Category Archives: Wafer Processing

“Si photonics growth is now confirmed,” announced Dr. Eric Mounier from Yole Développement (Yole). “Therefore, the development of Si photonics technologies is especially driven by the intra & inter data center applications. Silicon photonics is today one of the most valuable answers to high data rate/low cost for distances beyond VCSEL’s reach.”

The market research and strategy consulting company, Yole investigates the Si photonics sector for years now and was already announcing its take-off in 2017. This year, the trend is confirmed, strongly supported by the needs of data management and performances. Si photonics market forecasts are impressive: Yole’s analysts announce a US$560 million market value at chip level and an almost US$4 billion market at transceiver level, both in 2025. The Si photonics technology has reached its tipping point with lot of positive signs: Yole announces transceiver volume-shipping via two major players, Luxtera and Intel as well as a maturing supply chain. In addition, Yole’s analysts highlights the development of new startups and additional products reaching the market, mostly for 100G but soon for 200/400G. At the end, the market is showing very encouraging signs in terms of growing investments from the VC community.

illus_si_photonics_ecosystem_yole_jan2018_(433x280)

Yole, in collaboration with Jean-Louis Malinge, former CEO of Kotura, now at ARCH Venture Partners proposes a comprehensive analysis of the Si photonic industry, Silicon Photonics. It is a high added-value introduction to the silicon photonics technology, including market forecasts, description of applications and supply chain as well as manufacturing trends and challenges. Jean-Louis Malinge will attend OFC 2018 taking place this week in San Diego to meet the Si photonics companies.

The tipping point of the Si photonic industry is only at the very beginning, since there is massive, ongoing global development geared towards further integration. Indeed, Si Photonics today is restricted to the data center market and still competes with VCSEL, which continues to improve In parallel, metropolitan/long-haul applications are not still the main Si photonic targets since the cost is still too high. Long-haul require reliable components and volumes that are not interesting for SiPh. However, as FTTH specifications would converge to Metropolitan networks, this application could also be accessible to Si photonic solutions:

  •  The recent involvement of large IC foundries is a very encouraging sign that portends big things for Si photonics. They include: TSMC with Luxtera, GlobalFoundries with Ayar Labs…
•  The “zero-change”: it means manufacturing optical components without making any changes to a CMOS process. This processes currently in development target future inter-chip optical interconnects that could represents a huge market volume.
•  Datacom and telecom are not the only applications. As silicon photonics is an integration technology platform, it can also be used for sensing application where volume/small form factor are required: medical and automotive applications.

The analysis will not be completed if GAFAMs were not part of the game. Therefore, in development for years, Si photonics is still pushed hard by these major companies, due to their impressive advantages including low cost, higher integration, more embedded functionalities, higher interconnect density, lower power consumption, and better reliability compared with legacy optics and more. Big OEMs like Facebook, Google, and Amazon develop their own optical data center technology in partnership with chip firms. Indeed, while traffic continues to increase between users and data centers across the internet, more and more data communication is taking place within the data center. Current data center switching and interconnects make it difficult and costly to cope with this increasing flow. In this context, new approaches are necessary.

To identify the evolution of this industry and identify latest innovations, the consulting company is daily discussing with Si photonics players.

The SEMI-THERM Educational Foundation (STEF) proudly announces that the 34th Annual Thermal Measurement, Modeling and Management Symposium will take place from Monday, March 19th to Friday, March 23rd, 2018. World-class thermal experts will speak at the symposium and attendees will be able to visit with more than 40 exhibitors and experience hands-on demonstrations at vendor workshops.

Conference committee chairs and presenters are leaders and practitioners from companies including Cisco, IBM, Intel, Facebook, Microsoft, Google, Huawei, Qualcomm, and other organizations and academia dedicated to solving thermal challenges.

“Not only will the attendees be able to network with the key technical players in the thermal management field, but they will also be able to get inspired by the keynote and luncheon speeches, while establishing an understanding of thermal principles,” said Bernie Siegal, co-founder of the conference and recipient of SEMI-THERM’s Lifetime Achievement Award. “This program has been successful for 34 years because it offers something for everyone, from in-depth short courses and technical sessions to free evening tutorials and practical how-to courses,” he added.

Symposium Highlights

SEMI-THERM has an entire session dedicated to consumer electronics, along with the keynote address, “Thermal Challenges and Industry Trends of Consumer Electronic Devices” presented by Dr. Andre Ali of Google. And new to this year’s program is a special panel session titled “Challenges in Consumer Electronics”.

Additional technical sessions present best practices for keeping data centers and large electronic systems cool. Papers focus on low acoustics air mover technologies, two-phase and liquid cooling, thermal interfaces and heat sinks.

Other sessions help optimize chip package and microprocessors designs to minimize thermal factors. Multiple papers being presented are dedicated to addressing special requirements of devices and systems exposed to rugged conditions such as LEDS, power, and automotive devices.

Unique to the symposium, full conference registrants are able to attend fascinating luncheon speeches: “Mission Critical Facilities, Data Centers, Technology Spaces and Electronic Equipment” by Dr. Dustin W. Demetriou, IBM and “Tales from the Mars Science Laboratory Thermal Protection System Development” by Dr. Helen H. Hwang, NASA Ames .

Free programs include an evening tutorial presented by Dr. Bruce Guenin, “The Internet of Things – A Personal Perspective”, exhibits, vendor workshops, how-to courses, and two evening networking receptions.

For more information and to register, please visit:

http://semi-therm.org

 

The latest update to the SEMI World Fab Forecast report, published on February 28, 2018, reveals fab equipment spending will increase at 5 percent in 2019 for a remarkable fourth consecutive year of growth as shown in figure 1. China is expected to be the main driver of fab equipment spending growth in 2018 and 2019 absent a major change in its plans. The industry had not seen three consecutive years of growth since the mid-1990s.

Figure 1

Figure 1

SEMI predicts Samsung will lead in fab equipment spending both in 2018 and 2019, with Samsung investing less each year than in 2017.  By contrast, China will dramatically increase year-over-year fab equipment spending by 57 percent in 2018 and 60 percent in 2019 to support fab projects from both multinationals and domestic companies. The China spending surge is forecast to accelerate it past Korea as the top spending region in 2019.

After record investments in 2017, Korea fab equipment spending will decline 9 percent, to US$18 billion, in 2018 and an additional 14 percent, to US$16 billion, in 2019. However both years will outpace pre-2017 spending levels for the region. Fab equipment spending in Taiwan, the third-largest region for fab investments, will fall 10 percent to about US$10 billion in 2018, but is forecast to rebound 15 percent to over US$11 billion in 2019. (Details about other regions’ spending trends are available in SEMI’s latest World Fab Forecast.)

As expected, China’s fab equipment spending is increasing as projects shift to equipment fabs constructed earlier in this cycle.  The record 26 volume fabs that started construction in China in 2017 will begin equipping this year and next.  See figure 2.

Figure 2

Figure 2

Non-Chinese companies account for the largest share of fab equipment investment in China. However, Chinese-owned companies are expected to ramp up fabs in 2019, increasing their share of spending in China from 33 percent in 2017 to 45 percent in 2019.

Product Sector Spending

3D NAND will lead product sector spending, growing 3 percent each in 2018 and 2019, to US$16 billion and US$17 billion, respectively. DRAM will see robust growth of 26 percent in 2018, to US$14 billion, but is expected to decline 14 percent to US$12 billion in 2019.  Foundries will increase equipment spending by 2 percent to US$17 billion in 2018 and by 26 percent to US$22 billion in 2019, primarily to support 7nm investments and ramp of new capacity.

SCREEN Semiconductor Solutions, a subsidiary of SCREEN Holdings Co., Ltd (TSE: 7735), with strong semiconductor equipment sales and service bases in Japan, and Axcelis Technologies, Inc. (Nasdaq: ACLS), a supplier of innovative, high-productivity solutions for the semiconductor industry, today announced a strategic agreement for distribution and support of Axcelis’ complete Purion ion implant product line in Japan. Under the agreement, the companies will establish a training and demonstration facility at SCREEN’s Process Technology Center in Hikone, Japan, as well as initiate a technical collaboration focused on developing advanced process technology for emerging implant, thermal processing and wafer cleaning applications.

Tadahiro Suhara, representative director president of SCREEN Semiconductor Solutions, commented, “We are very excited to introduce the Purion platform’s advanced ion implant technology to our Japanese customers, as well as the opportunity to leverage our combined strengths to develop next generation thermal processing capabilities through our technical collaboration. This agreement will allow us to continue to offer our customers a diversity of solutions to meet our customers’ evolving technological needs.”

Mary Puma, president and CEO of Axcelis Technologies, said, “We’re very pleased to announce our partnership with SCREEN Semiconductor Solutions, a company widely recognized for superior technology and customer satisfaction. It will enable us to bring our Purion product line to the Japan market, and provide us with strong opportunities for new customer penetrations and market share gains.”

Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung’s 8 nanometer (nm) Low Power Plus (8LPP) FinFET process technology. Providing DesignWare Logic Library and Embedded Memory IP on Samsung’s latest process technology enables designers to take advantage of a reduction in power and area compared to Samsung’s 10LPP process. The DesignWare Foundation IP will be developed to meet strict automotive-grade requirements, enabling designers to accelerate ISO 26262 and AEC-Q100 qualifications of their advanced driver assistance system (ADAS) and infotainment system-on-chips (SoCs). The DesignWare Logic Library and Embedded Memory IP will be available from Synopsys through the Foundry-Sponsored IP Program for the Samsung 8LPP process, enabling qualified customers to license the IP at no cost. The collaboration extends Synopsys’ and Samsung’s long history of working together to provide silicon-proven IP that helps designers meet their performance, power, and area requirements for a wide range of applications including mobile, automotive, and cloud computing.

“Samsung’s collaboration with Synopsys over the last decade has enabled first-pass silicon success for billions of ICs in mobile and consumer applications,” said Jongwook Kye, vice president of Design Enablement at Samsung Electronics. “As designs get more complex and migrate to smaller FinFET processes, Samsung’s advanced 8LPP process with Synopsys’ high-quality Foundation IP solutions will enable designers to differentiate their products for mobile, cryptocurrency and network/server applications, accelerate project schedules, and quickly ramp into volume production.”

“Samsung and Synopsys share a long and successful history of providing designers with silicon-proven DesignWare IP on Samsung’s processes ranging from 180 to 10 nanometer,” said John Koeter, vice president of marketing for IP at Synopsys. “As the leading provider of physical IP with more than 100 test chip tapeouts on FinFET processes, Synopsys continues to make significant investments in developing IP to help designers take advantage of Samsung’s latest process technologies, reduce risk and speed development of their SoCs.”

Semiconductors–a class of materials that can function as both electrical conductor and insulator, depending on the circumstances–are an essential technology for all modern electronic innovations.

Silicon has long been the most famous semiconductor, but in recent years researchers have studied a wider range of materials, including molecules that can be tailored to serve specific electronic needs.

Perhaps appropriately, one of the most cutting-edge electronics–supercomputers–are indispensable research tools for studying complex semiconducting materials at a fundamental level.

Recently, a team of scientists at TU Dresden used the SuperMUC supercomputer at the Leibniz Supercomputing Centre to refine its method for studying organic semiconductors.

Illustration of a doped organic semiconductor based on fullerene C60 molecules (green). The benzimidazoline dopant (purple) donates an electron to the C60 molecules in its surrounding (dark green). These electrons can then propagate through the semiconductor material (light green). Credit: S. Hutsch/F. Ortmann, TU Dresden

Illustration of a doped organic semiconductor based on fullerene C60 molecules (green). The benzimidazoline dopant (purple) donates an electron to the C60 molecules in its surrounding (dark green). These electrons can then propagate through the semiconductor material (light green). Credit: S. Hutsch/F. Ortmann, TU Dresden

Specifically, the team uses an approach called semiconductor doping, a process in which impurities are intentionally introduced into a material to give it specific semiconducting properties. It recently published its results in Nature Materials.

“New kinds of semiconductors, organic semiconductors, are starting to get used in new device concepts,” said team leader Dr. Frank Ortmann. “Some of these are already on the market, but some are still limited by their inefficiency. We are researching doping mechanisms–a key technology for tuning semiconductors’ properties–to understand these semiconductors’ limitations and respective efficiencies.”

Quantum impurities

When someone changes a material’s physical properties, he or she also changes its electronic properties and, therefore, the role it can play in electronic devices. Small changes in material makeup can lead to big changes in a material’s characteristics–in certain cases one slight atomic alteration can lead to a 1000-fold change in electrical conductivity.

While changes in material properties may be big, the underlying forces–exerting themselves on atoms and molecules and governing their interactions–are generally weak and short-range (meaning the molecules and the atoms of which they are composed must be close together). To understand changes in properties, therefore, researchers have to accurately compute atomic and molecular interactions as well as the densities of electrons and how they are transferred among molecules.

Introducing specific atoms or molecules to a material can change its conducting properties on a hyperlocal level. This allows a transistor made from doped material to serve a variety of roles in electronics, including routing currents to perform operations based on complex circuits or amplifying current to help produce sound in a guitar amplifier or radio.

Quantum laws govern interatomic and intermolecular interactions, in essence holding material together, and, in turn, structuring the world as we know it. In the team’s work, these complex interactions need to be calculated for individual atomic interactions, including interactions among semiconductor “host” molecules and dopant molecules on a larger scale.

The team uses density functional theory (DFT)–a computational method that can model electronic densities and properties during a chemical interaction–to efficiently predict the variety of complex interactions. It then collaborates with experimentalists from TU Dresden and the Institute for Molecular Science in Okazaki, Japan to compare its simulations to spectroscopy experiments.

“Electrical conductivity can come from many dopants and is a property that emerges on a much larger length scale than just interatomic forces,” Ortmann said. “Simulating this process needs more sophisticated transport models, which can only be implemented on high-performance computing (HPC) architectures.”

Goal!

To test its computational approach, the team simulated materials that already had good experimental datasets as well as industrial applications. The researchers first focused on C60, also known as Buckminsterfullerene.

Buckminsterfullerene is used in several applications, including solar cells. The molecule’s structure is very similar to that of a soccer ball–a spherical arrangement of carbon atoms arranged in pentagonal and hexagonal patterns the size of less than one nanometer. In addition, the researches simulated zinc phthalocyanine (ZnPc), another molecule that is used in photovoltaics, but unlike C60, has a flat shape and contains a metallic atom (zinc).

As its dopant the team first used a well-studied molecule called 2-Cyc-DMBI (2-cyclohexyl-dimethylbenzimidazoline). 2-Cyc-DMBI is considered an n-dopant, meaning that it can provide its surplus electrons to the semiconductor to increase its conductivity. N-dopants are relatively rare, as few molecules are “willing” to give away an electron. In most cases, molecules that do so become unstable and degrade during chemical reactions, which in this context can lead to an electronic device failure. 2-Cyc-DMBI dopants are the exception, because they can be sufficiently weakly attractive for electrons–allowing them to move over long distances–while also remaining stable after donating them.

The team got good agreement between its simulations and experimental observations of the same molecule-dopant interactions. This indicates that they can rely on simulation to guide predictions as they relate to the doping process of semiconductors. They are now working on more complex molecules and dopants using the same methods.

Despite these advances, the team recognizes that next-generation supercomputers such as SuperMUC-NG–announced in December 2017 and set to be installed in 2018–will help the researchers expand the scope of their simulations, leading to ever bigger efficiency gains in a variety of electronic applications.

“We need to push the accuracy of our simulations to the maximum,” Ortmann said. “This would help us extend the range of applicability and allow us to more precisely simulate a broader set of materials or larger systems of more atoms.”

Ortmann also noted that while current-generation systems allowed the team to gain insights in specific situations and prove its concept, there is still room to get better. “We are often limited by system memory or CPU power,” he said. “The system size and simulation’s accuracy are essentially competing for computing power, which is why it is important to have access to better supercomputers. Supercomputers are perfectly suited to deliver answers to these problems in a realistic amount of time.”

KLA-Tencor Corporation (NASDAQ: KLAC) has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award. The PQS award recognizes companies like KLA-Tencor that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.

“The dynamic nature of our business necessitates continuous improvement and an unrelenting focus on quality,” said Jacklyn Sturm, Vice President of Technology and Manufacturing Group and General Manager of Global Supply Management at Intel. “As Intel transitions to become a more data centric company, our award winning suppliers are embracing the most difficult challenges with rapid innovation and bold strategies.”

To qualify for PQS status, suppliers must exceed high expectations and uncompromising performance goals while scoring at least 80 percent on an integrated report card that assesses performance throughout the year. Suppliers must also achieve 80 percent or greater on a challenging continuous improvement plan and demonstrate solid quality and business systems.

Applied Materials, Inc. has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award. The PQS award recognizes companies like Applied that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.

“The dynamic nature of our business necessitates continuous improvement and an unrelenting focus on quality,” said Jacklyn Sturm, Vice President of Technology and Manufacturing Group and General Manager of Global Supply Management at Intel. “As Intel transitions to become a more data centric company, our award winning suppliers are embracing the most difficult challenges with rapid innovation and bold strategies.”

To qualify for PQS status, suppliers must exceed high expectations and uncompromising performance goals while scoring at least 80 percent on an integrated report card that assesses performance throughout the year. Suppliers must also achieve 80 percent or greater on a challenging continuous improvement plan and demonstrate solid quality and business systems.

Historically, the DRAM market has been the most volatile of the major IC product segments.  A good example of this was displayed over the past two years when the DRAM market declined 8% in 2016 only to surge by 77% in 2017! The March Update to the 2018 McClean Report (to be released later this month) will fully detail IC Insights’ latest forecast for the 2018 DRAM and total IC markets.

In the 34-year period from 1978-2012, the DRAM price-per-bit declined by an average annual rate of 33%. However, from 2012 through 2017, the average DRAM price-per-bit decline was only 3% per year! Moreover, the 47% full-year 2017 jump in the price-per-bit of DRAM was the largest annual increase since 1978, surpassing the previous high of 45% registered 30 years ago in 1988!

In 2017, DRAM bit volume growth was 20%, half the 40% rate of increase registered in 2016.  For 2018, each of the three major DRAM producers (e.g., Samsung, SK Hynix, and Micron) have stated that they expect DRAM bit volume growth to once again be about 20%.  However, as shown in Figure 1, monthly year-over-year DRAM bit volume growth averaged only 13% over the nine-month period of May 2017 through January 2018.

Figure 1 also plots the monthly price-per-Gb of DRAM from January of 2017 through January of 2018.  As shown, the DRAM price-per-Gb has been on a steep rise, with prices being 47% higher in January 2018 as compared to one year earlier in January 2017.  There is little doubt that electronic system manufacturers are currently scrambling to adjust and adapt to the skyrocketing cost of memory.

DRAM is usually considered a commodity like oil.  Like most commodities, there is elasticity of demand associated with the product.  For example, when oil prices are low, many consumers purchase big SUVs, with little concern for the vehicle’s miles-per-gallon efficiency.  However, when oil prices are high, consumers typically look toward smaller or alternative energy (e.g., hybrid or fully electric) options.

Figure 1

Figure 1

While difficult to precisely measure, it is IC Insights’ opinion that DRAM bit volume usage is also affected by elasticity, whereby increased costs inhibit demand and lower costs expand usage and open up new applications.  As shown in Figure 1, the correlation coefficient between the DRAM price-per-bit and the year-over-year bit volume increase from January 2017 through January 2018 was a strong -0.88 (a perfect correlation between two factors moving in the opposite direction would be -1.0).  Thus, while system manufacturers are not scaling back DRAM usage in systems currently shipping, there have been numerous rumors of some smartphone producers scaling back DRAM in next-generation models (i.e., incorporating 4GB of DRAM per smartphone instead of 5GB).

In 2018, IC Insights believes that the major DRAM suppliers will be walking a fine line between making their shareholders even happier than they are right now and further alienating their customer base.  If, and it is a BIG if, the startup Chinese DRAM producers can field a competitive product over the next couple of years, DRAM users could flock to these new suppliers in an attempt to get out from under the crushing price increases now being thrust upon them—with the “payback” to the current major DRAM suppliers being severe.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $37.6 billion for the month of January 2018, an increase of 22.7 percent compared to the January 2017 total of $30.6 billion. Global sales in January were 1.0 percent lower than the December 2017 total of $38.0 billion, reflecting normal seasonal market trends. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“After notching its highest-ever annual sales in 2017, the global semiconductor industry is off to a strong and promising start to 2018, posting its highest-ever January sales and 18th consecutive month of year-to-year sales increases,” said John Neuffer, president and CEO, Semiconductor Industry Association. “All major regional markets saw double-digit growth compared to last year, with the Americas leading the away with year-to-year growth of more than 40 percent. With year-to-year sales also up across all major semiconductor product categories, the global market is well-positioned for a strong start to 2018.”

Year-to-year sales increased substantially across all regions: the Americas (40.6 percent), Europe (19.9 percent), Asia Pacific/All Other (18.6 percent), China, (18.3 percent), and Japan (15.1 percent). Month-to-month sales increased slightly in Europe (0.9 percent), held flat in China, but fell somewhat in Asia Pacific/All Other (-0.6 percent), Japan (-1.0 percent), and the Americas (-3.6 percent).

To find out how to purchase the WSTS Subscription Package, which includes comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, please visit http://www.semiconductors.org/industry_statistics/wsts_subscription_package/. For detailed data on the global and U.S. semiconductor industry and market, consider purchasing the 2017 SIA Databook: https://www.semiconductors.org/forms/sia_databook/.

Jan 2018

Billions

Month-to-Month Sales                              

Market

Last Month

Current Month

% Change

Americas

8.95

8.63

-3.6%

Europe

3.37

3.40

0.9%

Japan

3.24

3.21

-1.0%

China

12.01

12.01

0.0%

Asia Pacific/All Other

10.41

10.35

-0.6%

Total

37.99

37.59

-1.0%

Year-to-Year Sales                         

Market

Last Year

Current Month

% Change

Americas

6.14

8.63

40.6%

Europe

2.84

3.40

19.9%

Japan

2.79

3.21

15.1%

China

10.16

12.01

18.3%

Asia Pacific/All Other

8.73

10.35

18.6%

Total

30.64

37.59

22.7%

Three-Month-Moving Average Sales

Market

Aug/Sep/Oct

Nov/Dec/Jan

% Change

Americas

8.54

8.63

1.1%

Europe

3.36

3.40

1.1%

Japan

3.20

3.21

0.3%

China

11.65

12.01

3.1%

Asia Pacific/All Other

10.33

10.35

0.1%

Total

37.09

37.59

1.4%