Category Archives: LEDs

By Ayo Kajopaiye, Collaborative Technology Platforms, SEMI

What does Smart Manufacturing mean for the future of the electronics manufacturing supply chain?  SEMI members hold many different perspectives, but one thing is clear ─ the impact of Smart Manufacturing will be huge. SEMI is fully involved with many of the activities that center on Smart Manufacturing.

During the North America Standards meetings that took place at SEMI’s new Headquarters in February, the Automation Technology Committee Chapter in Taiwan was successfully chartered.  K.C. Chou, co-chair of the new Committee, believes in SEMI’s role, saying, “SEMI has a strong reputation for successful standardization which is why the Taiwan PCB industry has selected the global SEMI Standards platform to develop consensus on equipment communication and other manufacturing areas where standards are needed to drive down cost.”

What does the formation of this Committee mean for Smart Manufacturing in the PCB industry? “The industry can now use the Committee to drive consensus on how to adopt GEM technology so it can be implemented consistently” says Brian Rubow, director of Client Training and Support at Cimetrix. “Without these standards agreed upon, every equipment that needs to be integrated may have to have different technology adopted, making the process more difficult just to create a line that will produce their product since a lot of custom integration has to be done. However, once a standard is adopted, instead of spending time dealing with protocols, communication methods and messaging scenarios, they will be able to be a lot more productive and focus on building products and not worry about integrated equipment” he continues.

Next steps

The next step for the new Committee is to propose a ballot for distribution that will address adoption of GEM technology. “Anyone who is interested in this technology, now is the best time to get involved and get their ideas into the collaboration,” Rubow adds. He expects the balloting process to begin over the next quarter.

Many other Smart Manufacturing Programs

SEMI also has a Smart Manufacturing Initiative that is being led by a group of industry leaders through the SEMI Smart Manufacturing Advisory Council. This Council works closely with the Smart Manufacturing Special Interest Group which consists of a broader group of members across different regions as they focus on facilitating collective efforts on issues related to smart manufacturing. Also, members that are part of this group are connected to information and resources that can help with the implementation, supply, services or research of smart manufacturing systems. SEMI plans to continue to play an essential role in the emergence of Smart Manufacturing in the electronics industry.

For questions regarding the Smart Manufacturing Special Interest Group and Advisory Council please contact Tom Salmon, VP of Collaborative Technology Platforms – [email protected] or 408-943-6965.

Also be sure to take a look at SEMI’s Smart Manufacturing Central webpage for information related to Smart Manufacturing – www.semi.org/en/smart-manufacturing-central

SEMICON West 2017

Smart Manufacturing topics (Manufacturing, Automotive, and MedTech) will be covered at SEMICON West 2017. Under the “Programs” tab at the top, visit the “Agenda at a Glance” (filter listings to Smart Topics).  Learn more and register now.

Other SEMI shows will also feature Smart Manufacturing topics, including SEMICON Taiwan (September 13-15 in Taipei), SEMICON Europa (November 14-17 in Munich), and SEMICON Japan (December 13-15 in Tokyo).

Dow Corning today introduced Dow Corning CL-1000 Optical Silicone Binder, a new, more thermally stable, high refractive index (RI) material available only in China that is formulated to expand design options for high-power chip-scale LED packaging (CSP). The latest addition to the company’s portfolio of advanced solutions for LED lighting, CL-1000 Binder offers best-in-class thermal stability and is optimized for compression molding processes.

“The growing adoption of chip-scale packaging is enabling lighting designs that pack increasing numbers of LED dies more densely together in smaller form factors,” said Takuhiro Tsuchiya, global marketing manager at Dow Corning. “CL-1000 Optical Silicone Binder is Dow Corning’s response to the rapidly rising temperatures within these emerging applications. A more thermally stable iteration of our high-RI optical materials, this new product is formulated specifically to help enhance the robustness of high-power CSP designs.”

Validated through Dow Corning’s testing, the thermal stability of CL-1000 Optical Silicone Binder enabled it to exhibit lower degradation and improved maintenance of mechanical properties vs. other high-RI silicone encapsulants after 2,000 hours exposure to temperatures above 180°C. The new high-RI material also delivers excellent photo-stability with high clarity to further support reliable performance over the life of LED devices.

New CL-1000 Binder demonstrates good conformance with highly reflective Dow Corning WR-3001 and WR-3100 Die Edge Coat materials, enabling CSP packaging with enhanced reliability over longer periods. The product’s high Shore D60 hardness also enables LED packaging to withstand dicing operations.

CL-1000 Optical Silicone Binder leverages the same phenyl silicone chemistry as Dow Corning’s other industry-leading high RI optical encapsulants, which can help optimize the efficiency of next-generation LED lighting designs without costly investments in more powerful LED dies.

A market leader in materials, expertise and collaborative innovation for LED lighting concepts, Dow Corning offers solutions that span the entire LED value chain, adding reliability and efficiency for sealing, protecting, adhering, cooling and shaping light across all lighting applications.

A team of researchers at the Israel Institute of Technology has developed a new capacitor with a metal-insulator-semiconductor (MIS) diode structure that is tunable by illumination. The capacitor, which features embedded metal nanoparticles, is similar to a metal-insulator-metal (MIM) diode, except that the capacitance of the new device depends on illumination and exhibits a strong frequency dispersion, allowing for a high degree of tunability.

This new capacitor has the potential to enhance wireless capability for information processing, sensing and telecommunications. The researchers report their findings this week in the Journal of Applied Physics, from AIP Publishing.

“We have developed a capacitor with the unique ability to tune the capacitance by large amounts using light. Such changes are not possible in any other device,” said Gadi Eisenstein, professor and director of the Russell Berrie Nanotechnology Institute at the Technion Israel Institute of Technology in Haifa and a co-author of the paper. “The observed photo sensitivity of this MIS diode structure expands its potential in optoelectronic circuits that can be used as a light-sensitive variable capacitor in remote sensing circuits.”

MIM diodes are common elements in electronic devices, especially those utilizing radio frequency circuits. They comprise thin-film metal plate electrodes that are separated by an insulator. Like the MIM structure, the researchers’ new MIS capacitor is bias independent, meaning the constant capacitance is independent of its supply voltage. Bias-independent capacitors are important for high linearity, and therefore straightforward predictability, of circuit performance.

“We have demonstrated that our MIS structure is superior to a standard MIM diode,” said Vissarion (Beso) Mikhelashvili, senior research fellow at the Israel Institute of Technology and also a co-author of the paper. “On one hand, it has all the features of an MIM device, but the voltage independent capacitance is tunable by light, which means that the tuning functionality can be incorporated in photonic circuits.”

“The illumination causes a twofold effect,” Eisenstein said. “First, the excitation of trap states enhances the internal polarization. Second, it increases the minority carrier density (due to photo generation) and reduces the depletion region width. This change modifies the capacitance.”

The researchers created three MIS structures, fabricated on a bulk silicon substrate, based on a multilayer dielectric stack, which consisted of a thin thermal silicon dioxide film and a hafnium oxide layer. The two layers were separated by strontium fluoride (SrF2) sublayers in which ferrum (Fe, iron) or cobalt (Co) nanoparticles were embedded.

The researchers found that the fluoridation-oxidation process of the iron atoms causes the formation of a gradient in the valence state of iron ions across the active layer, which results in the generation of an electronic polarization. The polarization causes a bias-independent depletion region and hence an MIM-type characteristic.

Four additional structures were prepared for comparison: Two lacked the SrF2 sublayers and one of them was prepared without the iron film. The other two structures contained SrF2: One did not have cobalt and the second included a one-nanometer Co layer.

The comparison with other MIS capacitors that contained the metal nanoparticles with or without the SrF2 sublayers led to the unequivocal conclusion that only devices consisting of the combination of Fe and SrF2 turn the MIS structure into a photo-sensitive MIM-like structure.

FlexTech’s annual Flexible Electronics Conference and Exhibit – 2017FLEX – is set for the Hyatt Regency Hotel & Spa in Monterey, Calif.  from June 19-22, 2017. Consistently attracting 500+registrants, the event is the premier technology conference for the emerging flexible electronics industry. Twenty-six sessions will cover the landscape of flexible hybrid electronics and printed electronics, including R&D, manufacturing and applications. Short courses and networking events round out 2017FLEX.

According to Zion Research, “global demand for the flexible electronics market was valued at $5.13 billion in 2015 and is expected to generate revenue of $16.5 billion by 2021, growing at a CAGR of slightly above 21 percent between 2016 and 2021.”  Key elements of the market include flex displays, sensors, batteries, and memory. Applications also abound in the automotive, consumer electronics, healthcare, and industrial sectors.

While technology advancement and accelerating to manufacturing are the primary themes of the FLEX Conference, applications and business trends are highlighted on the opening day:

  • Applied Materials Keynote by Brian Shieh, corporate VP and GM, Display Business Group, on the flexible display market
  • Flex, the global EMS provider, and NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, on the challenges and solutions for manufacturing flexible and stretchable electronics
  • Libelium on how new IOT platforms that integrate sensors to monitor and control body parameters will lead to better healthcare for billions
  • Experience Co-Creation Partnership on the ten starting points for the development of flexible/hybrid sensors for agriculture and food
  • NovaCentrix on the OE-A Roadmap 2017, giving an outlook on organic and printed electronics developments and prospects
  • Gartner Group on when flexible electronics will reach critical mass

Sessions are planned for FHE manufacturing, standards and reliability, substrates, conductors, inspection, encapsulation and coating, nanoparticle inks, direct write, and 3D printing, among others. Well-known companies will present, such as Molex, Panasonic, Eastman Chemical, and Northrup Grumman, as well as leading universities, and the U.S. Army and U.S. Air Force Research Laboratories.

Among the R&D organizations presenting at 2017FLEX are CEA-LITEN (France), ETRI (South Korea), Flexible Electronics & Display Center (USA), Fraunhofer Institute (Germany), Holst Center (Netherlands), National Research Council (Canada), PARC (USA), and VTT (Finland). Topics of the presentations range from new forms of flexible substrates to TFT and OLED pilot lines to printed health monitoring sensors.

The exhibit floor, short courses and networking opportunities round out the event, as well as many member-only meetings.  FlexTech, the Nano-Bio Manufacturing Consortium (NBMC) and NextFlex hold member and planning meetings for the governing councils, technical councils and technology working groups.  Initiatives in manufacturing, mobile power, e-health, as well as project proposals will be discussed, all buoyed by the information shared during the technical conference.

For more information on 2017FLEX, please visit:  www.semi.org/en/2017-flex

Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.  The new conference, 2017FLEX Korea, focusing on the theme “A Practical Path to Flexible Hybrid Electronics,” is brought to action with a market-focused agenda and presentations on Displays, Wearables, Sensors, OLED, Quantum Dot, Micro LED, Head Up Display, Roll-to-Roll and 3D Printing by experts from both the industry and academia.

2017FLEX Korea features a technical conference, a Short Course, and networking opportunities. The two-day technical conference includes four sessions on critical areas for FHE success. The four sessions will feature 14 technology experts from Korea, America, Asia and Europe representing organizations active in the FHE area, including:

  • Display Applications: KIMM and UIN3D
  • Wearables and Sensors Applications: KT and KITECH
  • Emerging Markets Applications: EyeDis, KOPTI, and KITECH
  • Core Technology Applications: Coatema Coating Machinery GmbH, Daelim Chemical, Dankook University, DuPont, Kolon Industries, Nanosys, and Universal Display Corporation

Three keynotes will set the stage for all of the other topics, including:

  • LG Display: “Flexible Display Changes Your Life” by Joon Young Yang, head of OLED Advanced Research Division
  • FlexTech: “Emerging Product Opportunities and the Worldwide Ecosystem of FHE” by Melissa Grupen-Shemansky, Chief Technology Officer
  • Samsung Advanced Institute of Technology: “Quantum Dot Display” by Shinae Jun, research master

Combining traditional IC manufacturing with printed electronics, FHE is the leading technical approach to design and manufacture devices for fast-growth markets. Flexible and printed electronics applications have the potential to create business opportunities in growing market opportunities such as wearables, health care, flexible displays and other advanced applications. A 3-hour Short Course is intended for individuals and organizations seeking a comprehensive overview on the Printed Electronics industry.

“We are pleased to hold the 2017FLEX Korea conference,” said Hyun-Dae CHO, president of SEMI Korea. “We hope the conference will provide you with the insights into the FHE industry and you will also find networking opportunities at the event.”

Register by May 26 to reserve your spot with a discounted price: http://www.semi.org/ko/flex-korea-register

Today, SEMI announced that SEMICON Southeast Asia 2017 (SEMICON SEA 2017) is reporting an increase of up to 30 percent in attendees this year. Over 7,500 visitors and exhibitors are expected from 25 to 27 April at the event, which is the region’s premier exposition for connecting the electronics manufacturing supply chain. SEMICON SEA was officially launched today by YBhg Dato’ Sri Mustapa Mohamed, minister of International Trade and Industry, together with YAB Lim Guan Eng, chief minister of Penang, at the Subterranean Penang International Convention and Exhibition Centre (SPICE).  Guests-of-honour presiding at the opening ceremony included YBhg Dato’ Peter Halm, president of the Semiconductor Fabrication Association of Malaysia (SFAM) and Ajit Manocha, president and CEO of SEMI.

Key industry leaders will share their insights on technology innovation including the Internet of Things (IoT) that will bring significant transformation to the manufacturing sector, and examine the revolution of Disruptive Technology that has opened up new market opportunities. SEMICON SEA 2017 will showcase the trends, technologies and opportunities driving smart manufacturing in the electronics markets. In addition, SEMICON SEA 2017 will feature new activities:

  • Future Electronics Manufacturing Pavilion: featuring developments that can offer integration and add value to the manufacturing operations and supply chain
  • Failure Analysis Pavilion: showcasing solutions that can help companies maximise production while improving yield and reliability
  • World of IoT: Futura-X: featuring technologies and applications that are fuelling new markets for electronics and connecting the world

Ng Kai Fai, president of SEMI Southeast Asia, said the rise in participation this year demonstrates the importance that the manufacturing industry places on keeping well-informed of the advancements taking place. Ng expects Malaysia to have continued growth in 2017 following the strengthening global macroeconomics and growing demand for semiconductor technology in devices.  “Our industry participants see exceptional value in SEMICON Southeast Asia, learning about advances in the industry and how to automate and contribute to efficiency within their manufacturing processes. We are also seeing an increase in cross-border collaborations within this sector. The show facilitates these alliances by offering a complete platform for engaging customers, suppliers, engineers and decision-makers from across the industry, including buyers from Malaysia, Singapore, Thailand, Indonesia, the Philippines, and Vietnam.”

Sponsors for SEMICON SEA 2017 include 3M, Advantest, Air Products, AMEC, Applied Materials, ASE Group, Edwards, Evatec Process Systems, GLOBALFOUNDRIES, Hermes Epitek, Kulicke & Soffa, KLA-Tencor, Lam Research, Merck, Mentor Graphics, NTT Data, Rudolph Technologies, SAS, Screen, SPTS, TEL, Thermo Fisher Scientific, Tibco, Toray, Xcerra, and Zeiss. Partners for the exposition include AEIS, INTI College Penang, investPenang, Malaysia Convention and Exhibition Bureau, MATRADE, Ministry of Tourism and Culture Malaysia, MIDA, Malaysia Truly Asia, Penang Tourism, Singapore Manufacturing Federation, Samenta, Touch Display Research, VLSI Consultancy, and Yole Développement.

For more information on SEMICON Southeast Asia, please visit www.semiconsea.org

At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector. Chen believes that Smart Manufacturing, or Industry 4.0, is no longer hype but real, and Asia needs to get on board sooner rather than later. SEMICON Southeast Asia (SEA) 2017, held at the SPICE arena in Penang on 25-27 April, is Asia’s premier showcase for electronics manufacturing innovation.

“Digital transformation has proven to provide solutions for addressing challenges in the manufacturing industry but there is still the issue of acceptance as well as lack of skills and knowledge that needs to be addressed,” said Chen. “With disruptive technology changing our world, I expect that more companies will see the value of their investments realised as this technology accelerates the creation of more individualised products and services.”

Dr. Hai Wang from NXP Semiconductors Singapore Pte Ltd agreed that more consumer-related innovations would stem from digital transformation as demand for solutions that provide efficiency and security increases. “At NXP, we look at developing advanced cyber security solutions for the automotive industry, such as tracking and analysing intelligence around connected and automated vehicles, which will help to counter any adverse threats in real time. These innovations are real and will soon mark a shift in the future of automation and manufacturing. It is vital that we embrace the change and adapt accordingly,” he said.

Other speakers at SEMICON SEA also feel strongly about the importance of Smart Manufacturing and digital transformation. David Chang of HTC Corporation, Taiwan, sees a dramatic shift in the value of being a “smart” manufacturer to address to the rising demand in consumer products and services innovation. “We have seen virtual reality technology offered by products such as HTC VIVE(TM) really shaping the future of the world. Transformative innovations such as this will pave the way for disruptive technology to be coupled into business models to benefit consumers in the long term,” he said.

These three speakers will join a long list of thought leaders from the electronics manufacturing sector – including Jamie Metcalfe from Mentor Graphics U.S., Chiang Gai Kit from Omron Asia Pacific Singapore, Ranjan Chatterjee from Cimetrix U.S. and Duncan Lee from Intel Products Malaysia – to speak at SEMICON SEA 2017. Topics discussed will cover issues relevant to the transformation of the manufacturing industry ranging from next-generation manufacturing to system-level integration, including exhibitions that will highlight the market and technology trends that are driving investment and growth in all sectors across the region.

The conference also aims to champion regional collaboration through new business opportunities for customers and foster stronger cross-regional engagement through reaching buyers, engineers and key decision-makers in the Southeast Asia microelectronics industry, including buyers from Malaysia, Singapore, Thailand, Indonesia, the Philippines, and Vietnam.

Learn more about SEMICON Southeast Asia 2017 in Penang, Malaysia on 25-27 April: http://www.semiconsea.org/.

LG Innotek succeeded in mass-producing ultraviolet (UV) LED module that sterilizes the inside of water purifier faucet aerators.

The company started to mass-produce the UV LED module for sterilizing water purifier faucet aerators at the end of the last month. This product is built in LG Electronics’ new direct water purifier “PuriCare Slim Updown” launched in March in the Republic of Korea.

A water purifiers faucet aerator always holds a small amount of water. This part is prone to contamination due to the growth of germs that come in with the influx of air. However, it was difficult to install a sterilizer inside a faucet aerator because its space is too narrow.

LG Innotek developed a UV LED module customized for the faucet aerator that has strong sterilizing power and is harmless.

This module directly sterilizes the water inside faucet aerator with ultraviolet rays. The product is 1.5cm in width and 3.7cm in length and can be mounted in the small space inside the water purifier.

The product kills 99.98% of germs when a faucet aerator is exposed to ultraviolet rays for 5 minutes. This result was obtained by sterilizing a faucet aerator with 278nm wavelength.

UV LED module is also harmless since it uses only ultraviolet rays for sterilization without any chemicals or heavy metals. Also, unlike a mercury UV lamp, you don’t need to worry about breaking it.

This product is convenient to use as it allows you to control ultraviolet rays quickly and accurately. As soon as its sterilization function is activated, ultraviolet rays are released at peak performance. On the contrary, a mercury UV lamp requires about 2 minutes of warming period.

LG Electronics’ direct water purifier installed with this module allows you to sterilize faucets in an instant by pressing the “Self Care” button anytime. It also performs automatic sterilization every 1 hour.

LG Innotek plans to actively expand the application of UV LEDs to various products. The company already developed a 280nm UV-C LED that has the power of 70mW for the first time in the world.

The company has already secured a product line-up with products that are optimized for different applications, including 365nm, 385nm, 395nm and 405nm UV-A LEDs for general industry and 305nm UV-B LED for biomedical field as well as 280nm UV-C LED for sterilization.

Ho-rim Jung, the vice president of LED marketing division, said, “Our UV LEDs will increase the value of the end products that are installed with them and allow us to care for the health of users in a smart way.”

According to Yole Development, a market research firm, the global market for UV LEDs is expected to grow more than seven folds from USD 130 million in 2015 to USD 1 billion in 2021. Especially, the UV LEDs for water purification is expected to occupy 60% of the said UV LED market.

On March 31, 2017, Seoul Semiconductor Co., Ltd (Seoul) filed a patent infringement lawsuit in Germany in the District Court of Düsseldorf against Mouser Electronics Inc. (Mouser), a global electronic components distributor, asserting infringement of an LED patent.

According to the complaint, the infringement involves products from Mouser – LEDs for high-power light emission – manufactured by multiple LED companies, including Everlight Electronics Co., Ltd, a global top-10 LED maker. In the lawsuit, Seoul has sought a permanent injunction, damages, and recall and destruction of the alleged infringing products.

The asserted patented technology serves to efficiently extract light emitted from the internal LED structure by treating LED chip surfaces, thereby significantly improving light intensity and brightness. This patented technology has been widely used for various high-power LED applications, such as automobile lighting, cell phone flash lights, outdoor lighting, UV LED appliances, and others.

“The asserted patent is considered an essential technology for manufacturing high-power LEDs and has been widely used in various LED applications,” said Ki-bum Nam, Vice President of the Lighting Business Department at Seoul Semiconductor. “Seoul has actively enforced our patent rights against products that infringe high power LED technology. To create fair market competition and promote technological innovation, we continually take actions necessary to deter such infringement and protect our intellectual property,” Nam added.

According to the Institute of Electrical and Electronics Engineers (IEEE), among the companies that exclusively manufacture LED components, Seoul Semiconductor was the only one to be selected in the 2013 Semiconductor Manufacturing Patent Power Ranking. Seoul Semiconductor was also selected for the same category in 2012. IEEE’s patent power scorecards for each industry segment are based on the evaluation of the patent portfolios of more than 5000 leading commercial enterprises, academic institutions, nonprofit organizations, and government agencies worldwide. They take into account not only the size of the organizations’ patent portfolios, but also the quality of their patents with regard to growth index, impact of their patents, originality, and general applicability of the patents.

According to market research firm IHS, the LED penetration rate in automobile headlamps is expected to increase sharply to 32.3 % by 2021 from the current penetration rate of 16.4%. This high-power LED technology is already being used for exterior automobile lighting including headlights and daytime running lights. Furthermore, it is expected to become a significant technology for electric vehicles and autonomous vehicles, which require high-power LED lighting with high heat dissipation for energy efficiency.

In addition, this high-power LED technology applies to LEDs for mobile phone flash lights, which require higher light intensity. Because margins for LEDs used in flash applications are higher than those for backlights, this segment of the LED market for mobile phones has still grown steadily despite the overall decline in the IT sector LED market.

Further, this high-power LED technology is widely applicable to general lighting products for outdoor illumination, as well as commercial and industrial lighting systems, because such technology substantially enhances light efficiency and improves the brightness per unit area obtained from the LED. The technology is also widely used in manufacturing UV LEDs for sterilization, purification and curing processes. The UV LED application market is expected to grow rapidly, reaching $800 million by 2020.

Semiconductors are used for myriad optoelectronic devices. However, as devices get smaller and smaller and more demanding, new materials are needed to ensure that devices work with greater efficiency. Now, researchers at the USC Viterbi School of Engineering have pioneered a new class of semiconductor materials that might enhance the functionality of optoelectronic devices and solar panels–perhaps even using one hundred times less material than the commonly used silicon.

Researchers at USC Viterbi, led by Jayakanth Ravichandran, an assistant professor in the Mork Family Department of Chemical Engineering and Material Sciences and including Shanyuan Niu, Huaixun Huyan, Yang Liu, Matthew Yeung, Kevin Ye, Louis Blankemeier, Thomas Orvis, Debarghya Sarkar, Assistant Professor of Electrical Engineering Rehan Kapadia, and David J. Singh, a professor of physics from University of Missouri, have developed a new class of materials that are superior in performance and have reduced toxicity. Their process, documented in “Bandgap Control via Structural and Chemical Tuning of Transition Metal Perovskite Chalcogenide,” is published in Advanced Materials.

Ravichandran, the lead on this research, is a materials scientist, who has always been interested in understanding the flow of electrons and heat through materials, as well as the how electrons interact within materials. This deep knowledge of how material composition affects electron movement was critical to Ravichandran’s and his colleagues’ most recent innovation.

Computers and electronics have been getting better, but according to Jayakanth Ravichandran, the principal investigator of this study, “the performance of the most basic device–the transistors –are not getting better.” There is a plateau in terms of performance, as noted by what is considered the “end of Moore’s law.” Similar to electronics, there is a lot of interest to develop high performance semiconductors for opto-electronics. The collaborative team of material scientists and electrical engineers wanted to develop new materials which could showcase the ideal optical and electrical properties for a variety of applications such as displays, light detectors and emitters, as well as solar cells.

The researchers developed a class of semiconductors called “transition metal perovskite chalcogenides.” Currently, the most useful semiconductors don’t hold enough carriers for a given volume of material (a property which is referred to as “density of states”) but they transport electrons fast and thus are known to have high mobility. The real challenge for scientists has been to increase this density of states in materials, while maintaining high mobility. The proposed material is predicted to possess these conflicting properties.

As a first step to show its potential applications, the researchers studied its ability absorb and emit light. “There is a saying,” says Ravichandran of the dialogue among those in the optics and photonics fields, “that a very good LED is also a very good solar cell.” Since the materials Ravichandran and his colleagues developed absorb and emit light effectively, solar cells are a possible application.

Solar cells absorb light and convert it into electricity. However, solar panels are made of silicon, which comes from sand via a highly energy intensive extraction process. If solar cells could be made of a new, alternative semiconductor material such as the one created by the USC Viterbi researchers– a material that could fit more electrons for a given volume (and reducing the thickness of the panels), solar cells could be more efficient–perhaps using one hundred times less material to generate the same amount of energy. This new material, if applied in the solar energy industry, could make solar energy less expensive.

While it is a long road to bring such a class of materials to market, the next step is to recreate this material in an ultra-thin film form to make solar cells and test their performance. “The key contribution of this work,” says Ravichandran, “is our new synthesis method, which is a drastic improvement from earlier studies. Also, our demonstration of wide tunability in optical properties (especially band gap) is promising for developing new optoelectronic devices with tunable optical properties.”