Category Archives: Wafer Processing

InfinityQS International, Inc. (InfinityQS), the global authority on data-driven manufacturing quality, announces TEL NEXX, a metallization solutions provider to chip designers and manufacturers, is using its software to modernize shop floor data collection and quality control. Moving from a manual, paper-based system to an accessible database, the company has installed InfinityQS’ Quality Intelligence solution ProFicient on tablets for shop floor operators to directly enter data. This has improved the accuracy and timeliness of data capture and enabled rapid response to production issues. With access to historical data at the management level, TEL NEXX can also identify opportunities for quality and process improvements.

Brian Hart, Manufacturing Engineer, TEL NEXX, said, “ProFicient has made accessing a history for each product easy. As our database grows, we can extract information to drive continuous improvement projects and eliminate bottlenecks. What’s more, moving from a paper-based system to an accessible database has made us more efficient. As the projects and operators advance, we only expect to move faster and faster—with the same integrity.”

Historically, TEL NEXX collected data almost entirely manually, which required operators to duplicate data-entry steps by recording data on paper and then entering them into spreadsheets. These processes were time consuming and required rechecking to avoid errors. But now, operators are entering data once into ProFicient, and the data immediately becomes available for managers and administrators to review and provide feedback in real time. Direct data entry has also improved morale on the shop floor, with operators seeing the importance of data collection and taking greater ownership of the work.

Michael Lyle, President and CEO, InfinityQS, said, “When manufacturers rely on manual data entry, it creates inefficiencies that prevent them from responding to variations and other shop floor issues properly and in a timely manner. Instead, modern technologies are available that can create visibility for organizations into their quality data. This transparency enables them to not only make prompt corrections to ensure problems don’t compound, but also perform proactive analysis for continuous improvement.”

To support operator adoption, Hart is leading an incremental rollout of ProFicient and also gradually integrating the solution with TEL NEXX’s existing shop-floor systems. Notably, within just weeks of deploying ProFicient, Hart was able to detect equipment settings that had been inadvertently altered from the original specifications and in a few hours make adjustments so that the machine operated correctly moving forward.

SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation. The customer relationships were already being serviced within SkyWater’s 200mm semiconductor wafer manufacturing facility when purchased from Cypress earlier this year. Through the transaction, SkyWater assumes ownership of Cypress’ current embedded Specialty Foundry customer engagements and adds associated business management personnel.

“This transaction builds upon the concept of a Technology Foundry, which enables customers to design, build, and scale their products by simplifying the realization of complex technologies through access to semiconductor technology, experienced personnel and volume manufacturing capabilities,” said SkyWater Chairman of the Board Gary Obermiller. “The addition of the Specialty Foundry customers is synergistic with our pure-play Technology Foundry model; customers come to us with their ideas and we transform them into practice through the application of our differentiated semiconductor technology and operational expertise.”

The Technology Foundry Business model enables customers to design and optimize their product concepts. In tandem with SkyWater’s advanced wafer manufacturing facility, customers are able to prototype and rapidly scale to production volumes, all inside of a high-yield production fab.

“The Specialty Foundry Business was created in 2008 with the vision of providing advanced development access to a high-volume production-scale fab, building on the site’s proven track record of success in bringing new technologies to production,” said Michael Moore, executive vice president of Sales and Marketing at SkyWater. “It’s in our DNA. We’ve been doing development work at this site for decades, right alongside production.  This move is a natural next step for the company and our customers.  We have successfully diversified the customer base this way, by serving new and unique markets that are poised for rapid growth.”

As part of the assignment, which closed October 2, SkyWater will now have direct responsibility for all Specialty Foundry Business customers, eliminating the prior Cypress interface. Because of the existing working relationship between all parties, there will be a seamless transition for all current projects; the same team will continue working with all existing customers, the only difference being that they are now SkyWater employees.

Within SkyWater’s manufacturing facility there are a wide variety of unique technologies currently being developed and manufactured – from superconducting quantum computers to advanced technology Readout IC’s (ROIC), MEMS-based infrared imagers, DNA sequencing and fabrication platforms, and photonic integrated circuit (PIC) devices.

According to SkyWater’s Senior Director of Sales Brad Ferguson, “These types of Technology engagements just start with a simple conversation about our capabilities, and once Customers see the potential of our Technology Foundry solution, they realize this is the right place to transform their concepts into a manufactured product.”

SkyWater is a U.S.-based technology foundry specializing in the development and manufacturing of a wide variety of semiconductor based solutions.

The Semiconductor Industry Association (SIA) today announced the SIA Board of Directors has elected Matt Murphy, president and CEO of Marvell Semiconductor, Inc. (NASDAQ: MRVL), as its 2018 Chair and Sanjay Mehrotra, president and CEO of Micron Technology, Inc. (NASDAQ: MU), as its 2018 Vice Chair.

SIA Matt Murphy headshot

“It is a great pleasure to welcome Matt Murphy as SIA’s 2018 Chair and Sanjay Mehrotra as SIA’s Vice Chair,” said John Neuffer, SIA President and CEO. “Matt is a strong leader, an industry veteran, and an outstanding champion for SIA and our industry. An engineer by trade, Sanjay is a mainstay in our industry and a respected voice on semiconductor technology. Together, their skills and accomplishments will be a major asset to advancing SIA’s priorities in Washingtonand around the world.”

Murphy has led Marvell since joining the company in July 2016, and serves as a member of the company’s board of directors. Since that time, he has led the company’s turnaround and reestablished Marvell as a leading innovator in storage and networking technology.

Prior to joining Marvell, Murphy spent over two decades at Maxim Integrated, most recently as Executive Vice President of Business Units and Sales & Marketing, overseeing all product development and go-to-market activities. Previously, Murphy managed the company’s Communications & Automotive Solutions Group, led Worldwide Sales & Marketing, and served in a range of other business unit management positions.

“Few technologies have impacted the modern world more than semiconductors, and we’re now entering an era that promises even greater change,” said Murphy. “However, progress isn’t guaranteed unless the United States does more to support research, boost competitiveness, and promote global trade. As 2018 SIA Chair, I look forward to working with my colleagues to champion these priorities.”

Mehrotra joined Micron in May 2017, after a long and distinguished career at SanDisk Corporation where he led the company from a start-up in 1988 until its eventual sale in 2016. In addition to being a SanDisk co-founder, Mr. Mehrotra served as its President and CEO from 2011 to 2016, overseeing its growth to a Fortune 500 company.

Prior to SanDisk, Mr. Mehrotra held design engineering positions at Integrated Device Technology, Inc., SEEQ Technology and Intel Corporation. Mehrotra earned both bachelor’s and master’s degrees in electrical engineering and computer science from the University of California, Berkeley. He holds more than 70 patents and has published articles on nonvolatile memory design and flash memory systems.

“Semiconductor technology has revolutionized our society and transformed our economy,” said Mehrotra. “The success of our industry is driven, in part, by our unity of purpose. Working together through SIA, we can ensure continued U.S. leadership in semiconductor manufacturing, design, and research. I look forward to helping lead that effort as 2018 SIA Vice Chair.”

AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronics-grade diamond, announced today the issuance by the Japan Patent Office of a patent covering a method for the fabrication of diamond semiconductor materials, core to applications in automotive, aerospace, consumer electronics, military, defense, and telecommunications systems, amongst others.

“We are ecstatic to be awarded this key patent in Japan. Its issuance protects our proprietary interests in diamond semiconductor in one of the nations leading the globe in diamond research,” said Adam Khan, Founder & Chief Executive Officer, AKHAN Semiconductor, Inc. “Following this year’s issuances of a Taiwan diamond semiconductor patent, and a major US diamond transparent electronics patent, the Japan patent issuance is a further testament to AKHAN’s leadership in the diamond semiconductor space.”

Japan, which has actively funded millions of dollars into diamond electronics research since 2002, earlier this year announced marked progress in the development of diamond semiconductor device performance. The AKHAN granted and issued patent, JP6195831 (B2), is a foreign counterpart of other issued and pending patents owned by AKHAN Semiconductor, Inc. that are used in the company’s Miraj Diamond Platform products. As a key landmark patent, the claims protect uses far beyond the existing applications, including microprocessor applications. Covering the base materials common to nearly all semiconductor components, the intellectual property can be realized in everything from diodes, transistors, and power inverters, to fully functioning diamond chips such as integrated circuitry.

AKHAN’s flagship Miraj Diamond Glass for mobile display and camera lens is 6x stronger, 10x harder, and runs over 800x cooler than leading glass competitors like Gorilla Glass by coating standard commercial glass such as aluminosilicate, BK7, and Fused Silica with lab-grown nanocrystalline diamond. Diamond-based technology is capable of increasing power density as well as creating faster, lighter, and simpler devices for consumer use. Cheaper and thinner than its silicon counterparts, diamond-based electronics could become the industry standard for energy efficient electronics.

“This patent adds to the list of other key patents in the field of Diamond Semiconductor that are owned by the company, including the ability to fabricate transparent electronics, as well as the ability to form reliable metal contacts to diamond semiconductor systems,” said Carl Shurboff, President and Chief Operating Officer, AKHAN Semiconductor, Inc. “This patent bolsters the supporting evidence of AKHAN’s leadership in manufacturing diamond semiconductor products, and supports ongoing efforts with our major defense, aerospace and space system development partners.”

 

IC Insights has revised its outlook for semiconductor industry capital spending and will present its new findings in the November Update to The McClean Report 2017, which will be released at the end of this month.  IC Insights’ latest forecast now shows semiconductor industry capital spending climbing 35% this year to $90.8 billion.

After spending $11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to $26 billion.  Bill McClean, president of IC Insights stated, “In my 37 years of tracking the semiconductor industry, I have never seen such an aggressive ramp of semiconductor capital expenditures.  The sheer magnitude of Samsung’s spending this year is unprecedented in the history of the semiconductor industry!”

Figure 1 shows Samsung’s capital spending outlays for its semiconductor group since 2010, the first year the company spent more than $10 billion in capex for the semiconductor segment.  After spending $11.3 billion in 2016, the jump in capex expected for this year is simply amazing.

To illustrate how forceful its spending plans are, IC Insights anticipates that Samsung’s semiconductor capex of $8.6 billion in 4Q17 will represent 33% of the $26.2 billion in total semiconductor industry capital spending for this quarter.  Meanwhile, the company is expected to account for about 16% of worldwide semiconductor sales in 4Q17.

IC Insights estimates that Samsung’s $26 billion in semiconductor outlays this year will be segmented as follows:

3D NAND flash: $14 billion (including an enormous ramp in capacity at its Pyeongtaek fab)

DRAM: $7 billion (for process migration and additional capacity to make up for capacity loss due to migration)

Foundry/Other: $5 billion (for ramping up 10nm process capacity)

annual samsung capex

IC Insights believes that Samsung’s massive spending outlays this year will have repercussions far into the future. One of the effects likely to occur is a period of overcapacity in the 3D NAND flash market. This overcapacity situation will not only be due to Samsung’s huge spending for 3D NAND flash, but also to its competitors in this market segment (e.g., SK Hynix, Micron, Toshiba, Intel, etc.) responding to the company’s spending surge.  At some point, Samsung’s competitors will need to ramp up their capacity or loose market share.

Samsung’s current spending spree is also expected to just about kill any hopes that Chinese companies may have of becoming significant players in the 3D NAND flash or DRAM markets.  As our clients have been aware of for some time, IC Insights has been extremely skeptical about the ability of new Chinese startups to compete with Samsung, SK Hynix, and Micron with regards to 3D NAND and DRAM technology.  This year’s level of spending by Samsung just about guarantees that without some type of joint venture with a large existing memory suppler, new Chinese memory startups stand little chance of competing on the same level as today’s leading suppliers.

SUNY Polytechnic Institute (SUNY Poly) is hosting the 11th IEEE Nanotechnology Symposium at its world-class Albany NanoTech Complex on Wednesday, November 15, from 9 a.m. to 5:30 p.m., with support from sponsors IEEE and the Electron Devices Society, as well as from donors IBM and GlobalFoundries.

The symposium will feature keynotes and presentations on topics from computational health, silicon photonics, spintronics, and packaging to advances in quantum computing devices and architecture. In addition, a number of technical leaders will be recognized with awards for their contributions toward the introduction of copper (Cu) interconnects to the semiconductor industry, including Dr. Dan Edelstein, IBM Fellow and one of the pioneers of this advancement.

In addition to the award recipients from IBM and GlobalFoundries, guests of honor include:

  • Mukesh Khare (Vice President, Semiconductor Technology Research, IBM);
  • Bahgat Sammakia (Interim President, SUNY Poly);
  • T.C. Chen (Vice President Science & Technology, IBM Fellow, IBM);
  • Bijan Davari (Vice President, Next Generation Computing Systems and Technology, IBM Fellow, IBM);
  • George Gomba (Vice President, Technology Research, GLOBALFOUNDRIES);
  • Thomas N. Theis (Executive Director, Columbia Nano Initiative, Columbia University); and
  • Kang-ill Seo (Vice President, R & D, Samsung Semiconductor Inc.).

A link to more information about the symposium, as well as an agenda, can be found here: http://albanynanotechnology.org/

SEMICON Europa 2017 will take place in Munich from 14 to 17 November, co-located with productronica. Consistent with SEMI’s theme “Connect, Collaborate, and Innovate,” co-locating SEMICON Europa with productronica gathers the full span of electronics manufacturing and end-products, creating the largest European electronics platform ever. More than 400 exhibitors will present their products and innovations at SEMICON Europa 2017. Over 40,000 attendees are expected at the co-located events.

After a period of slow growth, Europe’s semiconductor manufacturers are investing in new construction of 300mm fabs in Germany, Italy and France. Four semiconductor and MEMS manufacturers have announced investments in Europe totaling more than $10 billion. Bosch will build a new fab in Dresden; ST Microelectronics is planning two new 300mm fabs in Agrate and Crolles; and GLOBALFOUNDRIES and Infineon plan to expand their production capacity.

“The global industry will invest more than US$100 billion in equipment and materials this year. Forecasts for 2017 also predict that semiconductor manufacturers worldwide will exceed $400 billion in revenue ─ a new record,” says Ajit Manocha, president and CEO of SEMI.  “An unprecedented number of new inflections and applications will broadly expand the digital economy and drive increasing silicon content — in areas including IoT, assisted driving in automotive, Artificial Intelligence (AI), Big Data, and 5G. Assuming an average 7 percent CAGR, global chip sales could approach $1 trillion by 2030, and equipment and materials spending could similarly grow to nearly a quarter of a trillion dollars.”

The market segments in which European companies hold strong market positions also shape the conference program of SEMICON Europa 2017. More than 250 presentations, 50 conferences and high-caliber discussions provide an overview of current trends. Key issues this year include: materials, semiconductor manufacturing, advanced packaging, MEMS/sensors, power electronics, flexible and printed electronics. The focus is also on important applications such as the Internet of Things (IoT) and artificial intelligence (AI), smart manufacturing (“Industry 4.0”), automotive electronics and medical technology.

The Opening Ceremony will include a welcome speech by Ajit Manocha, president and CEO of SEMI,followed by Laith Altimime, president, SEMI Europe, plus four keynotes:

  • Bosch Sensortec: Stefan Finkbeiner, CEO, on how environmental sensing can contribute to a better quality of life in the context of the IoT
  • Rinspeed Inc.: Frank M. Rinderknecht, founder and CEO, on how to create innovative technologies, materials and mobility means of tomorrow
  • SOITEC: Carlos Mazure, CTO, executive VP, on contributions and benefits of engineered substrates solutions and thin-layer transfer technologies, focusing on applications in the smart space
  • TSMC Europe: Maria Marced, president, on opportunities for new business models to apply in the Smart City

On the exhibition show floor, the TechARENA free sessions are a highlight with the SEMI China Innovation and Investment Forum and the INNOVATION VILLAGE.

Ben-Gurion University of the Negev (BGU) researchers have achieved a breakthrough in manipulating light to render an object, such as an optical chip, invisible.

According to the recent study published in Nature Scientific Reports, the researchers conceived a new method that deflects and scatters light away from a “cloaking” chip surface so it is not detected.

An operational cloaking chip can be an extension of the basic technologies such as radar-absorbing dark paint used on stealth aircraft, local optical camouflage, surface cooling to minimize electromagnetic infrared emissions, or electromagnetic wave scattering.

“These results open the door to new integrated photonic devices, harnessing electromagnetic fields of light at nanoscale for a variety of applications from on-chip optical devices to all-optical processing,” says Dr. Alina Karabchevsky, head of BGU’s Light-on-a-Chip Group and a member of the BGU Unit of Electro-Optical Engineering and the Ilse Katz Institute for Nanoscale Science and Technology. “We showed that it is possible to bend the light around an object located on the cloak on an optical chip. The light does not interact with the object, thus resulting in the object’s invisibility.”

The next step is for researchers to overcome the significant challenge of developing a prototype.

Other group researchers who contributed to the study, Invisibility Cloaking Scheme by Evanescent Fields Distortion on Composite Plasmonic Waveguides with Si Nano-Spacer, include Yakov Galutin, an MSc student and a member of the BGU Electro-Optical Engineering Unit and the Ilse Katz Institute for Nanoscale Science and Technology, and Eran Falek, a student in the Department of Electrical and Computer Engineering.

Electrical physicists from Czech Technical University have provided additional evidence that new current sensors introduce errors when assessing current through iron conductors. It’s crucial to correct this flaw in the new sensors so that operators of the electrical grid can correctly respond to threats to the system. The researchers show how a difference in a conductor’s magnetic permeability, the degree of material’s magnetization response in a magnetic field, affects the precision of new sensors. They also provide recommendations for improving sensor accuracy. The results are published this week in AIP Advances, from AIP Publishing.

With the addition of new renewable energy sources and smart homes demanding more information, the electrical grid is becoming more complex. Author Pavel Ripka said, “If you have [a] grid at the edge of capacity, you have to be careful to monitor all the transients (power surges).” Surges are overloads or failures to the system, which can be caused by something as simple as a broken power line, or more dramatic events like lightning strikes or geomagnetic storms.

Ripka explained the importance of monitoring electrical currents: “Every day you get a lot of these small events (surges) within a big power grid, and sometimes it is difficult to interpret them. If it is something really serious, you should switch off parts of the grid to prevent catastrophic damage, but if it’s a short transient which will finish fast there is no need to disconnect the grid. It’s a risky business to distinguish between these events, because if you underestimate the danger then parts of the distribution installations can be damaged causing serious blackouts. But if you overestimate and disconnect, it is a problem because connecting these grids back together is quite complicated,” he said.

To address the increasing complexity of the grid and power outage threats, there has been an increase in use of ground current sensors in the past couple of years. New yokeless current sensors are popular because of their low cost and compact size. These sensors are good for assessing currents in nonmagnetic conductors such as copper and aluminum. However, ground conductors are usually iron due to its mechanical strength, and iron has a high magnetic permeability.

Using these new sensors to measure ground currents when iron is present is a bit like using a thermometer to assess if the heating needs to be switched on, not taking into account where exactly the thermometer is placed. Near a door or window, the thermometer’s reading can be affected differently than elsewhere. In the same way, this study has shown that not taking into account the magnetic permeability of a conductor distorts the accuracy of a reading with a yokeless sensor.

Ripka and his team matched experimental measurements with theoretical simulations to highlight the difference in yokeless sensor readings between nonmagnetic and magnetic conductors.

“We can show how to design (yokeless) current sensors so that they are not so susceptible to this type of error,” Ripka said. “[This study is] just a small reminder to make [engineers] design sensors safely.”

To further prove the point, Ripka’s group is starting to take long-term readings at power stations, comparing results to commercial uncalibrated sensors. In the future, Ripka envisions cooperating with geophysicists to correlate ground currents and geomagnetic activity, to better understand how these currents are distributed within the earth and even predict future disruptions to the grid.

A transfer technique based on thin sacrificial layers of boron nitride could allow high-performance gallium nitride gas sensors to be grown on sapphire substrates and then transferred to metallic or flexible polymer support materials. The technique could facilitate the production of low-cost wearable, mobile and disposable sensing devices for a wide range of environmental applications.

Transferring the gallium nitride sensors to metallic foils and flexible polymers doubles their sensitivity to nitrogen dioxide gas, and boosts response time by a factor of six. The simple production steps, based on metal organic vapor phase epitaxy (MOVPE), could also lower the cost of producing the sensors and other optoelectronic devices.

Sensors produced with the new process can detect ammonia at parts-per-billion levels and differentiate between nitrogen-containing gases. The gas sensor fabrication technique was reported November 9 in the journal Scientific Reports.

Abdallah Ougazzaden, director of Georgia Tech Lorraine in Metz, France and Chris Bishop, a researcher at Institut Lafayette, example a sample being processed in a lab at Georgia Tech Lorraine. (Credit: Rob Felt, Georgia Tech).

Abdallah Ougazzaden, director of Georgia Tech Lorraine in Metz, France and Chris Bishop, a researcher at Institut Lafayette, example a sample being processed in a lab at Georgia Tech Lorraine. (Credit: Rob Felt, Georgia Tech).

“Mechanically, we just peel the devices off the substrate, like peeling the layers of an onion,” explained Abdallah Ougazzaden, director of Georgia Tech Lorraine in Metz, France and a professor in Georgia Tech’s School of Electrical and Computer Engineering (ECE). “We can put the layer on another support that could be flexible, metallic or plastic. This technique really opens up a lot of opportunity for new functionality, new devices – and commercializing them.”

The researchers begin the process by growing monolayers of boron nitride on two-inch sapphire wafers using an MOVPE process at approximately 1,300 degrees Celsius. The boron nitride surface coating is only a few nanometers thick, and produces crystalline structures that have strong planar surface connections, but weak vertical connections.

Image shows wafer-scale processed AlGaN/GaN sensors being tested. (Credit: Georgia Tech Lorraine).

Image shows wafer-scale processed AlGaN/GaN sensors being tested. (Credit: Georgia Tech Lorraine).

Aluminum gallium nitride (AlGaN/GaN) devices are then grown atop the monolayers at a temperature of about 1,100 degrees Celsius, also using an MOVPE process. Because of the boron nitride crystalline properties, the devices are attached to the substrate only by weak Van der Waals forces, which can be overcome mechanically. The devices can be transferred to other substrates without inducing cracks or other defects. The sapphire wafers can be reused for additional device growth.

“This approach for engineering GaN-based sensors is a key step in the pathway towards economically viable, flexible sensors with improved performances that could be integrated into wearable applications,” the authors wrote in their paper.

So far, the researchers have transferred the sensors to copper foil, aluminum foil and polymeric materials. In operation, the devices can differentiate between nitrogen oxide, nitrogen dioxide, and ammonia. Because the devices are approximately 100 by 100 microns, sensors for multiple gases can be produced on a single integrated device.

“Not only can we differentiate between these gases, but because the sensor is very small, we can detect them all at the same time with an array of sensors,” said Ougazzaden, who expects that the devices could be modified to also detect ozone, carbon dioxide and other gases.

The gallium nitride sensors could have a wide range of applications from industry to vehicle engines – and for wearable sensing devices. The devices are attractive because of their advantageous materials properties, which include high thermal and chemical stability.

“The devices are small and flexible, which will allow us to put them onto many different types of support,” said Ougazzaden, who also directs the International Joint Research Lab at Georgia Tech CNRS.

To assess the effects of transferring the devices to a different substrate, the researchers measured device performance on the original sapphire wafer and compared that to performance on the new metallic and polymer substrates. They were surprised to see a doubling of the sensor sensitivity and a six-fold increase in response time, changes beyond what could be expected by a simple thermal change in the devices.

“Not only can we have flexibility in the substrate, but we can also improve the performance of the devices just by moving them to a different support with appropriate properties,” he said. “Properties of the substrate alone makes the different in the performance.”

In future work, the researchers hope to boost the quality of the devices and demonstrate other sensing applications. “One of the challenges ahead is to improve the quality of the materials so we can extend this to other applications that are very sensitive to the substrates, such as high-performance electronics.”

The Georgia Tech researchers have previously used a similar technique to produce light-emitting diodes and ultraviolet detectors that were transferred to different substrates, and they believe the process could also be used to produce high-power electronics. For those applications, transferring the devices from sapphire to substrates with better thermal conductivity could provide a significant advantage in device operation.

Ougazzaden and his research team have been working on boron-based semiconductors since 2005. Their work has attracted visits from several industrial companies interested in exploring the technology, he said.

“I am very excited and lucky to work on such hot topic and top-notch technology at GT-Lorraine,” said Taha Ayari, a Ph.D. student in the Georgia Tech School of ECE and the paper’s first author.

In addition to Ougazzaden, the research team includes Georgia Tech Ph.D. students Taha Ayari, Matthew Jordan, Xin Li and Saiful Alam; Chris Bishop and Youssef ElGmili, researchers at Institut Lafayette; Suresh Sundaram, a researcher at Georgia Tech Lorraine; Gilles Patriarche, a researcher at the Centre de Nanosciences et de Nanotechnologies (C2N) at CNRS; Paul Voss, an associate professor in the Georgia Tech School of ECE; and Jean Paul Salvestrini, a professor at Georgia Tech Lorraine and adjunct professor in the Georgia Tech School of ECE.

The research was supported by ANR (Agence Nationale de Recherche), the National Agency of Research in France through the “GANEX” Project.

CITATION: Taha Ayari, et al., “Gas sensors boosted by two-dimensional h-BN enabled transfer on thin substrate foils: towards wearable and portable applications,” (Scientific Reports, 2017). http://dx.doi.org/10.1038/s41598-017-15065-6