Category Archives: LEDs

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) today announced it has entered into a licensing agreement with Idaho, US based Rohinni LLC (Rohinni), to facilitate the design, commercialization and distribution of next-generation micro and mini LED solutions.

Next-generation LED technologies have the potential to further enhance performance, improve efficiency and reduce the size of existing lighting technologies. Significant high-volume end-markets including automotive, display, consumer electronics and general lighting are anticipated to drive adoption and benefit from this emerging technology. While micro and mini LED benefits are compelling, high-volume production challenges must be addressed prior to widespread market adoption of these emerging lighting solutions.

Rohinni has developed promising solutions that directly address production challenges and have enabled greater design flexibility in end-use applications. In parallel, Rohinni has also established a network of partnerships in several key segments poised to benefit from this technology.

Kulicke & Soffa’s existing market positions, R&D competencies, supply chain and manufacturing capabilities provide scale to further extend Rohinni’s leadership and its effort in driving adoption of new LED technologies.

“K&S has recently taken a much more proactive approach in targeting and identifying complementary partnerships with a clear path to value creation,” stated Chan Pin Chong, Senior Vice President of Wedge Bond and EA/APMR Business Unit. “We are very excited to work together with Rohinni’s talented team to commercialize this high-potential and innovative technology.”

“Our team has spent the past several years developing precise, high-speed placement technologies for micro and mini LED products,” stated Matt Gerber, Rohinni’s CEO. “This agreement with K&S provides capabilities to quickly scale development and global production for our customers. This is really an exciting moment for designers to be able to produce lighting products that haven’t been possible with existing production technologies.”

LCD displays incorporating these latest developments in LED backlighting technologies deliver an unparalleled High-Dynamic-Range (HDR) viewing experience and are significantly brighter than OLEDs. To produce an HDR LCD display with over 10,000 LEDs in a backlight assembly requires a completely new generation of high speed production technologies. With an estimated 220 million square meters of flat-panel displays estimated to be produced in 2018, the growth potential of new backlighting technologies is significant. The unique and highly-complementary contributions of both organizations are anticipated to accelerate the global adoption of leading micro and mini LED-based solutions.

The 64th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 1-5, 2018, has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

The paper submission deadline this year is Wednesday, August 1, 2018. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A limited number of late-news papers will be accepted. Authors are asked to submit late-news papers announcing only the most recent and noteworthy developments. The late-news submission deadline is September 10, 2018.

At IEDM each year, the world’s best scientists and engineers in the field of microelectronics gather to participate in a technical program consisting of more than 220 presentations, along with a variety of panels, special sessions, Short Courses, a supplier exhibit, IEEE/EDS award presentations and other events highlighting leading work in more areas of the field than any other conference.

This year, special emphasis is placed on the following topics:

  • Neuromorphic computing/AI
  • Quantum computing devices and links
  • Devices for RF, 5G, THz and mmWave
  • Advanced memory technologies
  • More-than-Moore devices and integrations
  • Technologies for advanced logic nodes
  • Non-charge-based devices and systems
  • Sensors and MEMS devices
  • Package-device level interactions
  • Electron device simulation and modeling
  • Advanced characterization, reliability and noise
  • Optoelectronics, displays and imaging systems

Overall, papers in the following areas of technology are encouraged:

  • Circuit and Device Interaction
  • Characterization, Reliability and Yield
  • Compound Semiconductor and High-Speed Devices
  • Memory Technology
  • Modeling and Simulation
  • Nano Device Technology
  • Optoelectronics, Displays and Imagers
  • Power Devices
  • Process and Manufacturing Technology
  • Sensors, MEMS and BioMEMS

Further information

For more information, interested persons should visit the IEDM 2018 home page at www.ieee-iedm.org.

SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco. The electronics industry’s premier U.S. event, SEMICON West — July 10-12 at Moscone North and South — will highlight engines of industry expansion including smart transportation, smart manufacturing, smart medtech, smart data, big data, artificial intelligence, blockchain and the Internet of Things (IoT). Click here to register.

“We are excited that the WT | Wearables Technologies Conference has joined SEMICON West to co-locate in 2018,” said David Anderson, president of SEMI Americas. “Our strategic partnership brings new content and more value to our extended supply chain. Every day the semiconductor industry makes chips smaller and faster with ever-higher performance. These innovations enable new wearable applications for smart living, smart medtech and healthcare that are continuously improving our lives. The WT | Wearable Technologies Conference speakers at SEMICON West 2018 will demonstrate just how they use semiconductor technology to deliver leading-edge wearables.”

“It is a great pleasure to collaborate with the leading global electronics manufacturing association and its successful SEMICON West event,” said Christian Stammel, CEO of WT | Wearables Technologies. “Since the beginning of our platform in 2006, the semiconductor industry has been a major driver of wearables and IoT innovation. All major developments in the WT application markets like healthcare (smart patches), safety and security (tracking solutions), lifestyle and sport (smartwatches and wristbands) and in the industrial field (AR / VR) were driven by semiconductor and MEMS innovations. Our program of expert speakers at SEMICON West will share the latest insights in the wearables market as the SEMI and WT ecosystems explore collaboration and innovation opportunities.”

By Walt Custer, Custer Consulting Group

Broad global & U.S. electronic supply chain growth

The first quarter of this year was very strong globally, with growth across the entire electronics supply chain. Although Chart 1 is based on preliminary data, every electronics sector expanded –  with many in double digits. The U.S. dollar-denominated growth estimates in Chart 1 have effectively been amplified by about 5 percent by exchange rates (as stronger non-dollar currencies were consolidated to weaker U.S. dollars), but the first quarter global rates are very impressive nonetheless.

Walt Custer Chart 1

U.S. growth was also good (Chart 2) with Quarter 1 2018 total electronics equipment shipments up 7.2 percent over the same period last year. Since all the Chart 2 values are based on domestic (US$) sales, there is no growth amplification due to exchange rates.

Walt Custer Chart 2

We expect continued growth in Quarter 2 but not at the robust pace as the first quarter.

Chip foundry growth resumes

Taiwan-listed companies report their monthly revenues on a timely basis – about 10 days after month end. We track a composite of 14 Taiwan Stock Exchange listed chip foundries to maintain a “pulse” of this industry (Chart 3).

Walt Custer Chart 3

Chip foundry sales have been a leading indicator for global semiconductor and semiconductor capital equipment shipments. After dropping to near zero in mid-2017, foundry growth is now rebounding.

Chart 4 compares 3/12 (3-month) growth rates of global semiconductor and semiconductor equipment sales to chip foundry sales. The foundry 3/12 has historically led semiconductors and SEMI equipment and is pointing to a coming cyclical upturn. It will be interesting to see how China’s semiconductor industry buildup impacts this historical foundry leading indicator’s performance.

Walt Custer Chart 4

Passive Component Shortages and Price Increases

Passive component availability and pricing are currently major issues. Per Chart 5, Quarter 1 2018 passive component revenues increased almost 25 percent over the same period last year. Inadequate component supplies are hampering many board assemblers with no short-term relief in sight.

Walt Custer Chart 5

Peeking into the Future

Looking forward, the global purchasing managers index (a broad leading indicator) has moderated but is still well in growth territory.

Walt Custer Chart 6

The world business outlook remains positive but requires continuous watching!

Walt Custer of Custer Consulting Group is an  analyst focused on the global electronics industry.

Originally published on the SEMI blog.

For the 20th year, a worldwide survey of semiconductor manufacturers has resulted in Plasma-Therm winning multiple awards for its systems and superior customer service.

In the annual Customer Satisfaction Survey conducted by VLSIresearch, Plasma-Therm earned a total of five awards, including two “RANKED 1st” awards. Plasma-Therm earned the highest scores of all companies in two award categories, “Etch & Clean Equipment” and “Focused Suppliers of Chip Making Equipment.”

Survey participants are asked to rate semiconductor equipment suppliers in 15 categories based on supplier performance, customer service, and product performance.

“The achievement of two ‘RANKED 1st’ awards and five awards overall is very gratifying” Plasma-Therm CEO Abdul Lateef said. “While we continue to expand our product and application portfolio, we never lose our focus on providing the best service and support. We are working harder than ever to ensure success for all our customers, from small institutions and start-ups to specialty fabs and high-volume manufacturers.”

In THE BEST Suppliers of Fab Equipment, which includes specialized manufacturers like Plasma-Therm as well as the world’s largest equipment makers, Plasma-Therm ranked higher than every other company besides ASML, the world’s largest maker photolithography supplier. Plasma-Therm also was ranked higher than all other suppliers besides ASML in THE BEST Suppliers of Fab Equipment to Specialty Chip Makers.

With this year’s awards, Plasma-Therm now has received a total of 42 awards over 20 years of participation in the Customer Satisfaction Survey. VLSIresearch received feedback from more than 94 percent of the chip market in this year’s survey, which was conducted over 2-1/2 months and in five languages. Here is the full list of awards earned by Plasma-Therm in the 2018 Customer Satisfaction Survey:

• RANKED 1st in FOCUSED SUPPLIERS OF CHIP MAKINGEQUIPMENT • RANKED 1st in ETCH & CLEAN EQUIPMENT
• 10 BEST FOCUSED SUPPLIERS OF CHIP MAKING EQUIPMENT
• THE BEST SUPPLIERS OF FAB EQUIPMENT

• THE BEST SUPPLIERS OF FAB EQUIPMENT TO SPECIALTY CHIP MAKERS About Plasma-Therm

Established in 1974, Plasma-Therm is a manufacturer of advanced plasma processing equipment for specialty semiconductor markets, including advanced packaging, wireless communication, photonics, solid-state lighting, MEMS/NEMS, nanotechnology, renewable energy, data storage, photomask, and R&D. Plasma-Therm offers etch and deposition technologies and solutions for these markets.

Osram has added to its expertise in semiconductor-based optical security technology by acquiring US-based Vixar Inc. Already a technology leader in infrared LEDs and infrared laser diodes, Osram will have a unique breadth of technological expertise and an expanded product portfolio after bringing on board Vixar’s specialist capabilities in the field of VCSEL. While currently known primarily for identification applications in mobile devices, VCSEL also can be used to recognize gestures and measure distances in medical, industrial and automotive applications. Vixar was founded by pioneers in the VCSEL industry, having first brought VCSEL to the data communication market in the late 1990s, and more recently by founding Vixar in 2005 to pursue sensing applications. Approximately 20 employees of the company, which is based in Plymouth, Minnesota, will transfer to Osram as a result of the acquisition. Vixar is profitable both on an operational and net results level. The parties to the deal have agreed not to disclose financial details. Closing of the transaction is expected in summer.

“The acquisition of Vixar is adding to our expertise, particularly in the fast-growing market for security technologies,” said Olaf Berlien, CEO of OSRAM Licht AG. Osram is a technology leader in infrared optical semiconductors and has already succeeded in bringing to market light sources for fingerprint sensors, iris scanners, and 2D facial recognition. The acquired capabilities will pave the way for further security technologies, including ultra-compact 3D facial recognition. In addition to unlocking smartphones and other consumer electronics devices, such technologies also can be used for high-security access controls in industry.

The way in which VCSEL technology captures 3D environmental data has applications in everything from gesture recognition, augmented reality, robotics and proximity sensors to autonomous driving. VCSEL stands for vertical cavity surface emitting laser and is a special type of laser diode in which the light is emitted perpendicular to the surface of the semiconductor chip. Vixar is a fabless semiconductor company, and has developed a robust volume supply chain consisting of merchant foundries serving the optoelectronic market. Osram’s depth and breadth of semiconductor experience will further strengthen the manufacturing capabilities for the rapidly growing VCSEL market.

By Walt Custer, Custer Consulting Group

Global Manufacturing Growth has Slowed, but is Still Positive (Chart 1)

Most key countries/regions saw a slowdown in growth in March based on their respective Purchasing Managers Indices. And in one case – South Korea – manufacturing moved into contraction.

February 2018 March 2018
Japan 54.1 53.1
South Korea 50.3 49.1
Taiwan 56.0 55.3
China 51.6 51.0
Europe 58.6 56.6
USA 60.8 59.3

custer-1-424

PMI Points to More Modest Expansion (Chart 2)

The global Purchasing Managers Index is a timely and readily available leading indicator for both world semiconductor and semiconductor capital equipment shipments. PMI values greater than 50 indicate expanding manufacturing activity.  See www.markiteconomics.com for PMI values for all major countries.

 

Recent semiconductor equipment, semiconductor and PMI 3-month (3/12) world growth rates were:

SEMI Equipment +29% February
Semiconductors                +21% February
PMI (squared) +4% March

The PMI leading indicator now points to more modest but still positive growth ahead.

custer-2-424

Semiconductor Industry Still has Legs (Chart 3)

Another useful and timely leading indicator is a composite of monthly Taiwan Chip Foundry sales.  Taiwan-listed companies publish their revenues about 10 days after the month closes. Chart 3 compares the composite monthly revenues of 14 Taiwan listed foundries vs. global semiconductor sales. Due to Lunar New year shutdowns, February 2018 was weak but foundry sales rebounded in March. Chip demand appears to be holding!

custer-3-424

Originally published on the SEMI blog.

A chemical reactor that operates at extremely high temperatures is being developed by KAUST and could improve the efficiency and economy of a commonly used process in the semiconductor industry, with flow-on benefits for Saudi Arabia’s chemical industry.

The production of semiconductors relies on epitaxy: a process that creates high-quality single-crystal materials by depositing atoms on to a wafer layer by layer, controlling thickness with atomic precision.

The most common method of epitaxy is metalorganic chemical vapor deposition, or MOCVD. Pure vapors of organic molecules containing the desired atoms–for example, boron and nitrogen in the case of boron nitride–are injected into a reaction chamber. The molecules decompose on a heated wafer to leave the semiconductor’s atoms behind on the surface, which bond both to each other and the wafer to form a crystal layer.

Ph.D. student Kuang-Hui Li and a team led by Xiaohang Li at KAUST are developing an MOCVD reactor that can efficiently operate at extremely high temperatures to create high-quality boron nitride and aluminum nitride materials and devices particularly promising for flexible electronics, ultraviolet optoelectronics and power electronics.

The epitaxy of high-quality boron nitride and aluminum nitride have been a huge challenge for the conventional MOCVD process, which usually operates below 1200 degrees Celsius. Epitaxy of these materials responds best to temperatures over 1600 degrees Celsius; however, the most common resistant heaters are not reliable at these temperatures.

Although induction heaters can reach these temperatures, the heating efficiency of the conventional design is low. Because the wasted energy can overheat the gas inlet, it must be placed far away from the wafer, which is problematic for high-quality boron nitride and aluminum nitride due to particle generation and low utilization of organic molecules.

The KAUST team has developed an innovative and low-cost induction heating structure to solve these problems. “Our design can help greatly improve uniformity for up to 12-inch wafers and reduce particle generation, which is crucial for high-quality material and device fabrication,” says Kuang-Hui. “It also allows us to discover new materials.”

The results show significant increase in heating efficiency and reduction in wasted energy. “This equipment research involves many disciplines and is highly complex. However, history has shown that equipment innovation is the key to scientific breakthroughs and industrial revolution,” says Xiaohang Li. “A goal of the research is to set up MOCVD manufacturing activities that can be integrated into the huge chemical industry of Saudi Arabia.”

Pixelligent, the high-index advanced materials manufacturer, today announces $7.6M in new funding to help further drive product commercialization and accelerate global customer adoption.

This round of funding includes strategic investments from two new strategic partners, Tokyo Ohka Kogyo Co., LTD. (“TOK”) a leading Japanese advanced materials manufacturer, and Kateeva, Inc. a leading provider of inkjet deposition equipment for the rapidly growing OLED and HD Display markets. This latest investment was led by The Abell Foundation, with strong support from other Baltimore-based investors, including participation from TCP Venture Captial’s – Propel I and Propel II venture funds.

“The partnership with TOK will provide Pixelligent access to TOK’s vast and highly respected formulation expertise, helping us to accelerate product development and customer adoptions on a global basis. As our leading display customers are also requesting that our materials are compatible with inkjet manufacturing equipment, the partnership with Kateeva is a critical step in accessing the expertise and knowledge required to meet this requirement,” said Craig Bandes, President & CEO Pixelligent Technologies.

“We have been working with Pixelligent for a significant period of time now and feel confident that they have the best and most compatible high refractive index nanodispersions for improving the efficiency and performance for some very important optical device applications. Combining Pixelligent’s PixClear® materials with TOK’s world-class high-value added formulations will enable us to address many demanding applications in fast growing markets. These new materials will be formulated to enable application by a variety of methods — nanoimprint, photolithography and inkjet, to name a few — and will enable us to deliver the expanded functionality and performance to all of our customers demanding ultra-high refractive index coatings,” said Katsumi Ohmori of TOK.

“Kateeva has been working with Pixelligent for the past 18 months as our OLED Display customers are actively looking for ways to improve the efficiency and performance of their displays. Incorporating Pixelligent’s PixClear® nanoadditives to increase the refractive index of numerous layers inside the OLED display stack has the potential to deliver significant increases in light extraction and improve the overall performance of our customers’ display products,” said Alain Harrus, Kateeva’s Chairman and Chief Executive Officer.

“Both of these companies are industry leaders in markets that are critically important to Pixelligent. Having companies of this caliber invest in, and partner with Pixelligent is a great validation of value we have created and the value we are delivering,” said Bandes.

This latest financing builds on the momentum of the past twelve months, where the company dramatically increased its product development efforts in the rapidly growing OLED Display, HD Display, and AR/VR markets, was named the 2017 Manufacturer of the Year by Frost & Sullivan, and increased its manufacturing yields by over 100%. Collectively the OLED Display, HD Display, AR/VR, and Solid State Lighting target markets represent an estimated $11 billion of advanced materials sales in 2018 growing to nearly $18 billion by 2023.

Toyoda Gosei Co., Ltd. has achieved state-of-the-art high current operation1 in a vertical GaN power semiconductor developed using gallium nitride (GaN), a main material in blue LEDs.

Power semiconductors are widely used in power converters2 such as power sources and adaptors for electronic devices. However, simultaneous achievement of both high breakdown voltage3 and low loss4 (low conduction loss and switching loss) at high levels has been difficult with conventional silicon due to its material properties.

In its power semiconductors, Toyoda Gosei uses GaN, which has material properties of high breakdown voltage and low loss, and employs a vertical device structure in which electrical current flows vertically from or to a substrate. These changes have enabled a GaN power transistor chip with operating current of over 50A, highest ever reported for vertical GaN transistors2, and high-frequency (several megahertz) operation. Some prospective applications are shown below.

Promising areas of use (examples)

Power converters
More compact & lighter weight, higher efficiency

 Power control units (PCUs) for automobiles, etc.
DC-DC converters

High frequency power sources
Higher output

 Wireless power supply

Toyoda Gosei will continue development of these power semiconductors for improved reliability, aiming to achieve practical applications in cooperation with semiconductor and electronics manufacturers.

The newly developed vertical GaN power transistors (MOSFET)5 and Schottky barrier diodes6 will be presented on panel displays at the Techno-Frontier 2018 Advanced Electronic & Mechatronic Devices and Components Exhibition, held at Makuhari Messe, Chiba, Japan from April 18 to April 20. The world’s first full vertical-GaN DC-DC converter equipped with these devices will also be demonstrated at the company’s booth (6F-11, Hall 6).

1 According to internal Toyoda Gosei survey (as of April 2018).
2 Power conversion refers to conversion between direct and alternating current, direct current transformation, alternating current frequency conversion, etc.
3 The property of withstanding the high breakdown voltage during power conversion and not allowing current flow during off operation (non-conductance).
4 Heat loss generated by electrical resistance during electric conduction or when switching on/off.
5 Semiconductor used in power on/off.
MOSFET: Metal-oxide-semiconductor field-effect-transistor.
6 Semiconductor used in converting (rectification) from alternating current to direct current. Toyoda Gosei uses a trench MOS structure, in which trenches are formed at fixed intervals in the chip surface of the diode, achieving low leakage current operation at high temperatures.