Category Archives: LEDs

Outfitting the future


December 12, 2016

Wearable technology is about more than smartwatches or counting steps. Across North Carolina State University, researchers are using it to solve problems — monitoring heart rate and environmental dangers, powering electronic devices, delivering medications, building better prosthetics and improving safety.

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They’re developing technologies that are functional, efficient, innovative and practical, and that could have an impact on countless lives.

Here are a few of the NC State projects at the forefront of this evolving field.

What’s NEXT in wearables

What if the clothes you already wear not only covered your body but also kept track of how it’s functioning — and all you had to do was put them on?

Finding innovative, useful and economical ways to integrate electronics into clothing is the mission of the College of Textiles’ Nano-Extended Textiles (NEXT) Research Group.

Headed by Jesse Jur, assistant professor in the Department of Textile Engineering, Chemistry and Science, the NEXT group seeks to create cost-effective, energy-efficient wearable technology that’s powered by the user’s own body.

Jur’s team has gained attention for projects like customizable, iron-on sensors that monitor the heart’s performance and transmit the readings to a smartphone, or that monitor environmental levels of potentially dangerous gases like carbon monoxide and ozone.

The NEXT group has also explored bioluminescence in fashion through a collaboration with recent College of Textiles graduate Jazsalyn McNeil, who joined the group as a “fusion designer” to meld her design sensibility with the group’s research. McNeil’s Pulse Dress incorporates screen-printed sensors that make LED lights blink with the wearer’s heartbeat. NEXT and McNeil hope that the eye-catching dress will both influence fashion and draw attention to the possibilities of wearable electronics.

Heating up wearable tech

In recent years, smartwatches have turned up on the arms of millions of people who want convenient ways to keep track of their fitness, but these still depend on conventional batteries. At NC State’s Center for Advanced Self-Powered Systems of Integrated Sensors and Technologies (ASSIST) — a National Science Foundation Nanosystems Engineering Research Center — researchers are developing innovative health-monitoring devices that are battery-free and body-powered.

“The goal of ASSIST is to make wearable technologies that can be used for long-term health monitoring, such as devices that track heart health or monitor physical and environmental variables to predict and prevent asthma attacks,” said Daryoosh Vashaee, an associate professor of electrical and computer engineering in the NC State College of Engineering.

Vashaee and a team of undergraduates and faculty members have developed a new approach for harvesting body heat and converting it into electricity to power wearable electronics. The prototype armbands and embedded sensors in T-shirts are lightweight, conform to the shape of the body and can generate far more electricity than previous lightweight heat-harvesting technologies.

“We want to make devices that don’t rely on batteries,” Vashaee said. “And we think this design and prototype moves us much closer to making that a reality.”

Taking the sting out of diabetes

For some people with serious health issues, wearable technology has the potential to offer more than bells and whistles — it could make their treatments easier and even save lives.

Zhen Gu, an associate professor in the UNC/NC State Joint Department of Biomedical Engineering, has developed a glucose-responsive insulin patch for people living with Type 1 Diabetes. At around the size of a penny, the thin, square patch contains more than a hundred tiny, painless needles that supply the wearer with insulin as needed. This potential treatment could help to ensure consistent blood-sugar levels — and spare patients regular injections.

Gu, who has been honored as one of MIT Technology Review’s “Innovators Under 35” for his work with innovative drug-delivery systems, received $4.6 million in funding from JDRF (formerly the Juvenile Diabetes Research Foundation) and multinational pharmaceutical company Sanofi for the project. The patch is currently in animal trials. Gu is also working on patches to deliver melanoma drugs directly to tumor sites and to deliver blood thinners as needed to prevent blood clots.

Walking wearables

Amputees have always been among the earliest adopters of wearable technology, as even minor advances in prosthetics can markedly improve their mobility. Helen Huang, associate professor of biomedical engineering and director of the Rehabilitation Engineering Core in the UNC/NC State Joint Department of Biomedical Engineering, has made it her mission to develop the next generation of powered prosthetic limbs.

Huang’s projects include software that allows powered prosthetics to tune themselves automatically, making the devices more responsive and lowering the costs associated with powered prosthetic use.

“People are dynamic — a patient’s physical condition may change as he or she becomes accustomed to a prosthetic leg, for example, or they may gain weight,” said Huang. “These changes mean the prosthetic needs to be re-tuned, and working with a prosthetist takes time and money.”

Huang’s team has also worked on technology that translates electrical signals in human muscles into signals that control powered prosthetic limbs — enabling sensors in the prosthetics to follow simple cues from the user’s brain such as “open hand” or “close hand.”

A bright idea for safety

For College of Textiles alumnus Jeremy Wall, a near miss with a car while he was riding his bike one night became an unexpected source of inspiration: He now heads a company, Lumenus, that’s developing clothing and accessories with embedded smart LED lighting.

Wall, a 2014 graduate in fashion and textile management, began working on his tech with the help of an undergraduate research scholarship while he was still a student. His goal was to help cyclists, motorcyclists and runners be more visible to motorists at night while staying stylish and functional during the day.

The company will soon hit the market with apparel and accessories including jackets, vests, leggings, backpacks and armbands. It’s also licensing its technology to companies such as backpack manufacturer Timbuk2 and working with the Department of Defense to develop sensors for military gear.

Lumenus has also created an app that adds extra features to the apparel. For example, the wearer can enter a destination on the app, and the LED lights on the garment will flash strategically at intersections or other potentially hazardous points along the route.

Wall recently returned to NC State for help getting his company off the ground, enlisting three College of Textiles undergraduates to work with Lumenus as part of their senior design project.

Ultratech, Inc. (Nasdaq: UTEK), a supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced that the Laboratory for Emerging and Exploratory Devices (LEED), led by Professor Sayeef Salahuddin, Ph.D. of the Electrical Engineering and Computer Sciences Department at UC Berkeley (EECS UC Berkeley), has chosen the Ultratech-CNT Fiji G2 PEALD system as its instrument of choice for its research activities. Professor Salahuddin was recently honored at the White House by President Barack Obama for his work in developing nano-scale electronic and spintronic devices for low power logic and memory applications.

“ALD provides an exciting way of accessing ferroelectric materials, which play a key role in these types of devices, by providing a means of controlling the film properties through the precise engineering of the composition,” noted Professor Salahuddin. “This has led the way for us to explore the ferroelectric properties of rare earth oxides, such as Hafnium oxide, by adding a variety of dopants, such as silicon (Si), aluminum (Al), and yttrium (Y). Our decision in choosing the Fiji system was motivated not only by the system’s performance, and flexibility but also because of the strong reputation that the Ultratech ALD team has for R&D expertise, coupled with its excellent support.”

Adam Bertuch, senior thin film scientist at Ultratech-CNT, who has played a key role in the development of PEALD oxides at the company, said, “The Fiji is an extremely versatile instrument, which has been at the leading edge of the development of complex materials. Professor Salahuddin’s work in the field of ferroelectric materials speaks for itself, and we are looking forward to having a strong collaborative relationship with him, as well as his scientific group at UC Berkeley.”

Ultratech Fiji G2 ALD System

For advanced thin films, the Fiji series is a modular, high-vacuum ALD system that accommodates a wide range of deposition modes using a flexible architecture and multiple configurations of precursors and plasma gases. The result is a next-generation ALD system capable of performing thermal and plasma-enhanced deposition. Ultratech CNT has applied advanced computational fluid dynamics analyses to optimize the Fiji reactor, heaters, and vapor trap geometries. The system’s intuitive interface makes it easy to monitor and change recipes and processes as required. The Fiji is available in several different configurations, with up to six heated precursor ports that can accommodate solid, liquid or gas precursors, and up to six plasma gas lines. Options include a built-in ozone generator, Load Lock as well as several in-situ analysis tools, which offer significant experimental flexibility in a compact and affordable footprint.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $30.5 billion for the month of October 2016, an increase of 3.4 percent from last month’s total of $29.5 billion and 5.1 percent higher than the October 2015 total of $29.0 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, a new WSTS industry forecast projects roughly flat annual semiconductor sales in 2016, followed by slight market growth in 2017 and 2018.

“The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Sales increased compared to last month across all regional markets and nearly every major semiconductor product category. Meanwhile, the latest industry forecast has been revised upward and now calls for flat annual sales in 2016 and small increases in 2017 and 2018. All told, the industry is well-positioned for a strong close to 2016.

Regionally, year-to-year sales increased in China (14.0 percent), Japan (7.2 percent), Asia Pacific/All Other (1.9 percent), and the Americas (0.1 percent), but decreased in Europe (-3.0 percent). Compared with last month, sales were up across all regional markets: the Americas (6.5 percent), China (3.2 percent), Japan (3.0 percent), Europe (2.2 percent), and Asia Pacific/All Other (2.0 percent).

Additionally, SIA today endorsed the WSTS Autumn 2016 global semiconductor sales forecast, which projects the industry’s worldwide sales will be $335.0 billion in 2016, a 0.1 percent decrease from the 2015 sales total. WSTS projects a year-to-year increase in Japan (3.2 percent) and Asia Pacific (2.5 percent), with decreases expected in Europe (-4.9 percent) and the Americas (-6.5 percent). Among major semiconductor product categories, WSTS forecasts growth in 2016 for sensors (22.6 percent), discretes (4.2 percent), analog (4.8 percent) and MOS micro ICs (2.3 percent), which include microprocessors and microcontrollers.

Beyond 2016, the semiconductor market is expected to grow at a modest pace across all regions. WSTS forecasts 3.3 percent growth globally for 2017 ($346.1 billion in total sales) and 2.3 percent growth for 2018 ($354.0 billion). WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

Leti, an institute of CEA Tech, has developed a new light-sensing device that integrates photodiodes below the buried oxide (BOX) of FDSOI transistors, making the transistors very sensitive to visible light.

Presented today during IEDM 2016 in the paper, “Extending the Functionality of FDSOI N- and P-FETs to Light Sensing,” the innovative device architecture uses capacitive coupling, which doesn’t necessarily require an electrical connection between the transistor and the diode. Leti said preliminary results show that sensitivity in the visible spectrum is already better than 0.1pW/µm2, with a wide dynamic range (seven orders of magnitude, i.e. similar to most advanced CMOS image sensors).

“FDSOI is a very versatile technology that already has been shown to be ‘faster, cooler, and simpler’ than FinFET, and which also may become smarter for More than Moore applications such as imaging,” said Lina Kadura, who presented the paper. “In fact, it may be smarter for sensing generally, because FDSOI transistors can be considered as very small footprint probes that are sensitive to the electric potential below the BOX.”

In addition to embedding more light-sensing functionality in circuits, potential future applications include leveraging pixel size in image sensors.

In other results of the study, Leti demonstrated for the first time that SRAM cell characteristics can be controlled by light illumination. Leti also said that with capacitive coupling, light absorption in the diode integrated below the BOX leads to light-induced voltage-threshold (VT) shift of the transistor above the BOX, which means that forward optical back-biasing and reverse optical back-biasing are possible, depending on the diode polarity. In addition, the response of the system is logarithmic with light illumination, similar to the response of human vision.

ClassOne Technology, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates, has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand.

“We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt. “Most of these users are now focusing on capabilities they couldn’t get before, like wafer-level packaging and More than Moore technologies.”

Witt explained that wafer-level packaging (WLP) has been used for some time with 300mm and larger substrates — but the equipment has not been available for 200mm. “Fortunately, ClassOne focuses specifically on the smaller-wafer markets,” said Witt. “At a very affordable price, we deliver the new technology and advanced 3D features they’re looking for. For example, our Solstice® line of multifunctional electroplating systems enables high-efficiency Cu Through Silicon Via (TSV), Pillar, Bump and Barrier Plating and other capabilities that WLP requires. And that’s one major reason they’re coming to us.”

ClassOne reports that many of the new buyers are keenly interested in More than Moore (MtM) technologies to increase functionality while reducing cost per device. They are producing compound semiconductors, LEDs, MEMS, RF, Wi-Fi and a range of IoT-related sensors and other devices. ClassOne cites the combination of ≤200mm-specific tools, advanced capabilities and affordable pricing as the primary driver behind the current equipment-buying surge in emerging markets.

ClassOne Technology offers a selection of new-technology wet processing tools designed for 75mm to 200mm wafer users. These include three different models of Solstice electroplating systems for production and development as well as the Trident families of Spin-Rinse-Dryers and Spray Solvent Tools. All are priced at less than half of what similarly configured systems from the larger manufacturers would cost — which is why the ClassOne lines are often described as delivering “Advanced Wet Processing for the Rest of Us.”

Within a highly competitive landscape due to a strong price pressure, most of the LED companies are looking for business opportunities and adopt different strategies of development. Vertical integration, product, application and activity diversification. New relays of growth are required for LED players to survive.

From a packaging point of view, more and more packaged LED manufacturers selected the vertical integration strategy to move towards the module level and add more and more value in their LED components.

Under the new report titled LED Packaging 2016: Market, Technology and Industry Landscape report, Yole Développement (Yole) reviews the LED industry and market status. The “More than Moore” market research and strategy consulting company Yole, details process flows and related technologies in LED packaging. Yole proposes also a comprehensive analysis of the cost reduction and its impact at the LED packaging level.

According to Yole’s analysts, the packaged LED market represented a revenue of nearly US$15.7 billion in 2015. This industry should grow to a size of nearly US$18.2 billion by 2020.

led packaging revenue

Following the overcapacity caused by the recent LED TV crisis and the entry of Chinese players, industry consolidation was expected to decrease competition and stabilize price erosion. This eventually happened in China during 2014 and 2015, but with unforeseen effects on the overall industry. Indeed, several smaller players went bankrupt and many midsize players have since been acquired, leading to a situation where dozens of companies are having “going-out-of business” sales. This has triggered strong price decline and, naturally, other LED players had no choice but to match the price trend initiated by the Chinese industry.

ASP for low and mid power LEDs declined 30% – 40% in the second half of 2015. In parallel ASP for high power LEDs, though less affected, still declined 20% – 30%. Globally, 2015 was a rough year for the LED industry, with packaged LED revenue declining for the first time ever: from US$15.1 billion in 2014 to US$15 billion in 2015.

This decrease was emphasized by lower-than anticipated demand in the LED backlight and LED lighting markets. Moreover, strong evolution in currency exchange rates due to the US dollar’s rise contributed to many players’ declining revenue.

2016 has seen the industry begin recovering, and packaged LED ASPs have mostly stabilized for highly-commoditized stock keeping units like the low-power 2835 and mid-power 5630.

Higher power grades for lighting applications are seeing increasing demand, but also stiffer competition, which likely will lead to a significant ASP drop as competition intensifies.

“Thus we expect the packaged LED market to show moderate growth in the coming years, reaching US$18.5 billion in 2021 (CAGR 2016 – 2021: +3.4%)”, explains Pars Mukish, Business Unit Manager at Yole. 

LED packaging market is still a strong opportunity for materials suppliers. Indeed, LED packaging requires specific materials in agreement with application requirements.

Regarding packaging substrates, the high power density of devices induces the use of ceramic substrates, a market that will grow from nearly US$684 million in 2015 to US$813 million in 2021, according to Yole’s LED packaging report.

Encapsulant/optic materials will follow the same trend: Yole’s analysts announce US$400 million in 2015 and US$526 million in 2021. This market segment is driven mostly by the increased use of silicone material offering better reliability/lifetime than traditional epoxy material.

In parallel, with major YAG IP expiring from 2017, the phosphor market will face strong commoditization and price pressure. Consequently, market will only grow from nearly US$339 million in 2015 to US$346 million in 2021.

The LED packaging report (2016 edition) provides a comprehensive overview of all LED packaging aspects. Each step of the packaging process flow including equipment and materials used is described, along with associated trends. Associated technological breakthroughs are also analysed.

Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul. SEMICON Korea 2017 is the bellwether event for advanced memory, electronics manufacturing, and breaking technology developments, deep technical forums, business programs and Standards activities.

Each year, companies exhibit at SEMICON Korea ─ to the full capacity of the COEX facility ─ to connect with customers and decision makers, demonstrate product and technology leadership and expand their brand.

On opening day (February 8) of SEMICON Korea, three industry thought leaders will keynote on the future of the global semiconductor industry:

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The exposition includes valuable specific technical networking and business programs that are always very popular as they give insight into the full Korea electronics manufacturing ecosystem.

  • Supplier Search – featuring the world’s leading materials manufacturers
  • OEM Supplier Search – facilitating business cooperation between global suppliers and Korea’s parts manufacturers
  • Presidents Reception – an exclusive VIP networking event with more than 450 global industry leaders, that have been contributing to the growth of the Korea semiconductor industry for over 30 years.

SEMICON Korea 2017 is the leading semiconductor technology event in Korea. Major programs include: Smart Manufacturing Forum, SEMI Technology Symposium, System LSI Forum, Metrology and Inspection Forum, Test Forum, Market Seminar and more. The event is an opportunity to meet and learn from more 100 global experts. A complete schedule of the program is available here:
www.semiconkorea.org/en/attend/program-sessions

New this year, 32 companies will showcase their innovations in the new LED Pavilion at SEMICON Korea 2017, an opportunity to meet the entire LED supply chain.

Complimentary registration for SEMICON Korea 2017, which includes access to the exhibition hall and keynote attendance, opens tomorrow, November 16 (www.semiconkorea.org/en/attend/registration) and closes on February 1, 2017.

Today, SEMI announced that Innovation Village at SEMICON Japan 2016 has been expanded with participation by 31 start-up companies. SEMICON Japan, held December 14-16 at Tokyo Big Sight in Tokyo, is already the largest and most important gathering of the electronics manufacturing supply chain in Japan. With added exhibition and programming for innovation in the expanded Innovation Village this year, attendees will gain access to early high-tech startups and strategic investors ─ the driving force for future growth of the electronics supply chain. Click here to register for SEMICON Japan exhibition and conference programs.

SEMICON Japan 2016 Innovation Village includes:

  • TechSTAGE Start-up Pitches: from 31 start-up companies including: Adawarprobotics (opensource library for telepresence robot), ArtifactNoise (environmental measurements), Inupathy (a smart communication device for dogs), Osaka University (plasma nanomanufacturing), PixieDust Technologies (ultrasonic waves to generate a sound point source in air), primesap (a smart remote nursing system), Simulatio (AI that processes both natural languages and formulas), Trybots (a penguin robot), Yamanashi Thin Film Technology Developments (zinc oxide films) and ZaaZ (a scent device for head mounted displays).
  • Tabletop exhibition area: start-ups will describe new ideas, technologies, products, and services with attendees.
  • Innovate Reception: results revealed from the pitch contest and a networking opportunity for start-up companies seeking investment capital or strategic industry partners.
  • IoT and Innovation Village Joint Session on “Manufacturing Startups Today”: with a keynote by Junichi Hasegawa of Preferred Networks on “Industrial Revolution Led by Deep Learning” and panel discussion ─ with CEO panelists from AgIC, BONX, and SORACOM ─ moderated by Ken Nishimura of AOL Online Japan.

Innovation Village attendees will gain key insights into new technologies and products, advanced research solutions, investment opportunities, as well as technology transfer and partnerships opportunities.

Osamu Nakamura, president of SEMI Japan, said, “Our industry is driven by innovation. During the four decades of SEMICON Japan history, continuous innovation has moved our industry forward. The Japan semiconductor industry has increased its diversity in processes and product portfolio as well. As we face unprecedented changes, the industry is in need of new innovations to enable us to serve the smart and creative world of today and tomorrow. This year’s Innovation Village at SEMICON Japan will help fuel our industry with new ideas.”

Register now for SEMICON Japan. For a detailed agenda ─ including keynotes, SuperTHEATER, TechSTAGE, IoT sessions, SEMI Market Forum, Sustainable Manufacturing, 200mm Market,  networking events, and standards meetings ─ please see the “SEMICON Japan Schedule-at-a-Glance.”

SEMICON Japan’s Innovation Village is sponsored by: DMM.com, Japan Venture Capital Association, JSR, Leave a Nest, Japan Research Institute, and Tokyo Ohka Kogyo.

For the first time, researchers have created light-emitting diodes (LEDs) on lightweight flexible metal foil.

Engineers at The Ohio State University are developing the foil based LEDs for portable ultraviolet (UV) lights that soldiers and others can use to purify drinking water and sterilize medical equipment.

Nanowires were grown on titanium foil at The Ohio State University. CREDIT: Image by Brelon J. May, courtesy of The Ohio State University.

Nanowires were grown on titanium foil at The Ohio State University. Credit: Image by Brelon J. May, courtesy of The Ohio State University.

In the journal Applied Physics Letters, the researchers describe how they designed the LEDs to shine in the high-energy “deep” end of the UV spectrum. The university will license the technology to industry for further development.

Deep UV light is already used by the military, humanitarian organizations and industry for applications ranging from detection of biological agents to curing plastics, explained Roberto Myers, associate professor of materials science and engineering at Ohio State.

The problem is that conventional deep-UV lamps are too heavy to easily carry around.

“Right now, if you want to make deep ultraviolet light, you’ve got to use mercury lamps,” said Myers, who is also an associate professor of electrical and computer engineering. “Mercury is toxic and the lamps are bulky and electrically inefficient. LEDs, on the other hand, are really efficient, so if we could make UV LEDs that are safe and portable and cheap, we could make safe drinking water wherever we need it.”

He noted that other research groups have fabricated deep-UV LEDs at the laboratory scale, but only by using extremely pure, rigid single-crystal semiconductors as substrates–a strategy that imposes an enormous cost barrier for industry.

Foil-based nanotechnology could enable large-scale production of a lighter, cheaper and more environmentally friendly deep-UV LED. But Myers and materials science doctoral student Brelon J. May hope that their technology will do something more: turn a niche research field known as nanophotonics into a viable industry.

“People always said that nanophotonics will never be commercially important, because you can’t scale them up. Well, now we can. We can make a sheet of them if we want,” Myers said. “That means we can consider nanophotonics for large-scale manufacturing.”

In part, this new development relies on a well-established semiconductor growth technique known as molecular beam epitaxy, in which vaporized elemental materials settle on a surface and self-organize into layers or nanostructures. The Ohio State researchers used this technique to grow a carpet of tightly packed aluminum gallium nitride wires on pieces of metal foil such as titanium and tantalum.

The individual wires measure about 200 nanometers tall and about 20-50 nanometers in diameter–thousands of times narrower than a human hair and invisible to the naked eye.

In laboratory tests, the nanowires grown on metal foils lit up nearly as brightly as those manufactured on the more expensive and less flexible single-crystal silicon.

The researchers are working to make the nanowire LEDs even brighter, and will next try to grow the wires on foils made from more common metals, including steel and aluminum.

The latest Research and Markets report, “North America Light Emitting Diode (LED) Market (2016-2022)”,  indicates that the North American LED market is expected to reach $11,702.6 Million by 2022 growing at a CAGR of 9.7% during the forecast period.

The General lighting market dominated the North America LED market in 2015, and that trend is expected to continue until 2022, thereby achieving a market value of $ 4,563.6 Million by 2022 growing at a CAGR of 9.5% during the forecast period. The Automotive market is expected to reach a market size of $1,663.5 Million by 2022.

The U.S market dominated the North America LED market in 2015 and would continue until 2022 thereby achieving a market value of $ 8,683.3 Million by 2022 growing at a CAGR of 8.8% during the forecast period. The Canada application market is expected to reach a market size of $1,755.4 Million by 2022. The Mexico market would witness the growth rate of 14.2% during 2016-2022.

High brightness LEDs (HB-LEDs) are widely used in automotive, signals and signage in the North American region. Major mobile companies such as Apple Corporation have incorporated Organic LEDs (O-LED) in their mobile phones, which will contribute to the growth of the LED market. With widespread adoption in North America, the emerging economies also have started using LEDs in various applications, which should further add to the market growth, offering tremendous opportunities for the LED market players to enter into the LED market.