Category Archives: LEDs

Programme information is now available on the inaugural SEMICON Southeast Asia, which will run from 22–24 April at SPICE in Penang. The event, organized by SEMI, a global industry association, features an expanded programme and larger audience base focusing on Southeast Asia communities in the semiconductor and microelectronics sector.  SEMI estimates spending of US$19 on semiconductor equipment and materials in the Southeast Asia region for 2015 and 2016. With an emphasis on opening up new business opportunities and fostering stronger cross-regional engagement, SEMICON Southeast Asia will feature a tradeshow exhibition, networking events, market and technology seminars, and conferences.

Ng Kai Fai, President of SEMI Southeast Asia, said, “Southeast Asia is a vibrant and changing market for the semiconductor industry. For 2015 and 2016, SEMI estimates spending of almost US$ 5 billion on front-end and back-end equipment in the Southeast Asia region, and another $14 billion in spending on materials including $11 billion on packaging-related materials.  Southeast Asia has over 35 production fabs including Foundry, Compound Semiconductors, MEMS, Power, LED, and other devices. The region contributes a substantial 27 percent of global assembly, test and production, on top of being the largest market for assembly and test equipment,” he added.

More than 60 industry speakers and 200 companies will participate in SEMICON Southeast Asia, with thousands of attendees participating in the event. Attendees will learn the latest technology developments and strategies from industry leaders. SEMICON Southeast Asia connects decision makers from leading and emerging semiconductor companies with important industry stakeholders from both the region and all over the world.

Focusing on key trends and technologies in semiconductor design and manufacturing, the event also addresses expanding applications markets like mobile devices and other connected “Internet of Things” (IoT) technologies. Key enablers, such as specialised materials, packaging, and test technologies, as well as new architectures and processes, will be featured throughout the event. Highlights of SEMICON Southeast Asia include:

  • Market Trend Briefing — Features presentations from: EQUVO, Gartner, GFK Retail Technology , IC Insights, SMC Pneumatics (SEA), SEMI, and Yole Developpement
  • Assembly and Packaging Forum — “Emerging Packaging Solutions for Computing, Mobility and IoT Platforms” forum features presentations from: Advantest, AMD, ASE Group, Freescale Semiconductor, GLOBALFOUNDRIES Singapore, Intel, Infineon, Kulicke & Soffa, Lam Research, MediaTek, Tanaka Kikinzoku, and Yole Developpement
  • Product and System Test Forum — “Testing Strategy for a Fast-paced Semiconductor Market” with presentations from Advantest, ATMEL, GLOBALFOUNDRIES Singapore, Intel, Keysight Technologies, Silicon Labs International, UTAC Singapore, Xcerra

In addition, the event features forums on Technology Innovation, LED Technology, and Yield Productivity and Failure Analysis.

For more information and exhibition opportunities, visit www.semiconsea.org or register now.

Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates.

BY ANIL GANDHI, PH. D. and JOY GANDHI, Qualicent Analytics, Inc., Santa Clara, CA

In the last few decades, the volume of data collected in semiconductor manufacturing has grown steadily. Today, with the rapid rise in the number of sensors in the fab, the industry is facing a huge torrent of data that presents major challenges for analysis. Data by itself isn’t useful; for it to be useful it must be converted into actionable information to drive improvements in factory performance and product quality. At the same time, product and process complexities have grown exponentially requiring new ways to analyze huge datasets with thousands of variables to discover patterns that are otherwise undetected by conventional means.

In other industries such as retail, finance, telecom and healthcare where big data analytics is becoming routine, there is widespread evidence of huge dollar savings from application of these techniques. These advanced analytics techniques have evolved through computer science to provide more powerful computing that complements conventional statistics. These techniques are revolutionizing the way we solve process and product problems in the semiconductor supply chain and throughout the product lifecycle. In this paper, we provide an overview of the application of these advanced analytics techniques towards solving yield issues and preventing field failures in semiconductors and electronics.

Advanced data analytics boosts prior methods in achieving breakthrough yields, zero defect and optimizing product and process performance. The techniques can be used as early as product development and all the way through high volume manufacturing. It provides a cost effective observational supplement to expensive DOEs. The techniques include machine learning algorithms that can handle hundreds to thousands of variables in big or small datasets. This capability is indispensable at advanced nodes with complex fab process technologies and product functionalities where defects become intractable.

Modeling target parameters

Machine learning based models provide a predictive model of targets such as yield and field defect rates as functions of process, PCM, sort or final test variables as predictors. In the development phase, the challenge is to eliminate major systematic defect mechanisms and optimize new processes or products to ensure high yields during production ramp. Machine learning algorithms reduce the number of variables from hundreds to thousands to the few key variables of importance; this reduction is just sufficient to allow nonlinear models to be built without over fitting. Using the model, a set of rules involving these key variables are derived. These rules provide the best operating conditions to achieve the target yield or defect rate. FIGURE 1 shows an example non-linear predictive model.

FIGURE 1. Predictive model example.

FIGURE 1. Predictive model example.

FIGURE 2 is another example of rules extracted from a model, showing that when all conditions of the rule are valid across the three predictors simultaneously, then this results in lower yield. Discovering this signal with standard regression techniques failed because of the influence of a large number of manufacturing variables. Each of these large number of variables has a small and negligible influence individually, however they all combine to create noise and thus masking the signal. Standard regression techniques, available in commercial software, therefore are unable to detect the signal in these instances and therefore are not of practical use for process control. So how do we discover the rules such as the ones shown in Fig. 2?

FIGURE 2. Individual parameters M, Q and T do not exert influence while collectively they create conditions that destroy yield. Machine learning methods help discover these conditions.

FIGURE 2. Individual parameters M, Q and T do not exert influence while collectively they create conditions that destroy yield. Machine learning methods help discover these conditions.

Rules discovery

Conventionally, a parametric hypothesis is made based on prior knowledge (process domain knowledge) and then the hypothesis is tested. For example to improve an etest metric such as threshold voltage one could start with a hypothesis that connects this backend parameter with RF power on an etch process in the frontend. However many times it is impossible to make a hypothesis based on domain knowledge because of the complexity of the processes and the variety of possible interactions, especially across several steps. So alternatively, a generalized model with cross terms is proposed and then significant coefficients are picked and the rest are discarded. This works if the number of variables is small but fails with large number of variables. With 1100 variables (a very conservative number for fabs) there are 221 million possible 3-way interactions, and 60 million 2-way cross terms on top of the linear coefficients!

Fitting these coefficients would require a number of samples or records that are clearly not available in the fab. Recognizing that most of the variables and interactions have no bearing on yield, we must then reduce the feature set size (i.e. number of predictors) within a healthy manageable limit (< 15) before we apply any model to it; several machine learning techniques based on derivatives of decision trees are available for feature reduction. Once the feature set is reduced then exact models are developed using a palette of techniques such as those based on advanced variants of piece-wise regression.

In essence, what we have described above is discovery of the hypothesis, while more traditionally one starts with a hypothesis…to be tested. The example in Fig. 2 had 1100 variables most of which had no influence, six of them have measurable influence (three of them are shown), all of these were hard to detect because of dimensional noise.

The above type of technique is part of a group of methods classified as supervised learning. In this type of machine learning, one defines the predictors and target variables and the technique finds the complex relationships or rules governing how the predictors influence the target. In the next example we include the use of unsupervised learning which allows us to discover clusters that reveal patterns and relationships between predictors which can then be connected to the target variables.

FIGURE 3. Solar manufacturing line conveyor, sampled at four points for colorimetry.

FIGURE 3. Solar manufacturing line conveyor, sampled at four points for colorimetry.

FIGURE 3 shows a solar manufacturing line with four panels moving on a conveyor. The end measure of interest that needed improvement was cell efficiency. Measurements are made at the anneal step for each panel as shown at locations 1, 2, 3, 4 in FIGURE 4. The ratio between measurement sites with respect to a key metric called Colorimetry, was discovered to important; the way this was discovered was by employing clustering algorithms, which are part unsupervised learning. This ratio was found in subsequent supervised model to influence PV solar efficiency as part of a 3-way interaction.

FIGURE 4: The ratios between 1, 2, 3, 4 colorimetry were found to have clusters and the clusters corresponded to date separation.

FIGURE 4: The ratios between 1, 2, 3, 4 colorimetry were found to have clusters and the clusters corresponded to date separation.

In this case, without the use of unsupervised machine learning methods, it would have been impossible to identify the ratio between two predictors as an important variable affecting the target because this relationship was not known and therefore no hypothesis could be made for testing it among the large number of metrics and associated statistics that were gathered. Further investigation led to DATE as the determining variable for the clusters.

Ultimately the goal was to create a model for cell efficiency. Feature reduction described earlier is performed followed by advanced piecewise regression and the resulting model based on 10 fold cross validation (build model on 80% of data and test against rest 20% and do this 10 times with a different random sample each time) results in a complex non-linear model with key element that includes a 3 way interaction as shown in FIGURE 5, where the dark green area represents the condition that drops the median efficiency by 30% from best case levels. This condition Colorimetry < 81, Date > X and N2 < 23.5 creates the exclusion zone that should be avoided to improve cell efficiency.

FIGURE 5. N2 (x-axis)  X represent the “bad” condition (dark green) where the median cell efficiency drops by 30% from best case levels.

FIGURE 5. N2 (x-axis) < 23.5, colorimetry < 81 and Date > X represent the “bad” condition (dark green) where the median cell efficiency drops by 30% from best case levels.

Advanced anomaly detection for zero defect

Throughout the production phase, process control and maverick part elimination are key to preventing failures in the field at early life and the rest of the device operating life. This is particularly crucial for automotive, medical device and aerospace applications where field failures can result in loss of life or injury and associated liability costs.

The challenge in screening potential field failures is that these are typically marginal parts that pass individual parameter specifications. With increased complexity and hundreds to thousands of variables, monitoring a handful of parameters individually is clearly insufficient. We present a novel machine learning-based approach that uses a composite parameter that includes the key variables of importance.

Conventional single parameter maverick part elimination relies on robust statistics for single parameter distributions. Each parameter control chart detects and eliminates the outliers but may eliminate good parts as well. Single parameter control charts are found to have high false alarm rates resulting in significant scrap rates of good material.

In this novel machine learning based method, the composite parameter uses a distance measure from the centroid in multidimensional space. Just as in single parameter SPC charts, data points that are farthest from the distribution that cross the limits are maverick and are eliminated. In that sense the implementation of this method is very similar to the conventional SPC charts, while the algorithm complexity is hidden from the user.

FIGURE 6. Comparison of single parameter control chart for the top parameter in the model and Composite Distance Control Chart. The composite distance method detected almost all field failures without sacrificing good parts whereas the top parameter alone is grossly insufficient.

FIGURE 6. Comparison of single parameter control chart for the top parameter in the model and Composite Distance Control Chart. The composite distance method detected almost all field failures without sacrificing good parts whereas the top parameter alone is grossly insufficient.

See FIGURE 6 for a comparison of the single parameter control chart of the top variable of importance versus the composite distance chart. TABLES 1 and 2 show the confusion matrix for these charts. With the single parameter approach, the topmost contributing parameter is able to detect 1 out of 7 field failures. We call this accuracy. However only one out of 21 declared fails is actually a fail – we call this purity of the fail class. Potentially more failures can be detected by lowering the limit somewhat, in the top chart however in that case the purity of the fail class which was already bad now balloons rapidly to unacceptable levels.

TABLE 1. Top Parameter

TABLE 1. Top Parameter

TABLE 2. Composite Parameter

TABLE 2. Composite Parameter

In the composite distance method, on the other hand 6 out of 7 fails are detected – good accuracy. The cost of this detection is also low (high purity) because 6 of 10 declared fails are actually field failures – which is a lot better than 1 out of 21 in the incumbent case and significantly better if the limit in the single top parameter chart was lowered even a little.

We emphasize 2 key advantages of this novel anomaly detection technique. First, the multi-variate nature enables detection of marginal parts that not only pass the specification limits for individual parameters but also are within distribution for all of the parameters taken individually. The composite distance successfully identifies marginal parts that fail in the field. Second, this method significantly reduces the false alarm risk compared to single parameter techniques. This leads to reduction of the cost associated with the “producer’s risk” or beta risk of rejecting good units. In short, better detection of maverick material at lower cost.

Summary and conclusion

Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates. These techniques are able to crunch large data sets and hundreds to thousands of variables, overcoming a major limitation with conventional techniques. The two key methods that were explored in this paper key are as follows:

Discovery – This set of techniques provides a predictive model that contains the key variables of importance affecting target metrics such as yield or field defect levels. Rules discovery (a supervised learning technique) among many other methods that we employ, discovers rules that provide the best operating or process conditions to achieve the targets. Or alternatively it identifies exclusion zones that should be avoided to prevent loss of yield and performance. Discovery techniques can be used during early production phase when there is greatest need to eliminate major yield or defect mechanisms to protect the high volume ramp. And of course the techniques are equally applicable in high volume production.

Anomaly Detection – This method based on the unsupervised learning class of techniques, is an effective tool for maverick part elimination. The composite distance process control based on Quali- cent’s proprietary distance analysis method provides a cost effective way for preventing field failures. At leading semiconductor and electronics manufacturers, the method has predicted actual automotive field failures that occurred in top carmakers.

The promising new material molybdenum disulfide (MoS2) has an inherent issue that’s steeped in irony. The material’s greatest asset–its monolayer thickness–is also its biggest challenge.

Monolayer MoS2’s ultra-thin structure is strong, lightweight, and flexible, making it a good candidate for many applications, such as high-performance, flexible electronics. Such a thin semiconducting material, however, has very little interaction with light, limiting the material’s use in light emitting and absorbing applications.

“The problem with these materials is that they are just one monolayer thick,” said Koray Aydin, assistant professor of electrical engineering and computer science at Northwestern University’s McCormick School of Engineering. “So the amount of material that is available for light emission or light absorption is very limited. In order to use these materials for practical photonic and optoelectric applications, we needed to increase their interactions with light.”

Aydin and his team tackled this problem by combining nanotechnology, materials science, and plasmonics, the study of the interactions between light and metal. The team designed and fabricated a series of silver nanodiscs and arranged them in a periodic fashion on top of a sheet of MoS2. Not only did they find that the nanodiscs enhanced light emission, but they determined the specific diameter of the most successful disc, which is 130 nanometers.

“We have known that these plasmonic nanostructures have the ability to attract and trap light in a small volume,” said Serkan Butun, a postdoctoral researcher in Aydin’s lab. “Now we’ve shown that placing silver nanodiscs over the material results in twelve times more light emission.”

The use of the nanostructures–as opposed to using a continuous film to cover the MoS2–allows the material to retain its flexible nature and natural mechanical properties.

Supported by Northwestern’s Materials Research Science and Engineering Center and the Institute for Sustainability and Energy at Northwestern, the research is described in the March 2015 online issue of NanoLetters. Butun is first author of the paper. Sefaatiin Tongay, assistant professor of materials science and engineering at Arizona State University, provided the large-area monolayer MoS2 material used in the study.

With enhanced light emission properties, MoS2 could be a good candidate for light emitting diode technologies. The team’s next step is to use the same strategy for increasing the material’s light absorption abilities to create a better material for solar cells and photodetectors.

“This is a huge step, but it’s not the end of the story,” Aydin said. “There might be ways to enhance light emission even further. But, so far, we have successfully shown that it’s indeed possible to increase light emission from a very thin material.”

LED Taiwan, opening today at TWTC Nangang Exhibition Hall in Taipei, is Taiwan’s only LED manufacturing-focused exposition. LED Taiwan (March 25-28) showcases LED production equipment and materials, epi wafers, crystals, packaging, modules, etc., as well as related technologies and manufacturing solutions. Organized by SEMI and TAITRA, LED Taiwan is the country’s most influential LED exhibition where manufacturers unveil their products, technologies, and solutions. The Taiwan International Lighting Show (TILS) and Taiwan Solid State Lighting (TSSL) are co-located at LED Taiwan. This combination exhibition platform provides both attendees and exhibitors the world’s most comprehensive view of solid state lighting technology and products, from manufacturing to applications.

As countries across the globe embrace the use of LED lighting, renewed capital spending and capacity increases are foreseen for both 2015 and 2016.  According to the quarterly SEMI Opto/LED Fab Forecast on HB-LED front-end fabs, 2015 LED wafer fab equipment spending will rise approximately 24 percent to nearly US$1.5 billion in 2015, which will boost epitaxy capacity this year. Investment momentum is expected to continue in 2016 with $1 billion spending in front-end LED epitaxy and chip facilities.

Attendees at LED Taiwan 2015 will find solutions and technologies — from hardware, materials, parts, manufacturing, and inspection to test for component manufacturing and encapsulation and thermal dissipation. With a combined 337 exhibitors showcasing their latest developments in LED component technologies, LED manufacturing processes and display lighting applications in 898 booths, the three-in-one, industry-specific event is expected to attract over  20,000 visitors from across the world for the four-day event.

At the LED Executive Summit today (March 25), themed “What’s Next for LED?,” presenters from Cree, EPISTAR, OSRAM Opto, Philips Lumileds, with special video greetings from Dr. Shuji Nakamura, Nobel Prize in Physics Winner 2014. They will share their perspectives on the challenges and opportunities in the LED industry.

The LED Taiwan TechXPOT sessions include:

  • March 25: “Manufacturing Equipment and Materials” track includes speakers from: Advanced International Multitech, Aixtron, DISCO, Dow Corning, Shanghai Micro Electronics Equipment (AMEC), SEMI, Alinc Taiwan, and Sil-More Industrial.
  • March 26: “Sapphire and PSS” track features presenters from Advanced System Technology, EVG, Galaxy Technology Development, Meyer Burger, Monocrystal, Rigidtech, Sandvik Hyperion, Smooth & Sharp, and Yole.
  • March 27: “LED Advanced Technologies” track includes speakers from: Advanced Optoelectronic Technology, ASM, Beijing NMC, Epistar, Everlight, Lextar, PlayNitride, and Yole.
  • March 28: “Smart Lighting and Automobile Lighting” track with presenters from Cree, Infineon Technologies Taiwan, and TSLC.

For more information on LED Taiwan, please visit: www.ledtaiwan.org (Chinese) or www.ledtaiwan.org/en (English).

Following two lethargic years of low growth and some setbacks, worldwide sales of optoelectronics, sensors, actuators, and discrete semiconductors regained strength in 2014 and collectively increased 9 percent to reach an all-time high of $63.8 billion after rising just 1 percent in 2012 and 2013, according to IC Insights’ new 2015 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discretes.  Modest gains in the global economy, steady increases in electronic systems production, and higher unit demand in 2014 drove a strong recovery in discretes along with substantial improvements in sensors/actuators and greater growth in optoelectronics, says the new 360-page annual report, which becomes available in March 2015.

Each of the three O-S-D market segments are forecast to increase at or above their long-term annual growth rates in 2015 and 2016 (Figure 1) as the global economy continues to gradually improve and major new end-use systems applications boost sales in some of the largest product categories of optoelectronics, sensors/actuators, and discretes.  After a modest slowdown in 2017, due to the next anticipated economic downturn, all three O-S-D market segments are expected to continue reaching record-high sales in 2018 and 2019, based on the five-year forecast in the new 10th edition of IC Insights’ O-S-D Report.

Optoelectronics sales are now forecast to rise 10 percent in 2015 to set a new record-high $34.8 billion after growing 8 percent in 2014 to reach the current annual peak of $31.6 billion.  Sales of sensors/actuators are also expected to strengthen slightly in 2015, rising 7 percent to $9.9 billion, which will break the current record high of $9.2 billion set in 2014 when this market segment grew 6 percent.  The commodity-filled discretes market is forecast to see a more normal 5 percent increase in 2015 and reach a new record high of $24.2 billion after roaring back in 2014 with a strong 11 percent increase following declines of 7 percent in 2012 and 5 percent in 2013.  The two-year drop was the first back-to-back decline for discretes sales in more than 30 years and primarily resulted from delays in purchases of power transistors and other devices as cautious systems manufacturers kept their inventories low in the midst of uncertainty about the weak global economy and end-user demand.

OSD fig 1

 

In 2014, combined sales of O-S-D accounted for 18 percent of the semiconductor industry’s $354.9 billion in total revenues compared to 16 percent in 2004 and 13 percent in 1994.  (Optoelectronics was 9 percent of the 2014 sales total with sensors/actuators being 3 percent, discretes at 6 percent and ICs accounting for 82 percent, or $290.8 billion, last year).  On the strength of optoelectronics and sensor products—including CMOS image sensors, high-brightness light-emitting diodes (LEDs), and devices built with microelectromechanical systems (MEMS) technology—total O-S-D sales have outpaced the compound annual growth rate (CAGR) of ICs since the late 1990s.  IC Insights’ new report shows this trend continuing between 2014 and 2019 with combined O-S-D sales projected to grow by a CAGR of 6.9 percent versus 5.5 percent for ICs.

The 2015 O-S-D Report shows strong optoelectronics growth being driven in the next five years by new embedded cameras and image-recognition systems made with CMOS imaging devices as well as the spread of LED-based solid-state lights and high-speed fiber optic networks built with laser transmitters that are needed to keep up with tremendous increases in Internet traffic, video transmissions, and cloud-computing services, including those connected to the huge potential of the Internet of Things (IoT). The sensors/actuators market is forecast to see steady growth from high unit demand driven by the spread of automated embedded-control functions, new sensing networks, wearable systems, and measurement capabilities being connected to IoT in the second half of this decade.  Discretes sales are expected to climb higher primarily due to strong growth in power transistors and other devices used in battery-operated electronics and to make all types of systems more energy efficient—including automobiles, high-density servers in Internet data centers, industrial equipment, and home appliances.

Seoul Semiconductor, a developer of LED technology, on March 19th announced the availability of new Acrich3 modules for a wide range of residential and commercial lighting applications. The new advanced Acrich3 solution from Seoul Semiconductor enables the next generation of Smart-Lighting systems with the ability to interface through a wide variety of wireless networks and sensors. This technology does not require a complex AC/DC converter and can be operated directly from the AC mains, which simplifies designs, reduces component count and improves on the reliability of the luminaire. It also incorporates an analog dimming input as well and an increased compatibility with existing TRIAC dimmers with the ability to do uniform dimming giving lighting designers an easy to implement advanced lighting solution.

The new Acrich3 modules being released today incorporate Seoul Semiconductor’s proven and reliable high voltage LED architecture with Acrich MJT series of LEDs. These modules are available in different lumen outputs and form factors to address a wide range of lighting applications from downlights to street and area lighting. Available in 2700K-6500K with CRI options of 70, 80 and 90 these modules offer typical efficiencies of upto 100lm/W with low THD and high power factor.

Kibum Nam, Vice President of Product Development, said “The new Acrich3 modules from Seoul Semiconductor offer a complete solution for smart lighting systems with the Acrich3 IC and MJT LEDs. First launched in 2005 the Acrich technology has provided innovative solutions worldwide to a wide range of applications in the commercial, residential and industrial lighting environments. In the future, Seoul Semiconductor plans introduce more products to further enhance the adoption of the Acrich technology.”

University of Washington scientists have built a new nanometer-sized laser — using the thinnest semiconductor available today — that is energy efficient, easy to build and compatible with existing electronics.

Lasers play essential roles in countless technologies, from medical therapies to metal cutters to electronic gadgets. But to meet modern needs in computation, communications, imaging and sensing, scientists are striving to create ever-smaller laser systems that also consume less energy.

The ultra-thin semiconductor, which is about 100,000 times thinner than a human hair, stretches across the top of the photonic cavity. Credit: University of Washington

The ultra-thin semiconductor, which is about 100,000 times thinner than a human hair, stretches across the top of the photonic cavity. Credit:
University of Washington

The UW nanolaser, developed in collaboration with Stanford University, uses a tungsten-based semiconductor only three atoms thick as the “gain material” that emits light. The technology is described in a paper published in the March 16 online edition of Nature.

“This is a recently discovered, new type of semiconductor which is very thin and emits light efficiently,” said Sanfeng Wu, lead author and a UW doctoral candidate in physics. “Researchers are making transistors, light-emitting diodes, and solar cells based on this material because of its properties. And now, nanolasers.”

Nanolasers — which are so small they can’t be seen with the eye — have the potential to be used in a wide range of applications from next-generation computing to implantable microchips that monitor health problems. But nanolasers so far haven’t strayed far from the research lab.

Other nanolaser designs use gain materials that are either much thicker or that are embedded in the structure of the cavity that captures light. That makes them difficult to build and to integrate with modern electrical circuits and computing technologies.

The UW version, instead, uses a flat sheet that can be placed directly on top of a commonly used optical cavity, a tiny cave that confines and intensifies light. The ultrathin nature of the semiconductor — made from a single layer of a tungsten-based molecule — yields efficient coordination between the two key components of the laser.

The UW nanolaser requires only 27 nanowatts to kickstart its beam, which means it is very energy efficient.

Other advantages of the UW team’s nanolaser are that it can be easily fabricated, and it can potentially work with silicon components common in modern electronics. Using a separate atomic sheet as the gain material offers versatility and the opportunity to more easily manipulate its properties.

“You can think of it as the difference between a cell phone where the SIM card is embedded into the phone versus one that’s removable,” said co-author Arka Majumdar, UW assistant professor of electrical engineering and of physics.

“When you’re working with other materials, your gain medium is embedded and you can’t change it. In our nanolasers, you can take the monolayer out or put it back, and it’s much easier to change around,” he said.

The researchers hope this and other recent innovations will enable them to produce an electrically-driven nanolaser that could open the door to using light, rather than electrons, to transfer information between computer chips and boards.

The current process can cause systems to overheat and wastes power, so companies such as Facebook, Oracle, HP, Google and Intel with massive data centers are keenly interested in more energy-efficient solutions.

Using photons rather than electrons to transfer that information would consume less energy and could enable next-generation computing that breaks current bandwidth and power limitations. The recently proven UW nanolaser technology is one step toward making optical computing and short distance optical communication a reality.

“We all want to make devices run faster with less energy consumption, so we need new technologies,” said co-author Xiaodong Xu, UW associate professor of materials science and engineering and of physics. “The real innovation in this new approach of ours, compared to the old nanolasers, is that we’re able to have scalability and more controls.”

Still, there’s more work to be done in the near future, Xu said. Next steps include investigating photon statistics to establish the coherent properties of the laser’s light.

With an impressive 20 percent growth in MEMS revenue compared to 2013, and sales revenues of more than $1.2B, Robert Bosch GmbH is the clear #1.

illus_top30mems_march2015

From Yole Développement’s yearly analysis of “TOP 100 MEMS Players,” analysts have released the “2014 TOP 20 MEMS Players Ranking.” This ranking shows the clear emergence of what could be a future “MEMS titan”: Robert Bosch (Bosch). Driven by MEMS for smartphone sales – including pressure sensors -, Bosch’s MEMS revenue increased by 20 percent in 2014, and totaling $1.2B. The gap between Bosch and STMicroelectronics now stands at more than $400M

“The top five remains unchanged from 2013, but Bosch now accounts for one-third of the $3.8B MEMS revenue shared by the top five MEMS companies. Together, these five companies account for around one- third of the total MEMS business,” details Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). “It’s also interesting to see that among the top thirty players, almost every one increased its revenue in 2014,” he adds.

In other noteworthy news, Texas Instruments’ sales saw a slight increase thanks to its DLP projection business. RF companies also enjoyed impressive growth, with a 23 percent increase for Avago Technologies (close to $400M) and a 141 percent increase for Qorvo (formerly TriQuint), to $350M.

Meanwhile, the inertial market keeps growing. This growth is beneficial to InvenSense, which continues its rise with a 32 percent increase in 2014, up to $329M revenue. Accelerometers, gyroscopes and magnetometers are not the only devices contributing to MEMS companies’ growth. Pressure sensors also made a nice contribution, especially in automotive and consumer sectors. Specifically, Freescale Semiconductor saw a 33 percent increase in pressure revenue, driven by the Tire Pressure Monitoring Systems (TPMS) business for automotive. On the down side, ink jet head companies still face hard times, with Hewlett-Packard (HP) and Canon both seeing revenues decrease. However, new markets are being targeted. Though thus far limited to consumer printers, MEMS technology is set to expand into the office and industrial markets as a substitute for laser printing technology (office) and inkjet piezo machining technology (for industrial & graphics).

“What we see is an industry that will generally evolve in four stages over the next 25 years. This is true for both CMOS Image Sensors and MEMS,” explains Dr Eric Mounier, Senior Technology & Market Analyst, MEMS devices & Technologies at Yole. He explains: “The “opening stage” generally begins when the top three companies hold no more than 10 – 30 percent market share. Later on, the industry enters the “scale stage” through consolidation, when the top three increases its collective market share to 45 percent.”

According to Yole, the “More than Moore” market research and strategy consulting company, MEMS industry has now entered the “Expansion Stage.”

“Key players are expanding, and we’re starting to see some companies surpassing others (i.e. Bosch’s rise to the top). If we follow this model, the next step will be the “Balance & Alliance” stage, characterized by the top three holding up to 90 percent of market share”, comments Dr Mounier.

Among the 10 or so MEMS titans currently sharing most of the MEMS markets, Yole’s analysts have separated them into two categories:

  • “Titans with Momentum” and “Struggling Titans”. In the first category we include Bosch, InvenSense, Avago Technologies and Qorvo. Bosch’s case is particularly noteworthy, since it’s currently the only MEMS company with dual markets (automotive and consumer) and the right R&D/production infrastructure.
  • On the “Struggling Titans” side, Yole identifies STMicroelectronics, HP, Texas Instruments, Canon, Knowles, Denso and Panasonic. These companies are currently struggling to find an efficient growth engine.

 

Without question, both Bosch and InvenSense are growing, while others like STMicroelectronics and Knowles are suffering a slow-down or MEMS sales decrease.

Another interesting fact about Yole’s 2014 TOP MEMS Ranking is that there are no new entrants (and thus no exits).

More market figures and analysis on MEMS, the Internet of Things (IoT) and wearables can be found in Yole’s 2014 IoT report (Technologies & Sensors for Internet of Things: Business & Market Trends, June 2014), and the upcoming “Sensors for Wearables and Mobile” report.

Also, Yole is currently preparing the 2015 release of its “MEMS Industry Status.” This will be issued in April and will delve deeper into MEMS markets, strategies and players analyses.

Silicon Labs, a provider of semiconductor and software solutions for the Internet of Things (IoT) and Digi-Key, a developer of electronic component selection, availability and delivery, today announced an IoT design contest for pioneering developers who want to create connected “things” that will help make the world a smarter, more connected and energy-friendly place. Co-sponsored by Silicon Labs and Digi-Key, the “Your IoT Connected World” design contest is open to inventors of all skill levels, from professional embedded developers and seasoned makers to electronics enthusiasts.

The contest runs now through July 17, with three winners to be announced on August 3, 2015. Visitors to the www.YourIoTContest.com site will vote to decide on 15 finalists, and expert judges from Silicon Labs and Digi-Key will choose the three winners. Each winner will select the Silicon Labs components they need (microcontrollers, wireless chips, sensors, boards and more – valued up to $10,000) to bring their prize-winning IoT ideas to market as commercially viable products.

“The silicon and software technology needed to make ‘your IoT’ a reality is available today, and it’s up to pioneering developers like you to create the next IoT innovations that will help save time and energy, enhance health and security, and improve the quality of life for people everywhere,” said Peter Vancorenland, vice president of engineering and IoT solutions at Silicon Labs. “This is your chance to bring your groundbreaking IoT ideas to market, enabled by Silicon Labs development tools and kickstarted by $10,000 in Silicon Labs components.”

“Whether designers are solving an existing problem or creating a totally new invention, ideas are limited only by the developer’s imagination,” said David Sandys, director of technical marketing for Digi-Key. “Winning IoT designs may include innovations like connected home devices, smart appliances, lighting control systems, wearable technology, security systems, wireless sensor networks and much more.”

To get started, simply visit www.YourIoTContest.com. All IoT designs must contain a Silicon Labs microcontroller (MCU) product. Each contestant must submit photos or a brief video overview of their IoT product design. Silicon Labs offers a wide array of 8-bit and 32-bit MCUs, wireless ICs, interface chips, optical and environmental sensors, and development tools for IoT applications, all available through Digi-Key. To help simplify the evaluation, design and prototyping process, Silicon Labs’ Simplicity Studio development platform can be downloaded at no charge at www.silabs.com/simplicity-studio.

The competition is open to contestants in selected countries in the Americas and EMEA including Austria, Belgium, Brazil, Canada (excluding Quebec), the Czech Republic, Denmark, Finland, France, Germany, Hungary, Ireland, Israel, Italy, Mexico, Norway, Poland, Portugal, Spain, Sweden, Turkey, the United Kingdom and the United States.

Cambridge Nanotherm has published results of a round of testing of several thermal PCB materials intended for use in LEDs, including its Nanoceramic thermal management substrates for LEDs. The tests were conducted by The LIA Laboratories (part of The LIA – Europe’s largest lighting trade association) and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.

The LIA Laboratories test used 4 x 50 watt Intelligent LED Solutions Oslon 16+ PowerClusters mounted on four different MCPCB (Metal Clad PCB) substrates from leading manufacturers including Nanotherm LC. The substrates were attached with a TIM to a Fischer Elektronik LA 7/150 fan-cooled heat sink (thermal resistance: 0.075°C/W). A precision EA-PS 2084-10B (0-10A; 0-84V) laboratory power supply was used to drive the LEDs at constant current. Thermocouples measured the cluster and heat sink temperature at multiple locations. A calibrated integrating sphere measured the Lumens output.

With a drive current of 1,000mA running through the LEDs, Nanotherm LC ran a massive 13.6°C (30%) cooler than the generic Chinese MCPCB used as a ‘control’ board. Even compared to the closest high-performance board Nanotherm LC ran 2.4°C (5 percent) cooler.

The tests also examined how much extra luminosity could be achieved on Nanotherm LC within a given temperature envelope, compared to the nearest competitor. At 1,000mA drive current, LEDs on the closest high-performance board ran at 39.7°C and delivered a light output of 4760 Lumens. When LEDs on Nanotherm LC were run up to this exact same temperature of 39.7°C, the LEDs were able to handle a drive current of 1,350mA and produced a luminosity of 5896 Lumens. In effect, at the same temperature as the competitor board, Nanotherm produced a 23.8 percent increase in brightness. Applied to the real world this means Nanotherm LC provides a clear path for manufacturers to substantially reduce the number of LED dies used in any given design whilst maintaining the brightness.

“The figures don’t lie,” commented Ralph Weir, CEO, Cambridge Nanotherm. “The results show Cambridge Nanotherm’s LC substrate outperforming every other MCPCB that was tested, including what we believe to be the current market leader.”

“Our results demonstrate two distinct possibilities, the ability to reduce overall system temperatures, or to run LEDs at a greater luminosity within a given temperature envelope. Both should have LED manufacturers very excited. These tests demonstrate comprehensively that our substrates can be used to drive down LED costs through die count reduction while maintaining product efficiency and lifetimes. The ability to drive LEDs harder, cooler and brighter should help forge new application areas.”

“These results demonstrate yet again why Nanotherm materials are enjoying such success in the high-power LED market. We’re delighted that the LIA Laboratories, as a fully independent test house, has confirmed that they achieved a 23 percent increase in brightness from the same LEDs – just by using Nanotherm materials rather than the more expensive options from the most respected “big brand” MCPCB suppliers.”

Under continuous drive at the same high current of 2,400mA, the test had to be stopped after a few minutes as even with this powerful heat sink all but Nanotherm exceeded 100°C  – the generic Chinese MCPCB was a staggering 47.2°C hotter. Even the best competitor exceeded 100°C, running 8.6°C hotter than the Nanotherm material. At this current Nanotherm’s substrate was the only one to keep the LEDs below 100°C.