Category Archives: Wafer Processing

IC Insights is in the process of completing its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published later this month.  Among the semiconductor industry data included in the new 400+ page report is an analysis of semiconductor merger and acquisition agreements.

The historic flood of merger and acquisition agreements that swept through the semiconductor industry in 2015 and 2016 slowed significantly in 2017 and then eased back further in 2018, but the total value of M&A deals reached in the last year was still nearly more than twice the annual average during the first half of this decade.  Acquisition agreements reached in 2018 for semiconductor companies, business units, product lines, and related assets had a combined value of $23.2 billion compared to $28.1 billion in 2017, based on data compiled by IC Insights.  The values of M&A deals struck in these years were significantly less than the record-high $107.3 billion set in 2015 (Figure 1).

Figure 1

The original 2016 M&A total of $100.4 billion was lowered by $41.1 billion to $59.3 billion because several major acquisition agreements were not completed, including the largest proposed deal ever in semiconductor history—Qualcomm’s planned purchase of NXP Semiconductor for $39 billion, which was raised to $44 billion before being canceled in July 2018.  Prior to the explosion of semiconductor acquisitions that erupted four years ago, M&A agreements in the chip industry had a total annual average value of $12.6 billion in the 2010-2014 timeperiod.

The two largest acquisition agreements in 2018 accounted for about 65% of the M&A total in the year.  In March 2018, fabless mixed-signal IC and power discrete semiconductor supplier Microsemi agreed to be acquired by Microchip Technology for $8.35 billion in cash.  Microchip said the purchase of Microsemi would boost its position in computing, communications, and wireless systems applications.  The transaction was completed in May 2018.  Fabless mixed-signal IC supplier Integrated Device Technology (IDT) agreed in September 2018 to be purchased by Renesas Electronics for $6.7 billion in cash.  Renesas believes the IDT acquisition will strengthen its position in automotive ICs for advanced driver-assistance systems and autonomous vehicles.  The IDT purchase is expected to be completed by June 2019.

Just two other semiconductor acquisition announcements in 2018 had values of more than $1 billion.  In October 2018, memory maker Micron Technology said it would exercise an option to acquire full ownership of its IM Flash Technology joint venture from Intel for about $1.5 billion in cash. Micron has started the process of buying Intel’s non-controlling interest in the non-volatile memory manufacturing and development joint venture, located in Lehi, Utah.  The transaction is expected to be completed in 2H19.  In September 2018, China’s largest contract manufacturer of smartphones, Wingtech Technology, began acquiring shares of Nexperia, a Dutch-based supplier of standard logic and discrete semiconductors that was spun out of NXP in 2017 with the financial backing of Chinese investors.   Wingtech launched two rounds of share purchases from the Chinese owners of Nexperia with a combined value of nearly $3.8 billion.  The company hopes to take majority ownership of Nexperia (about 76% of the shares) in 2019.

Worldwide PC shipments totaled 68.6 million units in the fourth quarter of 2018, a 4.3 percent decline from the fourth quarter of 2017, according to preliminary results by Gartner, Inc. For the year, 2018 PC shipments surpassed 259.4 million units, a 1.3 percent decline from 2017. Gartner analysts said there were signs for optimism in 2018, but the industry was impacted by two key trends.

“Just when demand in the PC market started seeing positive results, a shortage of CPUs (central processing units) created supply chain issues. After two quarters of growth in 2Q18 and 3Q18, PC shipments declined in the fourth quarter,” said Mikako Kitagawa, senior principal analyst at Gartner. “The impact from the CPU shortage affected vendors’ ability to fulfill demand created by business PC upgrades. We expect this demand will be pushed forward into 2019 if CPU availability improves.”

“Political and economic uncertainties in some countries dampened PC demand,” Ms. Kitagawa said. “There was even uncertainty in the U.S. — where the overall economy has been strong — among vulnerable buyer groups, such as small and midsize businesses (SMBs). Consumer demand remained weak in the holiday season. Holiday sales are no longer a major factor driving consumer demand for PCs.”

The top 3 vendors boosted their share of the global PC market as Lenovo, HP Inc. and Dell accounted for 63 percent of PC shipments in the fourth quarter of 2018, up from 59 percent in the fourth quarter of 2017 (see Table 1).

Lenovo surpassed HP Inc. to move into the No. 1 position in the global PC market in the fourth quarter of 2018. A major factor for Lenovo’s share gain was credited to a joint venture with Fujitsu formed in May 2018. Lenovo also had a strong quarter in the U.S. The company has recorded three consecutive quarters of double-digit year-over-year shipment growth, despite the stagnant overall market.

Table 1. Preliminary Worldwide PC Vendor Unit Shipment Estimates for 4Q18 (Thousands of Units)

Company 4Q18 Shipments 4Q18 Market Share (%) 4Q17 Shipments 4Q17 Market Share (%) 4Q18-4Q17 Growth (%)
Lenovo 16,628 24.2 15,697 21.9 5.9
HP Inc. 15,380 22.4 16,092 22.4 -4.4
Dell 10,915 15.9 10,763 15.0 1.4
Apple 4,920 7.2 5,112 7.1 -3.8
ASUS 4,211 6.1 4,716 6.6 -10.7
Acer Group 3,861 5.6 4,726 6.6 -18.3
Others 12,710 18.5 14,590 20.3 -12.9
Total 68,626 100.0 71,696 100.0 -4.3

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads (see “Market Definitions and Methodology: PCs, Ultramobiles and Mobile Phones”). All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.
Numbers may not add up to totals shown due to rounding.
*Lenovo’s results include Fujitsu units starting in 2Q18 to reflect the joint venture that closed in May 2018.

Source: Gartner (January 2019)

The fourth quarter of 2018 was a challenging one for HP Inc. The company experienced a shipment decline after four consecutive quarters of growth. HP Inc.’s shipments declined in most key regions, except Asia/Pacific and Japan. Dell registered positive growth as the company outperformed in EMEA and Japan, but it experienced a decline in Asia/Pacific and Latin America.

In the U.S., PC shipments totaled 14.2 million units in the fourth quarter of 2018, a 4.5 percent decline from the fourth quarter of 2017 (see Table 2). Four of the top six vendors experienced a decline in U.S. PC shipments in the fourth quarter of 2018. Lenovo’s growth was well above the U.S. average while Dell’s shipments increased slightly compared with a year ago. The overall decline in the U.S. was attributed to weak consumer demand despite holiday season sales as well as SMBs.

“The fourth quarter is typically a buying season for small office/home office (SOHO) and small business buyers in the U.S. as they want to use up the untouched budget before the tax year ends,” said Ms. Kitagawa. “Our early indicator showed that SOHO and small business buyers held off on some new PC purchases due to uncertainties around the political and economic conditions.”

Table 2. Preliminary U.S. PC Vendor Unit Shipment Estimates for 4Q18 (Thousands of Units)

Company 4Q18 Shipments 4Q18 Market Share (%) 4Q17 Shipments 4Q17 Market Share (%) 4Q18-4Q17 Growth (%)
HP Inc. 4,738 33.4 5,130 34.6 -7.6
Dell 3,645 25.7 3,613 24.3 0.9
Lenovo 2,150 15.2 1,743 11.7 23.4
Apple 1,762 12.4 1,800 12.1 -2.1
Microsoft 472 3.3 542 3.7 -12.9
Acer Group 458 3.2 587 4.0 -21.9
Others 953 6.7 1,430 9.6 -33.3
Total 14,178 100.0 14,843 100.0 -4.5

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.

Source: Gartner (January 2019)

PC shipments in EMEA totaled 20.9 million units in the fourth quarter of 2018, a 3.8 percent decline year over year. There were some positive signs, such as in Western Europe’s demand for desktops and ultramobiles that fueled SMB shipments, while the government sector also benefited from further Windows 10 renewals. Demand in Russia continued to recover, and some parts of Eastern Europe, such as the Czech Republic and Hungary. However, demand was not strong enough to offset declining shipments to consumers.

The Asia/Pacific PC market totaled 24.2 million units in the fourth quarter of 2018, a 4.6 percent decline from the fourth quarter of 2017. Due to uncertainties of the U.S.-China trade relations, and the volatile equity market, there was cautionary demand, especially among consumers and the SMB segment. In the fourth quarter of 2018, PC shipments in China declined 2.5 percent year over year, but shipments grew 5.6 percent sequentially.

Seventh Consecutive Year of Worldwide PC Shipment Decline

For the year, worldwide PC shipments totaled 259.4 million units in 2018, a 1.3 percent decrease from 2017 (see Table 3). This was the seventh consecutive year of global PC shipment decline, but it was less steep compared with the past three years.

“The majority of the PC shipment decline in 2018 was due to weak consumer PC shipments. Consumer shipments accounted for approximately 40 percent of PC shipments in 2018 compared with representing 49 percent of shipments in 2014,” Kitagawa said. “The market stabilization in 2018 was attributed to consistent business PC growth, driven by Windows 10 upgrade.”

Table 3. Preliminary Worldwide PC Vendor Unit Shipment Estimates for 2018 (Thousands of Units)

Company 2018

Shipments

 2018 Market

Share (%)

 2017

Shipments

 2017 Market Share (%) 2018-2017 Growth (%)
Lenovo 58,467 22.5 54,669 20.8 6.9
HP Inc. 56,332 21.7 55,179 21.0 2.1
Dell 41,911 16.2 39,793 15.1 5.3
Apple 18,016 6.9 18,963 7.2 -5.0
Acer Group 15,729 6.1 17,087 6.5 -7.9
ASUS 15,537 6.0 17,952 6.8 -13.5
Others 53,393 20.6 59,034 22.5 -9.6
Total 259,385 100.0 262,676 100.0 -1.3

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.

Source: Gartner (January 2019)

These results are preliminary. Final statistics will be available soon to clients of Gartner’s PC Quarterly Statistics Worldwide by Region program. This program offers a comprehensive and timely picture of the worldwide PC market, allowing product planning, distribution, marketing and sales organizations to keep abreast of key issues and their future implications around the globe.

The absorption of light in semiconductor crystals without inversion symmetry can generate electric currents. Researchers at the Max Born Institute have now generated directed currents at terahertz (THz) frequencies, much higher than the clock rates of current electronics. They show that electronic charge transfer between neighboring atoms in the crystal lattice represents the underlying mechanism.

Solar cells convert the energy of light into an electric direct current (DC) which is fed into an electric supply grid. Key steps are the separation of charges after light absorption and their transport to the contacts of the device. The electric currents are carried by negative (electrons) and positive charge carriers (holes) performing so called intraband motions in various electronic bands of the semiconductor. From a physics point of view, the following questions are essential: what is the smallest unit in a crystal which can provide a photo-induced direct current (DC)? Up to which maximum frequency can one generate such currents? Which mechanisms at the atomic scale are responsible for such charge transport?

(a) Unit cell of the semiconductor gallium arsenide (GaAs). Chemical bonds (blue) connect every Ga atom to four neighboring As atoms and vice versa. Valence electron density in the grey plane of (a) in the (b) ground state (the electrons are in the valence band) and in the (c) excited state (electrons are in the conduction band). Apart from the valence electrons shown, there are tightly bound electrons near the nuclei. Credit: MBI Berlin

The smallest unit of a crystal is the so-called unit cell, a well-defined arrangement of atoms determined by chemical bonds. The unit cell of the prototype semiconductor GaAs is shown in Figure 1a and represents an arrangement of Ga and As atoms without a center of inversion. In the ground state of the crystal represented by the electronic valence band, the valence electrons are concentrated on the bonds between the Ga and the As atoms (Figure 1b). Upon absorption of near-infrared or visible light, an electron is promoted from the valence band to the next higher band, the conduction band. In the new state, the electron charge is shifted towards the Ga atoms (Figure 1b). This charge transfer corresponds to a local electric current, the interband or shift current, which is fundamentally different from the electron motions in intraband currents. Until recently, there has been a controversial debate among theoreticians whether the experimentally observed photo-induced currents are due to intraband or interband motions.

Researchers at the Max Born Institute in Berlin, Germany, have investigated optically induced shift currents in the semiconductor gallium arsenide (GaAs) for the first time on ultrafast time scales down to 50 femtoseconds (1 fs = 10 to the power of -15 seconds). They report their results in the current issue of the journal Physical Review Letters 121, 266602 (2018) . Using ultrashort, intense light pulses from the near infrared (λ = 900 nm) to the visible (λ = 650 nm, orange color), they generated shift currents in GaAs which oscillate and, thus, emit terahertz radiation with a bandwidth up to 20 THz (Figure 2). The properties of these currents and the underlying electron motions are fully reflected in the emitted THz waves which are detected in amplitude and phase. The THz radiation shows that the ultrashort current bursts of rectified light contain frequencies which are 5000 times higher than the highest clock rate of modern computer technology.

The properties of the observed shift currents definitely exclude an intraband motion of electrons or holes. In contrast, model calculations based on the interband transfer of electrons in a pseudo-potential band structure reproduce the experimental results and show that a real-space transfer of electrons over the distance on the order of a bond length represents the key mechanism. This process is operative within each unit cell of the crystal, i.e., on a sub-nanometer length scale, and causes the rectification of the optical field. The effect can be exploited at even higher frequencies, offering novel interesting applications in high frequency electronics.

Brooks Instrument, a developer of advanced flow, pressure, vacuum and vapor delivery solutions, has licensed its direct liquid injection (DLI) vaporizer technology to Ceres Technologies, Inc., headquartered in Saugerties, NY.

The Brooks Instrument DLI vaporizer incorporates unique atomization and heat exchanger technologies to deliver pure vapor for a wide range of processes, including chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD) and atomic layer deposition (ALD). This unique technology has been applied successfully for more than a decade for precise vaporization of a wide range of liquids and liquid precursors. It overcomes the weaknesses of flash vaporizers, which can include thermal decomposition and incomplete vaporization.

Ceres Technologies is a global manufacturer of ultra-high purity gas, vapor and liquid delivery solutions for the semiconductor, compound semiconductor, fiber optic and solar industries. Ceres’ products include gas cabinets, gas blending systems, valve manifold boxes (VMBs) and vapor delivery systems.Ceres’ bulk/centralized vapor delivery systems, such as its VaporGen products based on patented SMR (self-metering reservoir) flash evaporators, and VaporStation™ products based on patented smart bubbler technology, have been used in fabs for more than a decade.

“Ceres’ extensive fluid delivery experience and their broad range of vaporization solutions will continue to expand the market for Brooks Instrument flow control technology,” said Jarek Pisera, Semiconductor Business Unit Manager at Brooks Instrument. “With their system integration capabilities, Ceres is in the unique position of providing customized turnkey solutions for OEMs as well as end-users.”

The Brooks Instrument Quantim™ Coriolis liquid mass flow controller and GF100 Series gas mass flow controller are provided in conjunction with the DLI vaporizer for precise mass flow measurement with fast-response “vapor on demand.”

“Brooks Instrument products are known worldwide for their precision, quality and reliability,” added Kevin Brady, President of Ceres Technologies. “Ceres has incorporated Brooks Instrument products into many of our present product designs. Licensing their DLI vaporizer technology is a key component as we expand our vapor delivery product line into newer liquid precursors.”

It’s chilly!


January 16, 2019

By Walt Custer

4Q’18 World Electronic Supply Chain – Slowing Electronic Equipment Growth

Custer Consulting Group has its first estimate of global electronic equipment growth in 4Q’18 vs. 4Q’17. Chart 1 compares the combined sales of a 213-company OEM composite to regional electronic equipment shipments. The composite is based on individual company financial reports. While fourth-quarter results for this group won’t be available until February, the regional model (driven by early reported Taiwan/China results) points to world electronic end market growth declining from +10% in 3Q’18 vs. 3Q’17 to +2% in 4Q’18 vs. 4Q’17.

These results are still preliminary, but Chart 1 gives an early indication of the magnitude and trajectory of slowing electronic equipment growth.

Chart 2 shows consolidated monthly sales from our regional electronic equipment model where December 2018 global revenues declined 1.8% vs. December 2017 and were down 0.9% sequentially vs. November 2018. Note the very predictable seasonality and the apparent “peaking” of 2018 sales in November – with a likely sharp drop in early 2019.

Sources: Company financial reports and USA, Europe, Japan, China/Taiwan and South Korea regional data as analyzed by Custer Consulting Group.

Wafer Foundry Sales – Leading Indicator for Semiconductors and Semiconductor Equipment

December monthly sales have been reported by Taiwan-listed wafer fabs.

  • Wafer foundry revenues dropped in December, suggesting a coming decline in global semiconductor and semiconductor equipment shipments (Chart 3). Foundry sales have historically been a leading indicator for both chips and semiconductor equipment.

  • Taiwan wafer foundry revenues, world semiconductor sales and the Global Purchasing Managers Index 3/12 growth rates all point to further slowing ahead (Chart 4).

Source: Company financial reports

Semiconductor Industry Business Cycles

Semiconductor shipment growth (although still positive) peaked in early 2018 (Chart 5).  Globally it was up only 4.6% in November 2018 versus the same month a year earlier and its trajectory is pointing down. This compares to +23.7% growth in December 2017.

Semiconductor equipment shipments (Chart 6) actually contracted 0.6% globally for just the month of November 2018 vs. November 2017. They are traditionally more volatile than semiconductor sales.

The normal winter seasonal industry slowdown is upon us and it is being overlaid with economic softness, political uncertainty, product (memory) shifts and general industry weakening.

Walt Custer of Custer Consulting Group is an analyst focused on the global electronics industry. He can be reached at [email protected].

IC Insights is in the process of completing its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published later this month.  Among the semiconductor industry data included in the new 400+ page report is an analysis of the top-50 semiconductor suppliers.

Research included in the new McClean Report shows that the world’s leading semiconductor suppliers significantly increased their marketshare over the past decade.  The top 5 semiconductor suppliers accounted for 47% of the world’s semiconductor sales in 2018, an increase of 14 percentage points from 10 years earlier (Figure 1).  In total, the 2018 top 50 suppliers represented 89% of the total $514.0 billion worldwide semiconductor market last year, up seven percentage points from the 82% share the top 50 companies held in 2008.

As shown, the top 5, top 10, and top 25 companies’ share of the 2018 worldwide semiconductor market increased 14, 15, and 11 percentage points, respectively, as compared to 10 years earlier in 2008.  With additional mergers and acquisitions expected over the next few years, IC Insights believes that the consolidation could raise the shares of the top suppliers to even loftier levels.

There was a wide 66-percentage point range of year-over-year growth rates among the top 50 semiconductor suppliers last year, from +56% for Nanya to -10% for Fujitsu.  Nanya rode a surge of demand for its DRAM devices to post its great full-year results.  However, evidence of a cool down in the memory market last year was evident in the company’s quarterly sales results, which saw its sales drop from $826 million in 2Q18 to $550 million in 4Q18 (a 33% plunge).  Overall, four of the top seven growth companies last year—Nanya, SK Hynix, Micron, and Samsung—were major memory suppliers.  Although Nanya registered the highest percentage increase, Samsung had the largest dollar volume semiconductor sales increase, a whopping one-year jump of $17.0 billion!

In total, only nine of the top 50 companies registered better growth as compared to the 2018 worldwide semiconductor market increase of 16%, with five companies logging increases of ≥30%.  In contrast, only three of the top 50 semiconductor companies logged a decline in sales last year, with Fujitsu being the only company to register a double-digit sales drop.

Figure 1

LED lights and monitors, and quality solar panels were born of a revolution in semiconductors that efficiently convert energy to light or vice versa. Now, next-generation semiconducting materials are on the horizon, and in a new study, researchers have uncovered eccentric physics behind their potential to transform lighting technology and photovoltaics yet again.

Comparing the quantum properties of these emerging so-called hybrid semiconductors with those of their established predecessors is about like comparing the Bolshoi Ballet to jumping jacks. Twirling troupes of quantum particles undulate through the emerging materials, creating, with ease, highly desirable optoelectronic (light-electronic) properties, according to a team of physical chemists led by researchers at the Georgia Institute of Technology.

Laser light in the visible range is processed for use in the testing of quantum properties in materials in Carlos Silva’s lab at Georgia Tech. Credit: Georgia Tech / Rob Felt

These same properties are impractical to achieve in established semiconductors.

The particles moving through these new materials also engage the material itself in the quantum action, akin to dancers enticing the floor to dance with them. The researchers were able to measure patterns in the material caused by the dancing and relate them to the emerging material’s quantum properties and to energy introduced into the material.

These insights could help engineers work productively with the new class of semiconductors.

Unusually flexible semiconductors

The emerging material’s ability to house diverse, eccentric quantum particle movements, analogous to the dancers, is directly related to its unusual flexibility on a molecular level, analogous to the dancefloor that joins in the dances. By contrast, established semiconductors have rigid, straight-laced molecular structures that leave the dancing to quantum particles.

The class of hybrid semiconductors the researchers examined is called halide organic-inorganic perovskite (HOIP), which will be explained in more detail at bottom along with the “hybrid” semiconductor designation, which combines a crystal lattice — common in semiconductors — with a layer of innovatively flexing material.

Beyond their promise of unique radiance and energy-efficiency, HOIPs are easy to produce and apply.

Paint them on

“One compelling advantage is that HOIPs are made using low temperatures and processed in solution,” said Carlos Silva, a professor in Georgia Tech’s School of Chemistry and Biochemistry. “It takes much less energy to make them, and you can make big batches.” Silva co-led the study alongside Ajay Ram Srimath Kandada from Georgia Tech and the Istituto Italiano di Tecnologia.

It takes high temperatures to make most semiconductors in small quantities, and they are rigid to apply to surfaces, but HOIPs could be painted on to make LEDs, lasers or even window glass that could glow in any color from aquamarine to fuchsia. Lighting with HOIPs may require very little energy, and solar panel makers could boost photovoltaics’ efficiency and slash production costs.

The team led by Georgia Tech included researchers from the Université de Mons in Belgium and the Istituto Italiano di Tecnologia. The results were published on January 14, 2019, in the journal Nature Materials. The work was funded by the U.S. National Science Foundation, EU Horizon 2020, the Natural Sciences and Engineering Research Council of Canada, the Fond Québécois pour la Recherche, and the Belgian Federal Science Policy Office.

Quantum jumping jacks

Semiconductors in optoelectronic devices can either convert light into electricity or electricity into light. The researchers concentrated on processes connected to the latter: light emission.

The trick to getting a material to emit light is, broadly speaking, to apply energy to electrons in the material, so that they take a quantum leap up from their orbits around atoms then emit that energy as light when they hop back down to the orbits they had vacated. Established semiconductors can trap electrons in areas of the material that strictly limit the electrons’ range of motion then apply energy to those areas to make electrons do quantum leaps in unison to emit useful light when they hop back down in unison.

“These are quantum wells, two-dimensional parts of the material that confine these quantum properties to create these particular light emission properties,” Silva said.

Imaginary particle excitement

There is a potentially more attractive way to produce the light, and it is a core strength of the new hybrid semiconductors.

An electron has a negative charge, and an orbit it vacates after having been excited by energy is a positive charge called an electron hole. The electron and the hole can gyrate around each other forming a kind of imaginary particle, or quasiparticle, called an exciton.

“The positive-negative attraction in an exciton is called binding energy, and it’s a very high-energy phenomenon, which makes it great for light emitting,” Silva said.

When the electron and the hole reunite, that releases the binding energy to make light. But usually, excitons are very hard to maintain in a semiconductor.

“The excitonic properties in conventional semiconductors are only stable at extremely cold temperatures,” Silva said. “But in HOIPs the excitonic properties are very stable at room temperature.”

Ornate quasiparticle twirling

Excitons get freed up from their atoms and move around the material. In addition, excitons in an HOIP can whirl around other excitons, forming quasiparticles called biexcitons. And there’s more.

Excitons also spin around atoms in the material lattice. Much the way an electron and an electron hole create an exciton, this twirl of the exciton around an atomic nucleus gives rise to yet another quasiparticle called a polaron. All that action can result in excitons transitioning to polarons back. One can even speak of some excitons taking on a “polaronic” nuance.

Compounding all those dynamics is the fact that HOIPs are full of positively and negatively charged ions. The ornateness of these quantum dances has an overarching effect on the material itself.

Wave patterns resonate

The uncommon participation of atoms of the material in these dances with electrons, excitons, biexcitons and polarons creates repetitive nanoscale indentations in the material that are observable as wave patterns and that shift and flux with the amount of energy added to the material.

“In a ground state, these wave patterns would look a certain way, but with added energy, the excitons do things differently. That changes the wave patterns, and that’s what we measure,” Silva said. “The key observation in the study is that the wave pattern varies with different types of excitons (exciton, biexciton, polaronic/less polaronic).”

The indentations also grip the excitons, slowing their mobility through the material, and all these ornate dynamics may affect the quality of light emission.

Rubber band sandwich

The material, a halide organic-inorganic perovskite, is a sandwich of two inorganic crystal lattice layers with some organic material in between them – making HOIPs an organic-inorganic hybrid material. The quantum action happens in the crystal lattices.

The organic layer in between is like a sheet of rubber bands that makes the crystal lattices into a wobbly but stable dancefloor. Also, HOIPs are put together with many non-covalent bonds, making the material soft.

Individual units of the crystal take a form called perovskite, which is a very even diamond shape, with a metal in the center and halogens such as chlorine or iodine at the points, thus “halide.” For this study, the researchers used a 2D prototype with the formula (PEA)2PbI4.

By Christian G. Dieseldorff

This year, SEMI ISS covered it all – from a high-level semiconductor market and global geopolitical overview down to the neuro morphic and quantum level. Here are key takeaways from the Day 1 keynote and Economic Trends and Market Perspectives presentations.

In the opening keynote, Anne Kelleher from Intel pointed to the huge growth of data, with fabs collecting more than 5 billion sensor data points each day. The challenge, Kelleher noted, is to turn massive amounts of data into valuable information. Moore’s law is not dead. New models of computing benefit still from Moore’s law and advances in Si/CMOS technologies for conventional, deep learning, neuro morphic and quantum computing.

With customers expecting continual improvements in applications, the question is whether the chip industry is moving fast enough to meet these expectations, Kelleher said. A broad supply chain, equipment and materials innovations, and attracting the “best of the best” college graduates to fuel innovation is key, she said.

In the economic trends session, Nicholas Burns (ambassador ret.) from Harvard University pointed out that we will see a major shift in power. The U.S. will remain the major world power over the next 10 years, but we will see a major shift in power in the next coming decades as the gap with countries like China, Russia and India continues to narrow.

Duncan Meldrum from Hilltop Economics said that we are passing the peak growth of economic cycle. He warns that a more likely outlook is that a global growth recession is developing. Although semiconductor MSI growth will see a noticeable slowdown in 2019 and 2020, the semiconductor industry is still healthy over the longer term.

Bob Johnson from Gartner sees demand shifting from consumer to commercial applications with higher ROIs and budgets. AI, IoT and 5D are the major enablers. He sees structural changes in the semiconductor industry especially for memory but also for Moore’s law with increasing costs and fewer players.

The DRAM markets shows volatility and NAND market may be negative in 2019 but non-memory are expected to accelerate mainly because of increasing content and some price hikes.

Overall Gartner expects good long-term growth with a CAGR (2017 to 2022) of 5.1%, outpacing 2011 to 2016 CAGR of 2.6%. After a strong 2018 with 13.4% revenue, he forecasts a slower 2019 with 2.6% growth followed by a 8% growth in 2020 and negative growth rate in 2021.

Andrea Lati of VLSI went “Back to fundamentals” in his presentation about the industry. VLSI sees a downside bias due to slowing global economy, tariffs, and trade wars. Future drivers are data economy, cloud, AI and automotive.

As memory leads the 2019 slowdown, analog, power, logic and other sectors remain in positive territory. VLSI lowered its semiconductor equipment forecast for 2018 from 20% (Jan. 2018) to 14% (Dec. 2018) but increased its sales outlook from 8% to 15% in 2018. VLSI expects revenue to slow into the first half of 2019 but increase to over 4% in the second half of the year, resulting in total 2019 drop of 2.7%. Semiconductor equipment sales are expected to drop from 14% in 2018 to -10% in 2019.

Michael Corbett of Linz Consulting, covering wafer fab materials in the years of 3D scaling, sees these as good times for the industry. His outlook for wafer fab materials is bullish based on strong MSI and because wafer fab materials suppliers are getting bigger because of M&As.

In the Market Perspective session, Sujeet Chand of Rockwell Automation pointed out that as more and more data is generated, the problem is how to get value of all the data collected. There is a need to create the right architecture for machine learning and AI and big data is increasingly being replaced by contextual/structured data. He expects Industry 4.0 to drive foundries to become smaller, more flexible and more productive.

In the Technology and Manufacturing session, Aki Sekiguchi of TEL addressed process challenges in the age of co-optimization. The semiconductor industry continues to expand, driven by massive growth of interconnected devices, with heavy demand for processing power and storage. He expects an exponential increase of data from about 40ZB in 2018 to 50ZB in 2020 to 163 ZB in 2026.

Major technologies such as DRAM, 3D NAND and logic are dealing with scaling challenges. The density of DRAM (Mb/chip) is plateauing according to 2015 to 2020 trend data, with DRAM is in need of EUV. Memory capacity demand is leading to increasing layers and higher aspect ratios that is concern for 3D NAND and mainly for plasma etch. With Logic already implementing 3D structures, it appears to be in a solid position.

Buddy Nicoson of Micron talked about his 50 years in the industry and looked ahead to the next 50. The anchors – quality, cost, scale and speed – won’t change. It has been a great journey so far with unprecedented opportunities and challenges ahead of us. We are getting into a convergence (specialization, integration) and solution-based phase. We will see some inflection points in the coming years, with the best yet to come.

Christian G. Dieseldorff is senior principal analyst in the Industry Research and Analysis group at SEMI in California.

This story first appeared on the SEMI blog.

SIA today filed comments to the Department of Commerce Bureau of Industry and Security (BIS) in response to an advanced notice of proposed rulemaking of controls for “emerging” technologies. In accordance with requirements of the Export Control Reform Act of 2018 (ECRA), enacted into law as part of the defense authorization bill, BIS is required to establish export controls on certain “emerging and foundational technologies.” The SIA comments respond to the request for comments on “emerging” technologies, and we expect BIS to commence a separate rulemaking on “foundational” technologies sometime this year.

Maintaining a strong U.S. semiconductor industry is critical to our country’s economic and national security. Semiconductors are America’s fourth-largest export, and the semiconductor industry has a highly complex, specialized, and geographically widespread global supply chain. For these reasons, it is important for government and industry to work together to ensure U.S. export control policies both enhance our national security and continue to allow the U.S. semiconductor industry to grow and innovate. SIA has long collaborated with the U.S. government to support reforms and modernization of export control policy, particularly with respect to semiconductors.

The SIA comments outline the statutory framework set forth in ECRA and call on BIS to carefully consider each of the factors set forth in the statute in crafting narrowly tailored controls on emerging technologies. Among other things, ECRA calls on BIS to consider controls only on technologies essential to national security, whether these technologies are exclusive to the U.S. or are available from foreign sources, and the effectiveness of proposed controls. It also directs BIS to consider the impact of unilateral controls on specified technologies on domestic research and development and the economy as a whole. SIA’s comments provide detailed recommendations on how BIS can best implement these statutory mandates.

We are confident BIS, by following the statutory criteria set forth in ECRA and considering the input of affected stakeholders, will enhance national security while at the same time enabling the semiconductor industry in the U.S. to grow and innovate.

When German mineralogist Gustav Rose stood on the slopes of Russia’s Ural Mountains in 1839 and picked up a piece of a previously undiscovered mineral, he had never heard of transistors or diodes or had any concept of how conventional electronics would become an integral part of our daily lives. He couldn’t have anticipated that the rock he held in his hand, which he named “perovskite,” could be a key to revolutionizing electronics as we know them.

In 2017, University of Utah physicist Valy Vardeny called perovskite a “miracle material” for an emerging field of next-generation electronics, called spintronics, and he’s standing by that assertion. In a paper published today in Nature Communications, Vardeny, along with Jingying Wang, Dali Sun (now at North Carolina State University) and colleagues present two devices built using perovskite to demonstrate the material’s potential in spintronic systems. Its properties, Vardeny says, bring the dream of a spintronic transistor one step closer to reality.

The full study can be found here.

Spintronics

A conventional digital electronic system conveys a binary signal (think 1s and 0s) through pulses of electrons carried through a conductive wire. Spintronics can convey additional information via another characteristic of electrons, their spin direction (think up or down). Spin is related to magnetism. So spintronics uses magnetism to align electrons of a certain spin, or “inject” spin into a system.

If you’ve ever done the old science experiment of turning a nail into a magnet by repeatedly dragging a magnet along its length, then you’ve already dabbled in spintronics. The magnet transfers information to the nail. The trick is then transporting and manipulating that information, which requires devices and materials with finely tuned properties. Researchers are working toward the milestone of a spin transistor, a spintronics version of the electronic components found in practically all modern electronics. Such a device requires a semiconductor material in which a magnetic field can easily manipulate the direction of electrons’ spin–a property called spin-orbit coupling. It’s not easy to build such a transistor, Wang says. “We keep searching for new materials to see if they’re more suitable for this purpose.”

Here’s where perovskites come into play.

Perovskites

Perovskites are a class of mineral with a particular atomic structure. Their value as a technological material has only became apparent in the past 10 years. Because of that atomic structure, researchers have been developing perovskite into a material for making solar panels. By 2018 they’d achieved an efficiency of up to 23 percent of solar energy converted to electrical energy–a big step up from 3.8 percent in 2009.

In the meantime, Vardeny and his colleagues were exploring the possibilities of spintronics and the various materials that could prove effective in transmitting spin. Because of heavy lead atoms in perovskite, physicists predicted that the mineral may possess strong spin-orbit coupling. In a 2017 paper, Vardeny and physics assistant professor Sarah Li showed that a class of perovskites called organic-inorganic hybrid perovskites do indeed possess large spin-orbit coupling. Also, the lifetime of spin injected into the hybrid materials lasted a relatively long time. Both results suggested that this kind of hybrid perovskite held promise as a spintronics material.

Two spintronic devices

The next step, which Vardeny and Wang accomplished in their recent work, was to incorporate hybrid perovskite into spintronic devices. The first device is a spintronic light-emitting diode, or LED. The semiconductor in a traditional LED contains electrons and holes–places in atoms where electrons should be, but aren’t. When electrons flow through the diode, they fill the holes and emit light.

Wang says that a spintronic LED works much the same way, but with a magnetic electrode, and with electron holes polarized to accommodate electrons of a certain spin.  The LED lit up with circularly polarized electroluminescence, Wang says, showing that the magnetic electrode successfully transferred spin-polarized electrons into the material.

“It’s not self-evident that if you put a semiconductor and a ferromagnet together you get a spin injection,” Vardeny adds. “You have to prove it. And they proved it.”

The second device is a spin valve. Similar devices already exist and are used in devices such as computer hard drives. In a spin valve, an external magnetic field flips the polarity of magnetic materials in the valve between an open, low-resistance state and a closed, high-resistance state.

Wang and Vardeny’s spin valve does more. With hybrid perovskite as the device material, the researchers can inject spin into the device and then cause the spin to precess, or wobble, within the device using magnetic manipulation.

That’s a big deal, the researchers say. “You can develop spintronics that are not only useful for recording information and data storage, but also calculation,” Wang says. “That was an initial goal for the people who started the field of spintronics, and that’s what we are still working on.”

Taken together, these experiments show that perovskite works as a spintronic semiconductor. The ultimate goal of a spin-based transistor is still several steps away, but this study lays important groundwork for the path ahead.

“What we’ve done is to prove that what people thought was possible with perovskite actually happens,” Vardeny says. “That’s a big step.”