Category Archives: Semiconductors

Veeco Instruments Inc. (NASDAQ: VECO) today announced its GENxcel R&D Molecular Beam Epitaxy (MBE) System earned the 2018 Compound Semiconductor (CS) Industry Innovation Award. Hosted by Compound Semiconductor magazine, the CS Industry Awards celebrate the success of companies across five unique categories. Specifically, the Innovation Award honors the most significant breakthrough in compound semiconductor manufacturing over the last 12 months.

“We are honored to have the GENxcel MBE System recognized by Compound Semiconductor and our industry peers. The recognition is especially meaningful because winners are voted on by our respected colleagues, customers and collaborators,” said Gerry Blumenstock, vice president and general manager of MBE and ALD products at Veeco. “We continue to be committed to creating the most advanced and highest quality tools to support leading-edge compound semiconductor R&D and production.”

The GENxcel R&D MBE system builds on the success of the GENxplor® MBE system designed for compound semiconductor R&D and pilot production markets. The system produces high-quality epitaxial layers on substrates up to 100mm in diameter. The innovative architectural concept of GENxcel reduces the system footprint by 40 percent compared to similar 100mm wafer systems, improves the ease of maintenance, and allows users to easily integrate additional deposition and analysis chambers—specifically Veeco’s new atomic layer deposition (ALD) product line.

The CS Industry Awards is a peer-voted awards program honoring people, processes and products within the compound semiconductor industry. Winners were honored at a ceremony on April 10 in conjunction with the CS International Conference in Brussels, Belgium. For a complete list of 2018 winners, visit www.csawards.net/winners.

Previous Veeco products that have won the CS Industry Innovation Award include the TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) System in 2015, the GENxplor MBE system in 2014, and the TurboDisc® MaxBright® Multi-Reactor MOCVD System in 2012. To learn more about Veeco’s GENxcel R&D MBE system, please visithttp://www.veeco.com/products/genxcel-randd-mbe-system.

Research included in the April Update to the 2018 edition of IC Insights’ McClean Report shows that the world’s leading semiconductor suppliers significantly increased their marketshare over the past decade. The top-5 semiconductor suppliers accounted for 43% of the world’s semiconductor sales in 2017, an increase of 10 percentage points from 10 years earlier (Figure 1).  In total, the 2017 top-50 suppliers represented 88% of the total $444.7 billion worldwide semiconductor market last year, up 12 percentage points from the 76% share the top 50 companies held in 2007.

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Figure 1

As shown, the top 5, top 10, and top 25 companies’ share of the 2017 worldwide semiconductor market each increased from 10-12 percentage points over the past decade.  With the surge in mergers and acquisitions expected to continue over the next few years (e.g., Qualcomm and NXP), IC Insights believes that consolidation will raise the shares of the top suppliers to even loftier levels.

As shown in Figure 2, Japan’s total presence and influence in the IC marketplace has waned significantly since 1990, with its IC marketshare (not including foundries) residing at only 7% in 2017.  Once-prominent Japanese names missing from the top IC suppliers list are NEC, Hitachi, Mitsubishi, and Matsushita. Competitive pressures from South Korean IC suppliers—especially in the memory market—have certainly played a significant role in changing the look of the IC marketshare figures over the past 27 years. Moreover, depending on the outcome of the sale of Toshiba’s NAND flash division, the Japanese-companies’ share of the IC market could fall even further from its already low level.

Figure 2

Figure 2

With strong competition reducing the number of Japanese IC suppliers, the loss of its vertically integrated businesses, missing out on supplying ICs for several high-volume end-use applications, and its collective shift toward the fab-lite IC business model, Japan has greatly reduced its investment in new semiconductor wafer fabs and equipment.  In fact, Japanese companies accounted for only 5% of total semiconductor industry capital expenditures in 2017 (two points less than the share of the IC market they held last year), a long way from the 51% share of spending they represented in 1990.

Indium Corporation, one of more than 3,000 ON Semiconductor production suppliers, was selected for its commitment to ensuring high quality and supply continuity in an evolving semiconductor market.

The annual Perfect Quality Award was presented to Weng Fai Pang, Managing Director for Asia-Pacific Operations, and Tim Twining, Vice President of Marketing, at ON Semiconductor’s Supplier Executive Conference in March in Hong Kong, China.

Indium Corporation is a materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

ON Semiconductor (Nasdaq: ON) has introduced the industry’s first 1/1.7-inch 2.1 megapixel CMOS image sensor featuring ON Semiconductor’s newly developed 4.2μm Back Side Illuminated (BSI) pixels – the AR0221 delivers class-leading low light sensitivity for industrial applications.

The AR0221 offers exceptional 3-exposure line-interleaved High Dynamic Range (HDR) with a sensor resolution of 1936H x 1096V, supporting frame rates of 1080p at 30 fps and an outstanding Signal-Noise Ratio (SNR) across visible and near-infrared wavelengths. Its 16:9 ratio with vivid colors and high contrast make it ideal for demanding industrial applications.

Gianluca Colli, Vice President and General Manager, Consumer Solution Division of Image Sensor Group at ON Semiconductor, said: “The AR0221 represents the industry’s best CMOS image sensor in this class, thanks to its outstanding low light sensitivity and SNR performance. By including features like windowing, auto black level correction and an onboard temperature sensor, ON Semiconductor has produced an image sensor that will enable a new generation of security and surveillance cameras.”

The sensor offers dual data interfaces in the form of 4-lane MIPI CSI-2 and HiSPi SLVS. Designed to meet industrial-grade specifications, the AR0221 can operate in harsh outdoor environments where operating temperatures can range between -30°C and +85°C. Packaged in a durable, reliable and robust iBGA package with anti-reflection coating on its cover glass, the AR0221 is programmable through a simple two-wire serial interface.

When power generators like windmills and solar panels transfer electricity to homes, businesses and the power grid, they lose almost 10 percent of the generated power. To address this problem, scientists are researching new diamond semiconductor circuits to make power conversion systems more efficient.

The view of the H-diamond MOSFET NOR logic circuit from above (left), and the operation of the NOR logic circuits, showing that the circuit only produces voltage when both inputs are at zero. Credit: Liu et al.

The view of the H-diamond MOSFET NOR logic circuit from above (left), and the operation of the NOR logic circuits, showing that the circuit only produces voltage when both inputs are at zero. Credit: Liu et al.

A team of researchers from Japan successfully fabricated a key circuit in power conversion systems using hydrogenated diamond (H-diamond.) Furthermore, they demonstrated that it functions at temperatures as high as 300 degrees Celsius. These circuits can be used in diamond-based electronic devices that are smaller, lighter and more efficient than silicon-based devices. The researchers report their findings this week in Applied Physics Letters, from AIP Publishing.

Silicon’s material properties make it a poor choice for circuits in high-power, high-temperature and high-frequency electronic devices. “For the high-power generators, diamond is more suitable for fabricating power conversion systems with a small size and low power loss,” said Jiangwei Liu, a researcher at Japan’s National Institute for Materials Science and a co-author on the paper.

In the current study, researchers tested an H-diamond NOR logic circuit’s stability at high temperatures. This type of circuit, used in computers, gives an output only when both inputs are zero. The circuit consisted of two metal-oxide-semiconductor field-effect transistors (MOSFETs), which are used in many electronic devices, and in digital integrated circuits, like microprocessors. In 2013, Liu and his colleagues were the first to report fabricating an E-mode H-diamond MOSFET.

When the researchers heated the circuit to 300 degrees Celsius, it functioned correctly, but failed at 400 degrees. They suspect that the higher temperature caused the MOSFETs to breakdown. Higher temperatures may be achievable however, as another group reported successful operation of a similar H-diamond MOSFET at 400 degrees Celsius. For comparison, the maximum operation temperature for silicon-based electronic devices is about 150 degrees.

In the future, the researchers plan to improve the circuit’s stability at high temperatures by altering the oxide insulators and modifying the fabrication process. They hope to construct H-diamond MOSFET logic circuits that can operate above 500 degrees Celsius and at 2.0 kilovolts.

“Diamond is one of the candidate semiconductor materials for next-generation electronics, specifically for improving energy savings,” said Yasuo Koide, a director at the National Institute for Materials Science and co-author on the paper. “Of course, in order to achieve industrialization, it is essential to develop inch-sized single-crystal diamond wafers and other diamond-based integrated circuits.”

Veeco Instruments Inc. (Nasdaq: VECO) today announced that ON Semiconductor (Nasdaq: ON) has ordered its Propel® High-volume Manufacturing (HVM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system. Based on its successful beta evaluation of the Propel HVM tool, ON Semiconductor ordered the production-level Propel system for GaN power electronics manufacturing. As the industry’s first single-wafer cluster platform, the Propel GaN MOCVD system is specifically designed for high-voltage power-management devices used in data centers; automotive, information and communication technology; defense; aerospace and power distribution systems, among other applications.

“Our prior learning with Veeco’s K465i™ GaN MOCVD system drove us to investigate the Propel HVM platform for our production ramp,” said Marnix Tack, PhD, senior director of corporate R&D and Open Innovation at ON Semiconductor. “The beta test results demonstrated superior device performance with high uniformity and within-wafer and wafer-to-wafer repeatability, while meeting our cost-of-ownership targets for six- and eight-inch wafers. As such, the Propel HVM system proved to be the most suitable platform for our power electronics manufacturing needs.”

The Propel HVM platform is based on Veeco’s innovative single-wafer system with proprietary IsoFlange™ and SymmHeat™ technologies that provide homogeneous laminar flow and uniform temperature profile across the entire wafer. The system enables production of power electronics, laser diodes, RF devices and advanced LEDs with higher performance and production yields while ensuring very low cost-of-ownership.

“The Propel HVM platform is rapidly gaining traction in the industry as innovative companies like ON Semiconductor recognize the benefits of GaN-on-silicon, which will partially replace current silicon technology for power electronics,” commented Peo Hansson, PhD, senior vice president and general manager of Veeco MOCVD operations. “With its highly controlled doping, run-to-run stability, superior wafer uniformity, high productivity and uptime, Propel HVM extends the benefits of our TurboDisc® platform to a unique single-wafer architecture. These capabilities benefit customers that seek a superior solution for manufacturing while providing a path for scaling to eight-inch wafers and expansion to RF and other advanced applications.”

GaN is a wide band gap semiconductor material with specific advantages over conventional technologies such as gallium arsenide (GaAs) and silicon carbide (SiC). GaN has enormous potential in the short term due to its benefits in terms of thermal behavior, efficiency, weight and size. According to market research firm Yole Développement, the GaN power device business was worth $14 million in 2016, and projects that it will reach $460 million by 2022, with a compound annual growth rate (CAGR) of 79 percent. GaN-based devices will be used increasingly in RF amplifiers, LEDs and high voltage applications among others, primarily due to their abilities to operate at high frequency, power density and temperature with improved efficiency and linearity.

Veeco is discussing the power of its innovative MOCVD and wet etch systems in the “5G: Where Are We and What’s Next?” track at the CS International Conference this week in Brussels, Belgium. Somit Joshi, senior director of MOCVD marketing is presenting a session titled, “Enabling GaN RF and Power Electronics through Innovative MOCVD and Wet Etch Process Technologies,” on Wednesday, April 11, and the Veeco team will also be accepting the CS Industry 2018 Award for Innovation for its GENxcel™ R&D MBE System at the awards ceremony held during the conference.

The 2018 Symposia on VLSI Technology & Circuits will deliver a unique perspective into the technological ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing – the emerging technologies needed for ‘smart living.’ In a weeklong conference packed with technical presentations, a demonstration session, panel discussions, focus sessions, short courses, and a new “Friday Forum” on machine learning, the microelectronics industry’s premiere international conference covers technology, circuits, and systems with a range and scope unlike any other conference.

Built around the theme of “Technology, Circuits & Systems for Smart Living,” the Symposia programintegrates advanced technology developments, innovative circuit design, and the applications that they enable as part of our global society’s adoption of smart, connected devices and systems that change the way humans interact with each other.

Plenary Sessions (June 19):
The Symposia will open with two technology plenary sessions, including “Memory Technology: The Core to Enable Future Computing Systems” by Scott DeBoer, executive VP for technology development, Micron; and “Revolutionizing Cancer Genomic Medicine by Artificial Intelligence & Supercomputing with Big Data” by Satoru Miyano, director of the Human Genome Center, Institute of Medical Science at University of Tokyo.

The following Circuits plenary sessions include “Hardware-Enabled Artificial Intelligence” by Dr. Bill Dally, chief scientist & senior VP, Nvidia; and “Semiconductor Technologies Accelerate Our Future Vision: ‘ANSHIN Platform'” by Tsuneo Komatsuzaki, advisor, SECOM.

Focus Sessions (June 19, 20 & 21):
As part of the Symposia’s ongoing program integration, a series of joint focus sessions will be held to present contributed papers from the Technology and Circuits Symposia on June 20 and 21. Topics will include: “Heterogeneous System Integration,” “Power Devices & Circuits,” “New Devices & Systems for AI,” and “Design & Technology Co-Optimization (DTCO) in Advanced CMOS Technology.”

On June 19, the Technology focus sessions will include: “Back-End Compatible Devices & Advanced Thermal Management“ and “Sensors and Devices for IoT, Medicine, & Smart Living.” The Circuits focus sessions, held on June 21, include “Machine Learning Circuits & SoCs,” and “Advanced Wireline Techniques.”

Evening Panel Sessions (June 18 & 19):
A joint panel discussion, bringing together leading experts from Technology & Circuits programs will be held June 18 to answer the question, “Is the CPU Dying or Dead? Are Accelerators the Future of Computation?”

As Moore’s Law slows down and processor architecture innovations move away from single thread performance, the future of computing seems to be moving away from the general purpose CPU. Is the era of the CPU over? Will future CPUs simply coordinate activity among accelerators and other specialized processing units? The panel will examine future computing workloads as well as the innovative technology and circuit solutions that enable them, from moving computation closer to memory, and developing bio-inspired systems.

The Technology evening panel session panel discussion, held on June 19 will examine “Storage Class Memories: Who Cares? DRAM is Scaling Fine, NAND Stacking is Great.” Memory – DRAM and NAND scaling – though difficult, has persisted due to rapid innovations and continued engineering. Although there are new economic and fundamental challenges posed to continued memory scaling, a new class of memories – Storage Class memories, appears to bridge the latency gap that exists in the memory hierarchy and promises to improve system performance. Now the real question becomes – who really cares now? System architects, DRAM/NAND manufacturers? End users? The panel will discuss the challenges and opportunities of storage class memories in the environment where DRAM and NAND scaling continue.

The question to be addressed by the Circuits evening panel session, also held on June 19, is “What’s The Next Big Thing After Smartphones?” Although smartphones have driven the industry for more than a decade, the pace of innovation is slowing, and market saturation is occurring. What will be the next big thing? The Internet of Things? Automotive electronics? Virtual reality? Something else? A set of panelists with diverse expertise will discuss the possibilities.

Thursday Luncheon (June 21):
Continuing the Symposia’s tradition of thought-provoking presentations centered around the conference theme is the Thursday luncheon talk, entitled “The Hardware of The Mind, from Turing to Today,” by Grady Booch, chief scientist for software engineering at IBM Research. As scientists continue to the computing power of the human mind, they strive to bridge the gap between the physicality of silicon and the exquisite wonder of the brain. This presentation examines the journey of the hardware of the mind – from the Iliad, to da Vinci, to Edison, to Turing, to today – including an examination of how the growing understanding of the brain transforms the engineering of silicon, and how the laws of physics as well as the laws of humanity constrain that journey.

Full Day Short Courses (June 18):
The Technology Short Course – “Device & Integration Technologies for Sub-5nm CMOS & the Next Wave of Computing” will cover a range of topics, including CMOS technology beyond the 5nm node, MOL/BEOL interconnects, atomic-level analysis for FinFET & Nanowire design, 3D integration for image sensors, neuromorphic AI hardware, memory technologies for AI/machine learning, and sensors & analog devices for next generation computing.

The first Circuits Short Course – “Designing for the Next Wave of Cloud Computing” will address advanced computer architectures, GPU applications and FPGA acceleration, the evolution of memory and in-memory computation, and advanced packaging, power delivery and cooling for cloud computing, as well as the impact of quantum computing.

The second Circuits Short Course – “Bio-Sensors, Circuits & Systems for Wearable & Implantable Medical Devices” will cover circuits and systems for mobile healthcare, analog front-ends for bio-sensors, digital phenotyping using wearable sensors, bi-directional neural interfacing, body-area networking and body-coupled communications, ultrasound-on-a-chip, as well as a CMOS-based implantable retinal prosthesis.

Demonstration Session (June 18):
Following a successful launch last year in Kyoto, the popular demonstration session will again be part of the Symposia program, providing participants an opportunity for in-depth interaction with authors of selected papers from both Technology and Circuits sessions. These demonstrations will illustrate technological concepts and analyses through table-top presentations that show device characterization, chip operational results, and potential applications for circuit-level innovations.

Friday Forum (June 22):
New to the Symposia program this year will be the Friday Forum – a full-day series of presentations focusing on how technology and circuit designers engage in and drive the future of AI/machine learning systems, a subject area that continues to evolve as an impactful driver of the integrated systems that are part of the Symposia’s “Smart Living” theme. “Machine Learning Today & Tomorrow: A Technology, Circuits & Systems View” will provide the foundations and performance metrics for machine learning systems, an examination of advanced and emerging circuit architectures for next-generation systems, as well as highlighting tools and datasets for benchmarking and evaluating service-oriented architecture (SoA) machine learning systems.

The annual Symposium on VLSI Technology & Circuits will be held at the Hilton Hawaiian Village in Honolulu, Hawaii from June 18-22, 2018, with Short Courses held on June 18 and a special Friday Forum dedicated to machine learning/AI topics on June 22. The two conferences have been held together since 1987, providing an opportunity for the world’s top device technologists, circuit and system designers to exchange leading edge research on microelectronics technology, with alternating venues between Hawaii and Japan. A single registration enables participants to attend both Symposia.

POET Technologies Inc. (“POET”) (TSX Venture:PTK) (OTCQX:POETF), a designer, developer and manufacturer of optoelectronic devices, including light sources, passive wave guides and Photonic Integrated Circuits (PIC), today announced a master collaboration agreement with SilTerra, a Malaysia-based semiconductor wafer foundry, for the co-development of certain fabrication processes and the manufacturing of POET’s Optical Interposer Platform. The partnership is expected to accelerate the path to commercial production of the Optical Interposer, which will enable optical engines for single-mode transceiver modules and other high bandwidth devices.

Together, the companies will bring-up critical waveguide processes previously developed by POET for its Optical Interposer, and implement the process flows on newly purchased equipment at SilTerra’s world-class 8″ silicon foundry in Kulim, Malaysia. In support of this activity, SilTerra has agreed to assist financially with the purchase of specialized semiconductor fabrication and testing equipment, as well as to share certain costs associated with facilities enhancements and installation of equipment for manufacturing the Optical Interposer. Additionally, the collaboration includes a wafer purchase agreement for the manufacturing of prototype, initial production and volume production wafers.

POET’s Chief Executive Officer, Dr. Suresh Venkatesan, commented, “Following several months of preliminary collaborative work together, this agreement with SilTerra represents a significant milestone toward our goal of commercializing POET’s Optical Interposer Platform. The combined resources and investments of the two companies enables us to establish a unique manufacturing process as well as a reliable supply of wafers for our Optical Interposer. SilTerra offers POET a truly unique combination of advanced 90 nanometer lithography, cost-effective 8″ silicon processing copper metallization and MEMS capabilities, all of which are needed for our Optical Interposer. As a result of this partnership, POET has now secured a key element in the commercialization process allowing us to establish more engagements with prospective customers.”

Firdaus Abdullah, SilTerra’s Chief Executive Officer stated, “SilTerra is delighted to be working with POET in what we regard as a key strategic engagement to address the increasing need for cost-effective solutions for Data Center Interconnects through the innovative use of silicon in photonics.  POET’s Optical Interposer is a major advance over other approaches to optical interconnects and facilitates the co-packaging of electronics and photonics devices in a single Multi-Chip-Module (MCM). POET’s “Photonics-in-a-package” solution has the potential to address even larger markets in the future for the integration and co-optimization of ASIC’s and DSP’s with photonics at the interposer and chip level.  We at SilTerra look forward to a long and prosperous relationship between our two companies and our teams.”

The Master Collaboration Agreement between POET Technologies and SilTerra Malaysia Sdn Bhd was signed on April 6, 2018 and includes provisions for multiple co-development projects, consignment by POET of newly purchased equipment to be installed in SilTerra’s Malaysian foundry, various support services to be provided by SilTerra and the purchase of wafers containing Optical Interposer devices from SilTerra over an initial three-year term.

GLOBALFOUNDRIES Inc. (GF) and Toppan Photomasks, Inc. (TPI) today announced a multi-year extension to their Advanced Mask Technology Center (AMTC) joint venture in Dresden, Germany. Opened in 2002, the AMTC provides GF’s fabs in Dresden, Malta and Singapore with high-end production and development masks at world-class cycle times in support of the foundry’s ambitious technology roadmap. The AMTC also supports TPI customers worldwide from Dresden.

Owned equally by TPI and GF, the AMTC joint venture was previously extended in 2012 to further increase tool capability and capacity. This new extension to the agreement aims to continue the current charter for manufacturing production masks as well as developing mask technology for ever smaller geometries. GF is both TPI’s partner in the joint venture and a strategic and critical customer, while TPI is GF’s preferred mask supplier, leveraging AMTC and TPI’s global manufacturing network to support GF’s worldwide operations.

The AMTC provides one of the most essential and complex elements in the semiconductor manufacturing process, which puts the latest technology innovations at consumers’ fingertips.

Since its inception, the output of AMTC has grown continuously with growth rates exceeding 10 percent in recent years. Sizeable investments have enabled the AMTC to keep up with the rapid technological developments and challenges of this dynamic market sector; in 2017 alone more than 100 million euros (US$124 million) were invested.

“From computing to communication, and from automotive to medtech – our dual roadmap allows us to provide innovative technologies for the benefit of our customers around the world,” said Geoff Akiki, World Wide Mask Operations Executive at GF. “Regardless if they choose FD-SOI with its focus on energy efficiency or FinFET with its focus on high performance, both require leading-edge lithographic masks. AMTC is a great partner and provider of those masks. We are especially pleased that the experience of AMTC will be fully utilized to support us at the leading edge of chip technology.”

“Having been in place for more than 15 years, this joint venture is one of the lengthiest in the mask industry,” said Mike Hadsell, TPI CEO. “This is a testament to the synergy and commitment of the partners, as well as the strength of the AMTC and Toppan Dresden team members. AMTC is truly a best-of-breed effort that has provided high-quality masks to TPI’s customer base, both in Europe and globally.”

“AMTC was founded with a mission to be its customers’ first choice for photomasks. To achieve this goal, our experienced and dedicated team pursues cost-effective and timely manufacturing of high-quality masks for multiple nodes. In the process, the partners have continued to strengthen their relationship while allowing AMTC to serve as a valuable resource for our demanding global customer base,” noted Thomas Schmidt, AMTC’s general manager. “AMTC was established to support AMD’s microprocessor production in Dresden at the 65nm/90nm node. We have moved way beyond that and are looking beyond the current 14nm node.”

AMTC was founded in 2002 by AMD, Infineon Technologies and DuPont Photomasks, which became TPI in 2005. Subsequently, GF and TPI became the ownership partners in 2009. AMTC has seen a cumulative investment of more than US$600 million since 2002. The mask facility employs more than 250 engineers and other specialists. The company is currently expanding its team.

SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that after several years of incremental increases the worldwide semiconductor photomask market surged 13 percent to a record high $3.75 billion in 2017 and is forecast to exceed $4.0 billion in 2019. The mask market is expected to grow 5 percent and 4 percent in 2018 and 2019, respectively, according to the SEMI report. Key photomask market drivers remain advanced technology feature sizes (less than 45nm) and Asia-Pacific manufacturing growth. Taiwan is again the largest photomask regional market for the seventh year in a row and is expected to retain the top spot for the duration of the forecast. Korea rose in the rankings to claim the second spot.

With the $3.75 billion in revenues, photomasks accounted for 13 percent of the total wafer fabrication materials market, behind silicon and semiconductor gases, in 2017. By comparison, SEMI reports that photomasks represented 18 percent of the total wafer fabrication materials market in 2003. Reflecting their growing importance, captive mask shops, aided by intense capital expenditures in 2011 and 2012, continue to gain market share at merchant suppliers’ expense. Captive mask suppliers accounted for 65 percent of the total photomask market last year, up from 63 percent in 2016. In 2013, captive mask shops represented 31 percent of the photomask market.

The recently published SEMI report, 2017 Photomask Characterization Summary, provides details on the 2017 Photomask Market for seven regions of the world including North America, Japan, Europe, Taiwan, Korea, China, and Rest of World. The report also includes data for each of these regions from 2003 to 2019 and summarizes lithography developments over the past year.