Category Archives: Wafer Processing

Total wafer demand is expected to return to historical growth rates over the next five years. However, what is uncharacteristic of the past is the wide range of decline and growth that will be logged by specific product categories and technologies. Semico’s recent report Semico Wafer Demand Model Update Q3 2016 indicates that the compound annual growth rates by detailed product breakouts range from a -4.1% decrease all the way up to 11.3% growth, exemplifying the diverse applications within the semiconductor industry.

“The products experiencing growth or decline have a significant impact on the need for certain types of production capacity such as 200mm versus 300mm; logic, memory or other; and advanced versus mature process technology”, says Joanne Itow, Managing Director Manufacturing for Semico. “The process technologies covered in wafer demand model ranges from >1000nm down to 7nm.”

Key findings include:

* Semiconductor revenues are expected to fall 2.5% in 2016
* Total wafer demand in 2016 is expected to exceed 100 million 300mm wafer equivalents
* The main reason for the increase in wafer demand in 2016 is due to continued increases in Other MOS Logic (Automotive, Consumer, Audio, etc.), NAND, DRAM, Discretes/Sensors and Optoelectronics
* DRAM chip revenue is expected to decline 14.7% in 2016
Semico Research’s report, Semico Wafer Demand Model Update Q3 2016, study number MA112-16 , includes an excel spreadsheet which provides wafer demand by 18 product categories and 14 technology nodes over a 10 year time frame from 2010 to 2020. There is also a summary write-up which provides insight into the recent changes compared to the previous quarter.

Other data contained in the report:
* Wafer demand by product (discrete/sensor, Opto, Analog, Communications, MCU, MPU, DRAM, NAND, NOR, SRAM, etc.) by process node (≥1000nm-7nm)
* Silicon wafer shipments from 2010-2020

Astronics Corporation (NASDAQ:ATRO), a supplier of advanced technologies and products to the global aerospace, defense, and semiconductor industries, announced that it has appointed three new independent directors to its Board: Jeffry D. Frisby, Warren C. Johnson and Neil Kim.  The appointments expand the Board to nine directors, eight of whom are independent.

Kevin T. Keane, Chairman of the Board, commented, “We are fortunate to add directors that bring such extensive experience in leading world-class aerospace and semiconductor companies.  Jeff, Warren and Neil each bring unique talents and valuable perspectives to our already strong board.  The expansion of the Board is critical to our succession plan and provides for necessary continuity to support Astronics’ continued success.”

Jeff Frisby, age 60, brings significant aerospace experience spanning nearly 40 years.  He spent 17 years with Triumph Group, Inc. (NYSE:TGI), a global company that designs, engineers, manufacturers, repairs and overhauls a broad portfolio of aerostructures, aircraft components, accessories, subassemblies and systems, as President and CEO and prior to that as President of the Aerospace Systems Group.  He began his career at Frisby Aerospace, which was later acquired by Triumph.  Mr. Frisby currently serves on the board of Quaker Chemical Corporation (NYSE:KWR).  He is a graduate of the Wayne Calloway School of Business and Accountancy at Wake Forest University, where he earned a Bachelor of Science degree in Business.

Warren C. Johnson, age 57, brings noteworthy aerospace experience from his 33-year career at Moog Inc., a worldwide manufacturer of precision control components and systems.  Prior to his retirement, Mr. Johnson was President of the Moog Aircraft Group.  He began his career as a Development Engineer and held various positions of increasing responsibility, leading Moog’s efforts to streamline aerospace product development cycle time and lean activities.  Mr. Johnson holds Bachelor of Science and Master of Science degrees in Mechanical Engineering from The Ohio State University.  He completed a Sloan Fellows M.B.A. at the Massachusetts Institute of Technology.

Neil Kim, age 58, was with Broadcom Corporation, a developer of semiconductor solutions for wired and wireless communications, since 2000 and held progressively advanced positions of responsibility until its acquisition in January 2016.  He retired as Executive Vice President, Operations and Central Engineering, and was responsible for the company’s global manufacturing, including foundry operations, supply chain management and corporate procurement operations.  Prior to Broadcom, he held a variety of senior technical, research and development engineering positions with Western Digital Corporation and Micropolis Corporation.  Mr. Kim is named as inventor on 33 patents, previously served as a director for the Global Semiconductor Alliance and currently is a member of the Board of Directors for Silicon Laboratories Inc., (NASDAQ:SLAB), Signetics Korea (KOSDAQ:033170) and Korea Circuit Co. LTD (KS:007810).  He received a Bachelor of Science in Electrical Engineering and Computer Science from the University of California, Berkeley.

200mm fabs on the rise


October 11, 2016

One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has issued an October 2016 update, with the improved and expanded report forecasting 200mm fab trends out to 2020.  This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity have changed worldwide.  SEMI’s analysts updated information on almost 200 facilities, including new facilities and closures of existing facilities.

Examining 200mm capacity over the years, the highest level of 200mm capacity was recorded in 2007 and the lowest following this peak in 2009 (see figure). The capacity decline from 2007 to 2009 was driven by the 2008/2009 global financial crisis, which caused the closure of many facilities, and the transition of memory and MPU fabrication to 300mm fabs from 200mm.

Global_200mm_chart_700px

Since 2009, installed 200mm fab capacity has increased, and by 2020, 200mm capacity is expected to reach 5.5 million wafers per month (wpm), though still less than the 2007 peak.  According to SEMI’s data, by 2019, installed capacity will reach close to 5.38 million wpm, almost as high as capacity in 2006.  From 2015 to 2020, 200mm facilities are forecast to add 618,000 wpm net capacity. This increase is a combination of fabs adding capacity and fabs losing capacity

Two applications account for the growing demand for 200mm: mobile devices and IoT. Rising fab capacity from 2015 to 2020 will be driven by MEMS devices, Power, Foundry and Analog.  By region, the greatest increases in capacity are expected to be in China, Southeast Asia, Americas, and Taiwan. Another trend is also observed: 200mm fabs are increasing the capacity to provide process capability below 120nm. Higher capacity does not mean more fabs, but fewer, larger fabs. In fact, the number of fabs in 2020 is almost the same as the count seen in 2009.  So 2020 capacity heads toward industry highs while in comparison 2009 had the lowest levels off the 2007 peak.

The Global 200mm Fab Outlook to 2020, published by SEMI in October 2016, includes two files: a 92-page pdf file featuring trend charts, tables and summaries and an Excel file covering 2009 to 2020 detailing on quarterly basis and fab-by-fab developments.

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the move of its United Kingdom (UK) team into a larger office facility. Located in Theale, this new office quadruples the working area and laboratory space to better accommodate the UK team’s 90-percent growth since the Murata acquisition in Dec. 2014.

“Our team had outgrown our old facility—both in seating capacity and in lab space to accommodate new product development—and it was time to move into a larger office,” says Mark Moffat, managing director of Peregrine Semiconductor Europe. “Our new ‘home’ not only better suits our current team, but it has the capacity for our projected growth. With a prime location in the Thames Valley, we are able to tap into the abundance of talent in this region and build a team that is driving Peregrine’s growth in areas like 5G and power management.”

Peregrine’s new UK office is located in the heart of the Thames Valley at 1420 Arlington Business Park in Theale, Berkshire. The 4,600-square-foot office includes two fully equipped laboratories.

A global company, Peregrine’s corporate headquarters are in San Diego, Calif. In addition to the Theale office, Peregrine has offices in Arlington Heights, Illinois; Seongnam-si, South Korea; and Shanghai, China.

Enormous financial and technology hurdles continue to plague the development of 450mm wafers. Ambitious goals to put 450mm wafers to use have been scaled back.  IC manufacturers are instead maximizing their manufacturing efficiency using 300mm and 200mm wafers.  IC Insights’ Global Wafer Capacity 2016-2020 report shows that worldwide capacity by wafer size was dominated by 300mm wafers in 2015 and is forecast to continue increasing through 2020 (Figure 1).

Figure 1

Figure 1

  • 300mm wafers represented 63.1% of worldwide capacity at the end of 2015 and are forecast to increase to about 68% by the end of 2020.
  • The share of the industry’s monthly wafer capacity represented by 200mm wafers is expected to drop from 28.3% in 2015 to 25.3% in 2020. But, 200mm wafer capacity is predicted to increase every year over the next several years.
  • Capacity for wafers of ≤150mm diameter is forecast to remain relatively flat during the forecast period.

The number of 300mm wafer fabrication facilities in operation is forecast to keep increasing through 2020 (Figure 2). For the most part, 300mm fabs are, and will continue to be, limited to production of high-volume, commodity-type devices like DRAMs and flash memories; image sensors and power management devices; and complex logic and microcomponent ICs with large die sizes; and by foundries, which can fill a 300mm fab by combining wafer orders from many sources.

Figure 2

Figure 2

  • The number of active volume-production 300mm fabs declined for the first time in 2013. A few fabs that were scheduled to open in 2013 were delayed until 2014. In addition, two large 300mm fabs owned by ProMOS closed in 2013.
  • At the end of 2015, there were 95 production-class IC fabs utilizing 300mm wafers (there are numerous R&D IC fabs and a few high-volume fabs around the globe that make “non-IC” products using 300mm wafers, but these are not included in the count).
  • Currently, there are eight 300mm wafer fabs scheduled to open in 2017, which would be the highest number in one year since 2014 when nine were added.
  • By the end of 2020 there are expected to be 22 more fabs in operation, bringing the total number of 300mm fabs used for IC fabrication to 117. The peak number of 300mm fabs may be somewhere around 125. For comparison, the most volume-production 200mm wafer fabs in operation was 210 (in December 2015 there were 148).

KLA-Tencor Corporation (NASDAQ:  KLAC) and Lam Research Corp. (NASDAQ:  LRCX) today announced that they have agreed to terminate their proposed merger agreement. The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating. No termination fees will be payable by either the Company or Lam Research in connection with the termination of the Merger Agreement.

“Although we are disappointed with this outcome, KLA-Tencor’s performance over the past several quarters demonstrates the Company is executing our strategies at a high level and creating compelling value for the industry and for our stockholders,” commented Rick Wallace, President and Chief Executive Officer of KLA-Tencor.

“Today our customer engagement and market leadership is strong and KLA-Tencor is delivering superior financial results. Growth and earnings momentum is expected to continue as we go forward, fueled by new products in the marketplace today, and with many more products in the pipeline,” continued Mr. Wallace. “Additionally, our collaboration over the past year with Lam Research and with our customers has affirmed the value of closer cooperation between process and process control for new, enabling solutions. For that reason, we plan to explore collaboration opportunities with Lam Research around programs identified as beneficial to our customers.”

After the initial announcement of the proposed merger, which was expected to close mid-year 2016, analysts voiced concern over whether the deal would be approved. Robert Maire of Semiconductor Advisors wrote: “We think this is going to be the obvious biggest issue after the failed AMAT & TEL merger.  We think there will likely be opposition in the semi industry but probably less so than we heard the screaming related to AMAT/TEL.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $28.0 billion for the month of August 2016, an increase of 3.5 percent compared to the previous month’s total of $27.1 billion and an uptick of 0.5 percent over the August 2015 total of $27.9 billion. August marked the market’s largest month-to-month growth since May 2013 and its first year-to-year growth since June 2015. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Following months of sluggish global semiconductor sales, the global market recently has shown signs of a rebound, punctuated by solid growth in August,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The Americas market was particularly encouraging, topping 6 percent month-to-month growth for the first time in nearly three years to lead all regional markets. China also stood out, posting by far the strongest year-to-year growth of all regions in August. All told, global sales are still behind last year’s pace, but appear to be on the right track as 2017 draws closer.”

Month-to-month sales increased across all regions: the Americas (6.3 percent), Japan (4.8 percent), China (3.1 percent), Asia Pacific/All Other (2.7 percent), and Europe (0.7 percent). Year-to-year sales increased in China (7.1 percent) and Japan (2.2 percent), but fell in Asia Pacific/All Other (-2.7 percent), the Americas (-3.1 percent), and Europe (-3.3 percent).

 

August 2016

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.10

5.43

6.3%

Europe

2.70

2.71

0.7%

Japan

2.60

2.73

4.8%

China

8.56

8.82

3.1%

Asia Pacific/All Other

8.12

8.34

2.7%

Total

27.08

28.03

3.5%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.60

5.43

-3.1%

Europe

2.81

2.71

-3.3%

Japan

2.67

2.73

2.2%

China

8.23

8.82

7.1%

Asia Pacific/All Other

8.57

8.34

-2.7%

Total

27.88

28.03

0.5%

Three-Month-Moving Average Sales

Market

Mar/Apr/May

Jun/Jul/Aug

% Change

Americas

4.79

5.43

13.2%

Europe

2.63

2.71

3.3%

Japan

2.55

2.73

6.9%

China

8.09

8.82

9.0%

Asia Pacific/All Other

8.00

8.34

4.2%

Total

26.07

28.03

7.5%

Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan’s “SuperTHEATER” focusing on innovation and insights into the future of the electronics supply chain. SEMICON Japan 2016, the largest exhibition in Japan for electronics manufacturing, will take place at Tokyo Big Sight in Tokyo on December 14-16. Registration for the exhibition and programs is now open.

Japan’s semiconductor fab equipment capital expenditure (front-end facilities, both new and used including discretes and LED) is forecast to increase 12 percent (to US$5.0 billion) in 2017, according to the August SEMI World Fab Forecast report.

On December 14, keynotes will focus on the future:

  • Semiconductor Executive Forum – “The Creation of New Business Opportunities” keynotes:
    • Toshiba: Yasuo Naruke, corporate senior executive VP, on “Toshiba Storage Business Strategy; Utilizing Big Data to Win Productivity”
    • TSMC: Jack Sun, VP of R&D and CTO, on “New Frontiers of Semiconductor Innovation”
    • Murata Manufacturing: Hiroshi Iwatsubo, executive VP, on “Business Strategy and Technology Trends”
  • Opening Keynotes – “Into the Future” keynotes:
    • IBM Research:  Dario Gil, VP, Science and Solutions, on “The Cognitive Era and the New Frontiers of Information Technology”
    • University of Tsukuba: Yoichi Ochiai, media artist and assistant professor, Digital Nature Group, on “The Age of Enchantment”

The SEMI Market Forum, also on December 14, with the theme “Outlook and Growth Opportunities in the Electronics Manufacturing Supply Chain” will offer presentations from IHS Markit, VLSI Research Inc., and SEMI.

Highlights on December 15 include Industrial IoT Forum, Autonomous & Connected Car Forum, and U.S. Commercial Service IT Forum. The Technology Trend Forum on December 16 focuses on “The Tokyo 2020 Olympics: Innovation for All.” In addition, SEMICON Japan features forums on Manufacturing Innovation and IoT Innovation.

Attendees at SEMICON Japan will explore the key technologies and business models necessary to grow in the coming years. The SuperTHEATER offers nine keynote forums, all with simultaneous English-Japanese translation, with global top executives.

Platinum sponsors of SEMICON Japan include Disco Corporation, Screen Semiconductor Solutions Co., Ltd. and Tokyo Electron Limited. Gold sponsors include: Advantest Corporation, Applied Materials, Inc., ASE Group, Daihen Corporation, Ebara Corporation, Fasford Technology Co., Ltd., Hitachi High-Technologies Corporation, JSR Corporation, Lam Research Corporation, Nikon Corporation, Tokyo Seimitsu Co., Ltd. and VAT Ltd.

For more information and to register for SEMICON Japan, visit www.semiconjapan.org/en/

As a provider of process solutions for a broad range of applications, Oxford Instruments announced the development and launch of the SiC via plasma etch process using its high performance PlasmaPro100Polaris etch system. SiC is becoming an increasingly important material, particularly in the arena of high performance GaN RF devices using SiC as a substrate. A smooth via etch through the SiC is essential to enable these devices, and Oxford Instruments has developed the ideal solution for etching high quality SiC vias efficiently. Combined with a low damage GaN etch within the same hardware, the PlasmaPro100 Polaris offers a unique capability for GaN based RF device plasma etch processing requirements.

The technology developed offers several process capabilities suited to the SiC via application:

  • High SiC etch rate enabling maximum throughput
  • Smooth sidewalls for problem free post etch metallisation
  • High selectivity to underlying GaN layer giving a smooth, low damage stop onto the GaN device layers
  • Clamping of sapphire carriers using Oxford Instruments’ unique patented Electrostatic Clamp technology ensuring excellent sample temperature control and maximum yield
  • Capability of etching SiC and GaN in the same tool through advanced plasma source technology
  • High utilisation provided by long Mean Time Between Cleans (MTBC)

Dr Mark Dineen, Optoelectronics Product Manager at Oxford Instruments Plasma Technology says, “Our Applications specialists have spent significant time developing this SiC via etch process on the PlasmaPro100 Polaris etch system, enabling high selectivity and throughput amongst other benefits. These benefits will enable our customers to etch both SiC and GaN in the same tool through advanced plasma source technology.”

Oxford Instruments delivers plasma processing systems, and offers a library of over 6,000 process recipes, all backed by a global support and service network.

SEM showing smooth via etch through SiC

SEM showing smooth via etch through SiC

Silicon Labs (NASDAQ: SLAB) today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT). This strategic acquisition helps simplify IoT design for all developers by combining a commercial-grade embedded RTOS with Silicon Labs’ IoT expertise and solutions. Micrium’s RTOS and software tools will continue to be available to all silicon partners worldwide, giving customers a wide range of options, even when using non-Silicon Labs hardware. Micrium will continue to fully support existing as well as new customers.

Founded in 1999, Micrium has consistently held a leadership position in embedded software components. The company’s flagship µC/OS RTOS family is recognized for reliability, performance, dependability, impeccable source code and extensive documentation.

“With an installed base of millions of devices, Micrium’s RTOS software has established itself as one of the most reliable and trusted platforms over the last 10 years,” said Jean-Michel Orsat, Chief Technology Officer, ICT Standards and Connectivity Solutions at Somfy. “Micrium has been a rock-solid RTOS solution partner for Somfy, and we look forward to using Micrium’s RTOS software family for years to come, delivering the reliability and performance we need for our IoT applications.”

Micrium’s widely deployed RTOS software has been ported to more than 50 microcontroller architectures and has a global footprint with more than 250,000 downloads across all embedded vertical markets, with solutions certified to meet safety-critical standards for medical electronics, avionics, communications, consumer electronics and industrial control.

“By combining forces with Silicon Labs, the Micrium team will drive advances in embedded connectivity for the IoT while giving customers a flexible choice of hardware platforms, wireless stacks and development tools based on the industry’s foremost embedded RTOS,” said Jean J. Labrosse, Founder, CEO and President of Micrium. “We will continue to provide our customers with an exceptional level of support, which is a Micrium hallmark.”

The combination of Micrium’s RTOS and Silicon Labs’ multiprotocol SoCs, wireless modules, wireless stacks and Simplicity Studio development tools gives customers a faster, easier on-ramp from connected devices to the cloud with end-to-end solutions for embedded IoT design.

“IoT products are increasingly defined by software. Explosive growth of memory/processor capabilities in low-end embedded products is driving a greater need for RTOS software in connected device applications,” said Daniel Cooley, Senior Vice President and General Manager of Silicon Labs’ IoT products. “The acquisition of Micrium means that connected device makers will have easier access to a proven embedded RTOS geared toward multiprotocol silicon, software and solutions from Silicon Labs.”