Category Archives: Wafer Processing

Nobuaki Kurumatani today took office as the first Chairman and CEO of Toshiba Corporation (TOKYO:6502) to be appointed from outside the company in over 50 years.

Commenting on his appointment as Representative Executive Officer and Chairman and CEO, Mr. Kurumatani said, “I am honored to be appointed CEO, and very much aware of the responsibilities I take on. Toshiba is not just any company. Its corporate DNA has realized countless Japan- and world-first technologies and products, made Toshiba a source of pride in Japan for nearly 145 years, and also made us a global leader.

“I believe that helping Toshiba back on its feet is my true calling. I am here at Toshiba to support change and transformation, and I see my role as to build on the company’s resilience and to lead its recovery. To secure growth, we must radically improve our earning power and reinforce our finances. We must move out of our comfort zone and promote fundamental reforms.”

Mr. Kurumatani most recently served as President of CVC Asia Pacific Japan (CVC). Before joining CVC in May 2017, he was Deputy President and a Director of Sumitomo Mitsui Financial Group, one of the largest financial institutions in Japan, where his career was devoted to corporate planning, public relations and internal auditing. He is a graduate of the University of Tokyo, where he studied Economics.

Satoshi Tsunakawa has taken on a new role in Toshiba as Representative Executive Officer and President, and Chief Operations Officer (COO). From today on, Mr. Kurumatani and Mr. Tsunakawa will together execute the management of Toshiba Group.

 SiFive, a provider of commercial RISC-V processor IP, today announced it raised $50.6 million in a Series C round led by existing investors Sutter Hill Ventures, Spark Capital and Osage University Partners alongside new investor Chengwei Capital, and strategic investors including Huami, SK Telecom and Western Digital and other companies that are among the most respected and iconic companies in the industry. This Series C round brings the total investment in SiFive to $64.1 million. Additionally, the company also announced it has signed a multi-year license to its Freedom Platform with Western Digital, which has pledged to produce 1 billion RISC-V cores.

This investment will enable SiFive to continue to innovate and provide leadership in bringing highly disruptive RISC-V technologies to the marketplace. “Over the past two years, SiFive has been at the forefront of the RISC-V ecosystem,” said Stefan Dyckerhoff, managing director at Sutter Hill Ventures and member of the SiFive board of directors. “Sutter Hill Ventures is confident that SiFive will continue to provide innovative solutions that will fundamentally change the semiconductor industry.”

Said Martin Fink, chief technology officer, Western Digital: “RISC-V delivers a platform for innovation unshackled from the proprietary interface of the past. This freedom allows us to bring compute closer to data to optimize special purpose compute capabilities targeted at Big Data and Fast Data applications. The next generation of applications like Machine Learning, AI, and Analytics require this ability to focus on a specific task. Western Digital is focused on the next generation of innovation to enable this new class of applications to deliver the possibilities of data.”

This Series C financing comes amid continued milestones for SiFive since its last round of funding in May 2017. Since then, SiFive has expanded its executive team with seasoned industry veterans including CEO Naveed Sherwani. The company also moved to a new, larger headquarters in Silicon Valley, a move that was prompted by a projected 3X growth in headcount.

“We are honored by the continued partnership with our investors and energized by new engagements with longtime industry leaders,” said Naveed Sherwani, CEO of SiFive. “This funding from our investors and licensing agreements with strategic partners establishes a strong financial foundation which will help us to continue our trailblazing path of engineering innovations and extend our market leadership around the world.”

SiFive’s mission is to democratize access to custom silicon through its IPs and platforms, globally. Since becoming available, HiFive1 and HiFive Unleashed software development boards have been deployed in more than 50 countries. Additionally, the company has engaged with multiple customers across its IP and SoC products, shipped the industry’s first RISC-V SoC in 2016 and the industry’s first RISC-V IP with support for Linux in October 2017.

Plastics are excellent insulators, meaning they can efficiently trap heat – a quality that can be an advantage in something like a coffee cup sleeve. But this insulating property is less desirable in products such as plastic casings for laptops and mobile phones, which can overheat, in part because the coverings trap the heat that the devices produce.

Now a team of engineers at MIT has developed a polymer thermal conductor — a plastic material that, however counterintuitively, works as a heat conductor, dissipating heat rather than insulating it. The new polymers, which are lightweight and flexible, can conduct 10 times as much heat as most commercially used polymers.

Researchers at MIT have designed a new way to engineer a polymer structure at the molecular level, via chemical vapor deposition. This allows for rigid, ordered chains, versus the messy, 'spaghetti-like strands' that normally make up a polymer. This chain-like structure enables heat transport both along and across chains. Credit: MIT News Office / Chelsea Turner

Researchers at MIT have designed a new way to engineer a polymer structure at the molecular level, via chemical vapor deposition. This allows for rigid, ordered chains, versus the messy, ‘spaghetti-like strands’ that normally make up a polymer. This chain-like structure enables heat transport both along and across chains. Credit: MIT News Office / Chelsea Turner

“Traditional polymers are both electrically and thermally insulating. The discovery and development of electrically conductive polymers has led to novel electronic applications such as flexible displays and wearable biosensors,” says Yanfei Xu, a postdoc in MIT’s Department of Mechanical Engineering. “Our polymer can thermally conduct and remove heat much more efficiently. We believe polymers could be made into next-generation heat conductors for advanced thermal management applications, such as a self-cooling alternative to existing electronics casings.”

Xu and a team of postdocs, graduate students, and faculty, have published their results today in Science Advances. The team includes Xiaoxue Wang, who contributed equally to the research with Xu, along with Jiawei Zhou, Bai Song, Elizabeth Lee, and Samuel Huberman; Zhang Jiang, physicist at Argonne National Laboratory; Karen Gleason, associate provost of MIT and the Alexander I. Michael Kasser Professor of Chemical Engineering; and Gang Chen, head of MIT’s Department of Mechanical Engineering and the Carl Richard Soderberg Professor of Power Engineering.

Stretching spaghetti

If you were to zoom in on the microstructure of an average polymer, it wouldn’t be difficult to see why the material traps heat so easily. At the microscopic level, polymers are made from long chains of monomers, or molecular units, linked end to end. These chains are often tangled in a spaghetti-like ball. Heat carriers have a hard time moving through this disorderly mess and tend to get trapped within the polymeric snarls and knots.

And yet, researchers have attempted to turn these natural thermal insulators into conductors. For electronics, polymers would offer a unique combination of properties, as they are lightweight, flexible, and chemically inert. Polymers are also electrically insulating, meaning they do not conduct electricity, and can therefore be used to prevent devices such as laptops and mobile phones from short-circuiting in their users’ hands.

Several groups have engineered polymer conductors in recent years, including Chen’s group, which in 2010 invented a method to create “ultradrawn nanofibers” from a standard sample of polyethylene. The technique stretched the messy, disordered polymers into ultrathin, ordered chains — much like untangling a string of holiday lights. Chen found that the resulting chains enabled heat to skip easily along and through the material, and that the polymer conducted 300 times as much heat compared with ordinary plastics.

But the insulator-turned-conductor could only dissipate heat in one direction, along the length of each polymer chain. Heat couldn’t travel between polymer chains, due to weak Van der Waals forces — a phenomenon that essentially attracts two or more molecules close to each other. Xu wondered whether a polymer material could be made to scatter heat away, in all directions.

Xu conceived of the current study as an attempt to engineer polymers with high thermal conductivity, by simultaneously engineering intramolecular and intermolecular forces — a method that she hoped would enable efficient heat transport along and between polymer chains.

The team ultimately produced a heat-conducting polymer known as polythiophene, a type of conjugated polymer that is commonly used in many electronic devices.

Hints of heat in all directions

Xu, Chen, and members of Chen’s lab teamed up with Gleason and her lab members to develop a new way to engineer a polymer conductor using oxidative chemical vapor deposition (oCVD), whereby two vapors are directed into a chamber and onto a substrate, where they interact and form a film. “Our reaction was able to create rigid chains of polymers, rather than the twisted, spaghetti-like strands in normal polymers.” Xu says.

In this case, Wang flowed the oxidant into a chamber, along with a vapor of monomers – individual molecular units that, when oxidized, form into the chains known as polymers.

“We grew the polymers on silicon/glass substrates, onto which the oxidant and monomers are adsorbed and reacted, leveraging the unique self-templated growth mechanism of CVD technology,” Wang says.

Wang produced relatively large-scale samples, each measuring 2 square centimeters – about the size of a thumbprint.

“Because this sample is used so ubiquitously, as in solar cells, organic field-effect transistors, and organic light-emitting diodes, if this material can be made to be thermally conductive, it can dissipate heat in all organic electronics,” Xu says.

The team measured each sample’s thermal conductivity using time-domain thermal reflectance — a technique in which they shoot a laser onto the material to heat up its surface and then monitor the drop in its surface temperature by measuring the material’s reflectance as the heat spreads into the material.

“The temporal profile of the decay of surface temperature is related to the speed of heat spreading, from which we were able to compute the thermal conductivity,” Zhou says.

On average, the polymer samples were able to conduct heat at about 2 watts per meter per kelvin – about 10 times faster than what conventional polymers can achieve. At Argonne National Laboratory, Jiang and Xu found that polymer samples appeared nearly isotropic, or uniform. This suggests that the material’s properties, such as its thermal conductivity, should also be nearly uniform. Following this reasoning, the team predicted that the material should conduct heat equally well in all directions, increasing its heat-dissipating potential.

Going forward, the team will continue exploring the fundamental physics behind polymer conductivity, as well as ways to enable the material to be used in electronics and other products, such as casings for batteries, and films for printed circuit boards.

“We can directly and conformally coat this material onto silicon wafers and different electronic devices” Xu says. “If we can understand how thermal transport [works] in these disordered structures, maybe we can also push for higher thermal conductivity. Then we can help to resolve this widespread overheating problem, and provide better thermal management.”

Mattson Technology introduces Novyka product family, an innovative technology for atomic level surface treatment and ultra-selective etching of extremely thin and delicate materials for continued scaling of 3D logic and memory devices.

“There are significant challenges in scaling with 3D structures for advanced memory and logic chips that include small, narrow, deep and complicated features composed of thin layers of different materials. Among these manufacturing challenges is selective removal of certain layers without damaging or removing other layers and without affecting other features,” said Dr. Subhash Deshmukh, Chief Business Officer of Mattson Technology. “Another challenge is cleaning of these complex structures, as wet chemistry is no longer able to meet the requirements of cleaning the very bottom of the high-aspect ratio features while maintaining device structure integrity.”

“Our new Novyka™ products offer proprietary chemistries in surface cleaning, surface treatment and surface modification. The unique designs of Novyka™ products further extend to enable ultra-high selectivity in removal of thin and delicate layers in 3D device structures,” said Dr. Michael Yang, Executive Vice President and Chief Technology Officer of Mattson Technology. “In addition to delivering the most innovative process solutions to some of the key technical challenges in the industry, Novyka™ products have the lowest running cost, or the best total cost of ownership in their class.”

“We are very excited about the potential of Novyka products as we are working closely with several of our most advanced customers on a variety of leading edge applications. With Mattson Technology achieving record revenue and profit in 2017, we continue to relentlessly drive technology innovations and provide uncompromising service to our global customer base,” commented Dr. Allen Lu, CEO and President of Mattson Technology.

Mattson Technology, a Delaware Company, headquartered in Fremont, California, designs, manufactures, markets and supports semiconductor wafer processing equipment. Mattson’s dry strip, plasma etch, rapid thermal processing and millisecond annealing equipment are used in high volume manufacturing by leading memory and logic chip makers around the world.

The semiconductor industry closed out 2017 in blockbuster fashion, posting the highest year-over-year growth in 14 years. Global semiconductor revenue grew 21.7 percent, reaching $429.1 billion in 2017, according to IHS Markit (Nasdaq: INFO).

Recording year-over-year growth of 53.6 percent, and its highest semiconductor revenue ever, Samsung replaced Intel as the new market leader of the semiconductor industry in 2017. Intel was followed by SK Hynix, in third position.

“2017 was quite a memorable year,” said Shaun Teevens, semiconductor supply chain analyst, IHS Markit. “Alongside record industry growth, Intel, which had led the market for 25 years, was supplanted by Samsung as the leading semiconductor supplier in the world.”

Among the top 20 semiconductor suppliers, SK Hynix and Micron enjoyed the largest year-over-year revenue growth, growing 81.2 percent and 79.7 percent, respectively. “A very favorable memory market with strong demand and high prices was mainly responsible for the strong growth of these companies,” Teevens said.

Qualcomm remained the top fabless company in 2017, followed by nVidia, which moved into the second position, after growing 42.3 percent over the previous year. Among the top 20 fabless companies, MLS enjoyed the highest market share gain, moving from number 20 to number 15 in the IHS Markit revenue ranking.

Figure 1

Figure 1

Memory was the strongest industry category

Memory integrated circuits proved to be the strongest industry category, growing 60.8 percent in 2017 compared to the previous year. Within the category, DRAM grew 76.7 percent and NAND grew 46.6 percent — the highest growth rate for both memory subcategories in 10 years. Much of the revenue increase was based on higher prices and increased demand for memory chips, relative to tight supply.

“The technology transition from planar 2D NAND to 3D NAND drove the market into an unbalanced supply-demand environment in 2017, driving prices higher throughout the year,” said Craig Stice, senior director, memory and storage, IHS Markit. “Entering 2018, the 3D NAND transition is now almost three-quarters of the total bit percent of production, and it is projected to provide supply relief for the strong demand coming from the SSD and mobile markets. Prices are expected to begin to decline aggressively, but 2018 could still be a record revenue year for the NAND market.”

Excluding memory, the remainder of the semiconductor industry grew 9.9 percent last year, largely due to solid unit-sales growth and strong demand across all applications, regions and technologies. Notably, semiconductors used for data processing applications expanded 33.4 percent by year-end. Intel remained the market leader in this category, with sales almost two times larger than second-ranked Samsung.

 

Kinetic Solutions, Inc., a full-service process and mechanical contractor for high-technology markets worldwide, announced today the acquisition of Mega Fluid Systems, a global supplier of chemical and slurry delivery equipment to the global semiconductor, LED, pharmaceutical, specialty chemicals and solar/PV industries. According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line. The acquisition marks another strategic decision in the latest string of investments to strengthen the Kinetics global footprint and position it as a leader in critical process facilities systems services, advanced process equipment and facility management solutions.

Kinetics, now in its 45th year, and Mega share a long legacy, as Mega was originally spun out of Kinetics in 2004. The reacquisition brings the story full circle, and allows Kinetics to offer a comprehensive range of equipment solutions that cover the scope of service and provide global turnkey solutions from feasibility studies through design, construction, construction management, commissioning and closeout.

“We are excited to welcome Mega Fluid Systems home to the Kinetics family,” said Peter Maris, president and CEO of Kinetics. “Adding the Mega portfolio of chemical and slurry delivery systems not only extends our process tool offering, it broadens our global reach and allows us to better serve our customers from R&D to volume manufacturing. Together, with the addition of Wafab and Mega, we are now operating from 20 offices with 1,800 employees worldwide.”

The Mega Fluid Systems product line includes leading-edge chemical, slurry and slurry-blend delivery systems, as well the supporting slurry filtration, metrology and world-class control and SCADA systems.

“As an independent brand for over 20 years, Mega established itself as a trusted supplier of high-performance blend and delivery systems, and built our reputation on innovation and ingenuity,” said Delton Hyatt, president, Mega Fluid Systems. “We are proud to bring that reputation home and be reunited with Kinetics. Together, we are a powerhouse of innovative process and mechanical solutions.”

“The Mega product line is a welcome addition to our existing portfolio of legacy process media distribution systems,” said Steve McGuigan, executive VP and general manager of Kinetics Equipment Solutions Group. “Combined with our chemical process systems and other offerings of facility management and high-purity installation capabilities, this strengthens Kinetics’ ability to serve our customers’ needs globally.”

No dust mops needed here. The inside of a chip factory is cleaner than about any other place you can visit on Earth. To avoid contaminating the chip-making process, the air in an Intel fab clean room is filtered to 1,000 times fewer airborne particles than a sterile hospital operating room.

The “Team Room” inside Intel’s Fab D1X in Hillsboro, Oregon, is unique.

It’s the sole conference room inside this entire multibillion-dollar factory. Though the fab sprawls over four football fields, every square foot is supremely expensive and valuable. That’s why Intel designed leading-edge Fab D1X with one and only room like this.

Intel operations leaders gather for the daily "8:20" – a morning huddle inside Fab D1X to ensure that the Hillsboro, Oregon, chip factory is running smoothly. Up to 30 people may squeeze into this room to confer on factory tool status, parts availability, operating forecasts, experts who may be needed or other urgent issues. The fab – the size of four football fields – runs 24/7/365. (Credit: Walden Kirsch/Intel Corporation)

Intel operations leaders gather for the daily “8:20” – a morning huddle inside Fab D1X to ensure that the Hillsboro, Oregon, chip factory is running smoothly. Up to 30 people may squeeze into this room to confer on factory tool status, parts availability, operating forecasts, experts who may be needed or other urgent issues. The fab – the size of four football fields – runs 24/7/365. (Credit: Walden Kirsch/Intel Corporation)

Anything entering the fab – including the Fab D1X Team Room – must be thoroughly scrubbed or swabbed. Human skin and hair must be almost entirely covered. Workers wear head-to-toe bunny suits, protective glasses, two pairs of gloves, booties, hoods, and face masks. Workers often recognize one another by their build or their gait, not their face.

In the D1X Team Room, anything that could shed particulates is verboten. No makeup, for example. Common supplies like paper and pencils are off-limits too – they both can create micro-dust. Only ink pens and special fab-approved synthetic paper are allowed in. This is the first photo inside the D1X Team Room ever shared externally. See more images from Intel’s fabs: Intel Manufacturing Images

More than Moore (MtM) wafer demand reached almost 45 million 8-inch eq wafers in 2017. The wafer demand is expected to reach more than 66 million 8-inch eq. wafers by 2023, with an almost 10% CAGR between 2017 and 2023. According to Yole Développement (Yole)’s definition, the MtM applications include MEMS & sensors, CIS , and power, along with RF devices.

For the first time, the market research and strategy consulting company Yole announces a global technology & market analysis dedicated to the MtM industry. The Wafer Starts for More Than Moore Applications report is the first part of a valuable series that will be released all year long.

“Yole’s analysts are part of the powerful semiconductor community”, explains Emilie Jolivet, Director, Semiconductor and Software at Yole. “Their daily interactions with leading companies allow them to collect a large amount of relevant data and cross their vision of market segments’ evolution and technology breakthroughs. Wafer Starts for More Than Moore Applications report is the first opportunity to get an overview of the MtM industry based on a 20-year expertise.”

“Numerous megatrend market drivers will contribute to MtM devices’ growth”, confirms Amandine Pizzagalli, Technology & Market Analyst, Semiconductor Manufacturing at Yole. “The megatrends are covering the following market segments: 5G including wireless infrastructure & mobile, mobile with additional functionalities, voice processing, smart automotive, AR/VR and AI.”

What is the status of the MtM wafer demand? Which market drivers will contribute to the growth of MtM devices? Which semiconductor substrate materials and wafer diameter dominate the MtM industry today? What are Yole’s expectations for the next 5 years? The analysts propose you a comprehensive analysis of the MtM wafer demand market.

Driven by the increasing deployment of renewable energy sources , and industrial motor drives, as well as the growing EV/HEVs industry, power devices’ wafer market size will grow at an almost 13% CAGR from 2017 to 2023. In 2017, it accounted for more than 60% of overall MtM wafer starts. According to Yole’s analysts, it will continue dominating the MtM industry.

In parallel, 5G, a hot topic today, will likely be a huge part of the MtM evolution, bringing any service to any user anywhere, but also requiring new antennas, along with filtering functionality. These stringent requirements will lead to increasing demand for RF components like RF filters, PAs , and LNAs to ensure access to tomorrow’s radio network.

Meanwhile, the demand for advanced mobile applications that integrate more functionalities will require aggregating more and more devices such as fingerprint sensors, ambient light sensors, 3D sensing, microphones, and inertial MEMS devices. This will, in the near future, contribute to strong wafer growth in the MEMS & sensors wafer market. Additionally, smart automobiles have reached a new level of complexity requiring the development and integration of new sensors. As such, Yole expects smart automobiles to drive consistent growth of CIS and sensor wafer production over the next five years, fueled by the expanding integration of high-value sensing modules like radar, imaging, and LiDAR. Although automotive will be mainly supported by these growth areas, classical MEMS & sensors such as MEMS pressure sensors and inertial MEMS will still continue growing at a reasonable rate, supporting the standard automotive world.

Yole’s investigations are based on numerous discussions with leading semiconductor players. Applied Materials Inc. is part of them. Amandine Pizzagalli recently had the opportunity to debate with Mike Rosa, Head of Marketing, 200mm Equipment Products Group (EPG) at Applied Materials. During this discussion, both exchanged their vision of the MtM industry and its evolution.

“Today, while many of these technologies exist on 200mm and below wafer sizes much of this business falls within the purview of the 200mm Equipment Product Group”, explains Mike Rosa from Applied Materials. “With the exception of Power Bipolar-CMOS-DMOS (BCD) and some Discretes, 2.5D Interposer, CMOS Image Sensors and some Photonics devices in the market – all other technologies in the MtM segment are manufactured on 200mm and 150mm wafer sizes today. So, to support our customers on current and future wafer size requirements, we work across the company to share the domain knowledge acquired, for example in the 200mm group on MEMS or Discrete Power, with the 300mm group in order to ensure continuity of technology development onto the larger wafer sizes.”

The full interview is available on i-micronews.com, semiconductor manufacturing news or click Here.

In terms of wafer size, the MtM wafer market is dominated by the 6-inch wafer format, followed by the 8-inch size, which is mostly supported by power device applications. However, though 6-inch will continue increasing in the next few years, its share will decrease compared to 8-inch. “We expect 8-inch wafer diameter to progress significantly and surpass the 6-inch wafer size by 2023”, explains Amandine Pizzagalli from Yole. And she adds: “This transition will be driven first by power and MEMS & sensor applications, where the vast majority will convert their components from 6-inch to 8-inch over the next five years due to increasing volume production.”

Nevertheless, 12-inch will represent the fastest growth from 2017 to 2023, with a 15% CAGR. The 12-inch wafer demand should also grow from 3.3 million units in 2017 to 7.5 million in 2023, mainly fueled by BSI CIS (Including 3D stacked BSI, 3D hybrid BSI).

On the other side, 4-inch wafer diameter is in large demand today for MtM applications driven by RF SAW filter products. However, 4-inch’s adoption will decrease due to the transition from 4-inch to 6-inch for these applications. Yole still sees some MtM products manufactured in wafer sizes below 4-inch, i.e. 3-inch and 2-inch wafer formats. However, these represent a very small volume, and the analysts expect such sizes to die out, aside from small volumes still used for producing MEMS, power, and RF SAW devices.

The Wafer Starts for More Than Moore Applications report is the first research performed by Yole’s analysts, gathering all the wafer starts markets for MtM applications. Yole’s market forecast methodology is based on both top bottom and a bottom up approach with dozens of interviews of companies across the entire semiconductor value chain. With this report, the company proposes an assessment of the wafers market for MEMS & Sensors, CIS, power and RF devices. This analysis reveals the market metrics at wafer market level for the whole MtM industry from 2017-2023. It evaluates market developments in terms of market size, substrate sizes/formats, and by MtM application.

Yole’s report also discloses the competitive landscape with key players in technology development and manufacturing. A detailed analysis of the key market drivers that will shape the MtM market in the future are also part of this technology & market report.

NVIDIA and Arm today announced that they are partnering to bring deep learning inferencing to the billions of mobile, consumer electronics and Internet of Things devices that will enter the global marketplace.

Under this partnership, NVIDIA and Arm will integrate the open-source NVIDIA Deep Learning Accelerator (NVDLA) architecture into Arm’s Project Trillium platform for machine learning. The collaboration will make it simple for IoT chip companies to integrate AI into their designs and help put intelligent, affordable products into the hands of billions of consumers worldwide.

“Inferencing will become a core capability of every IoT device in the future,” said Deepu Talla, vice president and general manager of Autonomous Machines at NVIDIA. “Our partnership with Arm will help drive this wave of adoption by making it easy for hundreds of chip companies to incorporate deep learning technology.”

“Accelerating AI at the edge is critical in enabling Arm’s vision of connecting a trillion IoT devices,” said Rene Haas, executive vice president, and president of the IP Group, at Arm. “Today we are one step closer to that vision by incorporating NVDLA into the Arm Project Trillium platform, as our entire ecosystem will immediately benefit from the expertise and capabilities our two companies bring in AI and IoT.”

Based on NVIDIA® Xavier™, an autonomous machine system on a chip, NVDLA is a free, open architecture to promote a standard way to design deep learning inference accelerators. NVDLA’s modular architecture is scalable, highly configurable and designed to simplify integration and portability.

NVDLA brings a host of benefits that speed the adoption of deep learning inference. It is supported by NVIDIA’s suite of powerful developer tools, including upcoming versions of TensorRT, a programmable deep learning accelerator. The open-source design allows for cutting-edge features to be added regularly, including contributions from the research community.

The integration of NVDLA with Project Trillium will give deep learning developers the highest levels of performance as they leverage Arm’s flexibility and scalability across the wide range of IoT devices.

“This is a win/win for IoT, mobile and embedded chip companies looking to design accelerated AI inferencing solutions,” said Karl Freund, lead analyst for deep learning at Moor Insights & Strategy. “NVIDIA is the clear leader in ML training and Arm is the leader in IoT end points, so it makes a lot of sense for them to partner on IP.”

ON Semiconductor (Nasdaq: ON) today announced it has recognized 20 companies with supplier excellence awards. Selected from among the company’s extensive list of preferred global suppliers, the 2017 award winners represent partners who have demonstrated a deep commitment to ensuring high quality and supply continuity in an evolving semiconductor market.

elected from more than 3,000 active production suppliers, the finalists gathered for a two-day awards event and executive conference in Hong Kong, China, with the focus of anticipating the future of semiconductor growth and accelerating customer needs.

“As a top 20 global semiconductor design and manufacturing company, ON Semiconductor creates innovative semiconductor and general electronic component solutions to solve our customers’ design challenges and reduce their time to market,” said Jeffrey Wincel, vice president and chief procurement officer at ON Semiconductor. “All the suppliers recognized today demonstrated a similar commitment to collaboration and partnership. These strong relationships are key in delivering on our business strategy, including the areas of product innovation, customer satisfaction and growth.”

Full list of award winners:

Front End (FE) Direct Material Supplier: Konfoong Materials International Company, LTD.
Back End (BE) Direct Material Supplier: Chang Wah Technology Co., Ltd.
FE Site Supplier: Plansee SE
BE Site Supplier: KETECA Singapore (Pte) Ltd
BE External Manufacturing: King Yuan Electronics Co. Ltd.
FE External Manufacturing: JiangYin ChangDian Advanced Packaging Co., LTD
Corporate Services Supplier: DHL Supply Chain
Technology Leader Award: Mentor Graphics
BE Subcon Quality Award: GEM Services, Inc.
BE Perfect Quality Award: Indium Corporation
BE Perfect Quality Award: Henkel
FE Perfect Quality Platinum Award: Shin-Etsu Handotai Co., Ltd
FE Perfect Quality Platinum Award: Brewer Science, Inc.
FE Perfect Quality Platinum Award: JSR Micro, Inc.
FE Perfect Quality Platinum Award: JX Nippon Mining & Metals
FE Perfect Quality Gold Award: Cabot Microelectronics Corporation
FE Perfect Quality Gold Award: Grikin Advanced Materials Co., Ltd.
FE Perfect Quality Award: Tanaka Kikinzoku Kogyo K.K.
FE Perfect Quality Award: Tosoh SMD, Inc.
Pinnacle Award: Global Wafers