Category Archives: LEDs

The influx of wireless technologies and intelligent devices has resulted in the rapid evolution of the Internet of Things (IoT), a disruptive cross industry force expected to transform the manufacturing value chain into a state of hyper-connectivity. While it is only a matter of time before end users see the compelling benefits of real-time data collection and in-depth analysis of multiple process variables from diverse distributed assets, several roadblocks remain to enforce high-level business continuity.

New analysis from Frost & Sullivan, Internet of Things (IoT)—Challenges and Impediments, finds that improving the speed and reliability of communication, enforcing a single standard across the enterprise, maintaining a robust security platform and managing high volume datasets are paramount to the success of the highly dynamic IoT landscape.

“Security, particularly for critical infrastructure, is a key concern for end users owing to the number of attack points and potential magnitude of impact,” said Frost & Sullivan Industrial Automation and Process Control Senior Research Analyst Rahul Vijayaraghavan. “As the IoT market moves towards semi- and fully-autonomous control networks, end users will have limited awareness and control in the event of targeted attacks, heightening the risk of sudden disruptions.”

While IoT provides benefits like responsiveness, collaboration, and visibility, there remain concerns surrounding management of high volume data traffic from multiple connected assets.  End users must decide what mission-critical data (safety, financial, and operational) to manage in-house and what data should be progressively farmed out to service-platform providers.

Additionally, to derive value from the data amassed, development of extensible, industry-specific platforms that offer actionable, real-time insights to improve operational productivity should be a focal point for solution providers.

“As data becomes the currency of the future, vendors must further invest in meeting critical end user data storage, management, analytics and ownership requirements,” noted Rahul. “The ability to establish robust strategic partnerships with IoT ecosystem value chain participants will determine if solution providers can sustain growth in the fast-evolving IoT domain.”

Internet of Things (IoT)—Challenges and Impediments is a Market Insight that is part of the Industrial Automation & Process Control Growth Partnership Service program. This Insight provides value chain participants in the IoT ecosystem an overview of the key business drivers fueling IoT adoption, applications of IoT across the manufacturing value chain, and a detailed analysis of critical concerns and road blocks.

For complimentary access to more information on this research, please visit: http://bit.ly/1zyTljI.

Nine of the Top 20 Semiconductor Suppliers are Forecast to Register Double-Digit Growth in 2014

Later this month, IC Insights’ November Update to The 2014 McClean Report will show a forecast ranking of the 2014 top 25 semiconductor suppliers with the companies’ sales broken down on a quarterly basis.  A preview of the forecast for the top 20 companies’ total 2014 sales results is presented in Figure 1.  The top 20 worldwide semiconductor (IC and O S D—optoelectronic, sensor, and discrete) sales ranking for 2014 includes eight suppliers headquartered in the U.S., three in Japan, three in Europe, three in Taiwan, two in South Korea, and one in Singapore, a relatively broad representation of geographic regions.

This year’s top-20 ranking includes two pure-play foundries (TSMC and UMC) and six fabless companies.  Pure-play IC foundry GlobalFoundries is forecast to be replaced in this year’s top 20 ranking by fabless IC supplier Nvidia.  It is interesting to note that the top four semiconductor suppliers all have different business models.  Intel is essentially a pure-play IDM, Samsung a vertically integrated IC supplier, TSMC a pure-play foundry, and Qualcomm a fabless company.

IC foundries are included in the top 20 ranking because IC Insights has always viewed the ranking as a top supplier list, not as a marketshare ranking, and realizes that in some cases semiconductor sales are double counted.  With many of IC Insights’ clients being vendors to the semiconductor industry (supplying equipment, chemicals, gases, etc.), excluding large IC manufacturers like the foundries would leave significant “holes” in the list of top semiconductor suppliers.  Foundries and fabless companies are clearly identified in Figure 1.  In the April Update to The McClean Report, marketshare rankings of IC suppliers by product type were presented and foundries were excluded from these listings.

As shown, it is expected to require total semiconductor sales of over $4.2 billion to make the 2014 top 20 ranking. In total, the top 20 semiconductor companies’ sales are forecast to increase by 9 percent this year as compared to 2013. However, when excluding the two pure-play foundries (TSMC and UMC) from the ranking, the top “18” semiconductor companies’ sales are forecast to increase by 8 percent this year, the same rate as IC Insights’ current forecast for total 2014 worldwide semiconductor market growth.

 

Fig. 1

Outside of the top six spots, there are numerous changes expected within the 2014 top-20 semiconductor supplier ranking.  In fact, of the 14 companies ranked 7th through 20th, 10 of them are forecast to change positions in 2014 as compared with 2013 (with NXP expected to jump up two spots).

More details on the forecasted 2014 top 25 semiconductor suppliers will be provided in the November Update to The McClean Report.

Soraa announced today that it has introduced a perfectly compatible version of its award-winning MR16 LED lamp. Featuring the company’s signature elements of full-visible-spectrum light, Soraa’s constant current MR16 LED lamp is the ideal lighting solution for restaurants, retail, high-end residential, and office environments where superior light quality and dimming are essential.

Equipped with a standard GU5.3 two-pin base, Soraa’s constant current MR16 LED lamp fits into any MR16 fixture and fully conforms to the ANSI/ IECE compatible form factor. Unlike other MR16 LED lamps, the constant current LED lamp is designed to accept an external driver which supplies the lamp with low voltage DC input current, eliminating the need to fit a transformer in limited space.

Providing enormous dimming and control flexibility, light output can now be programmed to the desired level when using a programmable or remote driver. The lamp also achieves zero flicker when used with a DC driver and is available in 10 degree, 25 degree and 36 degree versions.

“Incompatibility issues between LED lamps, fixtures, dimmers and transformers continue to hinder the advancement and adoption of LED technology,” explained George Stringer, Senior VP of North America Sales at Soraa. “Our new constant current MR16 LED lamp overcomes these hurdles, enabling flexibility and choice without compromising on performance and quality.”

Soraa’s constant current MR16 LED lamp features the company’s Point Source Optics for beautiful, high intensity, and uniform beams; and unique Violet-Emission 3-Phosphor (VP3) LED technology for perfect rendering of colors and whiteness. Utilizing every color in the rainbow, especially deep red emission, Soraa’s VP3 Vivid Color renders warm tones beautifully and accurately, and achieves a color-rendering index (CRI) of 95 and deep red (R9) rendering of 95 at color temperatures ranging from 2700K to 4000K. And unlike blue-based white LEDs without any violet/ ultra-violet emission, the company’s VP3 Natural White is achieved by engineering the violet emission to properly excite fluorescing agents including natural objects like human eyes and teeth, as well as manufactured white materials such as clothing, paper and cosmetics.

Related news: Soraa founder wins Nobel Prize in physics

By Daniel QI, SEMI China

General Lighting is a Key Growth Driver

As a result of cost reduction and performance improvements, LED lighting is becoming more and more competitive in general lighting market. Energy-efficient fluorescent lamps (like CFL) productions have experienced growing and stabilizing stages in recent years; however, energy-efficient fluorescent lamp production is now facing a significant decline in 2014 as LED lighting products represent a faster growing segment of this market. SEMI China believes that the general lighting market will replace the LCD TV backlight market as the largest application market for LEDs in 2014, and general lighting market will continue to drive the LED industry over the next several years.

ChinaLED1

China’s LED Fab Industry Is Consolidating and Recovering

Due to overly optimistic expectations for future market growth and opportunities, coupled with many local governments providing subsidies for MOCVD equipment procurement, China’s LED fab industry entered into a hyper-growth period between 2010 and 2011, resulting in 76 LED fabs being established by the end of 2011. Many of these companies struggled given challenges in ramping up and with over-supply in the market. Fab capacity utilization lagged for many companies.

Following this post hyper growth period, fab utilization eventually recovered and improved throughout 2013, reaching about 90% by first quarter in 2014 (see next figure). Two key reasons are evident for improved capacity utilization. First, as previously mentioned, demand in general lighting application has increased. Second, China’s LED fabs have undergone consolidation since 2012. Consolidation occurred as some of LED fabs went bankrupt or exited the industry entirely, thus mitigating oversupply in the China market. These bankrupted or former LED fabs are not included in the utilization statistics shown in the figure below.

 ChinaLED2

China LED Fab Industry Expansion Plan

There has been very limited news of LED fab expansions over the previous two years, but the situation has changed as a number of China’s LED companies have announced new fab projects and/or expansion plans in 2014. SEMI believes that over the next three to four years upstream LED manufacturers in China will enter robust era of growth. Unlike 2010 and 2011, this expansion round will be dominated by leading manufacturers, not new entrants. Also, the total increase in MOCVD tool quantity in 2014 and 2015 will be from just six companies  and will account 74% of the total quantity of MOCVD tools installed in China. It is expected that the number of new MOCVD tools installed will exceed 1,000 from 2014 to 2018.

ChinaLED3

The New Edition of China LED Fab Industry Report

SEMI China has recently published a new report of China’s LED Fab Industry in October 2014.This report covers: the LED lighting market, global LED fab capacity forecast, China’s LED fab industry utilization statistics, a listing of all of China’s LED fabs, LED fab expansion plans by supplier, China MOCVD tool market analysis and forecast, China GaN epitaxial wafer capacity statistics, and LED forecast by wafer size.

For more information, please contact Daniel QI: [email protected]

The Semiconductor Industry Association (SIA), today announced that worldwide sales of semiconductors reached $87 billion during the third quarter of 2014, an increase of 5.7 percent over the previous quarter and a jump of 8 percent compared to the third quarter of 2013. Third quarter sales outperformed the latest World Semiconductor Trade Statistics (WSTS) industry forecast. Global sales for the month of September 2014 reached $29 billion, 8 percent higher than the September 2013 total of $26.9 billion and 1.9 percent more than last month’s total of $28.5 billion. All monthly sales numbers are compiled by WSTS and represent a three-month moving average.

“Through the third quarter of 2014, global semiconductor sales remain strong and well ahead of last year’s pace,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “The industry has now posted seven consecutive months of sequential monthly growth, and year-to-year growth has been strong across nearly all semiconductor product categories, with DRAM and Analog leading the way.”

Regionally, sales were up compared to last month in the Americas (2.8 percent) and Asia Pacific (2.5 percent), but down slightly in Europe (-0.1 percent) and Japan (-1.3 percent). Compared to September 2013, sales increased in Asia Pacific (12 percent), Europe (7.9 percent) and the Americas (3.7 percent), but decreased in Japan (-3.7 percent). All four regional markets have posted better year-to-date sales through September than they did through the same point last year.

September 2014      
Billions      
Month-to-Month Sales      
Market Last Month Current Month % Change
Americas 5.60 5.76 2.8%
Europe 3.22 3.22 -0.1%
Japan 3.07 3.03 -1.3%
Asia Pacific 16.57 16.99 2.5%
Total 28.46 29.00 1.9%
       
Year-to-Year Sales      
Market Last Year Current Month % Change
Americas 5.55 5.76 3.7%
Europe 2.98 3.22 7.9%
Japan 3.15 3.03 -3.7%
Asia Pacific 15.17 16.99 12.0%
Total 26.85 29.00 8.0%
       
Three-Month-Moving Average Sales      
Market Apr/May/Jun Jul/Aug/Sep % Change
Americas 5.24 5.76 9.8%
Europe 3.19 3.22 0.9%
Japan 2.97 3.03 2.2%
Asia Pacific 16.04 16.99 5.9%
Total 27.44 29.00 5.7%

 

SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 11.  ASMC, which takes place May 3-6, 2015 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, and tutorials.

ASMC, in its 26th year, continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts.  Selected speakers have the opportunity to present in front of IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. Technical abstracts are now due November 11, 2014.

This year SEMI (www.semi.org) is including two new technology areas (3D/TSV/Interposer; Fabless Experience). SEMI is soliciting technical abstracts in these key technology areas:

·        3D/TSV/Interposer

·        Advanced Metrology

·        Advanced Equipment Processes and Materials

·        Advanced Patterning / Design for Manufacturability

·        Advanced Process Control (APC)

·        Contamination Free Manufacturing (CFM)

·        Data Management and Data Mining Tools

·        Defect Inspection and Reduction

·        Discrete Power Devices

·        Enabling Technologies and Innovative Devices

·        Equipment Reliability and Productivity Enhancements

·        Fabless Experience

·        Factory Automation

·        Green Factory

·        Industrial Engineering

·        Lean Manufacturing

·        Yield Enhancement

·        Yield Methodologies

Complete descriptions of each topic and author kit can be accessed at www.semi.org/en/node/38316.  If you would like to learn more about the conference and the selection process, please contact Margaret Kindling at [email protected] or call 1.202.393.5552.   

Papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are encouraged.  To submit an abstract, visit http://semi.omnicms.com/semi/asmc2015/collection.cgi

Technical abstracts are due November 10, 2014. Learn more about the Advanced Semiconductor Manufacturing Conference; visit www.semi.org/asmc2015.

Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, today announced Jerry Turin as the company’s Chief Financial Officer.  Most recently, Mr. Turin served as Chief Financial Officer of Oclaro, Inc., which scaled to a peak of $600M revenue run-rate from $250M during his tenure.  Mr. Turin will direct the company’s financial strategy and finance team.

“Jerry Turin’s experience and financial expertise will promote the strategic growth objectives of Intematix,” said Mark Swoboda, CEO of Intematix. “His understanding of the financial ecosystem, and his rapport with the investment community, will contribute to the financial foundation supporting the execution of our plans.”

“I am excited to step into this role at Intematix,” stated Mr. Turin. “The core competencies of Intematix are impressive, and the market opportunities are significant. I look forward to working with the talented team at Intematix.”

Prior to his appointment as Chief Financial Officer at Intematix, Mr. Jerry Turin was the Chief Financial Officer of Oclaro, Inc. from 2008 through 2013. Mr. Turin served as the Vice President of Finance, Corporate Controller and Treasury from July 2005 to 2008. Before his tenure at Oclaro, Mr. Turin worked at executive level financial positions in Silicon Valley and has more than 20 years of combined accounting and corporate finance experience in the technology industry. He also served at Deloitte & Touche as Senior Manager of Audit Services. Mr. Turin holds a Bachelor’s in Business Administration and Commerce from the University of Alberta. He is also a member of the Canadian Institute of Chartered Accountants and the Institute of Chartered Accountants of Alberta.

Cree, Inc. announced a breakthrough in lighting-class LED performance with its SC5 Technology Platform. The new platform powers the next generation of lighting with the introduction of Extreme High Power (XHP) LEDs. This new class of LEDs can reduce system costs by up to 40 percent in most lighting applications.

“As a technology company, we’re focused on breaking the performance barriers that really matter to the lighting industry,” said Chuck Swoboda, Cree Chairman and CEO. “The SC5 Technology Platform redefines what is possible in high-power LEDs by doubling the lumens out of a single LED, giving lighting manufacturers the flexibility to innovate significantly lower cost systems. This new platform establishes a new benchmark for LED lumens per wafer, which we believe will define the long-term success of our industry. This also validates our belief that high-power LED technology enables the best lighting system designs and a better lighting experience for end customers.”

The SC5 Technology Platform is built on Cree’s silicon carbide technology and features significant advancements in epitaxial structure, chip architecture and an advanced light conversion system optimized for best thermal and optical performance. With these advancements, the SC5 Technology Platform achieves unparalleled lumen density and longer lifetime at higher operating temperatures than previous LED technology, which can significantly reduce thermal, mechanical and optical costs at the system level.

“LEDs are no longer the most expensive portion of an LED lighting system, but they fundamentally determine the overall system performance and cost,” said Dave Emerson, vice president and general manager for Cree LEDs. “While other LED manufacturers only promise incrementally lower LED cost, our new Extreme High Power (XHP) LEDs leveraging the SC5 Technology™ Platform directly address the increased burden that thermal, mechanical and optical elements now place on total system cost.”

The first available family of XHP LEDs is the XLamp® XHP50 LED, delivering up to 2250 lumens at 19 watts from a 5.0×5.0 mm package. At its maximum current, the XHP50 provides twice the light output of the industry’s brightest single-die LED, the XLamp XM-L2 LED, at a similar lumens per watt and without increasing the package footprint. By leveraging Cree’s latest reliability innovations, the XHP50 is designed to maintain L90 lifetimes above 50,000 hours even at high temperature and current.

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in September 2014 (three-month average basis) and a book-to-bill ratio of 0.94, according to the September EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 0.94 means that $94 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in September 2014 was $1.17 billion. The bookings figure is 12.9 percent lower than the final August 2014 level of $1.35 billion, and is 18.1 percent higher than the September 2013 order level of $992.8 million.

The three-month average of worldwide billings in September 2014 was $1.25 billion. The billings figure is 3.3 percent lower than the final August 2014 level of $1.29 billion, and is 22.5 percent higher than the September 2013 billings level of $1.02 billion.

“Following 11 months of above parity book-to-bill ratios, the three-month average ratio declined in September,” said Denny McGuirk, president and CEO of SEMI.  “While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

April 2014

$1,403.2

$1,443.0

1.03

May 2014

$1,407.8

$1,407.0

1.00

June 2014

$1,327.5

$1,455.0

1.10

July 2014

$1,319.1

$1,417.1

1.07

August 2014 (final)

$1,293.4

$1,346.1

1.04

September 2014 (prelim)

$1,250.4

$1,172.8

0.94

Source: SEMI, October 2014

The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

A principal challenge in making such devices has always been forming the active layer, whether the light absorbing layer in a solar cell or the light-emitting layer in a LED. This has also been the most costly and capital-intensive part of the manufacturing process, since the active layer must be made to high standards of semiconductor crystal quality and uniformity. Leading solar cells, for example, use mono- or poly-crystalline silicon wafers, while LEDs use variants of Gallium Nitride (GaN) on expensive sapphire, Silicon Carbide or even GaN wafers. In many cases, these materials are thicker than needed, the added thickness lending structural support to the end device without adding to efficiency, but contributing to overall cost and weight of the structure.

Versatilis shows instead that the active layer can be made from semiconductor fines or powders of single crystal particles densely packed into a monolayer, in a configuration not unlike sandpaper one particle thick, and then further processed into active diode structures serving as solar cells, for example, or as LEDs. Such particles are readily available, often a byproduct of other processes or made inexpensively off-line, or sometimes chemically synthesized. Silicon fines, for example, are widely available, screened for a desired size distribution, as are CIGS and GaN particles, the latter chemically synthesized. And a small amount of such “dust” can go a long way; for example, a kilogram of one micron single crystal CIGS particles used as micro-solar cells can cover an area over 300 square meters, resulting in very low costs per unit area.

“By levering cheap, ex-situ produced and optimized, single or polycrystalline powders and fines for Si, Ge, CIGS, GaN, ZnO as the starting raw material and wrapping unique processing techniques around that, we can produce highly functional opto-electronic devices with reduced infrastructure, processing, and material utilization cost,” stated Ajay Jain, Versatilis CTO and inventor of the now patented technology.

The potential cost savings have led others to try using semiconductor particles in a variety of ways, however, none have proven commercially practical. A major challenge has been to lay down these particles quickly enough and as a monolayer. Similarly, researchers have shown basic functional devices with nanorods, nanowires and other semiconductor “nanostructures” in the lab, only to be stopped by a general lack of production ready manufacturing technology for nanoscale, including suitable tools for in-line process metrology and characterization.

In addition to processing semiconductor particles into useful devices, Versatilis has unique fluidics technology for rapidly depositing such particles as a monolayer, from nano to microscale, on wafers or in a continuous, high-speed web. It had licensed the technology to VersufleX Technologies (http://www.versuflex.com), who are beginning to sell benchtop process tools to R&D labs based on this technology. The process can tolerate reasonable variation in particle size and shape, and there are a variety of methods possible for orienting particles floating on the surface of a fluid medium.

“This technology will not set performance records for efficiency in PV cells nor in lumens/watt for LEDs, but we believe there is no cheaper, more practical way to realize semiconductor diode based functionality over a large, flexible area,” added George Powch, Company CEO, “We think it can enable low cost Building Integrated Photovoltaics or rival OLEDs with a wholly inorganic large area micro-LED solution.”