Category Archives: LEDs

Veeco Instruments Inc., a supplier of metal organic chemical vapor deposition (MOCVD) systems, announced today that it has signed a joint development project (JDP) agreement with imec, the Belgium-based nano-electronics research center. The collaboration is expected to accelerate the development of highly-efficient, Gallium Nitride (GaN) based, power electronic devices using GaN Epi wafers created using Veeco’s Propel Power GaN MOCVD system.

Imec has already demonstrated significant gains in GaN layer uniformity and run-to-run repeatability with Veeco’s Propel system, resulting in significantly improved power device yields. The single wafer reactor incorporates Veeco’s proprietary TurboDisc technology that delivers superior film uniformity, run-to-run control and defect levels compared to batch reactors.

“Within the framework of our industrial affiliation program on GaN-on-Si, Veeco and imec have collaborated over the last four years to improve the Epi quality of GaN layers deposited on silicon wafer substrates,” said Rudi Cartuyvels, Senior Vice President Smart Systems and Energy Technologies at imec. “The ultimate goal is to produce the next generation of highly efficient power switching devices. We have set very high GaN device yield and reliability targets for 2016 and we look forward to partnering with Veeco to achieve these targets.”

According to IHS research, industry requirements are growing and requiring smaller, more energy efficient power ICs. This, in turn, is driving the need for improved power devices using advanced materials. GaN-on-Si coupled with improved process solutions, such as single-wafer GaN MOCVD, are critical to the development of these improved power devices.

“We are very pleased with our imec collaboration,” said Jim Jenson, Senior Vice President and General Manager, Veeco MOCVD Operations. “Global demand for advanced power electronics with greater energy efficiency, a smaller form factor and greater reliability is rapidly accelerating. We believe that the technology in our Propel single wafer system will enable imec to achieve their power device targets and help to bring these advanced devices to market faster.”

Ultratech, Inc., a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high­brightness LEDs (HB­ LEDs), as well as atomic layer deposition (ALD) systems, announced the promotion of two of its executives. Tammy D. Landon, Senior Vice President of Operations, and Dave Ghosh, Senior Vice President, Global Sales and Service, have been promoted to be executive officers at Ultratech. These promotions are an example of the company’s ongoing leadership succession process and efforts to cultivate top industry talent at Ultratech.

Ultratech Chairman and CEO Arthur W. Zafiropoulo, who remains the company’s principal operating officer said, “I congratulate both Tammy and Dave as they are both deserving of their respective promotions.  Tammy joined Ultratech in 2000, and her level of leadership and expertise have earned her the role of executive officer.  For this executive officer position, Dave will be leveraging his experience from the various responsibilities he has had at Ultratech since 1989.  Healthy companies both retain top talent and implement leadership plans as a means to remain competitive. Tammy and Dave each have over 30 years of industry experience, and these promotions are a part of the management process for Ultratech.  I have every confidence that Tammy and Dave will be successful in their new roles as executive officers, and I look forward to their continued contributions to Ultratech.”

Tammy D. Landon, Senior Vice President of Operations, Ultratech, Inc.
Landon joined Ultratech in 2000.  During this time, she had multiple responsibilities that included manufacturing, operations, materials, engineering, quality, training, technical support and installations. More recently, Landon has led the human resources, information technology and corporate services within the company. Her background includes more than 30 years of manufacturing, project management and engineering positions in the semiconductor and defense industries. Landon has a bachelor’s degree in biochemistry as well as a bachelor’s degree in industrial technology from California Polytechnic State University, San Luis Obispo.

Dave Ghosh, Senior Vice President Global Sales and Service, Ultratech, Inc.
Since 1989, Ghosh has served Ultratech in various capacities and has been responsible for risk management, corporate services, real estate, facilities, environment, health and safety, human resources, information technology systems and worldwide service. In addition, he works with the CEO on special projects that include M&A activities, initiating and negotiating with foreign governments for business development and risk management. His experience spans over 30 years in a variety of operations and service positions. Ghosh earned his bachelor’s degree in industrial technology from San Jose State University.

Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry. However, worldwide silicon revenues decreased by 6 percent in 2015 compared to 2014.

Silicon wafer area shipments in 2015 totaled 10,434 million square inches (MSI), up from the previous market high of 10,098 million square inches shipped during 2014. Revenues totaled $7.2 billion down from $7.6 billion posted in 2014. “Semiconductor silicon shipment levels remained strong throughout most of the year, resulting in record volume shipments,” said Dr. Volker Braetsch, chairman SEMI SMG and senior vice oresident of Siltronic AG. “The strength in shipments was not enough to compensate headwinds from further price decline and some exchange rate impact; silicon revenues for the year decreased yet again and are significantly below their market high set in 2007.”

Annual Silicon* Industry Trends

2007

2008

2009

2010

2011

2012

2013

2014

2015
Area Shipments (MSI)

8,661

8,137

6,707

9,370

9,043

9,031

9,067

10,098

10,434
Revenues ($B)

12.1

11.4

6.7

9.7

9.9

8.7

7.5

7.6

7.2

*Shipments are for semiconductor applications only and do not include solar applications

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or “chips” are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturers Group acts as an independent special interest group within SEMI and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region, and by product type through 2020.

Researchers estimate that there are about 80,000 earthquakes globally each year, but most are too minor to notice. The Great East Japan Earthquake (a.k.a., 2011 Tohoku Earthquake) and subsequent tsunami that struck east of Sendai on March 11, 2011 caused substantial loss of life and destruction to infrastructure. It was the most powerful earthquake ever to hit Japan and the fifth most powerful in the world since records started being kept in 1900. Many semiconductor fabs, as well as other facilities that support the industry, were significantly damaged by the quake (some were shut down permanently as a result).

Since the earliest days of IC production in Silicon Valley, the IC industry has always had much of its fabrication facilities located in seismically active regions. Moreover, as of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas (defined as areas having moderate to high risk of being significantly impacted by earthquake tremors).

  • Taiwan and Japan accounted for 39% of global IC capacity in December of 2015. Both countries are considered entirely seismically active, and have large amounts of IC capacity exposed to potential earthquake damage.
  • Even though Southeast Asia is generally considered very active seismically, Singapore and Malaysia are actually considered relatively safe from earthquake damage. In China, Beijing is considered to have moderate-to-high seismic risk, but other cities such as Shanghai, Shenzhen, and Wuxi are considered to be “on solid ground.” Similarly, while the Southern part of France has moderate seismic risk, the Central and Northern areas do not.

As shown in Figure 1, 64% of pure-play IC foundry capacity is located in seismically active regions. Since two of the largest pure-play IC foundries in the world (TSMC and UMC) have such a significant presence in Taiwan, a disastrous earthquake or typhoon in that country would have serious ramifications for the entire electronics supply chain. In fact, because IC foundries have so many different customers and are sole-source producers for such a wide variety of part types, the ramifications of damage to IC foundry fabrication facilities would be much greater than damage done to individual IDM IC fabs.

Figure 1

Figure 1

A few years ago, IC Insights was contracted to perform a proprietary market research report for a large insurance company.  This company wanted to develop a model that showed how much in electronic system sales would be lost if the fabs in Taiwan were shut down for one, two, or three months due to damage caused by an earthquake or typhoon.  When considering only the Hsinchu Science Park, which is home to about 45% of the island nation’s total wafer capacity, it was determined that, for each month of net loss resulting from the Hsinchu fabs being out of operation, a $9.3 billion net negative effect would be exerted on worldwide electronic system sales!

Although the IC industry has always had the majority of its fabrication capacity located in “dangerous” areas, most buyers of ICs don’t give this a second thought.  Ultimately, all that really can be said about the ability to predict devastating natural disasters is that everything is just “fine” until one day it isn’t. However, while these tragic events are impossible to predict, they are not impossible to plan for.  The Great East Japan Earthquake should have been a wake-up call to spur the entire electronics supply chain to create new contingency plans, just in case.

Semiconductor equipment manufacturer ClassOne Technology announced the purchase of its Solstice S8 electroplating system by one of the world’s leading LED manufacturers.

“The unique flexibility and process control of the Solstice electroplating system were particularly important factors in addressing this customer’s needs,” said Kevin Witt, Chief Technology Officer of ClassOne Technology. “The fully-automated 8-chamber Solstice gives users the ability to process multiple wafer sizes at the same time on a single tool. ClassOne’s distinctive design allows the chambers to be changed very quickly and easily. In addition, Solstice can provide a high degree of whole-process control, enabling close monitoring of such parameters as film stress.”

“ClassOne’s level of support for the tool in Europe was another significant factor in making the sale,” said Byron Exarcos, President of ClassOne Technology. “At this installation we will be providing not only product service but also ongoing process development assistance. We’re proud that Solstice was selected to help produce some of the most advanced next-generation LED products on the planet.”

Solstice systems are designed to provide high-performance electroplating on ≤200mm wafers at a very reasonable cost. Because of their superior performance/price ratio — as well as their ability to handle smaller substrates — Solstice plating tools have become very popular in emerging markets such as LED, MEMS, RF, power, and sensors. ClassOne’s electroplaters allow users to deposit a broad range of metals and alloys on both opaque and transparent substrates. The Solstice systems are available in fully-automated, 75-wph, 4- and 8-chamber configurations — as well as a smaller, semi-automated tool for process development.

The Semiconductor Industry Association (SIA) today announced the global semiconductor industry posted sales totaling $335.2 billion in 2015, a slight decrease of 0.2 percent compared to the 2014 total, which was the industry’s highest-ever sales total. Global sales for the month of December 2015 reached $27.6 billion, down 4.4 percent compared to the previous month and 5.2 percent lower than sales from December 2014. Fourth quarter sales of $82.9 billion were 5.2 percent lower than the total of $87.4 billionfrom the fourth quarter of 2014. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Despite formidable headwinds, the global semiconductor industry posted solid sales in 2015, although falling just short of the record total from 2014,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Factors that limited more robust sales in 2015 include softening demand, the strength of the dollar, and normal market trends and cyclicality. In spite of these challenges, modest market growth is projected for 2016.”

Several semiconductor product segments stood out in 2015. Logic was the largest semiconductor category by sales with $90.8 billionin 2015, or 27 percent of the total semiconductor market. Memory ($77.2 billion) and micro-ICs ($61.3 billion) – a category that includes microprocessors – rounded out the top three segments in terms of total sales. Optoelectronics was the fastest growing segment, increasing 11.3 percent in 2015. Other product segments that posted increased sales in 2015 include sensors and actuators, which reached $8.8 billion in sales for a 3.7 percent annual increase, NAND flash memory ($28.8 billion/2.2 percent increase), and analog ($45.2 billion/1.9 percent increase).

Regionally, annual sales increased 7.7 percent in China, leading all regional markets. All other regional markets – the Americas (-0.8 percent), Europe (-8.5 percent), Japan (-10.7 percent), and Asia Pacific/All Other (-0.2 percent) – saw decreased sales compared to 2014.

“The semiconductor industry is critically important to the U.S. economy and our global competitiveness,” continued Neuffer. “We urge Congress to enact polices in 2016 that promote innovation and growth. One such initiative is the Trans-Pacific Partnership (TPP), a landmark agreement that would tear down myriad barriers to trade with countries in the Asia-Pacific. The TPP is good for the semiconductor industry, the tech sector, the American economy, and the global economy. Congress should approve it.”

December 2015

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

6.07

5.75

-5.2%

Europe

2.93

2.77

-5.7%

Japan

2.68

2.57

-4.1%

China

8.67

8.45

-2.5%

Asia Pacific/All Other

8.53

8.08

-5.3%

Total

28.88

27.62

-4.4%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

6.73

5.75

-14.5%

Europe

3.01

2.77

-7.9%

Japan

2.80

2.57

-8.1%

China

8.03

8.45

5.2%

Asia Pacific/All Other

8.57

8.08

-5.7%

Total

29.13

27.62

-5.2%

Three-Month-Moving Average Sales

Market

Jul/Aug/Sep

Oct/Nov/Dec

% Change

Americas

5.82

5.75

-1.2%

Europe

2.87

2.77

-3.6%

Japan

2.69

2.57

-4.3%

China

8.45

8.45

0.0%

Asia Pacific/All Other

8.58

8.08

-5.8%

Total

28.41

27.62

-2.8%

By Christian G. Dieseldorff, Industry Research & Statistics Group, SEMI (January 25, 2016)

The industry’s first and only ‘Global 200mm Fab Outlook report to 2018’ reveals a change in the landscape for 200mm fab capacity.

Figure 1

In comparing 2006 versus 2018, memory capacity share of 200mm has declined to just about 2% as most memory production has migrated to 300mm fabs . A similar transition to 300mm has occurred in Logic/MPU device production.

On the other hand, we see strong 200mm capacity growth from Discrete/Power, MEMS, and Analog segments in part to the transition from 150mm production to 200mm production. Foundry has also been gaining share, driven by strong demand for PMIC, display driver IC, CMOS image sensor, MCU, MEMS, and other devices requiring >90nm process technology. These device technologies are cited as key components for many IoT applications.

Based on these observations, the IoT wave appears to be breathing new life into 200mm fabs. Before the advent of the IoT movement began, 2012 data suggested a decline in 200mm fabs. However, comparing the worldwide installed capacity for 200mm in 6 year intervals, we expect capacity to return to 2006 levels by 2018.

Figure 2

A number of 200mm fab projects globally are being expanded or built through the end of 2018, resulting in capacity growth through the end of that year.

The 200mm Fab Outlook report to 2018 is the industry’s first and one-of-a kind 200mm fab outlook report. It features analysis and forecasts (tables, graphs and text) in over 80 pages in Adobe Acrobat, accompanied by detailed data in an Excel spreadsheet.

This report is of critical interest to anyone who participates in the 200mm device manufacturing supply chain. The Global 200mm Fab Outlook report analyzes past trends and explores future trends out to 2018, extending the forecast period of our existing Fab Database reports.

In this new report, SEMI tracks over 200 facilities manufacturing devices on 200mm wafers, including those that are planned, under construction, installing new equipment, active, closing, or closed.  Over 110 individual companies or institutions are covered. Fab information detailed in the report includes geographic location, amount of equipment spending, capacity trends, and product type changes.

Here are some of the key highlights from the report:

  • Trend of 200mm fab count and capacity out to 2018 (compared to 150mm and 300mm)
  • 200mm Silicon wafer shipment trends
  • Capacity addition by existing and new fabs out to 2018
  • Fabs changing from smaller wafer sizes to 200mm
  • Fabs changing from 200mm to other wafer sizes (like 300mm)
  • Fabs closed (and still closed), will be closed and may be closed by region and product type
  • Fabs/lines starting operation
  • Fabs/lines losing capacity
  • Change of landscape 2006 vs 2018: capacity by region, product type and technology node
  • Top 20 companies adding capacity 2015 to 2018
  • Capacity by region 2015 to 2018
  • Capacity by product type 2015 to 2018
  • Top 20 companies for equipment spending 2015 to 2018
  • Change of landscape equipment spending 2006 vs 2018

For more information on SEMI market research and reports, visit: www.semi.org/en/MarketInfo

The global value of quantum dot markets was $306 million USD in 2014 and is expected at $4.6 billion USD over the forecast period due to the subsequent generation device, display, and system activated by quantum dot, according to a new report released this week by Radiant Insights. Semiconductor revolution is represented by quantum dots which provide complicated functions on the bases of nanoparticles shape. A verity of devices can be made with low-cost due to easy manipulation of the material.

Quantum Dot & Quantum Dot LED market sectors are solar, HDTV 7 displays, ID tags, LED lighting, cancer imaging, telco lasers, and personalized medicine. All sectors are expected to attain amazing expansion, with solar market and TV display technology getting more than $1 billion USD in profits annually by 2021. Qdot cancer imaging attains $750 million USD & quantum dot ID Tags reach $700 million USD over the forecast period.

Quantum dot market is growing rapidly. Technology maturity force is the key drive to the market. Solar quantum dots, fuel cell catalysts, TV displays, and a variety of applications depend on the aptitude to quantum dot time to time in enough amount needed for commercial purpose. One of the foremost applications of quantum dots commercially was the display of large screens and is proven to be a very good market.

According to a new market research report “Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LEDs, Interposers, and Logic), and Region – Global trend and Forecast to 2022,” published by marketsandmarkets, the market was valued $6.76 Billion in 2015 and estimated to reach $9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022.

Factors such as growth in the semiconductor industry, reduction in the size of electronic devices, growing mobile and consumer electronic markets, and high amount of material saving are key drivers for the growth of the thin wafer market. Moreover, the growing IC industry in China and high adoption of portable devices provide a huge opportunity for further growth of this market.

300mm wafer expected to lead the thin wafer market

The 300mm wafer is widely used in the manufacturing of semiconductor devices due to its high production capacity among all other wafers. This wafer size is expected to exhibit highest growth during the forecast period. It offers the ability to manufacture a large number of devices in a single batch. This is one of the reasons companies are developing their semiconductor devices on this wafer.

The market for application in LEDs expected to grow at the highest CAGR between 2016 and 2022 

The LED application is expected to grow at the highest CAGR between 2016 and 2022. The miniaturization of electronic devices has positively impacted the thin wafer market growth. A thin wafer offers high conductivity and electrical benefits for LED chips. These benefits drive the thin wafer market for LEDs.

APAC expected to hold the largest market share and grow at a high CAGR during forecast period 

APAC accounted for the largest share in the Thin Wafer Market in 2014; this market is expected to grow at the highest CAGR between 2016 and 2022. The growth is attributed to increasing industrialization and urbanization in the region. Further, the increasing semiconductor manufacturing capacity in countries such as China, Taiwan, and South Korea are key factors responsible for the increasing adoption of the thin wafer market.

Major players operating in this market are LG Siltronic, Inc. (South Korea), Shin-Etsu Chemical Co. (Japan), Siltronic AG (Germany), Sumco Corporation (Japan), Sunedision Semiconductor Ltd. (U.S.), SUSS Microtec AG (Germany), Lintec Corporation (Japan), Disco Corporation (Japan), 3M (U.S.), Applied Materials, Inc. (U.S.), Nissan Chemical Corporation (Japan), Synova (Switzerland), EV Group (U.S.), Brewer Science, Inc. (U.S.), and Ulvac GmbH (Germany).

This research report categorizes the global thin wafer market based on wafer size, application, and region. This report describes the drivers, restraints, opportunities, and challenges with respect to the thin wafer market.

North America-based manufacturers of semiconductor equipment posted $1.34 billion in orders worldwide in December 2015 (three-month average basis) and a book-to-bill ratio of 0.99, according to the December EMDS Book-to-Bill Report published today by SEMI.  A book-to-bill of 0.99 means that $99 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in December 2015 was $1.34 billion. The bookings figure is 8.6 percent higher than the final November 2015 level of $1.24 billion, and is 2.8  percent lower than the December 2014 order level of $1.38 billion.

The three-month average of worldwide billings in December 2015 was $1.35 billion. The billings figure is 4.9 percent higher than the final November 2015 level of $1.29 billion, and is 3.2 percent lower than the December 2014 billings level of $1.40 billion.

“Both semiconductor equipment bookings and billings improved in December,” said Denny McGuirk, president and CEO of SEMI.  “Despite softness in the equipment market in the fourth quarter, both annual bookings and billings in 2015 of North American equipment suppliers remained above 2014 levels.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
July 2015

$1,556.2

$1,587.3

1.02
August 2015

$1,575.9

$1,670.1

1.06
September 2015

$1,495.0

$1,554.9

1.04
October 2015

$1,358.6

$1,325.6

0.98
November 2015 (final)

$1,288.3

$1,236.6

0.96
December 2015 (prelim)

$1,351.8

$1,342.7

0.99

Source: SEMI (www.semi.org), January 2016