Category Archives: LEDs

SEMICON Japan 2015, an exhibition in Asia for semiconductor manufacturing and related processing technology, opens tomorrow at Tokyo Big Sight. The exposition and conference offers the latest in technology and innovations for the microelectronics industry, including emerging opportunities in the new World of IoT (Internet of Things). SEMICON Japan (December 16-18) registration is now open for both the exhibition and conference programs.

Japan is uniquely positioned to support the IoT revolution with its large 200mm fab capacity, diverse product mix and leadership in markets such as MCUs, automotive, power devices, sensors and LEDs. SEMICON Japan 2015 connects the players and companies enabling the world of IoT by facilitating communications and partnerships across the microelectronics industry.

Highlights at SEMICON Japan include:

  • The SuperTHEATER at Tokyo Big Sight will offer the Opening Ceremony at 9:40 a.m. Wednesday, and nine forums in three days featuring speakers from: Amazon, Cisco Systems, Fujitsu, Google,Hitachi, IBM, Intel, KLA-Tencor, Micron Technology, Microsoft, Nissan Motors, Rakuten, Renesas Electronics, Sony, Tata Consultancy Services, Toshiba, TSMC, and more.
  • Held in conjunction with SEMICON Japan, WORLD OF IOT, a “show-within-a-show”, offers a platform where semiconductor manufacturing technology intersects with IoT applications. The 65 exhibitors include Amazon Web Services, Dassault Systems, Fujitsu, Hitachi, IBM Research-Tokyo, Intel, Siemens, Tesla Motors, Toshiba Healthcare, Toyota Motors, and more.
  • Two theme pavilions – Sustainable Manufacturing Pavilion, providing solutions focused on sustainability for 200mm technologies, and Manufacturing Innovation Pavilion, showcasing innovations for developing higher performing, faster and lower-cost semiconductor devices – are adjacent in East Hall 1.
  • Showcasing startup pitch presentations and exhibits from early-stage companies, the INNOVATION VILLAGE connects 13 emerging companies with investors and prospective technology partners.

Osamu Nakamura, president of SEMI Japan, said “With the building momentum from the IoT revolution, the Japan semiconductor industry is poised to take advantage of growth within the Japan supply chain. I welcome all of you from the global semiconductor industry to learn about the innovations that will support this growth as you visit the exhibition and participate in the conferences at SEMICON Japan.”

For more information on SEMICON Japan, visit www.semiconjapan.org/en/.

Light and electricity dance a complicated tango in devices like LEDs, solar cells and sensors. A new anti-reflection coating developed by engineers at the University of Illinois at Urbana Champaign, in collaboration with researchers at the University of Massachusetts at Lowell, lets light through without hampering the flow of electricity, a step that could increase efficiency in such devices.

An array of nanopillars etched by thin layer of grate-patterned metal creates a nonreflective surface that could improve electronic device performance. Credit: Image courtesy of Daniel Wasserman

The coating is a specially engraved, nanostructured thin film that allows more light through than a flat surface, yet also provides electrical access to the underlying material – a crucial combination for optoelectronics, devices that convert electricity to light or vice versa. The researchers, led by U. of I. electrical and computer engineering professor Daniel Wasserman, published their findings in the journal Advanced Materials.

“The ability to improve both electrical and optical access to a material is an important step towards higher-efficiency optoelectronic devices,” said Wasserman, a member of the Micro and Nano Technology Laboratory at Illinois.

At the interface between two materials, such as a semiconductor and air, some light is always reflected, Wasserman said. This limits the efficiency of optoelectronic devices. If light is emitted in a semiconductor, some fraction of this light will never escape the semiconductor material. Alternatively, for a sensor or solar cell, some fraction of light will never make it to the detector to be collected and turned into an electrical signal. Researchers use a model called Fresnel’s equations to describe the reflection and transmission at the interface between two materials.

“It has been long known that structuring the surface of a material can increase light transmission,” said study co-author Viktor Podolskiy, a professor at the University of Massachusetts at Lowell. “Among such structures, one of the more interesting is similar to structures found in nature, and is referred to as a ‘moth-eye’ pattern: tiny nanopillars which can ‘beat’ the Fresnel equations at certain wavelengths and angles.”

Although such patterned surfaces aid in light transmission, they hinder electrical transmission, creating a barrier to the underlying electrical material.

“In most cases, the addition of a conducting material to the surface results in absorption and reflection, both of which will degrade device performance,” Wasserman said.

The Illinois and Massachusetts team used a patented method of metal-assisted chemical etching, MacEtch, developed at Illinois by Xiuling Li, U. of I. professor of electrical and computer engineering and co-author of the new paper. The researchers used MacEtch to engrave a patterned metal film into a semiconductor to create an array of tiny nanopillars rising above the metal film. The combination of these “moth-eye” nanopillars and the metal film created a partially coated material that outperformed the untreated semiconductor.

“The nanopillars enhance the optical transmission while the metal film offers electrical contact. Remarkably, we can improve our optical transmission and electrical access simultaneously,” said Runyu Liu, a graduate researcher at Illinois and a co-lead author of the work along with Illinois graduate researcher Xiang Zhao and Massachusetts graduate researcher Christopher Roberts.

The researchers demonstrated that their technique, which results in metal covering roughly half of the surface, can transmit about 90 percent of light to or from the surface. For comparison, the bare, unpatterned surface with no metal can only transmit 70 percent of the light and has no electrical contact.

The researchers also demonstrated their ability to tune the material’s optical properties by adjusting the metal film’s dimensions and how deeply it etches into the semiconductor.

“We are looking to integrate these nanostructured films with optoelectronic devices to demonstrate that we can simultaneously improve both the optical and electronic properties of devices operating at wavelengths from the visible all the way to the far infrared,” Wasserman said.

Worldwide semiconductor fab equipment capital expenditure growth (new and used) for 2015 is expected to be 0.5 percent (total capex of US$35.8 billion), increasing another 2.6 percent (to a total of $36.7 billion) in 2016, according to the latest update of the quarterly SEMI World Fab Forecast report.

SEMI reports that in 2015, Korea outspent all other countries ($9.0 billion) on front-end semiconductor fab equipment, and is expected to drop to second place in 2016 as Taiwan takes over with the largest capex spending at $8.3 billion. In 2015, Americas ranked third in overall regional capex spending with about $5.6 billion and is forecast to increase only slightly to (5.1 percent) in 2016.

fab equipment spending 2016

In 2015, 80 to 90 percent of fab equipment spending went to 300mm fabs, while only 10 percent was for 200mm or smaller.  SEMI’’s recently published “Global 200mm Fab Outlook” provides more detail about past and future 200mm activities.

Examining fab equipment spending by product type, Memory accounts for the largest share in 2015 and 2016.  While 2015’s spending was dominated by DRAM, the SEMI World Fab Forecast reports that 2016 will be dominated by Flash, mainly 3D-related architectures.  Capacity for 3D-NAND will continue to surge. SEMI’’s report tracks 10 major 3D producing facilities, with a capacity expansion of 47 percent in 2015 and 86 percent in 2016.

The Foundry segment is next in terms of the largest share of fab equipment spending in 2015 and 2016.  In general, the foundry segment shows steadier, more predictable spending patterns than other device product segments. Coming in third place in fab equipment spending, MPU had lower spending in 2015.  Logic spending was very strong in 2015, with 90 percent growth, driven by SONY’s CMOS image sensors.

Throughout 2015, SEMI anticipates that there will be 1,167 facilities worldwide investing in semiconductor equipment in 2016, including 56 future facilities across industry segments from Analog, Power, Logic, MPU, Memory, and Foundry to MEMS and LEDs facilities. For further details, please reference to the latest edition of SEMI’s World Fab Forecast report.

Hybrid optoelectronic devices based on blends of hard and soft semiconductors can combine the properties of the two material types, opening the possibility for devices with novel functionality and properties, such as cheap and scalable solution-based processing methods. However, the efficiency of such devices is limited by the relatively slow electronic communication between the material components that relies on charge transfer, which is susceptible to losses occurring at the hybrid interface.

A phenomenon called Förster resonant energy transfer (FRET) was recently theoretically predicted and experimentally observed in hybrid structures combining an inorganic quantum well with a soft semiconductor film. Förster resonant energy transfer is a radiationless transmission of energy that occurs on the nanometer scale from a donor molecule to an acceptor molecule. The process promotes energy rather than charge transfer, providing an alternative contactless pathway that avoids some of the losses caused by charge recombination at the interface.

Now researchers from the University of Cyprus and Cyprus University of Technology, along with colleagues from the University of Crete, Greece have conducted a comprehensive investigation on how various structural and electronic parameters affect FRET in structures of nitride quantum wells with light-emitting polymers. Based on their studies, the researchers discuss the process to optimize the energy transfer process and identify the limitations and implications of the Förster mechanism in practical devices. The work demonstrates the importance of understanding FRET in hybrid structures that could pave the way for developing novel devices such as high-efficiency LEDs and solar cells. The researchers present their work in a paper published this week in the Journal of Chemical Physics, from AIP Publishing.

In the top left is a schematic of Förster Resonant Energy Transfer from a near-surface nitride quantum well to a polymer overlayer. In the top right is fluorescence from solutions containing light emitting polymer materials. In the bottom left high resolution transmission electron microscope image from an InGaN/GaN quantum well. In the bottom right absorption and fluorescence spectra from various polymers used in our study. Credit: Grigorios Itskos/University of Cyprus, Cyprus

In the top left is a schematic of Förster Resonant Energy Transfer from a near-surface nitride quantum well to a polymer overlayer. In the top right is fluorescence from solutions containing light emitting polymer materials. In the bottom left high resolution transmission electron microscope image from an InGaN/GaN quantum well. In the bottom right absorption and fluorescence spectra from various polymers used in our study. Credit: Grigorios Itskos/University of Cyprus, Cyprus

“Pioneering theoretical and experimental work has demonstrated that energy can be efficiently transferred across hybrid semiconductors via the Förster mechanism. However, our understanding is not complete and many material and structural parameters affecting FRET in such hybrids remain unexplored. Our work employs for a first time a comprehensive approach that combines fabrication, theoretical modeling and optical spectroscopy to fully understand FRET in a nitride quantum well-polymer hybrid structure,” said Grigorios Itskos, the primary researcher and an assistant professor from the Department of Physics at the University of Cyprus.

“We used a systematic approach to optimize the FRET efficiency by tuning various parameters of the nitride quantum well component. The process allowed us to study unexplored aspects of the mechanism and identify competing mechanisms that limit the energy transfer efficiency in hybrid planar structures. The outcome of our investigation can guide future efforts towards a rational design of hybrid geometries that can optimize FRET and limit competing losses to render FRET-based devices feasible,” he said.

Itskos noted that the researchers chose to study structures based on nitrides because the material is well-researched and is used in niche applications such as blue light emitting LEDs. “However, the functionality [of nitride structures] can be further increased by combining them with other soft semiconductors such as light-emitting polymers. The spectral tunability and high light-absorption and emitting efficiency of the polymers can be exploited to demonstrate efficient down-conversion of the blue nitride emission, providing a scheme for efficient hybrid LEDs,” Itskos said.

In the study, the researchers initially sought to produce and study near-surface nitride quantum wells to allow a close proximity with the light-emitting polymer deposited on their top surface.

“The nanoscale proximity promotes efficient interactions between the excitations of the two materials, leading to fast Förster transfer that can compete with the intrinsic recombination of the excitations,” Itskos explained. Förster resonant energy transfer is a strongly distance-dependent process which occurs over a scale of typically 1 to 10 nanometers. The contactless pathway of energy transmission could avoid energy losses associated with charge recombination and transport in hybrid structures.

Using a sequence of growth runs, theoretical modeling and luminescence spectroscopy (a spectrally-resolved technique measuring the light emission of an object), the researchers identified the way to optimize the surface quantum well emission.

“We studied the influence of parameters such as growth temperature, material composition, and thickness of the quantum well and barrier on the optoelectronic properties of the nitride structures. Increase of the quantum confinement by reducing the width or increasing the barrier of the quantum well increases the well emission. However, for high quantum well confinement, excitations leak to the structure surface, quenching the luminescence. So there is an optimum set of quantum well parameters that produce emissive structures,” Itskos said. He also pointed out that the studies indicate a strong link between the luminescence efficiency of the nitride quantum well with the FRET efficiency of the hybrid structure, as predicted by the basic theory of Förster. The correlation could potentially provide an initial and simple FRET optimization method by optimizing the luminescent efficiency of the energy donor in the absence of the energy acceptor material.

“Our studies also indicated that electronic doping of the interlayer between the nitride quantum well and the polymer film reduces the efficiency of FRET. This constitutes a potential limitation for the implementation of such hybrid structures in real-world electronic devices, as electronic doping is required to produce efficient practical devices. Further studies are needed to establish the exact influence of doping on FRET,” Itskos noted.

He said the team’s next step is to perform a systematic study of hybrid structures based on doped nitride quantum wells to investigate the mechanisms via which electronic doping affects the characteristics of the Förster resonant energy transfer.

SEMI Foundation, created by global industry association SEMI to support education and career awareness in the field of high-tech, has announced the appointment of Leslie Tugman as its executive director. SEMI Foundation is known for its flagship program, SEMI High Tech U, which serves high school students interested in pursuing careers in science, technology, engineering and math. Plans are underway to expand SEMI Foundation’s activities under Tugman’s leadership to include workforce development programs.

“Leslie has been a key member of the SEMI Foundation team for the past 15 years, helping delivering over 190 High Tech U programs that have reached more than 6,000 students and teachers since the foundation’s inception in 2002,” said Art Zafiropoulo, chairman and CEO of Ultratech, and founding member of the SEMI Foundation board of directors. “Leslie’s thorough understanding of the High Tech U program and her passion and experience for workforce development will ensure continuity and quality of programs as we look to expand the foundation’s activities as part of our 2020 strategic initiatives.”

SEMI has long been at the center of the electronics supply chain representing its more than 1,900 corporate members.  As the electronics supply chain has become increasingly interdependent, SEMI’s platforms have been ever more relied on to bring the extended electronics supply chain together for collaboration.  Additionally, SEMI recently named FlexTech as a Strategic Association Partner providing this vital Flexible Hybrid Electronics community access to SEMI’s global platforms and adjacent opportunities for SEMI members. Now that the SEMI Foundation is a mature entity with established leadership, it is well-positioned to expand in complementary new directions.

“I am excited about this appointment, and look forward to the opportunity to work with the board and take the SEMI Foundation to the next level,” said Tugman. “The foundation is more than High Tech U; we are embarking on workforce development initiatives that address the pipeline for members in a near-term way.”

While with SEMI High Tech U, Tugman was president of WorkForce Resources, Inc.  Prior to that, she served as the business development director for Business Education Compact in Portland, Oregon, delivering workforce development programs focused on educator internships. Career milestones include deputy executive directorship of the Texas Water Development Board, and assistant land commissioner with the Texas General Land Office.

SEMI High Tech U provides secondary school students with an intensive, industry-led introduction to the high tech industry, potential career paths and education requirements to meet their goals.

SEMI High Tech U provides secondary school students with an intensive, industry-led introduction to the high tech industry, potential career paths and education requirements to meet their goals.

Students and teachers participate in hands-on activities that focus on topics including statistics, nanotechnology, solar and alternative energy technologies, electronics and mathematics. Students also work on soft skills and participate in mock job interviews with industry professionals.

Students and teachers participate in hands-on activities that focus on topics including statistics, nanotechnology, solar and alternative energy technologies, electronics and mathematics. Students also work on soft skills and participate in mock job interviews with industry professionals.

Cambridge Nanotherm, a producer of thermal management technology, has won the “LED Lighting Product of the Year” award at the 2015 Elektra Awards for its “Nanotherm DM” product. The industry’s largest technology and business awards, the Elektras is in its 13th year of celebrating the best the electronics industry has achieved.

Cambridge Nanotherm beat stiff competition from NASDAQ listed ON Semiconductor, Khatod Optoelectronics and Zeta Specialist Lighting to win the LED Lighting Product of the Year category. Commenting on the award the judges noted that Nanotherm DM is uniquely compatible with standard manufacturing processes and picked up on the fact that the company manufactures Nanotherm DM at its facility near Cambridge and exports to customers in the US and Asia.

Nanotherm DM is a robust and cost effective alternative to aluminium nitride, an electronics grade ceramic that is used in thermally challenging electronics. The production of Nanotherm DM involves a patented ‘ECO’ process (Electro Chemical Oxidation) that converts the surface of aluminium into a nanoceramic dielectric layer. The nanoceramic aluminium is completed with a copper circuit sputtered onto the nanoceramic to customer specifications. This results in a material with thermal properties that rival aluminium nitride but with the mechanical properties of aluminium that offers the best thermal performance to price ratio available.

Initially targeted at Chip-on-Board modules and LED packaging markets, Nanotherm DM enables LED manufacturers to make significant cost savings without impacting the performance of their products.

Collecting the award on Tuesday night Mike Edwards, Sales Director, said: “Winning an Elektra award is testament to the hard work and dedication our team has put into the development and commercialisation of Nanotherm DM. It cements Nanotherm’s place at the vanguard of UK high-technology manufacturing and I’m delighted to be taking the award back to our manufacturing facility in Haverhill. 2016 is shaping up to be a very exciting year for Nanotherm as we continue to ramp up our production capabilities to meet unprecedented demand for our thermal management solutions.”

The win follows on from Nanotherm being shortlisted for the R&D 100 awards and winning the 2015 Insider Media Made in the East technology award.

The winners of the 2015 were announced on the Tuesday 24th November at the awards ceremony taking place at The Lancaster, London.

Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments – Austin division, formerly known as Austin Scientific, effective November 23rd, 2015.  Focused on the helium compression based vacuum and temperature management and control sector, Oxford Instruments-Austin provides cryo pump, cold head and compressor service, a range of new cryogenic pumps, cold heads and helium compressors, as well as a full line of related spare parts and accessories.

“The Oxford Instruments-Austin acquisition serves a number of purposes for Trillium,” announced Graham Stone, President and CEO of Trillium. “We acquire a significant range of complementary products while strengthening our existing service capabilities, allowing us to further leverage our customer relationships, while also taking us into new markets,” he added.

Trillium currently operates a 12,000 SF facility in North Austin servicing primarily rough vacuum pumps and blowers, while the existing 23,000 SF Oxford Instruments-Austin facility is located in South Austin. “We have been very encouraged with the depth of engineering and the high quality level at Oxford Instruments-Austin . Bringing them into the Trillium family will allow us to achieve significant synergies and a larger critical mass by consolidating our TX operations to a single South Austin location,” said Glen Murray, Trillium’s General Manager and VP-Operations.

Trillium has significantly grown its offerings over the past five years from providing repair service and refurbished equipment to also include new products and spare parts. This transition began as part of the merger with Hamburg, NJ’s United Vacuum in 2011, and continues now with this most recent acquisition. “Adding Oxford Instruments-Austin’s portfolio to our existing product line further enhances Trillium’s value to the customer,” added Rob Breisch, Trillium’s VP-Sales and Marketing. “Our new cryogenic customers can now rely on us to provide a broader range of vacuum products and services, and our existing customer base can take advantage of Oxford Instruments-Austin’s world class support for cryo pumps and helium compressors,” he explained.

The business integration is already underway and Trillium plans to transact from South Austin starting November 23rd.  “Our immediate focus and number one priority is to ensure this transition is implemented quickly and seamlessly for our customers,” stated Graham Stone. He added, “Later phases in the process will include business system migration and consolidation of the facilities.”

Trillium expects to complete the full transition by June 2016.

Today, SEMI announced details about the SEMI Industry Strategy Symposium (ISS) on January 10-13 where semiconductor executives will discuss “Integrating for Growth: Markets, Technology, and Ecosystem” in Half Moon Bay, Calif.  Industry leaders present the current status of their major technological and economic challenges while economists and industry analysts discuss their views of global economic and industry forecasts. Attendees hear diverse perspectives from IC design, manufacturing, foundry, R&D, and consumer electronics.

Emerging applications are broadening the scope of the traditional semiconductor business, resulting in advanced capabilities and expanded ecosystems. Growing semiconductor complexity serves diverse markets, sophisticated technologies, and expanding ecosystems, while escalating costs related to innovation and investment requirements remain a concern. Still Moore’s Law continues to relentlessly push both silicon and the industry to new limits associated with physics and economics.  With an era of disruptive innovation on the horizon, the industry is focusing on creating value and achieving growth using an integrative platform approach. ISS will focus on a breakthrough approach that fosters greater sharing of resources and more effective strategies for accomplishing mutual goals, industry-wide.

Highlights of the conference include:

  • Keynotes: Mary J. Miller, U.S. Army; Haruyoshi Kumura, Nissan; and Ken Hansen, Semiconductor Research Corporation
  • ISS CxO Panel on “It’s 2050… Moore’s Law is Dead… What’s the New Business Model?” with panelists from Brewer Science, Intel, Synopsys, and more
  • Economic Trends: Keynote by Duncan Meldrum, Hilltop Economics; with presentations from Gartner, IC Insights, McKinsey & Company, Pacific Crest Securities, SEMI, and VLSI Research
  • Market Perspectives: Presentations from AnandTech, International Business Strategies, Jefferies, Robert Bosch LLC, and SanDisk
  • Technology and Manufacturing: Presentations from Amkor Technology, ASM International, GLOBALFOUNDRIES, IM Flash Technologies, Intel, Qualcomm, SMIC, and SUNY Poly/CNSE
  • Collaboration Towards Success: Presentations from ASML, Intel Capital, and Micron

For more information on the SEMI Industry Strategy Symposium, please visit: www.semi.org/iss.

BY PETER CONNOCK, Chairman of memsstar

The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity. Europe is a world leader in several major market segments – think automotive and healthcare as two examples – and many more are developing and growing at a rapid rate. Europe has the technology and manufacturing skills to satisfy these new markets but they must be addressed cost effectively – and that’s where the use of secondary equipment and related services comes in.

While Moore’s Law continues to drive the production of advanced devices, the broadening of the “More than Moore” market is poised to explode. All indicators are pointing to a major expansion in applications to support a massive increase in data interchange through sensors and related devices. The devices used to support these applications will range from simple sensors to complex packages but most can, and will, be built by “lower” technology level manufacturing equipment.

This equipment will, in many cases, be required to be “remanufactured” and “repurposed” but will allow semiconductor suppliers to extend the use of their depreciated equipment and/or bring in additional equipment, matched to their process needs, at reduced cost. In many cases this older equipment will need to be supported by advanced manufacturing control techniques and new test and packaging capabilities.

SEMI market research shows that investment in “legacy” fabs is important in manufacturing semiconductor products, including the emerging Internet of Things (IoT) class of devices and sensors, and remains a sizeable portion of the industries manufacturing base:

  • 150mm and 200mm fab capacity represent approximately 40 percent of the total installed fab capacity
  • 200mm fab capacity is on the rise, led by foundries that are increasing 200mm capacity by about 7 percent through to 2016 compared to 2012 levels
  • New applications related to mobility, sensing, and IoT are expected to provide opportunities for manufacturers with 200mm fabs

Out of the total US$ 27 billion spent in 2013 on fab equipment and US$ 31 billion spent on fab equipment in 2014, secondary fab equipment represents approximately 5 percent of the total, or US$ 1.5 billion, annually, according to SEMI’s 2015 secondary fab equipment market report. For 2014, 200mm fab investments by leading foundries and IDMs resulted in a 45 percent increase in spending for secondary 200mm equipment.

Secondary equipment will form at least part of the strategy of almost anyone manufacturing or developing semiconductors in Europe. In many cases, it is an essential capability for competitive production. As the secondary equipment industry increases its strategic importance to semiconductor manufac- turers and researchers it is critical that the corresponding supply chain ensures a supply of quality equipment, support and services to meet rapidly developing consumer needs.

Common challenges across the supply chain include:

  • How to generate cooperation across Europe between secondary equipment users and suppliers and what sort of cooperation is needed?
  • How to ensure the availability of sufficient engineering resource to support the European secondary installed base?
  • Are there shortages of donor systems or critical compo- nents that are restricting the use of secondary equipment and, if so, how might this be resolved

Europe’s secondary industry will be in the spotlight during two sessions at SEMICON Europa 2015:

  • Secondary Equipment Session – Enabling the Internet of “Everything”?
  • SEA Europe ‘Round Table’ Meeting

The sessions are organised by the SEMI SEA Europe Group and are open to everyone associated with the secondary industry, be they device manufacturer or supplier, interested in the development of a vibrant industry providing critical support to cost effective manufacturing in Europe.

The use of sapphire in the manufacturing of Light Emitting Diodes (LEDs) is covered in the second part of a two part series.

BY WINTHROP A. BAYLIES and CHRISTOPHER JL MOORE, BayTech-Resor LLC, Maynard, MA

In Part 1 of this article, we discussed the optical and mechanical properties of sapphire and its use in the mobile device industry. In part 2, we will discuss the use of sapphire in the LED process including some of the newer technologies that produce these devices.

Solid state lighting (or “LED bulbs” as they are commonly known) have become a mainstream product in our culture. Their longer life time and lower power usage (along with the banning of incandescent bulbs) have ensured that more and more consumers are moving to this type of lighting. Like a fluorescent light (where the white light is produced by a phosphor coating excited by the excited gas molecules) solid state lights use a phosphor excited by the short wavelength light emitted by an LED. What you may not know is that about 8 out of every 10 LED bulbs sold uses sapphire as the starting material for their manufacturing process.

As we summarized in part 1, sapphire has some good points: hard, strong, optically transparent and chemically inert (there is a reason high end watches use sapphire crystals) and some bad points: hard, strong, and chemically inert (which is why sapphire crystals are more expensive than glass). What we did not discuss is that single crystal sapphire has turned out to be an ideal material on which to grow the layers of material needed to make an LED.

As FIGURE 1 shows an LED is made by growing epitaxial layers of Gallium Nitride (GaN), AlGan or InGaN on a substrate. Ideally one would use GaN as the substrate material (similar to growing epitaxial Si on Si for integrated circuits) as this would result in the highest quality material and thus the most efficient LED’s. Unfortunately GaN substrates are very difficult to make in any reasonable size and the costs have ruled out using this approach except in certain niche markets. The three main substrate alternatives have been silicon (Si), silicon carbide (SiC) and sapphire.

Sapphire 1

As a substrate material Si would be expected to be the best choice due to its high quality, low cost and ready availability. To date, the quality of GaN type layers grown on Si has not been sufficient for large scale manufacturing processes. Work continues on improving this process and although it may one day dominate the process it currently remains a small part of the business.

SiC substrates are higher cost than Si but have been successfully used for LED manufacturing processes. Much of the LEDs produced by Cree (who also manufacture SiC substrates) use this type of substrate. However, the higher cost and limited availability of 6 inch SiC material means that the majority of LED producers use sapphire.

Thus sapphire substrates account for the majority of LED devices produced [1]. Although not as cheap as Si they are cheaper than SiC, available from a number of manufacturers and are able to survive the high temperature processes needed to produce a short wavelength LED. FIGURE 2 schematically shows the production process for a typical non-patterned sapphire wafer.

Sapphire 2

The sapphire production process starts when a seed crystal and a mixture of aluminum oxide and crackle (un-crystallized sapphire material) is heated in a crucible. Included in this mix is a cookie-sized seed crystal which forms the pattern to be replicated as the crystal grows. Each furnace manufacturer has its own special recipe which heats the material using a specific temperature/ time profile based on the size of melt and the type of crystal to be grown. Once the correct growth temperature is reached the melt is cooled (this process can take two weeks depending on the amount of sapphire being produced) using another set of carefully controlled time/temperature profiles. When done correctly, the cookie-sized seed grows and produces a single-crystal sapphire boule. (FIGURE 3). In reality, two weeks is a long time and any number of can go arise during this process including gas bubbles, mechanical faults such as cracks and contamination. Each of these problems affects the sapphire and its crystal properties. Each crystal fault can become a nucleation site for defects in the epitaxy grown on wafers produced from the boule. There is a clear correlation between the time taken to grow a boule and the potential quality of the boule produced. Many of the problems encountered in the upscaling of the sapphire production process have come from trying to grow large boules at high speeds.

Sapphire 3

At this point in the process you have a boule which in fact has the wrong crystal orientation for growing GaN epitaxy. Unlike the Si crystal growth process where the cylindrical boules can be ground to size and then cut into wafers, sapphire boules are often cored at right angles to the boule axis. Some companies produce sapphire using a silicon like process [2] but the majority of sapphire produced has to be cored. Thus the next step in the process is to “core-drill” a boule to produce one or more smaller round cylinders (ingots) depending on the original boule size and the size of wafers to be produced.

The ability to grow large sized boules on a regular basis is not in question; most important is how much of that boule is bubble-, crack- and impurity-free. In some cases the boules are inspected with various metrology techniques to determine which sections of the boule can be used and which cannot. The section of the boules not used is recycled into the original growth process (unless contaminated). Obviously if one is producing 6 inch wafers larger volumes of the boule need to be defect free than if one is producing 2 inch or 4 inch. Currently most of the LEDs produced are produced on 4 inch wafers with a few newer 6 inch lines and a number of older 2 inch lines. 8 inch sapphire wafers do exists but are not in mass production at this time.

The process after this is very similar to that used in the silicon industry to produce the wafers which will be used as substrates. A diamond saw (remember, Sapphire is a very hard material) is used to cur the ingot into a number of thin disc shapes by cutting perpendicular to the ingot’s long sides. Each of these discs is then ground to its final size, surface-ground and mechanically and chemically polished to produce sapphire substrates. These substrates, after cleaning, can be used as starting material for the epitaxial process used to produce the LED structure. FIGURE 4 shows some pictures of typical 2, 4 and 5 inch sapphire substrates. As discussed earlier the more defect free the surface is the better the quality of epitaxial film that can be grown. The video listed in reference [3] produced by GTAT shows many of the steps discussed above.

Sapphire 4

Recently one further step has been taken to produce what are called patterned sapphire substrates (PSS). The multiple quantum well layer shown in Fig. 1 is the layer that generates light in an LED. As you can imagine this light is emitted in all directions. However, once packaged most LED’s emit light from only one surface of the device. In the case of Fig. 1, a typical package collects the light emitted from the top of the device. This of course means that all of the light emitted in any other direction is wasted. In particular, since sapphire is transparent, little of the light emitted toward the substrate can be used.

One obvious solution to this would be to coat the substrate with something that reflects the light (i.e. metal). Unfortunately this interferes with the epitaxial layer growth process, producing poor devices. One partial solution to the reflection problem is to pattern the sapphire surface such that it reflects light. This pattern can be a series of microscopic pyramidal structures or more rounded bump like structures on the surface. FIGURE 5 shows top and side view SEM pictures of some of the patterns produced by manufacturers. These patterns scatter the light and reflect some of it back towards the surface of the device increasing the light output from the LED. In addition to increasing the apparent light output a number of manufacturers have claimed that epitaxial layers grown on patterned substrates is of better quality than that grown on bare sapphire substrates.

Sapphire 5

Patterned substrates can be produced by the manufacturer of the sapphire substrates. However, factories now exist which begin with a non-patterned substrate and produce specific patterns (normally via chemical etch) for specific LED manufacturers.

Once valued only as a gemstone, sapphire is now an engineered material with a wide variety of industrial uses. These two article have concentrated on its use in mobile devices for everything from camera lens covers to touch sensors and touch screens to the starting material on which most of the solid state lights produced are made. Cost of the material continues to be a limiting factor in its widespread adoption for certain industries. However, as the technology for producing sapphire matures material costs are decreasing and in some ways sapphire substrates have become a commodity rather than a rarity.

Additional reading and viewing material

1. http://rubicontechnology.com/sites/default/files/Opportu- nities%20for%20Sapphire%20White%20Paper-Rubicon%20 Technology.pdf
2. http://www.arc-energy.com/products-services/CHES/Foundations/1
3. https://www.youtube.com/embed/mHrDXyQGSK0