Category Archives: Semiconductors

Entegris, Inc. (NASDAQ: ENTG), a developer of specialty chemicals and advanced materials solutions for the microelectronics industry, announced today that it acquired Particle Sizing Systems, LLC (PSS), a company focused on particle sizing instrumentation for liquid applications in both semiconductor and life science industries.

This acquisition reflects Entegris’ value creation strategy by leveraging its global technology platform and customer relationships. The total purchase price of the acquisition was approximately $37 million in cash, subject to customary working capital adjustments. Entegris expects this transaction to be accretive to 2018 earnings.

Digital transformation continues to create a high demand for sophisticated cloud computing infrastructures that require the most advanced logic and memory chips available. However, advanced-node manufacturers already challenged by a continuously shrinking process window and high fab costs struggle to maintain yield  and  eliminate losses  associated with CMP performance.

In advanced-node CMP applications, scratch defects are often caused by the agglomeration of slurry abrasive particles that have the potential to become a key factor in process yield performance. With the technology from PSS, Entegris is enabling customers to perform particle size analysis online and in real time, directly in the fluid stream process.  Automating the monitoring process can lead to the application of more effective solutions like proper filter selection and system maintenance. This ability to intervene with these solutions prevents costly yield excursions.

“To stay competitive, our advanced-node customers need tools that allow them to shorten process times while maintaining accuracy and consistency in order to meet the high-quality standards of the manufacturers they partner with,” says Todd Edlund, Chief Operating Officer, Entegris. “PSS technology is unique in that it measures every particle in the slurry, making it more accurate than commonly used methods that employ averaging techniques. As a result, this technology eliminates the need for manual sampling and intervention, which is less efficient and runs a higher risk of slurry excursions.”

Qualcomm Incorporated (NASDAQ: QCOM) today announced that the European Commission and the Korea Fair Trade Commission (KFTC) authorized the acquisition by Qualcomm River Holdings B.V., an indirect wholly owned subsidiary of Qualcomm, of NXP Semiconductors N.V. (NASDAQ: NXPI).  The acquisition has now received 8 of the 9 approvals around the world, with China remaining.

Qualcomm cooperated with the Commission and the KFTC to obtain authorization, and committed to exclude certain near-field communication (NFC) patents from the proposed transaction and ensure that NXP licenses those patents to third parties.  Qualcomm also committed not to assert the NFC patents it will acquire from NXP and maintain interoperability between Qualcomm’s baseband chipsets and NXP’s NFC chips and rivals baseband chipsets and NFC chips.  Qualcomm also will continue to offer a license to MIFARE on terms commensurate with those offered by NXP today.

“We are pleased that both the European Commission and the Korean Fair Trade Commission have granted authorization of the NXP acquisition, and we are optimistic that China will expeditiously grant its clearance” said Steve Mollenkopf, Chief Executive Officer, Qualcomm Incorporated. “Acquiring NXP is complementary to Qualcomm’s global portfolio, providing tremendous scale in automotive, IoT, security and networking and will greatly accelerate our ability to execute and create value in new and adjacent opportunities.”

Sometimes it pays to be two-dimensional. The merits of graphene, a 2D sheet of carbon atoms, are well established. In its wake have followed a host of “post-graphene materials” – structural analogues of graphene made of other elements like silicon or germanium.

Now, an international research team led by Nagoya University (Japan) involving Aix-Marseille University (France), the Max Planck Institute in Hamburg (Germany) and the University of the Basque country (Spain) has unveiled the first truly planar sample of stanene: single sheets of tin (Sn) atoms. Planar stanene is hotly tipped as an extraordinary electrical conductor for high technology.

High-resolution STM image of stanene prepared on a Ag2Sn surface alloy. The honeycomb stanene structure model is superimposed. Credit: Junji Yuhara

High-resolution STM image of stanene prepared on a Ag2Sn surface alloy. The honeycomb stanene structure model is superimposed. Credit: Junji Yuhara

Just as graphene differs from ordinary graphite, so does stanene behave very differently to humble tin in bulk form. Because of relatively strong spin-orbit interactions for electrons in heavy elements, single-layer tin is predicted to be a “topological insulator,” also known as a quantum spin Hall (QSH) insulator. Materials in this remarkable class are electrically insulating in their interiors, but have highly conductive surfaces/edges. This, in theory, makes a single-layered topological insulator an ideal wiring material for nanoelectronics. Moreover, the highly conductive channels at the edge of these materials can carry special chiral currents with spins locked with transport directions, which makes them also very appealing for spintronics applications.

In previous studies, where stanene was grown on substrates of bismuth telluride or antimony, the tin layers turned out to be highly buckled and relatively inhomogeneous. The Nagoya team instead chose silver (Ag) as their host – specifically, the Ag(111) crystal facet, whose lattice constant is slightly larger than that of the freestanding stanene, leading to the formation of flattened tin monolayer in a large area, one step closer to the scalable industrial applications.

Individual tin atoms were slowly deposited onto silver, known as epitaxial growth. Crucially, the stanene layer did not form directly on top of the silver surface. Instead, as shown by core-level spectroscopy, the first step was the formation of a surface alloy (Ag2Sn) between the two species. Then, another round of tin deposition produced a layer of pure, highly crystalline stanene atop the alloy. Tunneling microscopy shows striking images of a honeycomb lattice of tin atoms, illustrating the hexagonal structure of stanene.

The alloy guaranteed the flatness of the tin layer, as confirmed by density-functional theory calculations. Junji Yuhara, lead author of an article by the team published in 2D Materials, explains: “Stanene follows the crystalline periodicity of the Ag2Sn surface alloy. Therefore, instead of buckling as it would in isolation, the stanene layer flattens out – at the cost of a slight strain – to maximize contact with the alloy beneath.” This mutual stabilization between stanene and host not only keeps the stanene layers impeccably flat, but lets them grow to impressive sizes of around 5,000 square nanometers.

Planar stanene has exciting prospects in electronics and computing. “The QSH effect is rather delicate, and most topological insulators only show it at low temperatures”, according to project team leader Guy Le Lay at Aix-Marseille University. “However, stanene is predicted to adopt a QSH state even at room temperature and above, especially when functionalized with other elements. In the future, we hope to see stanene partnered up with silicene in computer circuitry. That combination could drastically speed up computational efficiency, even compared with the current cutting-edge technology.”

Silicon photonics is still a small market today, with sales at die level estimated to be US$30 million in 2016. However, it has big promise, with a 2025 market value of US$560 million at chip level and almost US$4 billion at transceiver level.

illus_si_photonics_applications_range_yole_jan2018

According to Yole Développement (Yole), silicon photonics technology will grow from a few percent of total optical transceiver market value in 2016 to 35% of the market in 2025, mostly for intra-data center communication. The market research & strategy consulting company explains: the strongest demand is for 400G. In parallel, 200G could be only an intermediate step between 100G and 400G. “The next evolution is to develop a 400G optical port over a single fiber across 500m at less than $1 per gigabit and with power <5mW/Gb”, explains Dr. Eric Mounier, Senior Technology & Market Analyst at Yole. One terabit per second rates should follow. Although the wafer area this accounts for will be a minute part of the worldwide SOI market, it will represent significant value because of the SOI wafer high price.

Yole releases this month, the technology & market report titled “Silicon Photonics”. Dr Eric Mounier from Yole and Jean-Louis Malinge, former CEO of Kotura, now at ARCH Venture Partners combined their expertise to perform a comprehensive analysis of the silicon photonics industry. Both experts propose today the status of the market: it is a comprehensive overview of the Silicon photonics industry including technology roadmap, market trends and related figures, competitive landscape and more. The 2018 report gives a detailed description of the supply chain, with player status. It also provides updated market share numbers for the players. In this new study, Yole’s analysts reveal the current status and future challenges for data centers. They also explain why silicon photonics is the answer to future DC needs and other possible applications…

Silicon photonics technology has clearly reached its tipping point, with transceivers shipping in volume, announces the consulting company. Market evolution, competitive landscape, technology innovation, business opportunities: discover today what has been changed within the latest two years.

“We believe we are only at the very beginning as there is massive ongoing development worldwide for further integration”, asserts Dr. Mounier. And he adds: “The recent involvement of large integrated circuit foundries, such as TSMC’s relationship with Luxtera, and GlobalFoundries with Ayar Labs, are very encouraging signs showing the big promise for silicon photonics.”

The “Zero-Change” processes currently in development, manufacturing optical components without making any changes to a CMOS process, are targeting future inter-chip optical interconnects that could represent huge market volumes. Silicon photonics is at the maturity level of the electronics industry in the 1980s and there are still challenges to overcome. For all these challenges, technical breakthroughs will be necessary and are detailed in Yole’s silicon photonics roadmap:

•  Laser source integration: lasers are still in competition with VCSELs for low distance and developments of Si-based lasers are no longer progressing. Quantum dot lasers could be a solution in long term as they are less temperature sensitive.
•  Modulators: smaller size modulators are required and silicon photonics offers modulator integration advantage.
•  Assembly and testing: more advancements in lower cost packaging and wafer level testing are needed.
•  Design and software: specific software are required for photonics with pre-defined models.
•  Supply chain maturation similar to the semiconductor supply chain.
•  New manufacturing solutions: for example, a new trend is to have a zero-change approach on CMOS lines.
•  Higher distance transmission.

The historic flood of merger and acquisition agreements that swept through the semiconductor industry in 2015 and 2016 slowed significantly in 2017, but the total value of M&A deals reached in the year was still more than twice the annual average in the first half of this decade, according to IC Insights’ new 2018 McClean Report, which becomes available this month.  Subscribers to The McClean Report can attend one of the upcoming half-day seminars (January 23 in Scottsdale, AZ; January 25 in Sunnyvale, CA; and January 30 in Boston, MA) that discuss the highlights of the report free of charge.

In 2017, about two dozen acquisition agreements were reached for semiconductor companies, business units, product lines, and related assets with a combined value of $27.7 billion compared to the record-high $107.3 billion set in 2015 and the $99.8 billion total in 2016 (Figure 1).  Prior to the explosion of semiconductor acquisitions that erupted several years ago, M&A agreements in the chip industry had a total annual average value of about $12.6 billion between 2010 and 2015.

Figure 1

Figure 1

Two large acquisition agreements accounted for 87% of the M&A total in 2017, and without them, the year would have been subpar in terms of the typical annual value of announced transactions.  The falloff in the value of semiconductor acquisition agreements in 2017 suggests that the feverish pace of M&A deals is finally cooling off.  M&A mania erupted in 2015 when semiconductor acquisitions accelerated because a growing number of companies began buying other chip businesses to offset slow growth rates in major end-use applications (such as smartphones, PCs, and tablets) and to expand their reach into huge new market opportunities, like the Internet of Things (IoT), wearable systems, and highly “intelligent” embedded electronics, including the growing amount of automated driver-assist capabilities in new cars and fully autonomous vehicles in the not-so-distant future.

With the number of acquisition targets shrinking and the task of merging operations together growing, industry consolidation through M&A transactions decelerated in 2017.  Regulatory reviews of planned mergers by government agencies in Europe, the U.S., and China have also slowed the pace of large semiconductor acquisitions.

One of the big differences between semiconductor M&A in 2017 and the two prior years was that far fewer megadeals were announced.  In 2017, only two acquisition agreements exceeded $1 billion in value (the $18 billion deal for Toshiba’s memory business and Marvell’s planned $6 billion purchase of Cavium).  Ten semiconductor acquisition agreements in 2015 exceeded $1 billion and seven in 2016 were valued over $1 billion.  The two large acquisition agreements in 2017 pushed the average value of semiconductor M&A pacts to $1.3 billion.  Without those megadeals, the average would have been just $185 million last year. The average value of 22 semiconductor acquisition agreements struck in 2015 was $4.9 billion.  In 2016, the average for 29 M&A agreements was $3.4 billion, based on data compiled by IC Insights.

SkyWater Technology Foundry, the industry’s most advanced U.S.-based and U.S.-owned trusted foundry, announced today that it has appointed Steve Wold as Chief Financial Officer. Steve has more than 25 years of leadership experience, holding a variety of senior corporate finance roles. He brings a rich background to the company in capital markets, including equity, corporate financing and recapitalizations, and risk management. Steve succeeds Bart Zibrowski, who will move on to the role of Vice-Chairman for the company.

“As we complete our foundry transformation in 2018, I am delighted to welcome Steve Wold to SkyWater as our new CFO,” said Thomas Sonderman, President, SkyWater Technology Foundry. “With his background in high-performance growth organizations, Steve is ideally suited to help us deliver on our long-term vision. I’d also like to thank Bart Zibrowski for the tremendous job he did in putting a strong foundation in place for our finance organization over the last year as we created the company.” 

Steve comes to SkyWater Technology Foundry after most recently serving as a key member of the leadership team of Arctic Cat Inc. (formerly ACAT – NASDAQ), where he was instrumental in completing the sale of the company to Textron Inc. in 2017. Prior to that, he was at Orbital ATK (OA – NYSE) for 18 years, where he was focused on transforming processes, change management, and driving operational efficiencies, as the company grew from approximately $1 billion to over $5 billion in revenue. Steve began his career as a CPA with Deloitte Audit and Assurance for over 7 years, where he focused on providing services to both publicly traded and privately held manufacturing entities. He holds a Bachelor of Accountancy from the University of North Dakota, and is a member of the American Institute of Certified Public Accountants and the Minnesota Society of CPAs. 

SkyWater is a U.S.-based technology foundry, specializing in the development and manufacturing of a wide variety of differentiated semiconductor manufacturing solutions.

Scientists used spiraling X-rays at the Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) to observe, for the first time, a property that gives handedness to swirling electric patterns – dubbed polar vortices – in a synthetically layered material.

This property, also known as chirality, potentially opens up a new way to store data by controlling the left- or right-handedness in the material’s array in much the same way magnetic materials are manipulated to store data as ones or zeros in a computer’s memory.

Researchers said the behavior also could be explored for coupling to magnetic or optical (light-based) devices, which could allow better control via electrical switching.

Chirality is present in many forms and at many scales, from the spiral-staircase design of our own DNA to the spin and drift of spiral galaxies; it can even determine whether a molecule acts as a medicine or a poison in our bodies.

A molecular compound known as d-glucose, for example, which is an essential ingredient for human life as a form of sugar, exhibits right-handedness. Its left-handed counterpart, l-glucose, though, is not useful in human biology.

“Chirality hadn’t been seen before in this electric structure,” said Elke Arenholz, a senior staff scientist at Berkeley Lab’s Advanced Light Source (ALS), which is home to the X-rays that were key to the study. The study was published online this week in the journal Proceedings of the National Academy of Sciences.

The experiments can distinguish between left-handed chirality and right-handed chirality in the samples’ vortices. “This offers new opportunities for fundamentally new science, with the potential to open up applications,” she said.

“Imagine that one could convert a right-handed form of a molecule to its left-handed form by applying an electric field, or artificially engineer a material with a particular chirality,” said Ramamoorthy Ramesh, a faculty senior scientist in Berkeley Lab’s Materials Sciences Division and associate laboratory director of the Lab’s Energy Technologies Area, who co-led the latest study.

Ramesh, who is also a professor of materials science and physics at UC Berkeley, custom-made the novel materials at UC Berkeley.

Padraic Shafer, a research scientist at the ALS and the lead author of the study, worked with Arenholz to carry out the X-ray experiments that revealed the chirality of the material.

The samples included a layer of lead titanate (PbTiO3) and a layer of strontium titanate (SrTiO3) sandwiched together in an alternating pattern to form a material known as a superlattice. The materials have also been studied for their tunable electrical properties that make them candidates for components in precise sensors and for other uses.

Neither of the two compounds show any handedness by themselves, but when they were combined into the precisely layered superlattice, they developed the swirling vortex structures that exhibited chirality.

“Chirality may have additional functionality,” Shafer said, when compared to devices that use magnetic fields to rearrange the magnetic structure of the material.

The electronic patterns in the material that were studied at the ALS were first revealed using a powerful electron microscope at Berkeley Lab’s National Center for Electron Microscopy, a part of the Lab’s Molecular Foundry, though it took a specialized X-ray technique to identify their chirality.

“The X-ray measurements had to be performed in extreme geometries that can’t be done by most experimental equipment,” Shafer said, using a technique known as resonant soft X-ray diffraction that probes periodic nanometer-scale details in their electronic structure and properties.

Spiraling forms of X-rays, known as circularly polarized X-rays, allowed researchers to measure both left-handed and right-handed chirality in the samples.

Arenholz, who is also a faculty member of the UC Berkeley Department of Materials Science & Engineering, added, “It took a lot of time to understand the results, and a lot of modeling and discussions.” Theorists at the University of Cantabria in Spain and their network of computational experts performed calculations of the vortex structures that aided in the interpretation of the X-ray data.

The same science team is pursuing studies of other types and combinations of materials to test the effects on chirality and other properties.

“There is a wide class of materials that could be substituted,” Shafer said, “and there is the hope that the layers could be replaced with even higher functionality materials.”

Researchers also plan to test whether there are new ways to control the chirality in these layered materials, such as by combining materials that have electrically switchable properties with those that exhibit magnetically switchable properties.

“Since we know so much about magnetic structures,” Arenholz said, “we could think of using this well-known connection with magnetism to implement this newly discovered property into devices.”

Beijing NAURA Microelectronics Equipment Co.,Ltd. (“NAURA”) and Akrion Systems LLC today jointly announced that the previously announced acquisition by NAURA has been completed. As a result of the closing of the transaction, NAURA Akrion Inc. (“NAURA Akrion”), a wholly owned subsidiary of NAURA in the United States, acquired Akrion’s surface preparation business.

“We are very pleased to have completed the transaction,” said Mr. Michael Ioannou, NAURA Akrion CEO. “Enhanced by the strong strategic and financial support of our new investors, the company’s future is brighter than ever. We are excited to continue building and growing NAURA Akrion into a global leader in wet-processing systems as part of NAURA.”

“The successful completion of the transaction will enhance NAURA’s cleaning equipment product line rapidly, and allow it to cover the integrated circuit chip process including Pre Film Deposition Clean, PR Strip, Backside Clean, Wafer Reclaim, Post Etch Clean, SiN/Oxide Etch,Post Metal Deposition and Al pad clean, and other Wet technologies. This is a strong upgrade of NAURA’s surface preparation business and will boost NAURA’s overall market competitiveness.” Commented by Mr. Jinrong Zhao, President & CEO of NAURA. “Upon completion of the transaction, the new entity NAURA Akrion will continue to focus on and promote the existing line of 8-12 inch batch and single wafer systems designed for integrated circuit chip manufacturing, silicon wafer fabrication, MEMS and advanced packaging. NAURA Akrion will invest resources in R&D on new application development, new process development and new product development. It will also stay customer-focused and continue to support existing and future customers worldwide with expanded product and solutions.

Acuity Advisors LLP, a UK based M&A technology advisory firm, served as the financial advisor and Perkins Coie served as the legal advisor to Akrion Systems LLC. Needham & Company served as the financial advisor, Gibson, Dunn & Crutcher LLP served as the US legal advisor to NAURA.

NAURA Akrion is a supplier of advanced surface preparation systems and processes used in the manufacture of solar, semiconductor and related devices.

By Dan Tracy and Ji-Won Cho, SEMI

2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time. Among all major product segments, memory is the strongest, with sales are on track to grow 60 percent year-over-year, contributing to 30 percent of worldwide semiconductor sales in 2017. The consensus is that the growth momentum in memory will continue in 2018, driven by stable market demand and a favorable pricing environment.

Korean memory makers are the biggest beneficiaries of this memory super cycle. According to the Korea International Trade Association (KITA), the memory export value from Korea grew 86 percent through November 2017 compared to a year earlier, indicating that Korean memory makers are gaining more market share. On the supply side of the market, both Samsung and SK Hynix saw record high capital expenditures in 2017, contributing to the revenue surge from Korean suppliers. The spending spree is expected to continue in 2018. Together, Samsung and SK Hynix are forecast to invest over $20 billion in fab tools worldwide in 2018. (Track fab projects in detail with the SEMI World Fab Forecast or SEMI FabView databases).

WFF-Dec2017-chart

Samsung’s anchor project in 2018 is the ramp of its new Fab P1 phase 2 line in Pyeongtaek. Samsung plans to add new 3D NAND as well as DRAM capacity at this fab, fortifying its leading position in memory market. Beyond 2018, Samsung’s Xian phase 2 plan is also underway for future expansion.

SK Hynix, on the other hand, will ramp up M14 fab in 2018, adding new capacity for both 3D NAND and DRAM. In the meantime, SK Hynix is building a new fab, M15, in Cheongju, Korea, for 3D NAND and Fab C3 in Wuxi, China, for DRAM.

Both of these leading memory makers plan to ride this memory cycle and intend to vault ahead of the competition. Future demand for 3D NAND will continue to be the strongest, driving new fab projects in Korea now and later in China. Nevertheless, DRAM supply will also see new capacity coming online this year, followed by rare new fab projects. Memory not only accounts for a major portion of worldwide semiconductor sales but will also propel the investment momentum in the coming years.

SEMICON Korea 2018

The strong memory growth sets the stage for SEMICON Korea, January 31 through February 2 in Seoul. The largest microelectronics event in Korea, with over 40,000 attendees expected, SEMICON Korea will focus on enabling participants to “Connect, Collaborate, and Innovate.”

Key SEMICON Korea highlights include:

  • The 1,919 booths are sold out as major equipment, materials, and subsystem/parts companies exhibit their new products and technology solutions at the show.
  • Industry giants including Samsung, Micron, Intel, Toshiba, Sony, SK Hynix and LAM Research will connect with Korean equipment, materials and subsystems/parts manufacturers through the Supplier Search Program.
  • Participation by engineers is expected to be strong this year, after more than 10,000 engineers from​ Samsung Electronics, SK Hynix and DB Hitek attended SEMICON Korea 2017.

Major SEMICON Korea programs, including the following, will provide key insights into the Korea electronics manufacturing ecosystem:

  • Smart Automotive Forum
  • Smart Manufacturing Forum
  • Test Forum
  • SEMI Technology Symposium
  • Market Seminar

For a complete schedule of programs, visit www.semiconkorea.org/en/agenda-glance.

Peregrine Semiconductor Corporation today announces its corporate name change to pSemi™ Corporation, a Murata company focused on semiconductor integration. The name change coincides with two major milestones—the company’s 30-year anniversary of RF-CMOS innovation and the shipment of its 4 billionth chip. pSemi will serve as Murata’s semiconductor arm and is tasked with growing rapidly to support its expanding product portfolio and the hiring of engineers and professionals globally.

The new name is derived from Peregrine Semiconductor and reflects its proud 30-year history. pSemi will have the same experienced semiconductor team at the helm, but it will have a broader scope and an expanded product portfolio. Building on its strong foundation in RF integration, pSemi’s product portfolio will span power management, connected sensors, optical transceivers, antenna tuning and RF frontends.

“We’ve challenged the pSemi team to broaden their scope, increase their intellectual property (IP) portfolio and grow on a global scale to support more semiconductor innovations,” says Norio Nakajima, senior executive vice president, module business unit at Murata. “As a Murata company, pSemi will leverage the breadth of Murata’s manufacturing and technology leadership, while maintaining a level of autonomy that accelerates its path to semiconductor integration. pSemi will serve as the hub for Murata’s semiconductor activities, and we are investing in its aggressive growth strategy to fuel our move into more advanced and intelligent modules.”

Under the new name, pSemi celebrates its 30-year anniversary of RF-CMOS semiconductor technology innovation and the shipment of its 4 billionth chip. The 4 billionth chip was shipped in an order to Samsung. In Jan. 1988, the company’s founders published a research paper that served as the foundation for Peregrine’s UltraCMOS® technology platform. This paper was the first of many semiconductor technology innovations the company would build upon over its history.

“As pSemi celebrates these significant milestones, we reflect on the company’s history,” says Stefan Wolff, CEO of pSemi. “Over a span of three decades, many industry firsts were achieved, such as CMOS switches, SOI power amplifiers and mmWave beamforming. Our patent portfolio continues to grow and is now ranked as one of the technology world’s most valuable patent portfolios, and finally, we became a Murata company. The launch of pSemi is the next chapter in this company’s history. I am grateful to Murata for selecting us for this important growth strategy, and I am honored to lead this incredible team forward. With pSemi, we are building the ‘dream team’ of engineers, and we need more talented people to join us.”

With the new name, pSemi also launches a new logo and company website. The name change is effective immediately and will be rolled out across new products. Legacy Peregrine Semiconductor products will remain branded under the Peregrine Semiconductor name and logo and will be supported by the same sales teams, distributors and applications engineers.