Category Archives: Wafer Processing

Through three quarters of calendar year 2017, market shares of top semiconductor equipment manufacturers indicate large gains by Tokyo Electron and Lam Research, according to the report “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts,” recently published by The Information Network, a New Tripoli-based market research company.

The chart below shows shares for the entire year of 2016 and for the first three quarters of 2017. Market shares are for equipment only, excluding service and spare parts, and have been converted for revenues of foreign companies to U.S. dollars on a quarterly exchange rate.

equipment shares

Market leader Applied Materials lost 1.3 share points, dropping from 28.2% in 2016 to 26.9% YTD (year to date). Gaining share are Tokyo Electron Ltd. (TEL), which gained 2.4 share points while rising from 17.0% in 2016 to 19.4% in 2017 YTD. Lam Research gained 1.6 share points and growing from a 19.0% share in 2016 to a 20.6% share in 2017 YTD.

On a competitive basis, Applied Materials competes against both competitors in conductor and dielectric etch equipment and in deposition equipment (atomic layer deposition [ALD] and non-tube low pressure chemical vapor deposition [LPCVD]). TEL also competes against Screen Semiconductor Solutions, which dropped 1.4 share points, in photoresist track and wet clean equipment.

According to SEMI, the industry consortium, semiconductor equipment grew 41% in 2017.

SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit and loss (P&L) responsibility for SEMI Japan and leadership of SEMICON Japan along with all regional programs, events, and initiatives including SEMI Standards and industry advocacy. With more than 325 members, SEMI Japan plays a critical role in SEMI’s global industry association, representing more than 2,000 companies worldwide in the electronics manufacturing supply chain.

With all-time records expected in 2017 for global semiconductor revenue at $400 billion (USD), semiconductor equipment revenue at $56 billion (USD), and semiconductor materials revenue at $48 billion (USD), Japan is an essential global player and has seen very strong recent growth.  Japan supplies nearly one-third of the world’s semiconductor equipment and more than half all wafer fab materials. As semiconductor manufacturing continues its strong global growth, SEMI Japan role in connecting SEMI member companies in Japan with opportunities to collaborate and innovate with companies worldwide will take on increasing importance in enabling members’ growth and prosperity.

“With his long leadership experience at TEL, the largest semiconductor equipment company in Japan (and in the top-five globally), Jim understands the challenges and opportunities facing Japan as the global electronics manufacturing supply chain expands and evolves,” said Ajit Manocha, president and CEO of SEMI.  “Jim’s solid track record in heading ambitious business transformations makes him the ideal choice to lead SEMI Japan in SEMI’s 2.0 initiative. Jim will drive critical initiatives such as workforce development, greater environmental health and safety (EH&S) intensity, and new vertical application collaborations – like Smart Data and Smart Transportation that sharpen the industry’s focus on Artificial Intelligence (AI) and Machine Learning.”

Hamajima brings more than 30 years’ experience in the semiconductor equipment industry in Japan and the U.S. and a comprehensive understanding of the global industry.  Starting at Tokyo Electron Ltd. (TEL) in diffusion, Hamajima later held vice president positions overseeing multiple product lines at Tokyo Electron America and later for Cleaning Systems in Japan. Hamajima’s experience includes leading complex integrations as senior vice president at Timbre Technologies and as vice president and general manager at TEL-FSI. Prior to joining SEMI, Hamajima served as vice president and general manager of Corporate Strategy at TEL. Hamajima holds a Bachelor of Science degree in Metallurgy from the Nagoya Institute of Technology.

“I would also like to thank Osamu Nakamura for his important contributions, first as a SEMI Japan Regional Advisory Board member, later as a SEMI International BOD member and most recently as president of SEMI Japan, culminating in the very successful SEMICON Japan 2017 in mid-December,” commented Manocha. “I appreciate Osamu remaining as an advisor through the next several months to ensure a smooth transition and wish him a very happy retirement.”

 

United Microelectronics Corporation (NYSE:UMC;TWSE:2303) (“UMC”), a global semiconductor foundry, today announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The newly available 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s mass production 55nm SST technology. Toshiba Electronic Devices & Storage Corporation has started studying technical feasibility of UMC’s 40nm SST for their microcontroller (MCU) ICs.

“We expect that UMC’s 40nm SST will improve the performance of our MCU products,” said Toshiya Matsui, Vice President, Mixed Signal IC Division of Toshiba Electronic Devices & Storage Corporation “Working with UMC will also allow us to maintain a robust business continuity plan (BCP) through stable manufacturing supply and flexible capacity support based on our production requirements.”

More than 20 customers and products are in various stages of 55nm SST eFlash production at UMC, including those for SIM card, banking, automotive, IOT, MCU and other applications.

Wenchi Ting, Associate VP of Specialty Technology division at UMC said, “Since qualifying SST’s embedded flash technology on our popular 55nm process in 2015, we have received tremendous interest from customers looking to further utilize the low power, high reliability, superior data retention and high endurance characteristics of this process platform for their automotive, industrial, consumer and IoT applications. We are pleased to introduce this eNVM solution on our 40nm platform, and look forward to bringing the high speed and high reliability benefits of SST to Toshiba and our other foundry customers.”

UMC’s robust SST process performs according to JEDEC standards, with 100k endurance and more than 10 years of data retention at 85C and an operating-temperature range of -40C to 125C. In addition to the 40nm SST process, UMC has over 20 customers in production using the foundry’s 55nm SST for a broad range of product applications.

JEDEC Solid State Technology Association, a leader in standards development for the microelectronics industry, announces the successful launch of its newest committee: JC-70 Wide Bandgap Power Electronic Conversion Semiconductors. JC-70 held its first meeting in late October with twenty-three member companies, led by committee and subcommittee chairs from Infineon Technologies, Texas Instruments, Transphorm, and Wolfspeed, a Cree Company. Committee members include industry leaders in power GaN and SiC semiconductors as well as prospective users of WBG power semiconductors and T&M equipment manufacturers. Global multinational corporations and technology startups from the US, Europe, and Asia are working together to bring to the industry a set of standards for reliability, testing, and parametrics of WBG power semiconductors.

JC-70 has two subcommittees, which are focusing on Silicon Carbide (SiC) and Gallium Nitride (GaN) as the most mature wide bandgap (WBG) power semiconductor materials. Both SiC and GaN offer immense potential for enabling higher performance, more compact, and energy efficient power systems. Industry interest in JC-70 has been high with several new members joining the committee after the first meeting, underscoring the importance of creating universal standards to help advance the adoption of WBG power technologies.

“I am delighted by the initial response to the JC-70 committee, and look forward to welcoming additional companies to participate in developing standards for wide bandgap power technology,” said John Kelly, JEDEC President. “Broad industry participation will help ensure the resulting documents meet the needs of product designers as they create systems to enable a more energy efficient future.”

Four committee meetings are planned for 2018, including a webconference on January 25 and a meeting co-located with the APEC Conference on March 5. Interested companies worldwide are welcome to join JEDEC to participate in this important standardization effort.Contact Emily Desjardins ([email protected]) for more information or visit www.jedec.org.

Electronics manufacturing executives will sharpen their competitive edge in Dublin, Ireland, on 4-6 March at Europe’s SEMI Industry Strategy Symposium (ISS Europe). The three-day flagship business event brings together analysts, researchers, economists, technologists and industry leaders for critical insights into the forces shaping the electronics manufacturing supply chain. With Europe a key engine of global innovation and the supply chain, ISS Europe 2018 takes aim at helping European organisations find new ways to maximise competitive advantage.

“Organisations operating in Europe need to find the most effective way to innovate, manufacture and profit by leveraging their strengths in the global supply chain,” said Laith Altimime, president, SEMI Europe. “During ISS Europe 2018, hosted by SEMI Europe, top European companies, research institutes and public institutions will convene to discuss how to compete and win globally in the context of Europe’s strategic, economic and social needs.”

ISS Europe 2018 discussions will focus on successful manufacturing in Europe and mechanisms to support innovation. The speaker lineup includes:

  • David Bloss, VP, Technology Manufacturing Group, Intel
  • Holger Blume, professor, University of Hanover
  • Jean-Frederic Clerc, deputy CEO and CTO, CEA Tech
  • Kevin Cooney, senior VP and managing director, Global CIO, Xilinx EMEA
  • Jean-Christophe Eloy, CEO, Yole Développement
  • Ann-Charlotte Johannesson, CEO, CEI-Europe AB
  • Cheryl Miller, founder/executive director, Digital Leadership Institute
  • Michael Morris, director AMBER Research Centre, professor, Trinity College Dublin
  • Alain Mutricy, senior VP product management, GLOBALFOUNDRIES
  • James O’Riordan, CTO, S3 Group
  • David Sneddon, director of large customer sales for Central Europe, Google
  • Florien van der Windt, Cluster Manager Smart Mobility, Dutch Ministry of Infrastructure & Environment
  • Hanns Windele, vice president, Europe and India, Mentor Graphics, a Siemens Business

The Panel Discussion “Critical Strategies to Grow Europe in the Global Supply Chain” will highlight ISS Europe 2018 as participants take advantage of great networking opportunities such as an opening reception and a gala dinner announcing the 2017 European Award winner.

Join Europe’s strategic thinkers and business drivers at ISS Europe 2018 in Dublin, Ireland from March 4-6, 2018.

Renesas Electronics Corporation (TSE:6723, “Renesas”), a supplier of advanced semiconductor solutions, today announced the integration of Intersil Corporation as a legal entity and a new branding policy following the acquisition of Intersil on February 24, 2017. Effective January 1, 2018, Intersil Corporation is expected to operate in the market under the name of Renesas Electronics America Inc. The completion of Renesas’ U.S. entity integration marks a major milestone in the integration process, which remains well on track. As well, the integration process in Japan and Korea is expected to be completed on or about January 1, 2018. The remaining Intersil entities are expected to be integrated in the near future.

“With the integration of the Intersil business, we have taken another significant step towards maximizing the full potential of the combined business, providing scale, stability and a comprehensive product mix,” said Bunsei Kure, Representative Director, President and CEO of Renesas Electronics Corporation. “With the enhanced global strength, Renesas is in the best position to further strengthen its leadership in the global semiconductor market.”

“The promise of the Renesas and Intersil integration has already begun to materialize as we’ve started operating as one company,” said Necip Sayiner, Executive Vice President of Renesas, President of Renesas Electronics America and President, CEO and Director of Intersil. “We are fully combining our portfolios, technologies and talent to maximize the potential of the acquisition synergies. As a result, we are positioned to expand our business in the broad-based market, providing complete system solutions that enable customers to get to market faster.”

As of January 1, 2018, Intersil Corporation is expected to complete an absorption-type merger with Renesas Electronics America Inc., the U.S. subsidiary of Renesas, leaving Intersil Corporation as the surviving company. Intersil Corporation will then change its name to Renesas Electronics America Inc.

Prior to this entity integration, Renesas implemented a transition to a new organizational structure in July 2017 to accelerate the integration of the Intersil business. The aim of this transition is to move beyond its Japan-centric business management and to achieve a truly global company that acts as “One Global Renesas,” a company that operates as a global entity.

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its industry-leading process equipment. The building, part of an investment of more than 20 million Euros that was announced earlier this year, allows for a significant expansion of warehouse space and provides more than 50 percent additional test room space for the final assembly of EVG’s high-precision systems, as well as technical source inspection of the systems by its customers.

“EVG operates in highly dynamic markets, where we always strive to provide our customers with the latest technologies to realize their product ideas with the shortest possible time to market–true to EVG’s Triple-i philosophy of invent-innovate-implement,” stated Dr. Werner Thallner, executive operations and financial director at EV Group. “Our headquarters expansion helps ensure that we continue to deliver on this pledge to our customers. I’m pleased to say that we completed this expansion in record time too, and we already have plans for additional capacity expansion in preparation for future growth.”

The completed building at EV Group's headquarters is part of an investment of more than 20 million Euros to expand the company's production capacity.

The completed building at EV Group’s headquarters is part of an investment of more than 20 million Euros to expand the company’s production capacity.

The new test rooms, which are designed to house larger systems including high-volume manufacturing platforms and solutions for panel-sized substrates, are equipped with the latest air conditioning and cleanroom technology. The ambient conditions created through these measures are similar to those found in the semiconductor fabs or bio-medical labs of EVG’s global customers. The sophisticated security concept at EVG’s headquarters, which extends to the new building complex, enables customers to have controlled access to individual test rooms where the technical source inspection of their tools can take place together with EVG specialists.

Several EVG systems have already been moved to the new facility for final assembly, software installation and initial set-up in order to make more room available for fulfilling additional system orders.

Cypress Semiconductor Corp. (Nasdaq: CY) today announced the appointment of Jeannine Sargent to its board of directors. Sargent brings 30 years of experience encompassing leadership, operations, marketing and engineering roles within a diverse mix of high tech component and systems companies across multiple industries. As part of her responsibilities on Cypress’ board, she will serve on the company’s Compensation Committee.

In her most recent role as President of Innovation and New Ventures at Flex, a leading contract design, engineering and manufacturing company, Sargent led the fastest growing and highest margin design-enabled business, which was at the core of Flex’s long-term strategic growth plan. Prior to this, she served as president of Flex’s Energy business, which she helped build into a global multi-billion-dollar industry leader focusing on renewable energy, smart grid and solid-state lighting technologies, products and services. In her career, Sargent has served as CEO at both Oerlikon Solar, a thin-film silicon solar photovoltaic (PV) module manufacturer, and Voyan Technology, an embedded systems software provider to the communications and semiconductor industries. She currently serves on several investment and advisory boards and is on the board of trustees at Northeastern University.

“Jeannine Sargent is another excellent addition to Cypress’ board,” said Steve Albrecht, Cypress’ chairman. “She strengthens our team with the depth of her experience in growing innovative and profitable systems businesses at the forefront of emerging, high tech industries. I’m excited for her valuable contributions toward supporting the management team as they continue executing our strategy to become the leading embedded system solutions supplier in high-growth segments including Automotive, Industrial and applications across the IoT.”

Sargent holds a B.S. in chemical engineering from Northeastern University and certificates from the executive development programs at the MIT Sloan School of Management, Harvard University and Stanford University.

The global wafer mounter equipment market is expected to grow at a CAGR of more than 4% from 2017-2021, according to a new market research report by Technavio.

Global wafer mounter equipment market segmentation by application and product type

Technavio’s report on the global wafer mounter equipment market analyses the business dimensions and presents a comprehensive breakdown in terms of market segmentation by application, including 300 mm (12 inches), 200 mm (8 inches), and 150 mm (6 inches). In 2016, the global wafer mounter equipment market by application was dominated by the 300mm segment, which accounted for a revenue share of close to 64%.

Based on product type, the global wafer mounter equipment market has been segmented into manual wafer mounters, automatic wafer mounters, and semi-automatic wafer mounters. The manual wafer mounters segment dominated the market, accounting for a revenue share of more than 41% in 2016.

“Manual wafer mounters are the most preferred wafer mounters by semiconductor device manufacturers. Leading vendors such as Taiwan Semiconductor Manufacturing Company, GLOBALFOUNDRIES, United Microelectronics, and SMIC are undertaking capital investments to meet the rising requirements for chips as new applications such as the IoT, factory automation, and automobile automation are emerging. The market will slowly transition from manual wafer mounters to automatic wafer mounters as manufacturers look to automate various processes,” says Chetan Mohan, a lead analyst at Technavio for semiconductor equipment research.

 

Global wafer mounter equipment market: competitive vendor landscape

The semiconductor industry is witnessing significant technology transitions in the manufacturing process such as the shift to smaller nodes, the multi-patterning technology, and the growth of MEMS and NEMS devices. To address these requirements of the customers, some of the equipment manufacturers are expected to develop new fabrication equipment that is in line with these technological advances. The semiconductor market is predicted to be driven by the growth of the IoT market, which will increase the demand for sensors, controllers, and embedded non-volatile memory.

North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in November 2017 was $2.05 billion. The billings figure is 1.6 percent higher than the final October 2017 level of $2.02 billion, and is 27.2 percent higher than the November 2016 billings level of $1.61 billion.

“November billings for North American equipment manufacturers increased modestly for the first time in four months,” said Dan Tracy, Senior Director, Industry Research and Statistics, at SEMI. “Year-to-date equipment spending is well on track to set a historical high, and we expect that positive momentum to continue into next year as new fabs in China begin to equip.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)
Year-Over-Year
June 2017
$2,300.3
34.1%
July 2017
$2,269.7
32.9%
August 2017
$2,181.8
27.7%
September 2017
$2,054.8
37.6%
October 2017 (final)
$2,019.3
23.9%
November 2017 (prelim)
$2,052.2
27.2%

Source: SEMI (www.semi.org), December 2017