Category Archives: Semiconductors

Leti, a technology research institute of CEA Tech, announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria.

Emmanuel SABONNADIERE  P_ Jayet-CEA-010Sabonnadiere, who has more than 25 years of executive leadership experience in a variety of large technology environments, joins Leti from CEA Tech, where he led the industrial-partnership program. He brings a strong background in new-technology development with broad private-sector expertise in operational excellence, team building and guiding multicultural organizations in business transformation in Europe and globally.

As Leti’s chief executive officer, Sabonnadiere leads the activities of one of Europe’s largest micro- and nanotechnologies research institutes, which employs approximately 1,900 scientists and engineers, has a portfolio of 2,700 patents and has launched more than 60 startups.

“Success in today’s demanding international digital landscape requires a combination of deep technological expertise, advanced platforms, a commitment to customer and partner success and a shared excitement and agility about the new opportunities,” Sabonnadiere said. “This is where Leti is today, and I am very excited to join this world-class team to develop the solutions that will bring digital innovations to the benefit of leading technology companies around the world.”

Prior to joining CEA, Sabonnadiere was CEO of the Philips Lighting’s Business Group Professional in Amsterdam. From 2008 to 2014, he was CEO and chairman of General Cable Europe in Barcelona, and from 2005 to 2008 he served as CEO of NKM Noell in Wurzburg, Germany. Before that, he served as vice president of Alstom T&D for five years. Early in his career, he held multiple positions at Schneider Electric, including managing director of development for equipment units.

During his career, he has designed and implemented strategic plans for process optimization, product redesign-to-costs, market repositioning and system development.

Sabonnadiere holds a Ph.D. degree in physics from the Ecole Centrale de Lyon, an MBA degree from Ecole Supérieure des Affaires de Grenoble and an engineering degree in information technology from the Université Technologie Compiègne.

Sabonnadiere is a fully qualified instructor at the ski school in Les Ménuires, and member of the advisory board of IAC.

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Anirudh Devgan, executive vice president and general manager of the Digital & Signoff Group and the System & Verification Group, has been appointed president of Cadence, effective immediately.

Dr. Devgan will report to Lip-Bu Tan, Cadence chief executive officer. Together, they will further the company’s System Design Enablement strategy by accelerating the momentum in the core electronic design automation (EDA) business and delivering to the expanding needs of its growing customer base.

As Cadence’s President, Dr. Devgan will oversee Cadence’s EDA products, including the digital implementation and signoff, functional verification, custom IC design, PCB and packaging businesses. Additionally, he will be responsible for the corporate strategy, marketing ­and business development functions.

“This is an exciting time for Cadence, and Anirudh will play a key leadership role as we capture opportunities that are being driven by groundbreaking trends in high-performance and edge computing, automotive electronics and machine learning, among others,” said Lip-Bu Tan, CEO of Cadence. “Anirudh is a visionary and an innovator and a strong team leader with broad operational experience. Both Cadence and its customers will benefit from his enhanced role. I am delighted to partner with him to further our System Design Enablement strategy by accelerating the strong momentum in our existing businesses and by expanding into new areas. The Cadence Board and management team join me in congratulating Anirudh on his promotion.”

“It is an honor to step into the role of president as Cadence continues to execute well across all areas of our business,” said Anirudh Devgan. “I look forward to working closely with Lip-Bu and my talented colleagues to accelerate our momentum and drive further growth.”

Anirudh Devgan is a 25-year industry veteran. Prior to joining Cadence in 2012, he was at Magma Design Automation, Inc. for seven years where he was general manager of the Custom Design Business Unit. He also spent 12 years at IBM in a variety of technical and management roles. He received numerous awards there, including the IBM Outstanding Innovation award. Dr. Devgan is an IEEE Fellow and has numerous research papers and patents. He received a Bachelor of Technology degree in electrical engineering from the Indian Institute of Technology, Delhi, and M.S. and Ph.D. degrees in electrical and computer engineering from Carnegie Mellon University.

Broadcom Limited (NASDAQ: AVGO) (“Broadcom”), a semiconductor device supplier to the wired, wireless, enterprise storage, and industrial end markets, today announced that it has completed its acquisition of Brocade Communications Systems, Inc. (NASDAQ: BRCD).

Brocade’s common stock will now cease to be traded on NASDAQ. Brocade will operate as an indirect subsidiary of Broadcom and will be led by Jack Rondoni as General Manager. Previously, Rondoni served as Senior Vice President of Storage Networking at Brocade, having joined the company in 2006. Rondoni brings over 20 years of experience in storage, networking and technology.

“We are pleased to complete this transaction, which strengthens Broadcom’s position as a leading provider of enterprise storage and networking solutions and enables us to better serve our OEM customers,” said Hock Tan, President and Chief Executive Officer of Broadcom. “Broadcom has a track record of successfully integrating and growing companies we acquire, enabling us to offer customers a leading portfolio of best-in-class franchises across a diverse set of technologies. We intend to invest in and grow the Brocade business to further enhance its capabilities in mission-critical storage networking.”

Tan continued, “We are pleased to announce Jack’s appointment as General Manager, and would like to welcome the outstanding team of employees at Brocade to the Broadcom family. Together, we will continue to exceed the expectations of our customers.”

“We are very excited to join the Broadcom team and provide compelling benefits for customers and new opportunities for Brocade’s employees,” said Jack Rondoni, General Manager, Brocade business unit. “Broadcom provides us with the scale, resources and complementary capabilities to accelerate growth, execute on our strategic initiatives and extend our market leadership in storage area networking. We share a common culture of innovation and execution, and we look forward to the exciting new growth opportunities we will have as part of the Broadcom team.”

For the first time, physicists have developed a technique that can peer deep beneath the surface of a material to identify the energies and momenta of electrons there.

The energy and momentum of these electrons, known as a material’s “band structure,” are key properties that describe how electrons move through a material. Ultimately, the band structure determines a material’s electrical and optical properties.

The team, at MIT and Princeton University, has used the technique to probe a semiconducting sheet of gallium arsenide, and has mapped out the energy and momentum of electrons throughout the material. The results are published today in the journal Science.

By visualizing the band structure, not just at the surface but throughout a material, scientists may be able to identify better, faster semiconductor materials. They may also be able to observe the strange electron interactions that can give rise to superconductivity within certain exotic materials.

“Electrons are constantly zipping around in a material, and they have a certain momentum and energy,” says Raymond Ashoori, professor of physics at MIT and a co-author on the paper. “These are fundamental properties which can tell us what kind of electrical devices we can make. A lot of the important electronics in the world exist under the surface, in these systems that we haven’t been able to probe deeply until now. So we’re very excited — the possibilities here are pretty vast.”

Ashoori’s co-authors are postdoc Joonho Jang and graduate student Heun Mo Yoo, along with Loren Pfeffer, Ken West, and Kirk Baldwin, of Princeton University.

Pictures beneath the surface

To date, scientists have only been able to measure the energy and momentum of electrons at a material’s surface. To do so, they have used angle-resolved photoemission spectroscopy, or ARPES, a standard technique that employs light to excite electrons and make them jump out from a material’s surface. The ejected electrons are captured, and their energy and momentum are measured in a detector. Scientists can then use these measurements to calculate the energy and momentum of electrons within the rest of the material.

“[ARPES] is wonderful and has worked great for surfaces,” Ashoori says. “The problem is, there is no direct way of seeing these band structures within materials.”

In addition, ARPES cannot be used to visualize electron behavior in insulators — materials within which electric current does not flow freely. ARPES also does not work in a magnetic field, which can greatly alter electronic properties inside a material.

The technique developed by Ashoori’s team takes up where ARPES leaves off and enables scientists to observe electron energies and momenta beneath the surfaces of materials, including in insulators and under a magnetic field.

“These electronic systems by their nature exist underneath the surface, and we really want to understand them,” Ashoori says. “Now we are able to get these pictures which have never been created before.”

Tunneling through

The team’s technique is called momentum and energy resolved tunneling spectroscopy, or MERTS, and is based on quantum mechanical tunneling, a process by which electrons can traverse energetic barriers by simply appearing on the other side — a phenomenon that never occurs in the macroscopic, classical world which we inhabit. However, at the quantum scale of individual atoms and electrons, bizarre effects such as tunneling can occasionally take place.

“It would be like you’re on a bike in a valley, and if you can’t pedal, you’d just roll back and forth. You would never get over the hill to the next valley,” Ashoori says. “But with quantum mechanics, maybe once out of every few thousand or million times, you would just appear on the other side. That doesn’t happen classically.”

Ashoori and his colleagues employed tunneling to probe a two-dimensional sheet of gallium arsenide. Instead of shining light to release electrons out of a material, as scientists do with ARPES, the team decided to use tunneling to send electrons in.

The team set up a two-dimensional electron system known as a quantum well. The system consists of two layers of gallium arsenide, separated by a thin barrier made from another material, aluminum gallium arsenide. Ordinarily in such a system, electrons in gallium arsenide are repelled by aluminum gallium arsenide, and would not go through the barrier layer.

“However, in quantum mechanics, every once in a while, an electron just pops through,” Jang says.

The researchers applied electrical pulses to eject electrons from the first layer of gallium arsenide and into the second layer. Each time a packet of electrons tunneled through the barrier, the team was able to measure a current using remote electrodes. They also tuned the electrons’ momentum and energy by applying a magnetic field perpendicular to the tunneling direction. They reasoned that those electrons that were able to tunnel through to the second layer of gallium arsenide did so because their momenta and energies coincided with those of electronic states in that layer. In other words, the momentum and energy of the electrons tunneling into gallium arsenide were the same as those of the electrons residing within the material.

By tuning electron pulses and recording those electrons that went through to the other side, the researchers were able to map the energy and momentum of electrons within the material. Despite existing in a solid and being surrounded by atoms, these electrons can sometimes behave just like free electrons, albeit with an “effective mass” that may be different than the free electron mass. This is the case for electrons in gallium arsenide, and the resulting distribution has the shape of a parabola. Measurement of this parabola gives a direct measure of the electron’s effective mass in the material.

Exotic, unseen phenomena

The researchers used their technique to visualize electron behavior in gallium arsenide under various conditions. In several experimental runs, they observed “kinks” in the resulting parabola, which they interpreted as vibrations within the material.

“Gallium and arsenic atoms like to vibrate at certain frequencies or energies in this material,” Ashoori says. “When we have electrons at around those energies, they can excite those vibrations. And we could see that for the first time, in the little kinks that appeared in the spectrum.”

They also ran the experiments under a second, perpendicular magnetic field and were able to observe changes in electron behavior at given field strengths.

“In a perpendicular field, the parabolas or energies become discrete jumps, as a magnetic field makes electrons go around in circles inside this sheet,” Ashoori says.

“This has never been seen before.”

The researchers also found that, under certain magnetic field strengths, the ordinary parabola resembled two stacked donuts.

“It was really a shock to us,” Ashoori says.

They realized that the abnormal distribution was a result of electrons interacting with vibrating ions within the material.

“In certain conditions, we found we can make electrons and ions interact so strongly, with the same energy, that they look like some sort of composite particles: a particle plus a vibration together,” Jang says.

Further elaborating, Ashoori explains that “it’s like a plane, traveling along at a certain speed, then hitting the sonic barrier. Now there’s this composite thing of the plane and the sonic boom. And we can see this sort of sonic boom — we’re hitting this vibrational frequency, and there’s some jolt happening there.”

The team hopes to use its technique to explore even more exotic, unseen phenomena below the material surface.

“Electrons are predicted to do funny things like cluster into little bubbles or stripes,” Ashoori says. “These are things we hope to see with our tunneling technique. And I think we have the power to do that.”

InfinityQS International, Inc. (InfinityQS), the global authority on data-driven manufacturing quality, announces TEL NEXX, a metallization solutions provider to chip designers and manufacturers, is using its software to modernize shop floor data collection and quality control. Moving from a manual, paper-based system to an accessible database, the company has installed InfinityQS’ Quality Intelligence solution ProFicient on tablets for shop floor operators to directly enter data. This has improved the accuracy and timeliness of data capture and enabled rapid response to production issues. With access to historical data at the management level, TEL NEXX can also identify opportunities for quality and process improvements.

Brian Hart, Manufacturing Engineer, TEL NEXX, said, “ProFicient has made accessing a history for each product easy. As our database grows, we can extract information to drive continuous improvement projects and eliminate bottlenecks. What’s more, moving from a paper-based system to an accessible database has made us more efficient. As the projects and operators advance, we only expect to move faster and faster—with the same integrity.”

Historically, TEL NEXX collected data almost entirely manually, which required operators to duplicate data-entry steps by recording data on paper and then entering them into spreadsheets. These processes were time consuming and required rechecking to avoid errors. But now, operators are entering data once into ProFicient, and the data immediately becomes available for managers and administrators to review and provide feedback in real time. Direct data entry has also improved morale on the shop floor, with operators seeing the importance of data collection and taking greater ownership of the work.

Michael Lyle, President and CEO, InfinityQS, said, “When manufacturers rely on manual data entry, it creates inefficiencies that prevent them from responding to variations and other shop floor issues properly and in a timely manner. Instead, modern technologies are available that can create visibility for organizations into their quality data. This transparency enables them to not only make prompt corrections to ensure problems don’t compound, but also perform proactive analysis for continuous improvement.”

To support operator adoption, Hart is leading an incremental rollout of ProFicient and also gradually integrating the solution with TEL NEXX’s existing shop-floor systems. Notably, within just weeks of deploying ProFicient, Hart was able to detect equipment settings that had been inadvertently altered from the original specifications and in a few hours make adjustments so that the machine operated correctly moving forward.

SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation. The customer relationships were already being serviced within SkyWater’s 200mm semiconductor wafer manufacturing facility when purchased from Cypress earlier this year. Through the transaction, SkyWater assumes ownership of Cypress’ current embedded Specialty Foundry customer engagements and adds associated business management personnel.

“This transaction builds upon the concept of a Technology Foundry, which enables customers to design, build, and scale their products by simplifying the realization of complex technologies through access to semiconductor technology, experienced personnel and volume manufacturing capabilities,” said SkyWater Chairman of the Board Gary Obermiller. “The addition of the Specialty Foundry customers is synergistic with our pure-play Technology Foundry model; customers come to us with their ideas and we transform them into practice through the application of our differentiated semiconductor technology and operational expertise.”

The Technology Foundry Business model enables customers to design and optimize their product concepts. In tandem with SkyWater’s advanced wafer manufacturing facility, customers are able to prototype and rapidly scale to production volumes, all inside of a high-yield production fab.

“The Specialty Foundry Business was created in 2008 with the vision of providing advanced development access to a high-volume production-scale fab, building on the site’s proven track record of success in bringing new technologies to production,” said Michael Moore, executive vice president of Sales and Marketing at SkyWater. “It’s in our DNA. We’ve been doing development work at this site for decades, right alongside production.  This move is a natural next step for the company and our customers.  We have successfully diversified the customer base this way, by serving new and unique markets that are poised for rapid growth.”

As part of the assignment, which closed October 2, SkyWater will now have direct responsibility for all Specialty Foundry Business customers, eliminating the prior Cypress interface. Because of the existing working relationship between all parties, there will be a seamless transition for all current projects; the same team will continue working with all existing customers, the only difference being that they are now SkyWater employees.

Within SkyWater’s manufacturing facility there are a wide variety of unique technologies currently being developed and manufactured – from superconducting quantum computers to advanced technology Readout IC’s (ROIC), MEMS-based infrared imagers, DNA sequencing and fabrication platforms, and photonic integrated circuit (PIC) devices.

According to SkyWater’s Senior Director of Sales Brad Ferguson, “These types of Technology engagements just start with a simple conversation about our capabilities, and once Customers see the potential of our Technology Foundry solution, they realize this is the right place to transform their concepts into a manufactured product.”

SkyWater is a U.S.-based technology foundry specializing in the development and manufacturing of a wide variety of semiconductor based solutions.

The Semiconductor Industry Association (SIA) today announced the SIA Board of Directors has elected Matt Murphy, president and CEO of Marvell Semiconductor, Inc. (NASDAQ: MRVL), as its 2018 Chair and Sanjay Mehrotra, president and CEO of Micron Technology, Inc. (NASDAQ: MU), as its 2018 Vice Chair.

SIA Matt Murphy headshot

“It is a great pleasure to welcome Matt Murphy as SIA’s 2018 Chair and Sanjay Mehrotra as SIA’s Vice Chair,” said John Neuffer, SIA President and CEO. “Matt is a strong leader, an industry veteran, and an outstanding champion for SIA and our industry. An engineer by trade, Sanjay is a mainstay in our industry and a respected voice on semiconductor technology. Together, their skills and accomplishments will be a major asset to advancing SIA’s priorities in Washingtonand around the world.”

Murphy has led Marvell since joining the company in July 2016, and serves as a member of the company’s board of directors. Since that time, he has led the company’s turnaround and reestablished Marvell as a leading innovator in storage and networking technology.

Prior to joining Marvell, Murphy spent over two decades at Maxim Integrated, most recently as Executive Vice President of Business Units and Sales & Marketing, overseeing all product development and go-to-market activities. Previously, Murphy managed the company’s Communications & Automotive Solutions Group, led Worldwide Sales & Marketing, and served in a range of other business unit management positions.

“Few technologies have impacted the modern world more than semiconductors, and we’re now entering an era that promises even greater change,” said Murphy. “However, progress isn’t guaranteed unless the United States does more to support research, boost competitiveness, and promote global trade. As 2018 SIA Chair, I look forward to working with my colleagues to champion these priorities.”

Mehrotra joined Micron in May 2017, after a long and distinguished career at SanDisk Corporation where he led the company from a start-up in 1988 until its eventual sale in 2016. In addition to being a SanDisk co-founder, Mr. Mehrotra served as its President and CEO from 2011 to 2016, overseeing its growth to a Fortune 500 company.

Prior to SanDisk, Mr. Mehrotra held design engineering positions at Integrated Device Technology, Inc., SEEQ Technology and Intel Corporation. Mehrotra earned both bachelor’s and master’s degrees in electrical engineering and computer science from the University of California, Berkeley. He holds more than 70 patents and has published articles on nonvolatile memory design and flash memory systems.

“Semiconductor technology has revolutionized our society and transformed our economy,” said Mehrotra. “The success of our industry is driven, in part, by our unity of purpose. Working together through SIA, we can ensure continued U.S. leadership in semiconductor manufacturing, design, and research. I look forward to helping lead that effort as 2018 SIA Vice Chair.”

AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronics-grade diamond, announced today the issuance by the Japan Patent Office of a patent covering a method for the fabrication of diamond semiconductor materials, core to applications in automotive, aerospace, consumer electronics, military, defense, and telecommunications systems, amongst others.

“We are ecstatic to be awarded this key patent in Japan. Its issuance protects our proprietary interests in diamond semiconductor in one of the nations leading the globe in diamond research,” said Adam Khan, Founder & Chief Executive Officer, AKHAN Semiconductor, Inc. “Following this year’s issuances of a Taiwan diamond semiconductor patent, and a major US diamond transparent electronics patent, the Japan patent issuance is a further testament to AKHAN’s leadership in the diamond semiconductor space.”

Japan, which has actively funded millions of dollars into diamond electronics research since 2002, earlier this year announced marked progress in the development of diamond semiconductor device performance. The AKHAN granted and issued patent, JP6195831 (B2), is a foreign counterpart of other issued and pending patents owned by AKHAN Semiconductor, Inc. that are used in the company’s Miraj Diamond Platform products. As a key landmark patent, the claims protect uses far beyond the existing applications, including microprocessor applications. Covering the base materials common to nearly all semiconductor components, the intellectual property can be realized in everything from diodes, transistors, and power inverters, to fully functioning diamond chips such as integrated circuitry.

AKHAN’s flagship Miraj Diamond Glass for mobile display and camera lens is 6x stronger, 10x harder, and runs over 800x cooler than leading glass competitors like Gorilla Glass by coating standard commercial glass such as aluminosilicate, BK7, and Fused Silica with lab-grown nanocrystalline diamond. Diamond-based technology is capable of increasing power density as well as creating faster, lighter, and simpler devices for consumer use. Cheaper and thinner than its silicon counterparts, diamond-based electronics could become the industry standard for energy efficient electronics.

“This patent adds to the list of other key patents in the field of Diamond Semiconductor that are owned by the company, including the ability to fabricate transparent electronics, as well as the ability to form reliable metal contacts to diamond semiconductor systems,” said Carl Shurboff, President and Chief Operating Officer, AKHAN Semiconductor, Inc. “This patent bolsters the supporting evidence of AKHAN’s leadership in manufacturing diamond semiconductor products, and supports ongoing efforts with our major defense, aerospace and space system development partners.”

 

For the first time ever, SEMICON Southeast Asia (SEMICON SEA), the region’s premier gathering of the industry connecting people, products, technologies and solutions across the electronics manufacturing supply chain, will be held in Kuala Lumpur. Taking place 8 to 10 May 2018, the conference will debut in the newly constructed Malaysia International Trade and Exhibition Centre (MITEC). With more than 85 percent of the exhibition space already sold, SEMICON SEA 2018 will represent companies from Southeast Asia, China, Taiwan, Europe and the U.S.  More than 300 companies will exhibit and as many as 8,000 visitors from 15 countries are expected to participate in SEMICON SEA. Organised by SEMI, SEMICON SEA 2018 theme will be “Think Smart Make Smart.”

The Southeast Asia region is a world-class electronics manufacturing hub with end-to-end R&D capabilities, and SEMICON SEA 2018 is the comprehensive platform for the electronics industry in the region. The event will feature three themed pavilions, five country pavilions, keynote presentations, and forums that will address critical trending topics within the semiconductor eco-system. The show will connect decision makers from the industry, demonstrate the most advanced products, and provide the most up-to-date market and technology trends.

Ng Kai Fai, president of SEMI Southeast Asia says, “The growth of SEMICON Southeast Asia is attributed to the rapid expansion and robust growth of the Electrical & Electronics (E&E) sector across Southeast Asia, with companies emerging as world leaders in mobile, automotive, medical and Internet of Things (IoT) supply chains. As one of the high-growth markets in the region, Malaysia contributes 44 percent of the total manufacturing output and 26 percent of the total Gross Domestic Product of the region and is forecasted to generate approximately US$ 382 billion in exports in 2018.”

Over the past three years, SEMICON SEA has become the annual gathering of the full regional supply chain. SEMICON SEA 2018 will feature a supplier search programme to encourage cross-border business matching as well as a technology start-up platform which will bring together Southeast Asia technology entrepreneurial resources. In conjunction with SEMICON SEA 2018, this event will also include the SEMICON University Programme which aims to encourage and promote STEM (Science, Technology, Engineering, and Mathematics) interest amongst young talent and will also include a job fair.

IC Insights has revised its outlook for semiconductor industry capital spending and will present its new findings in the November Update to The McClean Report 2017, which will be released at the end of this month.  IC Insights’ latest forecast now shows semiconductor industry capital spending climbing 35% this year to $90.8 billion.

After spending $11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to $26 billion.  Bill McClean, president of IC Insights stated, “In my 37 years of tracking the semiconductor industry, I have never seen such an aggressive ramp of semiconductor capital expenditures.  The sheer magnitude of Samsung’s spending this year is unprecedented in the history of the semiconductor industry!”

Figure 1 shows Samsung’s capital spending outlays for its semiconductor group since 2010, the first year the company spent more than $10 billion in capex for the semiconductor segment.  After spending $11.3 billion in 2016, the jump in capex expected for this year is simply amazing.

To illustrate how forceful its spending plans are, IC Insights anticipates that Samsung’s semiconductor capex of $8.6 billion in 4Q17 will represent 33% of the $26.2 billion in total semiconductor industry capital spending for this quarter.  Meanwhile, the company is expected to account for about 16% of worldwide semiconductor sales in 4Q17.

IC Insights estimates that Samsung’s $26 billion in semiconductor outlays this year will be segmented as follows:

3D NAND flash: $14 billion (including an enormous ramp in capacity at its Pyeongtaek fab)

DRAM: $7 billion (for process migration and additional capacity to make up for capacity loss due to migration)

Foundry/Other: $5 billion (for ramping up 10nm process capacity)

annual samsung capex

IC Insights believes that Samsung’s massive spending outlays this year will have repercussions far into the future. One of the effects likely to occur is a period of overcapacity in the 3D NAND flash market. This overcapacity situation will not only be due to Samsung’s huge spending for 3D NAND flash, but also to its competitors in this market segment (e.g., SK Hynix, Micron, Toshiba, Intel, etc.) responding to the company’s spending surge.  At some point, Samsung’s competitors will need to ramp up their capacity or loose market share.

Samsung’s current spending spree is also expected to just about kill any hopes that Chinese companies may have of becoming significant players in the 3D NAND flash or DRAM markets.  As our clients have been aware of for some time, IC Insights has been extremely skeptical about the ability of new Chinese startups to compete with Samsung, SK Hynix, and Micron with regards to 3D NAND and DRAM technology.  This year’s level of spending by Samsung just about guarantees that without some type of joint venture with a large existing memory suppler, new Chinese memory startups stand little chance of competing on the same level as today’s leading suppliers.