by research partner Energage, LLC, a leading provider of technology-based employee engagement tools.

“Top Workplaces is more than just recognition,” said Doug Claffey, CEO of Energage. “Our research shows organizations that earn the award attract better talent, experience lower turnover, and are better equipped to deliver bottom-line results. Their leaders prioritize and carefully craft a healthy workplace culture that supports employee engagement.”

Since the inception of the company in 1981, Dr. Terry Brewer, founder and president of Brewer Science, has been dedicated to creating an environment where employees have the freedom to be innovative. “The culture of creativity at Brewer Science provides opportunities for employees to grow personally and professionally,” explains Alan Gerson, Executive Director, Human Resources. “By giving employees opportunities to participate in wellness programs, community events and mentorships as well as engage in challenging work, Brewer Science is committed to being a company of the people, by the technology and for the customer. This commitment sets us apart as a unique company and makes Brewer Science a rewarding place to work.”

The St. Louis Post-Dispatch has previously recognized Brewer Science as a Top Workplace or honorable mention in 2012, 2013, 2015, 2016, and 2017.

Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI. More than 26,000 professionals from the electronics manufacturing supply chain attend SEMICON West and the co-located Intersolar. The “Best of West” award was established to recognize new products moving the industry forward with technological developments in the electronics supply chain.

Selected from over 600 exhibitors, SEMI announced today that the following Best of West 2018 Finalists will be displaying their products on the show floor at Moscone Center from July 10-12:

  • Advantest: T5503HS2 Memory Tester— The T5503HS2 memory tester is the industry’s most productive test solution for the fastest memory devices available today as well as next-generation, super-high-speed DRAMs.  The new system’s flexibility extends the capabilities of the T5503 product family in the current “super cycle,” in which global demand for memories is skyrocketing. (South Hall Booth #1105)
  • BISTel: Dynamic Fault Detection (DFD®) – The DFD system offers full trace data coverage and eliminating the need for timely and costly modeling and set up. DFD® is also a bridge to smart factory manufacturing because it integrates seamlessly to legacy FDC systems meaning customers can access the most comprehensive, and accurate fault detection system on the market. (South Hall Booth 1811)
  • Rudolph Technologies: Dragonfly System with Truebump Technology– Rudolph’s Dragonfly System with Truebump Technology was designed to provide a complete solution for “total bump process control.” Using a unique approach, Truebump Technology combines 2D inspection and measurement information from image-based techniques with 3D data from separate high-precision and high-throughput laser-based techniques to deliver accurate and complete characterization at production-capable throughputs. (North Hall Booth #6170)

Congratulations to each of the Finalists. The Best of West Award winner will be announced during SEMICON West (www.semiconwest.org) on Wednesday, July 11, 2018.

About SEMI

SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

About Extension Media

Extension Media is a publisher of over 20 business-to-business magazines (including Solid State Technology), resource catalogs, newsletters and web sites that address high-technology industry platforms and emerging technologies such as chip design, embedded systems, software and infrastructure, intellectual property, architectures, operating systems and industry standards. Extension Media publications serve several markets including Electronics, Software/IT and Mobile/Wireless. Extension Media is a privately held company based in San Francisco, Calif. For more information, visit www.extensionmedia.com

IC Insights will release its 200+ page Mid-Year Update to the 2018 McClean Report next month.  The Mid-Year Update will revise IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in the 2018 McClean Report issued in January of this year.

Figure 1 shows that IC Insights forecasts that China-headquartered companies will spend $11.0 billion in semiconductor industry capex in 2018, which would represent 10.6% of the expected worldwide outlays of $103.5 billion.  Not only would this amount be 5x what the Chinese companies spent only three years earlier in 2015, but it would also exceed the combined semiconductor industry capital spending of Japan- and Europe-headquartered companies this year.

Since adopting the fab-lite business model, the three major European producers have represented a very small share of total semiconductor industry capital expenditures and are forecast to account for only 4% of global spending in 2018 after representing 8% of worldwide capex in 2005.  Although there may be an occasional spike in capital spending from European companies (e.g., the surge in spending from ST and AMS in 2017), IC Insights believes that Europe-headquartered companies will represent only 3% of worldwide semiconductor capital expenditures in 2022.

It should be noted that several Japanese semiconductor companies have also transitioned to a fab-lite business model (e.g., Renesas, Sony, etc.).  With strong competition reducing the number and strength of Japanese semiconductor manufacturers, the loss of its vertically integrated businesses and thus missing out on supplying devices for several high-volume end-use applications, and its collective shift toward fab-lite business models, Japanese companies have greatly reduced their investment in new wafer fabs and equipment.  In fact, Japanese companies are forecast to represent only 6% of total semiconductor industry capital expenditures in 2018, a big decline from the 22% share they held in 2005 and an even more precipitous drop from the 51% share they held in 1990.

Figure 1

Although China-headquartered pure-play foundry SMIC has been part of the list of major semiconductor industry capital spenders for quite some time, there are four additional Chinese companies that are forecast to become significant semiconductor industry spenders this year and next—memory suppliers XMC/YMTC, Innotron, JHICC, and pure-play foundry Shanghai Huali.  Each of these companies is expected to spend a considerable amount of money equipping and ramping up their new fabs in 2018 and 2019.

Due to the increased spending by startup China-based memory manufacturers, IC Insights believes that the Asia-Pac/Others share of semiconductor industry capital spending will remain over 60% for at least the next couple of years.

TowerJazz, the global specialty foundry, today announced details on its 13th annual Technical Global Symposium (TGS) being held in China, Japan, and the United States. This year, TowerJazz TGS will focus on the Company’s leading analog technology offerings, advanced manufacturing solutions and commitment to customer partnerships. All TGS events will commence with a keynote from TowerJazz CEO, Mr. Russell Ellwanger focusing on the Company’s performance, business strategy and industry leadership through alignment with customer roadmaps, innovative and superior technology, and worldwide manufacturing capabilities.

During TGS, speakers will discuss market directions and the latest TowerJazz plans, developments and activities for strategic growth in its specialty process technologies such as Radio Frequency (RF) & High Performance Analog (HPA), power management, and CMOS image sensors (CIS), as well as its process transfer offering (TOPS) for the rising markets of automotive, sensors, the IoT, and 5G, among others. In addition, TowerJazz will present the latest design enablement tools and solutions jointly developed with its EDA partners as well as the Company’s expanded manufacturing capacity and multi-sourcing capabilities.

The global TGS events facilitate customer and partner interaction with TowerJazz team members and industry executives to exchange information on the latest unique and advanced solutions for next-generation analog ICs. TowerJazz focuses on strong roadmap alignment and long-term partnerships with its customers to meet their current and future needs with the most innovative process platforms, addressing the requirements of the fastest growing markets.

As the leading analog pure play foundry, TowerJazz continues to be committed and passionate toward creating value for its customers. The Company offers the most advanced analog technology and best-in-class design enablement while providing global capacity assurance and flexibility to enable customers with competitive advantage and fast time to market.

This year, TowerJazz TGS events will be hosted in the following locations:

Sponsors at TowerJazz TGS events include the industry’s leading EDA vendors and tool providers who will share the latest design capabilities offered in collaboration with TowerJazz: Cadence, HES, Integra Tech, Keysight Technologies, Magwel, Mentor, PacTech, Photronics, Presto, Silvaco, Synkom and Synopsis.

For more information about TowerJazz TGS and registration please visit:
http://www.towerjazz.com/events.html#tgs

Micron Technology, Inc. (Nasdaq:MU) today announced volume production on its 8Gb GDDR6 memory. Built on experience and execution for several generations of GDDR memory, GDDR6 – Micron’s fastest and most powerful graphics memory designed in Micron’s Munich Development Center – is optimized for a variety of applications that require high performance memory, including artificial intelligence (AI), networking, automotive and graphics processing units (GPUs). Additionally, Micron has worked with core ecosystem partners to ramp GDDR6 documentation and interoperability, enabling faster time to market for designs.

“Micron is a pioneer in developing advanced high bandwidth memory solutions and continues that leadership with GDDR6. Micron demonstrated this leadership by recently achieving throughput up to 20 Gb/s on our GDDR6 solutions,” said Andreas Schlapka, director, Compute Networking Business Unit, Micron. “In addition to performance increases, Micron has developed a deep partner ecosystem to enable rapid creation of GDDR6 designs, enabling faster time to market for customers looking to leverage this powerful new memory technology.”

The need for high performance GDDR6 memory has grown as end-users demand advanced applications. GDDR6 enables advanced performance with lower power consumption in a number of segments including:

  • Artificial Intelligence – Artificial intelligence, machine learning, deep learning are memory intensive applications that require more bandwidth from memory solutions. GDDR6 delivers the higher bandwidth required to accelerate AI in applications like computer vision, autonomous driving and the many other applications that require this higher bandwidth.
  • Graphics – Enabling significant performance improvements for today’s top GPUs, GDDR6 delivers enhanced graphic memory speeds to enable higher application bandwidth. Micron GDDR6 will be a core enabling technology of advanced GPU applications, including acceleration, 4K video and improved rendering, VR/AR and crypto mining applications.
  • Networking – Advanced networking technologies require access to high speed/high bandwidth memory. GDDR6-powered smart Network Interface Cards (NIC) enable significant improvements in network bandwidth. Additionally, high bandwidth RAID controllers featuring GDDR6 memory deliver dramatic enhancements to data access and protection.
  • Automotive – As auto manufacturers push for autonomous vehicles, high performance memory is required to process the vast amounts of real-time data required to make this technology a reality. Micron GDDR6 delivers 448 GB/s auto qualified memory solutions, that deliver more than double the bandwidth of LPDDR5 automotive memory solutions.

“As demand for advanced automotive applications such as ADAS and other autonomous driving solutions grows, the need for high bandwidth memory in automotive will grow as well. Advanced high bandwidth GDDR6 memory solutions are a key enabling technology for autonomous vehicles and will be an important tool for the automotive industry as they develop next generation transportation initiatives,” said Kris Baxter, vice president, Marketing, Micron’s Embedded Business Unit.

Targeting up to 64GB/s in one package, GDDR6 brings a significant improvement over the fastest available GDDR5. This unprecedented level of single-chip performance, using proven, industry-standard BGA packaging provides designers a powerful, cost-efficient and low-risk solution using the most scalable, high-speed discrete memory available to the market.

In order to deliver this leading edge high bandwidth memory technology to customers, Micron is working directly with ecosystem partners in order to enable learning on both pre-silicon verification as well as validation. Prior to mass production of GDDR6 memory, Micron shipped early validation silicon to our ecosystem partners to accelerate engineering efforts behind validating intellectual property and build robust models and toolsets in the ecosystem and deliver board layout validation. This ensures that engineers are able to implement GDDR6 in designs at a faster rate and bring bandwidth intensive applications to the marketplace. These ecosystem partners include Rambus and more.

“With nearly 30 years’ experience in implementing designs for high-speed interfaces, Rambus is the first IP provider to launch a comprehensive GDDR6 PHY solution for next-generation AI, ADAS, networking and graphics applications and continues to be at the leading edge of implementing industry standards. We are proud to work with Micron and other ecosystem partners to help customers accelerate time to market for GDDR6 designs and deliver the most advanced solutions based on GDDR6 memory,” said Frank Ferro, senior director of product marketing, Rambus.

Micron GDDR6 memory solutions will be on display in booth B-1340 at ISC 2018, June 24-28, in Frankfurt, Germany. For more information, visit www.micron.com.

Cadence Design Systems, Inc. (NASDAQ: CDNS) today launched the Cadence Cloud portfolio, the first broad cloud portfolio for the development of electronic systems and semiconductors. The Cadence Cloud portfolio consists of Cadence-managed and customer-managed environments that enable electronic product developers to use the scalability of the cloud to securely manage the exponential increase in design complexity. With the new portfolio offerings, customers gain access to improved productivity, scalability, security and flexibility, through scalable compute resources available in minutes or hours instead of months or weeks, achieving better overall throughput in the development process.

The announcement was made at the 55th annual Design Automation Conference (DAC) being held in San Francisco at Moscone Center West, June 25-28, 2018. Cadence is located in booth 1308 in the main exhibit hall and booth 1245 in the Design Infrastructure Alley. For more information on the new Cadence Cloud portfolio, please visit www.cadence.com/go/cadencecloud.

Cadence gained extensive cloud experience by hosting design environments for more than 100 customers of varying sizes and architecting many of its products to be massively parallel for improved scalability in the cloud.

“The cloud will fundamentally influence silicon design by giving semiconductor companies the ability to optimize their capital versus operational expenses for computing infrastructure,” said Suk Lee, senior director Design Infrastructure Marketing Division at TSMC. “Cadence has passed our rigorous cloud security audits and is authorized to engage with mutual customers on the Cadence Cloud using TSMC process models and rule decks.”

“While many industries have previously adopted the cloud to address compute-intensive workloads, systems and semiconductor companies have faced unprecedented challenges that have made cloud adoption difficult until now,” said Richard Wawrzyniak, principal analyst for ASIC & SoC at Semico Research Corp. “Some of the challenges included security concerns and the sheer amount of design data and the inherent scalability limitations with electronic design automation tools. The Cadence approach to the cloud addresses historical industry issues, opening the door for customers to adopt the cloud and enter the next generation of chip design development.”

Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Electronics Co., Ltd. has certified the Synopsys Custom Design Platform for Samsung Foundry’s 7-nanometer (nm) Low Power Plus (LPP) process Samsung Foundry’s 7LPP is its first semiconductor process technology to use extreme ultraviolet (EUV) lithography, a process technology that greatly reduces complexity and offers significantly better yield and fast turnaround time when compared to its 10-nanometer (10nm) FinFET predecessors. Synopsys custom design tools have been updated to support Samsung Foundry’s 7LPP requirements. In addition, a Synopsys-ready process design kit (PDK) and custom design reference flow are available from Samsung Foundry.

The Synopsys Custom Design Platform has been certified for Samsung Foundry’s 7LPP process technology. The platform is centered around the Custom Compiler custom design and layout environment, and includes HSPICE, FineSim SPICE and CustomSim FastSPICE circuit simulation, StarRC parasitic extraction, and IC Validator physical verification. To support efficient 7LPP custom design, Synopsys and Samsung Foundry have collaborated to develop a reference flow that includes a set of tutorials illustrating key requirements of 7-nm design and layout. These tutorials include sample design data and step-by-step instructions for performing typical design and layout tasks. Topics covered include electrical rule checking, circuit simulation, mixed-signal simulation, Monte Carlo analysis, layout, parasitic analysis, and electromigration.

To achieve certification from Samsung Foundry, Synopsys tools have been optimized to support the demanding requirements of 7-nm design, including:

  • Accurate FinFET device modeling with device aging effect
  • Advanced Monte Carlo simulation features to enable efficient analysis
  • High-performance transient noise simulation for analog and RF designs
  • High-performance post-layout simulation to enable parasitic-aware design and simulation
  • Dynamic circuit ERC for device voltage checks
  • High-performance transistor-level EM/IR analysis to minimize over-design
  • Efficient symbolic editing of FinFET device arrays
  • EUV support
  • Coverage-based via resistance extraction

“Our custom design collaboration with Synopsys has expanded substantially over the past two years,” said Ryan Sanghyun Lee, vice president of Foundry Marketing Team at Samsung Electronics. “With this latest effort, we have added Synopsys Custom Design Platform support for our 7LPP process, including a custom design reference flow based on Synopsys tools.”

“We’ve been collaborating closely with Samsung Foundry to simplify custom design using FinFET process technology,” said Bijan Kiani, vice president of product marketing at Synopsys. “Together we have delivered certified tools, a reference flow, a PDK, simulation models, and runsets to enable Samsung customers to achieve robust custom designs on the 7LPP process.”

ON Semiconductor (Nasdaq: ON) plans to invest $51 million to support expansion of the Luzerne County facility. The ON Semiconductor Mountain Top location specializes in the manufacturing of semiconductor discrete devices used in power management applications across a wide variety of industries, including automotive, industrial, communication and computing.

Today, ON Semiconductor occupies 437,000 square feet of space on 84 acres in the Crestwood Industrial Park. The Mountain Top site is a high-tech location with a highly skilled workforce, benefits, clean work environment and open communication environment. The investment is planned to increase production and in turn create over 70 new jobs, including production staff, technicians, engineers and other support staff.

“We have an outstanding team of highly motivated employees combining our technical capabilities and expansive space capacity to meet exploding business growth in critical markets for ON Semiconductor,” said Heather Carreiro, general manager at ON Semiconductor’s Mountain Top facility. “The initial phase of expansion is currently underway. I’m very proud of our accomplishments and excited about the future of our operation here in Mountain Top.”

With its acquisition of Fairchild’s product portfolio of medium and high voltage products in late 2016, complementing ON Semiconductor’s specialization in low power, the company now has a complete suite of power conversion and power management technologies. This makes ON Semiconductor uniquely positioned to support customers across multiple sectors in working purposefully toward realizing the degree of energy efficiency desired by their customers and increasingly required by regulations.

ON Semiconductor is headquartered in Phoenix, Arizona, and offers a portfolio of over 80,000 energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices utilized in, computing, consumer, industrial, medical and military/aerospace applications. The company operates a network of manufacturing facilities, sales offices and design centers which are located in key markets throughout North America, Europe, and in the Asia Pacific region.

Researchers at Chalmers University of Technology, Sweden, have developed a graphene assembled film that has over 60 percent higher thermal conductivity than graphite film – despite the fact that graphite simply consists of many layers of graphene. The graphene film shows great potential as a novel heat spreading material for form-factor driven electronics and other high power-driven systems.

Until now, scientists in the graphene research community have assumed that graphene assembled film cannot have higher thermal conductivity than graphite film. Single layer graphene has a thermal conductivity between 3500 and 5000 W/mK. If you put two graphene layers together, then it theoretically becomes graphite, as graphene is only one layer of graphite.

Today, graphite films, which are practically useful for heat dissipation and spreading in mobile phones and other power devices, have a thermal conductivity of up to 1950 W/mK. Therefore, the graphene-assembled film should not have higher thermal conductivity than this.

Research scientists at Chalmers University of Technology have recently changed this situation. They discovered that the thermal conductivity of graphene assembled film can reach up to 3200 W/mK, which is over 60 percent higher than the best graphite films.

In the graphene film, phonons — quantum particles that describe thermal conductivity — can move faster in the graphene layers rather than interact between the layers, thereby leading to higher thermal conductivity. Credit: Chalmers University of Technology/Krantz Nanoart

Professor Johan Liu and his research team have done this through careful control of both grain size and the stacking orders of graphene layers. The high thermal conductivity is a result of large grain size, high flatness, and weak interlayer binding energy of the graphene layers. With these important features, phonons, whose movement and vibration determine the thermal performance, can move faster in the graphene layers rather than interact between the layers, thereby leading to higher thermal conductivity.

“This is indeed a great scientific break-through, and it can have a large impact on the transformation of the existing graphite film manufacturing industry”, says Johan Liu.

Furthermore, the researchers discovered that the graphene film has almost three times higher mechanical tensile strength than graphite film, reaching 70 MPa.

“With the advantages of ultra-high thermal conductivity, and thin, flexible, and robust structures, the developed graphene film shows great potential as a novel heat spreading material for thermal management of form-factor driven electronics and other high power-driven systems”, says Johan Liu.

As a consequence of never-ending miniaturisation and integration, the performance and reliability of modern electronic devices and many other high-power systems are greatly threatened by severe thermal dissipation issues.

“To address the problem, heat spreading materials must get better properties when it comes to thermal conductivity, thickness, flexibility and robustness, to match the complex and highly integrated nature of power systems”, says Johan Liu. “Commercially available thermal conductivity materials, like copper, aluminum, and artificial graphite film, will no longer meet and satisfy these demands.”

The IP of the high-quality manufacturing process for the graphene film belongs to SHT Smart High Tech AB, a spin-off company from Chalmers, which is going to focus on the commercialisation of the technology.

The semiconductor industry posted record results in 2017, with revenue exceeding US$400 billion. Overall demand for semiconductor devices was robust throughout the year, driven by the growing adoption of electronics components across all applications, with particular strength in the mobile and data center markets. Semiconductor growth in 2017 was led by the memory segment, with impressive revenue reaching US$126 billion. It represents an increase of over 60% year-over-year. Yole Développement (Yole) Memory Team forecasts the memory market to reach US$177 billion in 2018, with 40% growth.

Under this dynamic ecosystem, Yole and its partners System Plus Consulting and Knowmade, all parts of Yole Group of Companies, deeply scan the memory area. They propose today valuable memory services to deliver world class research, data and insight. Their aim is to ensure its clients are well-versed in all aspects of this competitive industry. Yole Group of Companies leverage decades of industry experience and expertise while partnering with its clients to make sure they are consistently well-informed on this pushy market.

Today two memory research services, DRAM Service and NAND Service have been developed by Yole Group of Companies. Full description of both services are available in a new dedicated Memory section on i-micronews.com. In addition, a selection of technology & market news are daily selected by Yole’s memory team and posted in this section.

Make sure to collect deep insights and significant analyses from leading industry experts, combining over 50-year experience in memory and semiconductor-related fields.

Both DRAM and NAND markets were in a state of undersupply throughout the year, leading to rising prices and record revenue and profitability for the memory suppliers. Demand was very strong, led by mobile and data center / SSD and augmented by emerging growth drivers including AI , IoT and automotive. Supply growth across both DRAM and NAND was constrained, due to a combination of limited wafer growth and technological challenges.

The current macro trends of AI and machine learning, mobility, and connectivity, are favorable to both the DRAM and NAND markets, and will likely result in Memory continuing to increase its share of the overall the semiconductor market.

“Understanding memory supply/demand dynamics and its relationship with pricing is vital to understanding the broader semiconductor market and all associated supply chains”, asserts Emilie Jolivet, Division Director, Semiconductor & Software at Yole.

The DRAM market is constantly evolving and changing. Yole Group is announcing a 22% CAGR for bit demand over the next five years.

“New Chinese suppliers threaten the current market balance, and emerging memory technologies are poised to cannibalize huge chunks of DRAM demand while the demand drivers of the past, including PCs and smartphones lose steam and no longer push industry demand,” comments .Mike Howards, VP of DRAM & Memory research within the Semiconductor & Software division at Yole.
In parallel, NAND market is expected to set another revenue record in 2018, before a flattish 2019. Therefore it continues to expand, with several consecutive quarters of record revenue and profitability for suppliers.

NAND’s competitive landscape remains incredibly dynamic. Samsung is prepping its first fab at its massive Pyeongtaek site; Intel is emerging as a stand-alone supplier with capacity in China; and the sale of Toshiba’s memory business to a consortium led by Bain Capital is finally happening. Meanwhile, a new entrant looms on the horizon: China’s Yangtze Memory Technologies Co. (YMTC), which threatens to disrupt the status-quo as well as multiple other Chinese projects.

“NAND demand remains robust, with strong growth for enterprise SSDs in data centers, increasing adoption of SSDs in laptop PCs, and continued content growth in smartphones and other mobile devices,” asserts Walt Coon, VP of NAND and Memory Research at Yole.“These segments will continue driving the bulk of NAND bit consumption, though several emerging trends are poised to augment future growth, including AI and VR adoption, automotive, and IoT,” he adds.

Memory Research Service from Yole, provides all data related to NAND/DRAM revenue per quarter, NAND/DRAM shipments, pricing per NAND/DRAM type, near and long-term revenue, market share per quarter, CAPEX per company, and a market demand/supply forecast. It also includes a complete analysis and details on the demand side, with a deep dive into client and enterprise SSD, data centers, mobile, automotive, graphics, PC, and more. Each Memory Research Service is composed of both products, the Quarterly Market Monitor and the Monthly Pricing Monitor.

During the next few weeks, Yole’s Memory Team will attend a selection of key trade shows and conferences to present the Memory Research Services. Make sure you will be there and ask for a meeting right now. Mike Howard and Walt Coon will for example be at SEMICON West mid-July and the Flash Memory Summit (Santa Clara, CA, North America – From August 6 to 9) in August. More information: Yole’s Agenda