Category Archives: Semiconductors

SiFive, the provider of commercial RISC-V processor IP, continues to grow its executive staff with the appointment of Shiva Natarajan as chief financial officer. Natarajan joins SiFive with more than two decades of financial management, accounting and strategic planning experience in both public and private technology companies.

As CFO, Natarajan will help to structure the company’s financial systems and oversee SiFive’s continued growth as it rolls out its innovative business model.

“I am excited to join one of the most unique teams in the world that is disrupting the semiconductor market using RISC-V technology,” said Natarajan. “I look forward to applying my experience to help guide the company through its continued, explosive growth.”

Since its founding in 2015, SiFive has grown exponentially with the RISC-V ecosystem, and the company is projecting to double its employee count in 2018 to support the increased demand for its market-leading RISC-V product offerings. The expansion includes the recent appointments of Sunil Shenoy as vice president of hardware engineering and Shafy Eltoukhy as vice president of operations.

“SiFive is at a crucial point in its development, and Shiva’s experience in navigating the growth path of expanding companies will help guide the next phase of SiFive’s growth,” said Naveed Sherwani, SiFive CEO. “Shiva will provide us with the financial vision, strategy and leadership to advance SiFive to the next level.”

Before joining SiFive, Natarajan was vice president of finance at A10 Networks. Earlier in his career, Natarajan served as vice president, corporate controller, chief accounting officer and interim CFO during his eight years at Applied Micro Circuits Corporation.

Natarajan began his career in public accounting and worked for PwC and Ernst & Young. He is a certified public accountant and holds a bachelor’s degree in science from the University of Calcutta.

By Cherry Sun, SEMI China

Yawning differences between cultures, economic systems and rules of law stand as barriers for many China- and US-based technology companies to do business on each other’s soil, making it imperative for both countries to work together to bridge the gaps that make it harder for tech businesses in each country to find partners and open markets in the other, SEMI China president Lung Chu said at a recent conference.

One answer is for SEMI, serving as a natural unifying communications platform, to help foster greater cooperation between US and China tech companies, Lung Chu said, speaking at the 2nd Silicon Valley Beijing International IoT Summit & Investment and Financing Competition in Santa Clara last month. The event gathered industry experts and experts to mine opportunities across technologies including smart and mobile medical care, virtual and augmented reality, wearables, smart homes, artificial intelligence (AI), robotics, 3D printing, Internet of Things (IoT) and manufacturing design.

In the IoT roundtable chaired by Chu, he asked mayors and other city officials from Sunnyvale, Palo Alto and Cupertino to consider the potential of IoT technology for improving city management. Inspired by the idea of greater efficiency, the mayors pointed to IoT applications including traffic management to better regulate traffic flow; faster, more effective medical treatment from first responders and emergency medical technicians; more efficient energy usage by cities and the public; better water resources management; and bicycle sharing programs for commuters.

Deploying more advanced networking architectures, the mayors agreed, is the first step for cities seeking to fulfill the promise of IoT. A recognized global leader in smart city technologies, China is much more than a key trade partner with the U.S., having developed IoT use cases for cities in Silicon Valley and beyond to consider.

Chu also asked the mayors about the importance to their cities of attracting talent and encouraging entrepreneurship. The roundtable agreed that in Silicon Valley, taking risks in hopes of reaping huge profits is prized and that failure is embraced as necessary to innovation. In China, pressure on business startups to flourish can inhibit the free-wheeling thinking and calculated risk-taking often needed to build new enterprises.

On talent, one mayor underscored the importance of diversity in building a skilled workforce. According to a recent report based on 2016 census data, nearly three-quarters – about 71 percent of tech employees in Silicon Valley – “are foreign born, compared to around 50 percent in the San Francisco-Oakland-Hayward region,” The Mercury News reported. Carl Guardino, CEO of the Silicon Valley Leadership Group, has noted that this “diversity is the strength of Silicon Valley.”

Much as China can turn to Silicon Valley as a model of entrepreneurship and diversity, the U.S. can learn from China’s deployment of IoT technologies to power smart cities as the country’s prominence in the semiconductor manufacturing industry continues to grow. An ally in that rising influence, SEMI China follows the 5C principles – Connect, Collaboration, Community, Communication, China – to help narrow the differences between China and other countries and foster stronger partnerships.

Originally published on the SEMI blog.

Orbotech Ltd. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received approximately $37M in orders for multiple etch and deposition systems from two GaAs foundry customers. SPTS’s Omega plasma etch, Delta PECVD, and Sigma PVD systems will be used to manufacture radio frequency (RF) devices for 4G and emerging 5G wireless infrastructure and mobile device markets. Delivery of the systems is expected to be split between the first quarter and second quarter of 2018.

“Compound semiconductor electronic devices based on gallium arsenide (GaAs) are the cornerstone of high speed wireless communications,” stated Kevin Crofton, Corporate Executive Vice President at Orbotech and President of SPTS Technologies. “RF devices are entering another exciting phase of growth with the proliferation of 4G mobile communications and preparation for 5G. IDMs and foundries are looking to add capacity to existing fabs to meet the growing demand, while new entrants are establishing new lines to address future demand for the 5G rollout. Our lead customer has been at the forefront of GaAs foundry services for almost two decades, and their repeat orders are a testament to the production advantages that our etch and deposition solutions continue to deliver to their core business.”

Power amplifiers (PAs) are among the most critical RF components in mobile communications and virtually all PAs in a modern smartphone are made from circuits built on GaAs semiconductors. Analysts[1] are predicting that the growth of 4G communications, gigabit LTE (Long Term Evolution) and emerging 5G will be the growth engine to drive the RF GaAs device market from over $8.1 billion in 2017 to over $9 billion by 2021.

“Our latest forecast[1] shows that PAs for cellular applications will continue to account for more than half of the RF GaAs device market,” noted Eric Higham, Director of the Advanced Semiconductor Applications service at Strategy Analytics. He added, “Despite smartphone growth slowing, the added complexity in mobile devices to support gigabit LTE and the emergence of 5G points to continuing growth in RF GaAs production.”

STMicroelectronics (NYSE: STM) today announced it has signed an agreement on LDMOS RF power technology from Innogration Technologies, a fabless semiconductor company headquartered in Suzhou, China, specializing in the design and manufacturing of RF power semiconductor devices, modules, and sub-system assemblies.

Combining a short conduction-channel length with a high breakdown voltage, LDMOS devices are well suited for RF power amplifiers where they can be used in base stations for wireless communications systems, as well as in the power amplifiers for commercial and industrial systems. The agreement with Innogration expands the range of applications that ST can address with LDMOS technology.

Terms of the agreements were not disclosed.

Graphene on toast, anyone?


February 13, 2018

Rice University scientists who introduced laser-induced graphene (LIG) have enhanced their technique to produce what may become a new class of edible electronics.

Rice University graduate student Yieu Chyan, left, and Professor James Tour. Credit: Jeff Fitlow/Rice University

Rice University graduate student Yieu Chyan, left, and Professor James Tour. Credit: Jeff Fitlow/Rice University

The Rice lab of chemist James Tour, which once turned Girl Scout cookies into graphene, is investigating ways to write graphene patterns onto food and other materials to quickly embed conductive identification tags and sensors into the products themselves.

“This is not ink,” Tour said. “This is taking the material itself and converting it into graphene.”

The process is an extension of the Tour lab’s contention that anything with the proper carbon content can be turned into graphene. In recent years, the lab has developed and expanded upon its method to make graphene foam by using a commercial laser to transform the top layer of an inexpensive polymer film.

The foam consists of microscopic, cross-linked flakes of graphene, the two-dimensional form of carbon. LIG can be written into target materials in patterns and used as a supercapacitor, an electrocatalyst for fuel cells, radio-frequency identification (RFID) antennas and biological sensors, among other potential applications.

The new work reported in the American Chemical Society journal ACS Nano demonstrated that laser-induced graphene can be burned into paper, cardboard, cloth, coal and certain foods, even toast.

“Very often, we don’t see the advantage of something until we make it available,” Tour said. “Perhaps all food will have a tiny RFID tag that gives you information about where it’s been, how long it’s been stored, its country and city of origin and the path it took to get to your table.”

He said LIG tags could also be sensors that detect E. coli or other microorganisms on food. “They could light up and give you a signal that you don’t want to eat this,” Tour said. “All that could be placed not on a separate tag on the food, but on the food itself.”

Multiple laser passes with a defocused beam allowed the researchers to write LIG patterns into cloth, paper, potatoes, coconut shells and cork, as well as toast. (The bread is toasted first to “carbonize” the surface.) The process happens in air at ambient temperatures.

“In some cases, multiple lasing creates a two-step reaction,” Tour said. “First, the laser photothermally converts the target surface into amorphous carbon. Then on subsequent passes of the laser, the selective absorption of infrared light turns the amorphous carbon into LIG. We discovered that the wavelength clearly matters.”

The researchers turned to multiple lasing and defocusing when they discovered that simply turning up the laser’s power didn’t make better graphene on a coconut or other organic materials. But adjusting the process allowed them to make a micro supercapacitor in the shape of a Rice “R” on their twice-lased coconut skin.

Defocusing the laser sped the process for many materials as the wider beam allowed each spot on a target to be lased many times in a single raster scan. That also allowed for fine control over the product, Tour said. Defocusing allowed them to turn previously unsuitable polyetherimide into LIG.

“We also found we could take bread or paper or cloth and add fire retardant to them to promote the formation of amorphous carbon,” said Rice graduate student Yieu Chyan, co-lead author of the paper. “Now we’re able to take all these materials and convert them directly in air without requiring a controlled atmosphere box or more complicated methods.”

The common element of all the targeted materials appears to be lignin, Tour said. An earlier study relied on lignin, a complex organic polymer that forms rigid cell walls, as a carbon precursor to burn LIG in oven-dried wood. Cork, coconut shells and potato skins have even higher lignin content, which made it easier to convert them to graphene.

Tour said flexible, wearable electronics may be an early market for the technique. “This has applications to put conductive traces on clothing, whether you want to heat the clothing or add a sensor or conductive pattern,” he said.

CEA-Leti’s chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which “a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud”.

Delivering a keynote presentation at the kickoff of ISSCC 2018, Barbara De Salvo said this architecture will include human-brain inspired hardware coupled to new computing paradigms and algorithms that “will allow for distributed intelligence over the whole IoT network, all-the-way down to ultralow-power end-devices.”

“We are entering a new era where artificial-intelligence systems are … shaping the future world,” said De Salvo, who also is Leti’s scientific director. “With the end of Moore’s Law in sight, transformative approaches are needed to address the enduring power-efficiency issues of traditional computing architectures.”

The potential efficiencies of processing data at the edge of networks – e.g. by small computers located near IoT-connected devices – rather than at distant data centers or the Cloud are increasingly cited as long-term goals for the Internet of Things. But the challenges to realizing this vision are formidable. For example, IoT battery-powered devices lack both processing power to analyze the data they receive and a power source that would support data processing.

To break through these barriers, De Salvo called for a “holistic research approach to the development of low-power architectures inspired by the human brain, where process development and integration, circuit design, system architecture and learning algorithms are simultaneously optimized.” She envisions a future in which optimized neuromorphic hardware will be implemented as a highly promising solution for future ultralow-power cognitive systems that extend well beyond the IoT.

“Emerging technologies such as advanced CMOS, 3D technologies, emerging resistive memories, and silicon photonics, coupled with novel brain-inspired paradigms, such as spike-coding and spike-time-dependent-plasticity, have extraordinary potential to provide intelligent features in hardware, approaching the way knowledge is created and processed in the human brain,” she said.

De Salvo’s presentation, “Brain-Inspired Technologies: Towards Chips that Think”, included summaries of key research findings in a variety of fields that will play a role in developing brain-inspired technologies for computing and data-handling requirements of a “hyperconnected” world.

NUST MISIS scientists jointly with an international group of scientists have managed to develop a composite material that has the best piezoelectric properties today. The research results were published in Scientific Reports journal.

Topography (a), PFM images of a pristine state (b) and after poling by +/?60V (c). Credit: ©NUST MISIS

Topography (a), PFM images of a pristine state (b) and after poling by +/?60V (c). Credit: ©NUST MISIS

Piezoelectrics are one of the world`s most amazing materials. It is possible to literally squeeze electricity from them. That is, an electric charge appears at the time of the material`s compression (or stretching). This is called the piezoelectric effect. Piezoelectric materials can be applied in many fields – from pressure sensors and sensitive elements of a microphone to the controller ink pressing in ink-jet printers and quartz resonators.

Lead zirconate titanate is one of the most popular piezoelectric materials. However, it has several disadvantages: it is heavy and inflexible. Additionally, lead production often causes great harm to the environment. That is why scientists are constantly looking for new materials with low lead content as well as with less weight and greater flexibility. In particular, the creation of flexible piezoelectric materials (while maintaining the key properties) would greatly expand piezoelectric materials` possibilities both as acoustic membrane and as pressure sensors.

An international team of scientists from the University of Duisburg-Essen (Germany), NUST MISIS, National Research Tomsk State University and the National Research University of Electronic Technology, working with the financial support of the Russian Science Foundation (grant 16-19-10112), has managed to create such a material and analyze its properties. For this, the nanoparticles consisting of titanate-zicronate barium-lead were placed in a complex polymer consisting of vinylidene disluoride and trifluoroethylene. By diversifying the composition of the components, scientists were able to get the most ideal composite.

The Russian-German group of scientists, including Dmitri Kiselev, a Senior Researcher at the NUST MISIS R&D Center for Materials Science & Metallurgy, has managed to create a composite material based on ceramics and organic polymer whose properties exceed today`s best piezoelectric materials. The research’s experimental part was carried out with an atomic-force microscope in the University of Duisburg-Essen (Germany). Thanks to this scientific collaboration, Dmitri Kiselev has gained skills from the world`s best scanning probe microscope, which he can later apply at NUST MISIS», said Alevtina Chernikova, Rector of NUST MISIS.

According to Dmitri Kiselev, the developed material has a very distinct field of application due to its polymer component: «Composite materials based on polymer and classic ferroelectrics, which have piezo- and pyroelectric properties, have a number of advantages compared to pure ceramics: low density, the ability to manufacture parts of any size and shape, mechanical elasticity, stability of electrophysical properties, and the simplicity and relatively low cost of production. Additionally, the synthesized composite has proved to be excellent at high pressures which makes it an excellent base for pressure sensors».

According to Kiselev, to study the composite they had to modify the standard technique which allowed them to correctly visualize the nanoparticles of ceramics in the volume of the polymer matrix: «In order to capture the electrical signal more clearly, we heated our sample in a certain way from room temperature to 60 degrees Celsius. It allowed us to measure the material’s characteristics very qualitatively and reproducibly. Our method will greatly simplify the work of our colleagues in the study of composites, so I hope that it will be in demand among our colleagues microscopists».

«It is now easier for Russian scientists to carry out world-class measurements as the MFP 3D Stand ?lone (Asylum Research) microscope is now available at the NUST MISIS Center for Collaborative Use, hence why we are now actively collaborating with several institutes from the Russian Academy of Sciences as well as other Moscow universities», Kiselev concluded.

 

Applied Materials, Inc. announced today that it has been recognized by the Ethisphere Institute, a global leader in defining and advancing the standards of ethical business practices, on its 2018 list as one of the World’s Most Ethical Companies.

“Ethical business conduct at Applied Materials extends far beyond a set of rules or policies; it is engrained in our values and reflected in the actions of our employees every day,” said Steve Adams, vice president, Litigation, Protection and Compliance at Applied Materials. “I want to thank everyone throughout the company for maintaining responsibility and integrity in all our business and community interactions.”

Applied Materials has been recognized as one of the World’s Most Ethical Companies for seven consecutive years. It is one of only six honorees in the Electronics & Semiconductors category.

“I congratulate everyone at Applied Materials for again being recognized as one of the World’s Most Ethical Companies,” said Ethisphere’s CEO, Timothy Erblich. “Amidst a rapidly changing technology industry, it is encouraging to see companies like Applied that remain true to their values and continually raise the bar for responsible corporate citizenship.”

This year, Ethisphere recognized 135 companies, spanning 23 countries and 57 industries. These honorees each demonstrated record levels of involvement with their stakeholders and their communities. Listed companies make it a priority to measure and improve corporate culture around ethical practices, to lead authentically and to commit to transparency, diversity and inclusion.

The World’s Most Ethical Companies list is based upon the Ethics Quotient framework, which quantitatively measures a company’s performance in an objective, consistent and standardized manner. Scores are generated in five categories: ethics and compliance program; corporate citizenship and responsibility; culture of ethics; governance; and leadership, innovation and reputation.

The full list of the 2018 World’s Most Ethical Companies can be found at https://worldsmostethicalcompanies.com/honorees.

 

ASML’s dominance in the semiconductor equipment market continued in 2017, according to the report “Sub-100nm Lithography: Market Analysis and Strategic Issues,” recently published by The Information Network (www.theinformationnet.com), a New Tripoli, PA-based market research company.

ASML’s led the semiconductor lithography equipment market for its 12th straight year, with a market share of more than 60% for system sales. The company led the market in revenue share for its 16th straight year, achieving a share of more than 85% in 2017.

information network

 

ASML is also the only supplier of EUV lithography systems, which cost over $100 million. Intel, Samsung Electronics, TSMC, and Globalfoundries are planning on introducing EUV at the 7nm technology node to reduce multi-patterning process steps required of immersion DUV lithography as dimensions approach 7nm. The replacement of immersion DUV by EUV will dramatically reduce deposition, etch, and metrology step, impacting equipment suppliers.

Brooks Instrument will showcase its newly enhanced GF125 mass flow controller (MFC) with high-speed EtherCAT connectivity and embedded self-diagnostics at the China Semiconductor Technology International Conference (CSTIC) in conjunction with SEMICON China 2018 in Shanghai.

CSTIC runs March 11-12 at the Shanghai International Convention Center, while SEMICON China takes place March 14-16 at the Shanghai New International Expo Center.

Building on the company’s proven GF Series of MFCs with EtherCAT connectivity for high-speed communications, the newly enhanced GF125 MFC features embedded self-diagnostics that automatically detect sensor drift and valve leak-by to help minimize tool downtime and improve process yield. As a result, the enhanced GF125 can run leak and drift self-diagnostics without interrupting process flow steps or requiring any hardware changes, thereby improving process gas accuracy and wafer production throughput.

Technology experts from Brooks Instrument will discuss the newly enhanced GF125 MFC capabilities with a presentation on “Advanced Mass Flow Controllers With EtherCAT Communication Protocol and Embedded Self-Diagnostics” during the CSTIC poster session.

For SEMICON China, Brooks Instrument will be co-exhibiting in booth 3675 with its regional business partner, SCH Electronics Co., Ltd., to demonstrate the newly enhanced GF125 MFC with high-speed EtherCAT connectivity and embedded self-diagnostics, along with a broad range of other mass flow meters and controllers and pressure and vacuum products for semiconductor manufacturing.

“At Brooks Instrument, we’re eager to present and exhibit at the China Semiconductor Technology International Conference and SEMICON China tradeshow,” said Mohamed Saleem, Chief Technology Officer at Brooks Instrument. “With more than 70 years of history in new technology developments, our company is focused on improving the precision and performance of mass flow, pressure and vacuum technologies to help enable advanced semiconductor manufacturing and address the challenges involved with next-generation production tools and processes.”

In addition to the newly enhanced GF125 MFC with high-speed EtherCAT connectivity and embedded self-diagnostics, Brooks Instrument will showcase other key components designed to meet critical gas chemistry control challenges and improve process yields for nodes 10nm and below, including the VDM300 vapor delivery module as well as other proven MFCs with EtherCAT.