Category Archives: LEDs

With consumer television prices falling, global shipments of organic light-emitting diode (OLED) TVs grew 133 percent year over year, reaching a new monthly record of 270,000 units in November 2017, during the lead-up to the holiday shopping season. This growth comes as falling prices placed 55-inch 4K OLED into the budget range of a greater number of high-end holiday shoppers, according to IHS Markit (Nasdaq: INFO).

Overall global liquid crystal display (LCD) TV shipments in November slightly declined by 1.6 percent month over month, falling to 24.4 million units, as Black Friday demand in the United States declined in 2017 compared to the prior year. Total OLED TV shipments from January through November 2017 surpassed 1.3 million units. Together with December estimates, overall OLED TV shipments are likely to exceed 1.4 million units shipped in 2017.

“In 2017, the landscape for OLED TV brands changed as Sony, Toshiba and other major brands began selling OLED TVs,” said Ken Park, associate director, IHS Markit. “The growing number of available OLED TV choices, especially high-profile Japanese and European brands, has resulted in more competition and pricing promotion activity in the OLED TV market.”

LGE dominated the OLED TV market in 2016, accounting for around 92 percent of all units shipped, while several Chinese brands accounted for most of the remaining shipments. During the weeks surrounding Black Friday 2017, LGE dropped the price of its entry-level B7 series 55-inch and 65-inch 4K OLED TVs by $200, pricing its lowest tier 55B7 model at $1,499.

LGE led overall OLED TV shipment volume in November, with a 31 percent month-over-month increase in shipments. Total year-over-year 55-inch OLED TV shipments rose 123 percent in November, while 65-inch shipments grew 157 percent.

IHSM_Monthly_OLED_TV_Shipments_2017_R

After several years of close partnership, SEMI and the Fab Owners Association (FOA) have fully integrated. Driving manufacturing efficiencies remains the overriding purpose of the FOA – where the “A” now stands for “Alliance.”  With FOA’s integration with SEMI, the association will leverage SEMI’s global infrastructure and connections to over 2,000 members around the world to extend its platforms for collaborative networking and benchmarking manufacturing operations.

“FOA members operate some of the most innovative and efficient fabrication facilities and are hotbeds for new optimization methodologies in integrated circuit and micro-electromechanical production,” said Ajit Manocha, president and CEO of SEMI. “The integration of FOA with SEMI brings together firsthand understanding of manufacturing challenges so we can help all SEMI members achieve higher operating efficiency.”

With integration complete, FOA is managed as a Special Interest Group (SIG) within SEMI. FOA member companies will become full SEMI members, with FOA continuing to expand its global membership through SEMI’s global network, while maintaining its unique community.

Established in 2004, FOA brings to SEMI a focus on addressing common semiconductor operations and manufacturing issues. The full integration comes after more than a year in which the organizations operated under an Association Management Agreement where SEMI provided FOA association services and deepened its association with FOA. SEMI-FOA will continue to focus on manufacturing efficiency, including the group’s popular benchmark activities, to enable best practices among FOA members.

“FOA members manufacture a wide variety of complex devices, many of which make up the applications we see in some of the most advanced automotive systems, medical devices, Smart Manufacturing and general IoT,” said Dale Miller, member of the FOA Executive Director, and Senior Director, Fab 9 Semiconductor Manufacturing Operations at GLOBALFOUNDRIES. “Given the strong growth in these applications, FOA members must keep the fabs humming at full capacity while always pursuing higher yield and lower cost. To help maintain this momentum, FOA will continue to enable members to collaborate on best practices and benchmarking while focusing on key issues such as cycle-time, yield and tool performance.”

From the Internet of Things to the cloud to artificial intelligence, industries are seeing a new wave of technologies that have the potential to transform and significantly impact the world around us. For its latest white paper, business information provider IHS Markit (Nasdaq: INFO) surveyed its leading technology experts to find out how these technologies are coming together in new and powerful ways to fundamentally change businesses, fuel innovation, disrupt industries and create both threats and opportunities.

The top eight transformative technologies for the global technology market in 2018, as identified in the IHS Markit report, are as follows:

Trend #1: Artificial intelligence (AI)

AI has matured to the point where it is being used as a competitive differentiator in several industries, particularly in the smartphone, automotive and medical markets. Also, optimization for on-device versus cloud-based solutions is becoming an area of focus. Cloud AI has more computing power to analyze data as it utilizes deep learning algorithms, but there are potential issues around privacy, latency and stability. On-device AI, meanwhile, can help offset those dangers to some degree. For instance, smartphone users who deploy the built-in AI of their phones are able to store data locally and thus safeguard their privacy.

Trend #2: Internet of Things (IoT)

The global installed base of IoT devices will rise to 73 billion in 2025, IHS Markit forecasts show. Accelerating IoT growth in 2018 and movement through a four-stage IoT evolution — “Connect, Collect, Compute and Create” — will be the confluence of enhanced connectivity options with edge computing and cloud analytics.

Enhancements in IoT connectivity, such as low-power wireless access (LPWA) will drive growth. Moreover, technologies adjacent to the IoT will become increasingly sophisticated. Machine video and ubiquitous video will empower new types of visual analytics. And AI, the cloud and virtualization will help develop critical insights sourced from data at the so-called “edge” of computing networks. Applying AI techniques to data will drive monetization in the form of cost savings, greater efficiencies and a transition from product- to service-centric business models.

Trend #3: Cloud and virtualization

Cloud services will pave the way for technologically immature companies to utilize machine learning (ML) and AI, radically transforming their usage and understanding of data.

Trend #4: Connectivity

As the first 5G commercial deployments emerge, the story will focus on connectivity. However, the path to full 5G adoption and deployment is complicated, with new opportunities and challenges alike in store for mobile network operators, infrastructure providers, device manufacturers and end users. 5G represents a dramatic expansion of traditional cellular technology use cases beyond mobile voice and broadband, to include a multitude of IoT and mission-critical applications.

Trend #5: Ubiquitous video

The growing use of screens and cameras across multiple consumer- and enterprise-device categories, along with increasingly advanced broadcast, fixed and mobile data networks, is powering an explosion in video consumption, creation, distribution and data traffic. More importantly, video content is increasingly expanding beyond entertainment into industrial applications for medical, education, security and remote controls, as well as digital signage.

Trend #6: Computer vision

The increasing importance of computer vision is directly tied to the mega-trend of digitization that has been playing out in the industrial, enterprise and consumer segments. The proliferation of image sensors, as well as improvements in image processing and analysis, are enabling a broad range of applications and use cases including industrial robots, drone applications, intelligent transportation systems, high-quality surveillance, and medical and automotive.

Trend #7: Robots and drones

The global market for robots and drones will grow to $3.9 billion in 2018. The deeper underpinnings of the story, however, lie in the disruptive potential of robots and drones to transform long-standing business models in manufacturing and industry, impacting critical areas such as logistics, material picking and handling, navigational autonomy and delivery.

Trend #8: Blockchain

Blockchain enables decentralized transactions and is the underlying technology for digital currency such as bitcoin and ether. Blockchain-based services beyond financial services are already being developed and deployed and will continue to ramp in 2018. These include: the use of blockchain to improve advertising measurement and combat ad fraud; blockchain-based systems for distributing music royalty payments; and solutions to better track and manage electronics supply chains.

The use of LEDs to illuminate buildings and outdoor spaces reduced the total carbon dioxide (CO2) emissions of lighting by an estimated 570 million tons in 2017. This reduction is roughly equivalent to shutting down 162 coal-fired power plants, according to IHS Markit (Nasdaq: INFO), a world leader in critical information, analytics and solutions. LED lighting uses an average of 40 percent less power than fluorescents, and 80 percent less than incandescents, to produce the same amount of light.

“The efficiency of LEDs is essentially what makes them environmentally friendly,” said Jamie Fox, principal analyst, lighting and LEDs group, IHS Markit. “Therefore, LED conversion is unlike other measures, which require people to reduce consumption or make lifestyle changes.”

LED component and lighting companies were responsible for reducing the global carbon (CO2e) footprint by an estimated 1.5 percent in 2017, and that number is likely to continue to grow as more LEDs are installed around the world.

LEDs have other positive environmental benefits, too. For example, LEDs have a longer life span than traditional bulbs and fewer are produced, so the emissions and pollution associated with the production, shipping, sale and disposal of the products is lowered. Secondly, unlike fluorescents, LEDs do not contain mercury. LEDs also decrease air pollution, since most electrical energy is still generated by burning fossil fuels. “While other activities affect climate change more than lighting does, it is still a very strong contribution from a single industry sector,” Fox said.

IHS Markit has tracked the market share for top LED component suppliers for many years. Based on an analysis of this data, Nichia can claim credit for having saved the most carbon overall — accounting for 10 percent of all LED lighting reduction achieved in 2017, which translates into 57 million tons of CO2 — about the same as 16 coal plants. Cree followed Nichia with 8 percent, while Lumileds, Seoul Semiconductor, MLS, Samsung and LG Innotek each have a share in the range of 4 percent to 7 percent.

Savings achieved by each company relate to the energy saved by the use of that company’s components while installed in lighting applications. It does not include a whole lifecycle analysis, which would likely lead to a small additional positive benefit, due to the longer life of LEDs.

“LED component companies and lighting companies have transformed their industry,” Fox said. “They are fighting climate change much more effectively than other industries, and they should be given credit for it. Unlike in other industry sectors, workers at LED companies can honestly say that by selling more of their products, they are helping to reduce global warming.”

IHS Markit figures are only based on the lighting market. They do not include energy saved by LEDs that replaced other technologies in other sectors, such as automotive and consumer technology.

More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate already strong industry growth. March 14-16, 2018, at the Shanghai New International Expo Centre (SNIEC), SEMICON China 2018 will bring together top executives and technologists in six exhibition halls, the most ever in the event’s 30-year history, to find opportunities in key focus areas including Smart Automotive and Smart Manufacturing, Green Tech, Advanced Technology, and Power and Compound Semiconductors.

Concurrent with FPD China, SEMICON China 2018, the largest and most influential gathering of the semiconductor supply chain in China, is now open for visitor registration.

SEMICON China technical forums will address the most pressing industry topics:

  • CSTIC 2018: Staged in conjunction with SEMICON China, this has ranked among the largest and most comprehensive annual semiconductor technology conferences in China since 2000. March 11-12, 2018, CSTIC 2018 will feature nine symposiums covering all aspects of semiconductor technology, with a focus on manufacturing and advanced technology.
  • SIIP: Tech Innovation and Investment Forum: SIIP is a key international platform for semiconductor industry investment in China. Informed by China’s IC policy to fund key semiconductor sectors, leaders of China’s National IC Fund and municipal IC funds will join leaders from global investment institutions to discuss hot opportunities in China semiconductor investment – and applications such as Artificial Intelligence (AI).
  • Win-Win: Build China’s IC Ecosystem: Spurred by a strong market outlook, policy and the national fund, fab construction in China will surge over the next five years, with OSAT (Outsourced Semiconductor Assembly and Test) making strategic investments. Industry leaders will explore how China’s semiconductor manufacturing industry will strengthen its core competency, prioritize resources, revisit its business model, and thrive in the electronics ecosystem.
  • Power and Compound Semiconductor International Forum: Among the largest power and compound semiconductor industry forums in Asia, this two-day event features four sessions: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology
  • Smart Automotive Forum – AI Inside: Top automotive, electronic, AI and technology executives will gather to discuss the future of the rapidly disrupting automotive industry.
  • China Memory Strategic Forum: Driven by market needs and policy support, three new Chinese Memory foundries are accelerating memory development. Industry leaders will explore ways multinationals can benefit more from China’s memory market, China can better leverage its technical strength, and Chinese companies can enhance research and development collaboration with global partners.
  • Green High-Tech Facility Forum: With more than 10 fabs now under construction in China,China’s semiconductor industry is entering a stage of rapid growth. Green Tech leaders will discuss how China can improve factory design and construction; optimize energy efficiency of semiconductor manufacturing equipment; enhance machine platform stability, chemicals and gas management, and wastewater treatment; and improve risk management.
  • Smart Manufacturing Forum: The semiconductor industry must be proactive in all aspects of smart manufacturing. This session will address automation, product tractability, cost and cycle time reduction, enhancements in productivity and yield, and efficiency improvements in front- and back-end factories.
  • Semiconductor New Technology Conference: The best way to promote new technology is through direct customer interaction and collaboration. Join this conference to discuss your new IC, new IOT solution, new machine or new material with more 200 customers from around the world.
  • 2018 China Display Conference-Emerging Display Forum: Join this forum, concurrent with FPD China 2018, to exchange ideas on emerging display technologies and future development.
  • MSIG International IOT Conference 2018: MEMS, sensors, IC, NB-IoT, 5G and smart application experts will share their insights on the IoT market and how to maximize the value of IoT applications.

SEMICON China also features three theme pavilions:

  • IC Manufacturing: See products, technologies, and manufacturing solutions focused on serving China’s fabless IC community, from design to final manufacturing.
  • LED and Sapphire: Learn how China has become the world’s largest sapphire manufacturing center.
  • ICMTIA: See the local IC material industry demonstrate its capabilities to support semiconductor industry growth.

Advanced Micro-Fabrication Equipment Inc. (AMEC) today announced that the Fujian High Court in China has granted AMEC’s motion for an injunction against Veeco Instruments (Shanghai) Co. Ltd. (Veeco Shanghai). The injunction prohibits Veeco Shanghai from importing, manufacturing, selling or offering for sale to any third party any MOCVD systems and wafer carriers used in the MOCVD systems that would infringe AMEC’s patent CN 202492576 in China. The patent covers AMEC’s proprietary wafer carrier and spindle-locking and synchronization technology. The injunction covers Veeco’s TurboDisk EPIK 700 system, EPIK 700 C2 system, and EPIK 700 C4 system, as well as the related wafer carriers used in the MOCVD systems. AMEC believes that the ruling should also cover Veeco’s EPIK 868 system and related wafer carriers, since AMEC believes that the EPIK 868 system also uses AMEC’s patented technology involved in the action.

The ruling, which is unappealable, takes effect immediately. The stringent injunction terms expose the nature of Veeco Shanghai’s flagrant violation of AMEC’s intellectual property (IP) and confirms that Veeco Shanghai does not respect AMEC’s IP rights.

AMEC filed the patent infringement claim against Veeco Shanghai in the Fujian High Court on July 13th 2017. The motion requested a permanent injunction against Veeco Shanghai, as well as compensation for monetary damages of more than 100 million RMB Yuan (approx. US$15 million).

The injunction follows a previous victory for AMEC relating to the same action. When AMEC filed its claim in July, Veeco Shanghai responded by filing a patent invalidation request with the Patent Re-examination Board (PRB) of the State Intellectual Property Office (SIPO) in China. A second request to invalidate the same AMEC patent was filed concurrently by an individual. The PRB held separate hearings for the two requests. On Nov. 24th2017, the PRB dismissed both requests,thereby upholding the validity of the patent.

AMEC invested heavily in R&D and IP protection for this key technology. AMEC first developed the technology, filed a series of patents to protect the innovations, and installed equipment containing the technology at a number of LED production fabs in China. Veeco later followed by using the same locking approach in its MOCVD system to improve the tool’s performance. After AMEC filed the patent disputed by Veeco Shanghai, Veeco Instruments Inc. (Veeco US) submitted a similar patent application, and subsequently used this technology in its MOCVD system, thus infringing AMEC’s patent.

“The court’s ruling and the PRB’s decisions together confirm in no uncertain terms that AMEC’s technology contains unique innovations, and that our patent portfolio is comprehensive, robust and highly valuable,” said Dr. Zhiyou Du, Senior Vice President, COO & General Manager of AMEC’s MOCVD Product Division. “We are very pleased with the court’s decision. We take IP enforcement seriously, and we will not tolerate any violation of our IP rights. Indeed, we will aggressively pursue instances of infringement, and vigorously protect our IP portfolio.”

Dr. Du continued: “As a supplier of high-end micro-fabrication equipment to leading global manufacturers of ICs, LEDs and power devices, AMEC attaches great importance to IP protection. Since our founding in 2004, we have independently developed unique technologies to enable our customers worldwide. Therefore, for more than a decade, we have defended our IP in domestic and international jurisdictions when challenged, and prevailed in every case. We respect the IP of our customers and competitors, and we expect the same regard for our IP.”

In a separate development, AMEC filed a motion on Dec. 8th 2017 to invalidate a Veeco patent with the Patent Trial and Appeal Board (PTAB) of the US Patent & Trademark Office (USPTO). The patent, US 6,726,769 filed in 2001, covers a detachable wafer carrier technology. It was asserted in an infringement action initiated in the US by Veeco US against AMEC’s supplier of wafer carriers for MOCVD systems. AMEC believes that the Veeco patent is invalid because the technology was definitively and clearly disclosed in many prior patents and publications as far back as the early 1960s. Therefore, the Veeco patent does not meet standard patent law requirements. Besides filing to invalidate the patent in the US, AMEC has already filed motions to invalidate counterpart patent families in China and South Korea.

AMEC intends to also challenge a second Veeco US patent (US 6,506,252) involved in the same US infringement action. A motion to that effect will soon be filed with the PTAB.

Dr. Gerald Yin, Chairman and CEO of AMEC, said: “We are confident that AMEC will prevail in its action against Veeco Shanghai, and that Veeco Shanghai will be required to pay for the enormous cost of its infringement beginning in 2014 when Veeco US launched its EPIK 700 system. In addition, we believe that our supplier will eventually prevail in its US case.”

Dr. Yin further noted: “AMEC is an innovative company with extensive expertise in providing breakthrough technologies that enable customers with competitive advantages. Our products have earned market success for their differentiation and value. Naturally, we prefer to focus our efforts on providing such innovative products and stellar service to customers instead of wasting time and resources on litigation. That’s why we’re fully committed to reaching a positive resolution with Veeco, and working diligently to achieve that goal.”

Cree, Inc. (Nasdaq: CREE) announces the commercial availability of the XLamp®XD16 LED, the industry’s first Extreme Density LED, which delivers up to 5 ½ times higher lumen density than Cree’s previous generation of high power LEDs. Built on Cree’s groundbreaking NX Technology Platform, the XD16 LED combines breakthrough lumen density, low optical cross-talk, unsurpassed thermal contact and ease of system manufacturing to enable innovative new designs for a broad spectrum of lighting applications, such as color-tuning, street, portable and industrial.

“Cree’s new XD16 LED delivers an incredible amount of light output for such a tiny package,” said Joe Skrivan, senior technical director at Black Diamond Equipment. “The XD16 LED’s breakthrough lumen output and peak intensity is a game-changer for our climbing headlamp products because we can design better beam control and decrease the overall size and weight compared to existing designs.”

The XLamp XD16 LED delivers a lumen density of more than 284 lumens per square-millimeter, which is the highest level achieved by a commercially available lighting-class LED. The ceramic-based XD16 LED utilizes the proven XQ footprint and successfully addresses challenges with luminaire manufacturing, thermal design, optical design and reliability faced by competing LEDs. For example, the XD16 LED reduces system-level optical loss by up to three times versus competing technologies when LEDs are placed close together on a board. This improvement translates into fewer wasted lumens and higher efficacy for lighting products.

“Cree’s new Extreme Density LED demonstrates that true LED innovation improves our customers’ system performance without forcing compromise,” said Dave Emerson, Cree LEDs executive vice president and general manager. “The XD16 LED delivers unmatched lumen density without the design and manufacturing challenges associated with inferior LED technology approaches. Now, lighting manufacturers can easily achieve previously unattainable levels of light output and efficacy in their existing form factors.”

The new LEDs are characterized and binned at 85°C, available in ANSI White, EasyWhite® 3- and 5-step color temperatures (2700K – 6500K), and CRI options of 70, 80 and 90. Product samples are available now and production quantities are available with standard lead times.

By Inna Skvortsova, SEMI

Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.  Progressively smaller geometries of ICs, lower supply voltages, and higher data rates all make devices and processes more vulnerable to EMI. Electrical noise, EMI-induced signal generated by equipment, and factors such as power line transients affect manufacturing processes, from wafer handling to wire bonding to PCB assembly and test, causing millions of dollars in losses to the industry. Furthermore, conducted emission capable of causing electrical overstress (EOS) can damage sensitive semiconductor devices.  Intel consistently names EOS as the “number one source of damage to IC components.” (Intel® Manufacturing Enabling Guide 2001, 2010, 2016).

While EMC (Electromagnetic Compatibility) standards, such as the European EMC Directive and FCC Testing and Certification, etc. provide limits on allowed emission levels of equipment, once the equipment is installed along with other tools, the EMI levels in actual operating environments can be substantially different and therefore impact the equipment operation, performance, and reliability. For example, (i) Occasional transients induce “extra” pulses in rotary feedback of the servo motor which in time contributes to robotic arm’s erroneous position eventually damaging the wafer; (ii) Combination of high-frequency noise from servo motors and switched mode power supplies in the tool creates difference in voltage between the bonding wire/funnel and the device which causes high current and eventual electrical overstress to the devices; (iii) Wafer probe test provides inconsistent results due to high level of EMI on the wafer chuck caused by a combination of several servo motors in the wafer handler.  Field cases like these illustrate the gap between EMC test requirements and real-life EMI tolerance levels and its impact on semiconductor manufacturing and handling.

EMI on AC power lines

EMI on AC power lines

New standard, SEMI E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment, developed by the NA Chapter of the Global Metrics Technical Committee bridges this gap. Targeted to IC manufacturers and anyone handling semiconductor devices, such as PCB assembly and integration of electronic devices, SEMI E176 is a practical guide as well as an educational document. SEMI E176 provides a concise summary of EMI origins, EMI propagation, measurement techniques and recommendations on mitigation of undesirable electromagnetic emission to enable equipment co-existence and proper operation as well as reduction of EOS in its intended usage environment. Specifically, E176 provides recommended levels for different types of EMI based on IC geometries.

“SEMI E176 is likely the only active Standard in the entire industry providing recommendations on both acceptable levels of EMI in manufacturing environments and the means of achieving and maintaining these numbers,” said Vladimir Kraz, co-Chair of the NA Metrics Technical Committee and president of OnFILTER, Inc. “E176 is also unique because it is not limited just to semiconductor manufacturing, but has application across other industries.  Back-end assembly and test, as well as PCB assembly are just as affected by EMI and can benefit from SEMI E176 implementation as there are strong similarities between handling of semiconductor devices in IC manufacturing and in PCB assemblies and prevention of defects is often shared between IC and PCBA manufacturers.”

The newly published SEMI E176 and recently updated SEMI E33-0217, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC),provide complete documentation for establishing and maintaining low EMI levels in the manufacturing environment.

Undesirable emission has operational, liability and regulatory consequences.  Taming it is a challenging task and requires a comprehensive approach that starts from proper system design practices and ends with developing EMI expertise in the field.  The new SEMI 176 provides practical guidance on reducing EMI to the levels necessary for effective high yield semiconductor manufacturing today and in the future.

SEMI Standards development activities take place throughout the year in all major manufacturing regions. To get involved, join the SEMI International Standards Program at: www.semi.org/standardsmembership.

 

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $37.1 billion for the month of October 2017, an increase of 21.9 percent from the October 2016 total of $30.4 billion and 3.2 percent more than last month’s total of $36.0 billion. October marked the global industry’s largest-ever monthly sales total. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, the latest WSTS industry forecast was revised upward and now projects annual global market growth of 20.6 percent in 2017 and 7.0 percent in 2018.

“The global semiconductor market continued to grow impressively in October, with sales surpassing the industry’s highest-ever monthly total and moving closer to topping $400 billion for 2017,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Market growth continues to be driven in part by high demand for memory products, but combined sales of all other semiconductor products were up substantially as well, showing the breadth of the market’s strength this year.”

Regionally, year-to-year sales increased in the Americas (40.9 percent), Europe (19.5 percent), China (19.1 percent), Asia Pacific/All Other (16.3 percent), and Japan (10.7 percent). Compared with last month, sales were up more modestly across all regions: the Americas (6.8 percent), China (2.6 percent), Europe (2.6 percent), Japan (1.8 percent), and Asia Pacific/All Other (1.5 percent).

Additionally, SIA today endorsed the WSTS Autumn 2017 global semiconductor sales forecast, which projects the industry’s worldwide sales will be $408.7 billion in 2017. This would mark the industry’s highest-ever annual sales, its first time topping $400 billion, and a 20.6 percent increase from the 2016 sales total. WSTS projects double-digit year-to-year increases across all regional markets for 2017: the Americas (31.9 percent), Asia Pacific (18.9 percent), Europe (16.3 percent), and Japan (12.6 percent). Beyond 2017, growth in the semiconductor market is expected to moderate across all regions. WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

To find out how to purchase the WSTS Subscription Package, which includes comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, please visit http://www.semiconductors.org/industry_statistics/wsts_subscription_package/. For detailed data on the global and U.S. semiconductor industry and market, consider purchasing the 2017 SIA Databook: https://www.semiconductors.org/forms/sia_databook/.

Oct 2017

Billions

Month-to-Month Sales                              

Market

Last Month

Current Month

% Change

Americas

7.99

8.54

6.8%

Europe

3.28

3.37

2.6%

Japan

3.14

3.20

1.8%

China

11.36

11.65

2.6%

Asia Pacific/All Other

10.18

10.33

1.5%

Total

35.95

37.09

3.2%

Year-to-Year Sales                         

Market

Last Year

Current Month

% Change

Americas

6.06

8.54

40.9%

Europe

2.82

3.37

19.5%

Japan

2.89

3.20

10.7%

China

9.78

11.65

19.1%

Asia Pacific/All Other

8.88

10.33

16.3%

Total

30.43

37.09

21.9%

Three-Month-Moving Average Sales

Market

May/Jun/Jul

Aug/Sep/Oct

% Change

Americas

6.94

8.54

23.0%

Europe

3.20

3.37

5.1%

Japan

3.04

3.20

5.2%

China

10.68

11.65

9.1%

Asia Pacific/All Other

9.77

10.33

5.8%

Total

33.63

37.09

10.3%

Texas Instruments (TI) (NASDAQ: TXN) today introduced the first 3-channel high-side linear automotive light-emitting diode (LED) controller without internal MOSFETs which gives designers greater flexibility for their lighting designs. The TPS92830-Q1’s novel architecture enables higher power and better thermal dissipation than conventional LED controllers, and are particularly beneficial for automotive LED lighting applications that require high performance and reliability.

Conventional LED drivers integrate the MOSFET, which limits designers’ ability to customize features. With that type of driver, designers often must make significant design modifications to achieve the desired system performance. The TPS92830-Q1 LED controller’s flexible on-board features give designers the freedom to select the best MOSFET for their system requirements. With this new approach, designers can more quickly and efficiently optimize their lighting power designs for automotive system requirements and desired dimming features.

Key features and benefits

  • Flexibility: The on-chip pulse-width modulation (PWM) generator or PWM input enables flexible dimming. Designers can use either the analog control or PWM to manage an output current of more than 150 mA per channel, to power automotive rear combination lamps and daytime running lights.
  • Improved thermal dissipation: By pairing the LED controller with an external MOSFET, the designer can achieve the required high power output while distributing the power across the controller and MOSFET to avoid system overheating. By retaining linear architecture, the TPS92830-Q1 provides improved electromagnetic interference (EMI) and electromagnetic compatibility (EMC) performance.
  • Greater system reliability: Advanced protection and built-in open and short detection features help designers meet original equipment manufacturer (OEM) system reliability requirements. The output current derating feature protects the external MOSFET under high voltage conditions to ensure system reliability.

The TPS92830-Q1 expands TI’s extensive portfolio of LED drivers, design tools and technical resources that help designers implement innovative automotive lighting features.