Category Archives: Wafer Level Packaging

ON Semiconductor (Nasdaq: ON) today announced its top distribution partners for 2017. These awards honor the distributor in each region that led overall channel sales, grew market share, captured increased sales of products from ON Semiconductor’s acquisitions and scored highly on overall process excellence.

The top 2017 distribution partners are:

“Distribution sales accounted for approximately 60 percent of ON Semiconductor’s 2017 annual revenues,” said Jeff Thomson, vice president of global channel sales for ON Semiconductor. “The support of our worldwide distribution partners is fundamental to the success of ON Semiconductor’s ongoing plans to increase market penetration and growing revenue at a faster pace than the industry. The collaborative relationships and progressive sales programs we foster with our channel partners are an integral part of this ongoing plan. As advocates of these goals, each of the 2017 distribution partner award winners successfully grew product sales, generated significant new business, and effectively supported both our customers’ needs and ON Semiconductor’s initiatives for operational excellence. We are pleased to recognize these outstanding channel partners for their valuable contributions throughout 2017 and look forward to continued success in the coming year.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced the global semiconductor industry posted sales totaling $412.2 billion in 2017, the industry’s highest-ever annual sales and an increase of 21.6 percent compared to the 2016 total. Global sales for the month of December 2017 reached $38.0 billion, an increase of 22.5 percent over the December 2016 total and 0.8 percent more than the previous month’s total. Fourth-quarter sales of $114.0 billion were 22.5 percent higher than the total from the fourth quarter of 2016 and 5.7 percent more than the third quarter of 2017. Global sales during the fourth quarter of 2017 and during December 2017 were the industry’s highest-ever quarterly and monthly sales, respectively. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

Worldwide semiconductor revenues, year-to-year percent change

Worldwide semiconductor revenues, year-to-year percent change

“As semiconductors have become more heavily embedded in an ever-increasing number of products – from cars to coffee makers – and nascent technologies like artificial intelligence, virtual reality, and the Internet of Things have emerged, global demand for semiconductors has increased, leading to landmark sales in 2017 and a bright outlook for the long term,” said John Neuffer, SIA president and CEO. “The global market experienced across-the-board growth in 2017, with double-digit sales increases in every regional market and nearly all major product categories. We expect the market to grow more modestly in 2018.”

Several semiconductor product segments stood out in 2017. Memory was the largest semiconductor category by sales with $124.0 billion in 2017, and the fastest growing, with sales increasing 61.5 percent. Within the memory category, sales of DRAM products increased 76.8 percent and sales of NAND flash products increased 47.5 percent. Logic ($102.2 billion) and micro-ICs ($63.9 billion) – a category that includes microprocessors – rounded out the top three product categories in terms of total sales. Other fast-growing product categories in 2017 included rectifiers (18.3 percent), diodes (16.4 percent), and sensors and actuators (16.2 percent). Even without sales of memory products, sales of all other products combined increased by nearly 10 percent in 2017.

Annual sales increased substantially across all regions: the Americas (35.0 percent), China (22.2 percent), Europe (17.1 percent), Asia Pacific/All Other (16.4 percent), and Japan (13.3 percent). The Americas market also led the way in growth for the month of December 2017, with sales up 41.4 percent year-to-year and 2.1 percent month-to-month. Next were Europe (20.2 percent/-1.6 percent), China (18.1 percent/1.0 percent), Asia Pacific/All Other (17.4 percent/0.2 percent), and Japan (14.0 percent/0.9 percent).

“A strong semiconductor industry is foundational to America’s economic strength, national security, and global technology leadership,” said Neuffer. “We urge Congress and the Trump Administration to enact polices in 2018 that promote U.S. innovation and allow American businesses to compete on a more level playing field with our counterparts overseas. We look forward to working with policymakers in the year ahead to further strengthen the semiconductor industry, the broader tech sector, and our economy.”

Nordson MARCH, a Nordson company (NASDAQ:NDSN), a developer of plasma processing technology, introduces the MesoSPHERE Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level – handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE’s new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.

For wafer cleaning, the MesoSPHERE plasma system removes contamination prior to wafer bumping, organic contamination, fluorine and other halogen contamination, and metal and metal oxides. Plasma improves spun-on film adhesion and cleans metallic bond pads.

For wafer etching, the MesoSPHERE plasma system descums wafers of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhances adhesion of wafer applied materials, removes excess wafer applied mold /epoxy, enhances adhesion of gold solder bumps, destresses wafer to reduce breakage, improves spun-on film adhesion, and cleans aluminum bond pads.

The MesoSPHERE’s chamber design and control architecture enable short plasma cycle times with very low overhead, maximizing throughput and minimizing cost of ownership. Plasma confinement technology uses a ring to isolate and focus plasma so it’s distributed directly above the wafer, minimizing undesired secondary reactions. Process temperatures can be kept low because the ring increases etch rate capability without increasing the electrode temperature or adding bias to the chuck.

An innovative handling system transfers round or square substrates and frame or bonded carriers. The modular design allows capacity increase on a per plasma chamber basis. Equipment front end module (EFEM) integration supports from 1 to 4 plasma chambers. A pocket chuck design provides accurate substrate placement and centering, for additional process repeatability.

“A unique feature of the MesoSPHERE is the way we developed the isolation,” explained Jonathan Doan, director of marketing for Nordson MARCH. “It allows our customers a method to perform advanced packaging without having to use an expensive carrier and it can be used with 300mm wafers on frames.”

Air Products (NYSE: APD) today announced it has been awarded the industrial gases supply for Samsung Electronics’ second semiconductor fab in Xi’an, Shaanxi Province, western China.

The Xi’an fabrication line, within the Xi’an High-tech Zone (XHTZ), represents one of Samsung’s largest overseas investments and one of the most advanced fabs in China. It produces three-dimensional (3D) vertical NAND (V-NAND) flash memory chips for a wide range of applications, including embedded NAND storage, solid state drives, mobile devices, and other consumer electronics products.

Air Products has been supporting this project since 2014 from a large site housing two large air separation units (ASUs), a hydrogen plant and a bulk specialty gas delivery system. Under the new award, Air Products will expand its site by building several large ASUs, hydrogen and compressed dry air plants, and a bulk specialty gas supply yard to supply ultra-high purity nitrogen, oxygen, argon, hydrogen and compressed dry air to the new fab, which is scheduled to be operational in 2019.

“Samsung is a strategic and longstanding customer for Air Products. It is our honor to have their continued confidence and again be selected to support their business growth and this important project in western China,” said Kyo-Yung Kim, president of Air Products Korea, who also oversees the company’s electronics investment in the XHTZ. “We have been supplying the project with proven safety, reliability and operational excellence. This latest investment further reinforces our global leading position and commitment to serving our valued customer, as well as the broader semiconductor and electronics industries.”

Continuing to build its strong relationship with Samsung Electronics, Air Products also recently announced the next phases of expansion to build two more nitrogen plants serving the customer’s giga fab in Pyeongtaek City, Gyeonggi Province, South Korea.

A leading integrated gases supplier, Air Products has been serving the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to most of the world’s largest technology companies. Air Products is working with these industry leaders to develop the next generation of semiconductors and displays for tablets, computers and mobile devices.

Microprocessors, which first appeared in the early 1970s as 4-bit computing devices for calculators, are among the most complex integrated circuits on the market today.  During the past four decades, powerful microprocessors have evolved into highly parallel multi-core 64-bit designs that contain all the functions of a computer’s central processing unit (CPU) as well as a growing number of system-level functions and accelerator blocks for graphics, video, and emerging artificial intelligence (AI) applications.  MPUs are the “brains” of personal computers, servers, and large mainframes, but they can also be used for embedded processing in a wide range of systems, such as networking gear, computer peripherals, medical and industrial equipment, cars, televisions, set-top boxes, video-game consoles, wearable products and Internet of Things applications.  The recently released 2018 edition of IC Insights’ McClean Report shows that the fastest growing types of microprocessors in the last five years have been mobile system-on-chip (SoC) designs for tablets and data-handling cellphones and MPUs used in embedded-processing applications (Figure 1).

Figure 1

Figure 1

The McClean Report also forecasts that 52% of 2018 MPU sales will come from sales of all types of microprocessors used as CPUs in standard PCs, servers, and large computers.  As shown in Figure 2, only about 16% of MPU sales are expected from embedded applications in 2018, with the rest coming from mobile application processors used in tablets (4%) and cellphones (28%).  Cellphone and tablet MPUs exclude baseband processors, which handle modem transmissions in cellular networks and are counted in the wireless communications segment of the special-purpose logic IC product category. A little over half of 2018 microprocessor sales are expected to come from x86 MPUs for computer CPUs sold by Intel and rival Advanced Micro Devices.

Figure 2

Figure 2

Cellphone and tablet SoC processors were the main growth drivers in microprocessors during the first half of this decade, but slowdowns have hit both of these MPU categories since 2015.  Market saturation and the maturing of the smartphone segment have stalled unit growth in cellular handsets.  Cellphone application processor shipments were flat in 2016 and 2017 and are forecast to rise just 0.3% in 2018 to reach a record high of nearly 1.8 billion units in the year.

The microprocessor business continues to be dominated by the world’s largest IC maker, Intel (Samsung was the world’s largest semiconductor supplier in 2017). Intel’s share of total MPU sales had been more than 75% during most of the last decade, but that percentage is now slightly less than 60% because of stronger growth in cellphones and tablets that contain ARM-based SoC processors.  For nearly 20 years, Intel’s huge MPU business for personal computers has primarily competed with just one other major x86 processor supplier—AMD—but increases in the use of smartphones and tablets to access the Internet for a variety of applications has caused a paradigm shift in personal computing, which is often characterized as the “Post-PC era.”

This year, AMD looks to continue its aggressive comeback effort in x86-based server processors that it started in 2017 with the rollout of highly parallel MPUs built with the company’s new Zen microarchitecture. Intel has responded by increasing the number of 64-bit x86 CPUs in its Xeon processors. Intel, AMD, Nvidia, Qualcomm, and others are also increasing emphasis of processors and co-processor accelerators for machine-learning AI in servers, personal computing platforms, smartphones and embedded processing.

The 2018 McClean Report shows that the total MPU market is forecast to rise 4% to $74.5 billion in 2018, following market growth of 5% in 2017 and 9% in 2016.  Through 2022, total MPU sales are expected to increase at a compound annual growth rate of 3.4%.  Total microprocessor units are expected to rise 2% in 2018, the same growth rate as 2017, to 2.6 billion units.  Through the forecast period, total MPU units are forecast to rise by a CAGR of 2.1%.

By Emmy Yi, SEMI Taiwan 

Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.

“The semiconductor manufacturing process has reached its downscaling limit, making outstanding manufacturing capabilities indispensable for corporations to stay competitive,” said Ana Li, Director of Outreach and Member Service at SEMI. “Advances in cloud computing, data processing, and system integration technologies will be key to driving the broad adoption of smart manufacturing.”

ompany representatives shared insights and successes in manufacturing digitalization.

ompany representatives shared insights and successes in manufacturing digitalization.

To help semiconductor manufacturing companies navigate the digital transformation, SEMI recently held the AI and Smart Manufacturing Forum, a gathering of industry professionals from Microsoft, Stark Technology, Advantech, ISCOM, and Tectura to examine technology trends and smart manufacturing opportunities and challenges. The nearly 100 guests at the forum also included industry veterans from TSMC, ASE, Siliconware, Micron, and AUO. Following are key takeaways from the forum:

1)    Smart manufacturing is the key for digital transformation
Industry 4.0 is all about using automation to better understand customer needs and help drive efficiency improvements that enable better strategic manufacturing decisions. For electronics manufacturers, thriving in the digital transformation should begin with research and development focused on optimizing processes, developing innovative business models, and analyzing data in ways that support their customers’ business values and objectives. Digitization is also crucial for manufacturers to target the right client base, increase productivity, optimize operations and create new revenue opportunities.

2)    Powerful data analysis capabilities will enable manufacturing digitalization

As product development focuses more on smaller production volumes, companies need a powerful data analysis software to accelerate decision-making and problem-solving processes, enhance integration across different types of equipment, and improve management efficiency across enterprise resources including business operations, marketing, and customer service.

3)    The digital transformation will fuel revenue growth
Connectivity and data analysis, the two essential concepts of smart manufacturing, are not only essential for companies to improve facility management efficiency and production line planning but also key for maintaining healthy revenue growth.

“With our more than 130 semiconductor manufacturers and long fab history, Taiwan is in a strong position to help the industry evolve manufacturing to support the explosion of new data-intensive technologies,” said Chen-Wei Chiang, the Senior Specialist at the Taichung City Government’s Economic Development Bureau. “We look forward to working with SEMI to help manufacturers realize the full potential of smart manufacturing.”

With the advent of new data-intensive technologies including AI and IoT, advanced manufacturing processes that improve product yield rates and reduce production costs will become even more important for manufacturers to remain competitive. SEMI Taiwan will continue to assemble representatives from the industry, government, academia and research to examine critical topics in smart manufacturing. To learn more, please contact Emmy Yi, SEMI Taiwan, at
[email protected] or +886.3.560.1777 #205.

 

The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensors.

Ultimately, the researchers believe their device design – a combination of a carbon nanotube antenna and diode rectifier – could compete with conventional photovoltaic technologies for producing electricity from sunlight and other sources. The same technology used in the rectennas could also directly convert thermal energy to electricity.

Georgia Tech researchers have developed a new higher efficiency rectenna design. Here, the device’s ability to convert blue light to electricity is tested. (Credit: Christopher Moore, Georgia Tech)

Georgia Tech researchers have developed a new higher efficiency rectenna design. Here, the device’s ability to convert blue light to electricity is tested. (Credit: Christopher Moore, Georgia Tech)

“This work takes a significant leap forward in both fundamental understanding and practical efficiency for the optical rectenna device,” said Baratunde Cola, an associate professor in the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. “It opens up this technology to many more researchers who can join forces with us to advance the optical rectenna technology to help power a range of applications, including space flight.”

The research was reported January 26 in the journal Advanced Electronic Materials. The work has been supported by the U.S. Army Research Office under the Young Investigator Program, and by the National Science Foundation.

Optical rectennas operate by coupling the light’s electromagnetic field to an antenna, in this case an array of multiwall carbon nanotubes whose ends have been opened. The electromagnetic field creates an oscillation in the antenna, producing an alternating flow of electrons. When the electron flow reaches a peak at one end of the antenna, the diode closes, trapping the electrons, then re-opens to capture the next oscillation, creating a current flow.

The switching must occur at terahertz frequencies to match the light. The junction between the antenna and diode must provide minimal resistance to electrons flowing through it while open, yet prevent leakage while closed.

“The name of the game is maximizing the number of electrons that get excited in the carbon nanotube, and then having a switch that is fast enough to capture them at their peak,” Cola explained. “The faster you switch, the more electrons you can catch on one side of the oscillation.”

To provide a low work function – ease of electron flow – the researchers initially used calcium as the metal in their oxide insulator – metal diode junction. But calcium breaks down rapidly in air, meaning the device had to be encapsulated during operation – and fabricated in a glovebox. That made the optical rectenna both impractical for most applications and difficult to fabricate.

So Cola, NSF Graduate Research Fellow Erik Anderson and Research Engineer Thomas Bougher replaced the calcium with aluminum and tried a variety of oxide materials on the carbon nanotubes before settling on a bilayer material composed of alumina (Al2O3) and hafnium dioxide (HfO2). The combination coating for the carbon nanotube junction, created through an atomic deposition process, provides the quantum mechanical electron tunneling properties required by engineering the oxide electronic properties instead of the metals, which allows air stable metals with higher work functions than calcium to be used.

Rectennas fabricated with the new combination have remained functional for as long as a year. Other metal oxides could also be used, Cola said.

The researchers also engineered the slope of the hill down which the electrons fall in the tunneling process. That also helped increase the efficiency, and allows the use of a variety of oxide materials. The new design also increased the asymmetry of the diodes, which boosted efficiency.

“By working with the oxide electron affinity, we were able to increase the asymmetry by more than ten-fold, making this diode design more attractive,” said Cola. “That’s really where we got the efficiency gain in this new version of the device.”

Optical rectennas could theoretically compete with photovoltaic materials for converting sunlight into electricity. PV materials operate using a different principle, in which photons knock electrons from the atoms of certain materials. The electrons are collected into electrical current.

In September 2015 in the journal Nature Nanotechnology, Cola and Bougher reported the first optical rectenna – a device that had been proposed theoretically for more than 40 years, but never demonstrated.

The early version reported in the journal produced power at microvolt levels. The rectenna now produces power in the millivolt range and conversion efficiency has gone from 10-5 to 10-3 – still very low, but a significant gain.

“Though there still is room for significant improvement, this puts the voltage in the range where you could see optical rectennas operating low-power sensors,” Cola said. “There are a lot of device geometry steps you could take to do something useful with the optical rectenna today in voltage-driven devices that don’t require significant current.”

Cola believes the rectennas could be useful for powering internet of things devices, especially if they can be used to produce electricity from scavenged thermal energy. For converting heat to electricity, the principle is the same as for light – capturing oscillations in a field with the broadband carbon nanotube antenna.

“People have been excited about thermoelectric generators, but there are many limitations on getting a system that works effectively,” he said. “We believe that the rectenna technology will be the best approach for harvesting heat economically.”

In future work, the research team hopes to optimize the antenna operation, and improve their theoretical understanding of how the rectenna works, allowing further optimization. One day, Cola hopes the devices will help accelerate space travel, producing power for electric thrusters that will boost spacecraft.

“Our end game is to see carbon nanotube optical rectennas working on Mars and in the spacecraft that takes us to Mars,” he said.

This work was supported by the Army Research Office under the Young Investigator Program agreement W911NF-13-1-0491 and the National Science Foundation Graduate Research Fellowship program under grant DGE-1650044. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the sponsoring organizations.

By Jay Chittooran, Manager, Public Policy, SEMI

International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion. Trade paves the way for this growth.

Unfortunately, despite its importance to the industry, trade has been transformed from an economic issue into a political one, raising many new trade challenges to companies throughout the semiconductor industry.

GHz-ChinaChina’s investments in the industry will continue to anchor the country as a major force in the semiconductor supply chain. China’s outsized spending has spawned concern among other countries about the implications of these investments. According to SEMI’s World Fab Forecast, 20 fabs are being built in China – and construction on 14 more is rumored to begin in the near term – compared to the 10 fabs under construction in the rest of the world. China is clearly outpacing the pack.

The Trump Administration has levied intense criticism of China, citing unfair trade practices, especially related to intellectual property issues. The U.S. Trade Representative has launched a Section 301 investigation into whether China’s practice of forced technology transfer has discriminated against U.S. consumers. Even as the probe unfolds, expectations are growing that the United States will take action against China, raising fears of not only possible retaliation in time but rising animosity between two trading partners that rely deeply on each other.

A number of other open investigations also cloud the future. The Administration launched two separate Section 232 investigations into steel and aluminum industry practices by China, claiming Chinese overproduction of both items are a threat to national security. The findings from these investigations will be submitted to the President, who, in the coming weeks, will decide an appropriate response, which could include imposing tariffs and quotas.

Another high priority area is Korea. While U.S. threats to withdraw from the U.S.-Korea Free Trade Agreement (KORUS) reached a fever pitch in August, rhetoric has since tempered. Informal discussions between the countries on how best to amend the trade deal are ongoing. The number of KORUS implementation issues aside, continued engagement with Korea – instead of scrapping a comprehensive, bilateral trade deal – will be critically important for the industry.

Lastly, negotiations to modernize the North American Free Trade Agreement (NAFTA) will continue this year. The United States wants to conclude talks by the end of March, but with the deadline fast approaching and the promise of resolution waning, tensions are running high. Notably, the outcome of the NAFTA talks will inform and set the tone for other trade action.

What’s more, a number of other actions on trade will take place this year. As we wrote recently, Congress has moved to reform the Committee on Foreign Investment in the United States (CFIUS), a government body designed to review sales and transfer of ownership of U.S. companies to foreign entities. Efforts have also started to revise the export control regime – a key component to improving global market access and making international trade more equitable.

SEMI will continue its work on behalf of its members around the globe to open up new markets and lessen the burden of regulations on cross-border trade and commerce. In addition, SEMI will continue to educate policymakers on the critical importance of unobstructed trade in continuing to push the rapid advance of semiconductors and the emerging technologies they enable into the future. If you are interested in more information on trade, or how to be involved in SEMI’s public policy program, please contact Jay Chittooran, Manager, Public Policy, at [email protected].

Year End Wow!


January 24, 2018

By Walt Custer, Custer Consulting Group

Strong year-end 2017 electronic equipment sales

2017 ended on a high note from an end market perspective thanks to:

  • Geographically broad economic strength and new products
  • Record high December electronic equipment production and shipments in China/Taiwan
  • Peak electronic equipment production in the Eurozone in November
  • A 4Q upturn in U.S. bookings and shipments of electronic equipment

Custer1-World-Electronic-Equipment-Monthly-Shipments

Based upon preliminary data, mobile phones including the Apple iPhone X were major contributors to the fourth-quarter 2017 strength in Asia/Pacific. Foxconn registered all-time record sales in December.

By comparison, personal computer sales were flat when adjusted for normal seasonality.

Early information indicates that December global equipment revenues were up almost 24 percent over December 2016 and up 3 percent sequentially over November 2017.

Resilient semiconductor supply chain

Semiconductors and SEMI equipment have a strong growth in this current business cycle (Chart 2), mainly due to strong memory demand and price increases for chips, and also robust capital equipment spending to increase memory chip capacity.

Custer2-World-Semiconductor-SEMI-Equipement-Shipments

 

By November this sales growth appeared to be plateauing (but at record levels).

On a 3/12 basis (Chart 3) world growth was:

Semiconductors +21.5% November
SEMI equipment +28.4% November
Taiwan Chip Foundries +6.1% December
Electronic Equipment +4.9% September

Custer3-Supply-Chain-Dynamics
Despite a likely moderation of the current SEMI equipment and chip growth rates, this current business cycle has been robust and prolonged. End market electronic equipment demand remains strong and new volume markets are emerging. However SEMI equipment and semiconductor sales are much more volatile than electronic equipment, so the current landscape could change quickly.

Looking forward

The global PMI is an excellent short-term leading indicator. It was at an all-time record high in December, pointing to an unseasonably strong first quarter of 2018. Keep watching the business cycles for any signs of abrupt change. Currently we are on a high plateau but conditions could change quickly.

Custer4-Purchasing-Managers-Index

Originally published on the SEMI blog.

North America-based manufacturers of semiconductor equipment posted $2.39 billion in billings worldwide in December 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.  The billings figure is 16.3 percent higher than the final November 2017 level of $2.05 billion, and is 27.7 percent higher than the December 2016 billings level of $1.87 billion.

“December 2017 monthly billings for North American equipment manufacturers ended the year at the highest levels in this record-breaking year,” said Ajit Manocha, president and CEO of SEMI. “For 2017, total billings for North American equipment companies soared over 40 percent compared to 2016.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)
Year-Over-Year
July 2017
$2,269.7
32.9%
August 2017
$2,181.8
27.7%
September 2017
$2,054.8
37.6%
October 2017
$2,019.3
23.9%
November 2017 (final)
$2,052.3
27.2%
December 2017 (prelim)
$2,387.8
27.7%

Source: SEMI (www.semi.org), January 2018

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases.