Category Archives: LEDs

SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.  ASMC, which takes place May 19-21, 2014 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “25 Years of Semiconductor Manufacturing,” moderated by Paul Werbaneth, 3D InCites,  technical sessions on advanced semiconductor manufacturing,   a keynote by TSMC, and tutorials on Silicon Photonics offered by Intel and Directed Self Assembly by IBM.

ASMC, celebrating 25 years of excellence, continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts.  Selected speakers have the opportunity to present in front of IC Manufacturers, Equipment Manufacturers, Materials Suppliers, Chief Technology Officers, Operations Managers, Process Engineers, Product Managers and Academia. Technical abstracts are due November 28, 2013.

SEMI is soliciting technical abstracts in key technology areas:

  •          Advanced Metrology
  •          Advanced Equipment Processes and Materials
  •          Advanced Patterning / Design for Manufacturability
  •          Advanced Process Control
  •          Contamination Free Manufacturing
  •          Data Management and Data Mining Tools
  •          Defect Inspection and Reduction
  •          Discrete and Power Devices
  •          Enabling Technologies and Innovative Devices
  •          Equipment Reliability and Productivity Enhancements
  •          Factory Automation
  •          Green Factory
  •          Industrial Engineering
  •          Lean Manufacturing
  •          Packaging and Through Silicon Via
  •          Yield Enhancement/Learning
  •          Yield Methodologies

Complete descriptions of each topic and author kit can accessed at www.semi.org/en/node/asmc2014.  If you would like to learn more about the conference and the selection process, please contact Margaret Kindling at [email protected] or call 1.202.393.5552.

SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics. Co-located with SEMICON Europa, one of the largest exhibitions in Europe, PE2014 is the ideal forum to meet technology leaders and professionals from industry, academia, and research organizations focused on developing the next-generation of plastic and organic electronics. This rotation strategy for both SEMICON Europa (www.semiconeuropa.org) and PE2014 (www.plastic-electronics.org) supports the European Union’s 10/100/20 initiative, in addition to providing increased business opportunities for both exhibitors and visitors.

The Plastic Electronics 2014 will be held at Alpexpo in Grenoble, France on 7-9 October 2014, returning to Dresden in October 2015. In addition to the keynote presentations, the conference has critical content to offer for engineers, material experts, manufacturing professionals and industry strategists. The conference will have a specific focus on heterogeneous integration of flexible and traditional electronics for innovative form factors products and applications.

This new focus on and selection of key application areas where in-roads of large area electronics is expected such as in medical, lighting, energy, automotive, fast moving consumer goods. The PE2014 conference covers all segments of the Printed Electronics industry currently driving development in this influential technology. For more information on PE2014, visit www.plastic-electronics.org.

Dr. Dominik Gronarz, CEO of OES (Organic Electronics Saxony), Europe’s leading organic-cluster, states, “Organic Electronics Saxony welcomes the alternating change between Dresden and Grenoble. Especially for the external and international visitors, this biannual rotation will make the Plastic Electronics even more attractive. Visitors have a growing interest in visiting companies and institutes on site, and the mutual relocation now offers this new and exciting opportunity. Thanks to the alternating location, our members are not only offered a further opportunity to present themselves to a new professional audience in Grenoble but also to establish new business contacts, which might differ from those made exclusively in Dresden as the sole location. This new cooperation with Grenoble allows an increased involvement of our French COLAE partners CEA-Liten in Grenoble and Plastipolis in Lyon in Plastic Electronics.”

Mrs. Isabelle Chartier, Printed Electronic program director from CEA-Liten states, “We are proud to host the next Plastic Electronics Conference fully integrated inside SEMICON Europa, here in Grenoble. The French Flexible Electronic community (from materials, equipment, institutes up to final integrators) is very active in this field and aims soon to start industrial manufacturing. In Grenoble, CEA-Liten is running PICTIC — the French Printed Electronic open technology platform — dedicated to printed processes development and products prototyping with industrials partners. CEA-Liten/PICTIC has a track record in terms of printed technology like: high performance printed OTFT: organic CMOS for analog and digital circuits (first printed ADC converter), PMOS backplanes, and printed sensors: Organic Photodiodes with the start-up ISORG and piezo pressure sensor in collaboration with ARKEMA/Piezotech.”

The Plastic Electronics 2014 is hosted by the SEMI Plastic Electronics Special Interest Group (PE-SIG), which is managed by representatives of leading industry companies, research centers and institutes. The PE-SIG of SEMI focuses its activities on Networking, roadmaps, standardization, research and statistics, conferences, exhibitions and public policy worldwide.

The Plastics Electronics Conference (www.plastic-electronics.org) showcases Europe’s most innovative companies, institutions and people.  It is an integral part of SEMICON Europa exhibition (www.semiconeuropa.org), the leading event dedicated to the future of micro- and nanoelectronics design and manufacturing in Europe. SEMICON Europa and Plastic Electronics will be held on 7-9 October 2014.

Quantum Electro Opto Systems Sdn. Bhd. (QEOS), a leading innovator in LED technology, announced today that it is entering the LED lighting and LED lighting systems business.  QEOS had previously commercialized its Tilted Charge Dynamics (TCD) device technology to produce the world’s fastest LED, which also featured lower cost, smaller size, and importantly, extremely low total power usage; thus providing a highly “Green Energy” product for the communications industry.  The company is now leveraging its R&D capability in materials and device design, optical lens technology and packaging, to bring forth new “Smart+” LED Lighting Systems, combining eco-friendly green technology with digitally-driven and Internet-enabled smart lighting.

Dr. Gabriel Walter, CEO of QEOS, said, “Through the use of advanced designs and packaging we can drive down cost and energy usage, while creating new uses of intelligent LED Lighting Systems.  It is our honor to enter the LED lighting systems market to create new innovations in applications on the 85th birthday of Nick Holonyak, Jr., a founder of QEOS and the inventor of the LED.  Product development for this market is a natural extension of our R&D.”

The worldwide LED lighting markets are expected to achieve significant growth as buildings, communities and governments convert to more cost effective systems. New QEOS Smart+ LED Lighting Systems continue the innovation by delivering better energy efficiency, lower heat emission, lower cost, lower environmental impact, and lower-maintenance systems; while leveraging digital control and Internet-enabled device integration and access.

Dr. Raymond Chin, Chairman of QEOS, said, “We foresee LED lighting systems rapidly becoming more integrated into the fabric of the Internet, and there is substantial room to create advanced products. At QEOS innovation is part of our DNA.   We also see integration between our Advanced Video Surveillance Security business and our new Smart+ LED Lighting Systems business,” he said. “Lighting Systems and Video Surveillance Security are complimentary to each other, and when integrated together can result in much better solutions for customers.”

Quantum Electro Opto Systems Sdn Bhd. is located in Melaka, Malaysia with operations in Cupertino, California in the heart of Silicon Valley. Its founders and management include Dr. Gabriel Walter and Dr. Raymond Chin, who are former students of Professor Holonyak; and also Professor Milton Feng, a co-inventor of the Transistor Laser.  QEOS has over 50 patents granted and pending

Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.  This new product line provides LED chip manufacturers with a ready-made source of large diameter PSS to serve the needs of the rapidly growing LED general lighting industry.

This news is very important as growth of the LED general lighting market is expected to expand from nearly 300 million lamps shipped in 2012 to 3 billion by 2020 according to IMS Research.  Technology innovation is helping the LED supply chain prepare for this dramatic growth.  Most high-brightness LED manufacturers etch a pattern into the sapphire wafers in order to both improve epitaxial growth and extract more light from each chip. Patterned sapphire substrates have been available for purchase in smaller diameters, but Rubicon is the first to offer highly customizable 6” and 8” PSS. The larger substrates increase chipmakers’ throughput and efficiency.

SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc. However, the market in recent years has been gaining significant opportunities in other industries such as automotive electronics, medical device electronics, defense and aerospace electronic equipment, and industrial equipment among others. With end-use markets for SMT equipment shifting focus from defect detection to defect prevention, SMT equipment manufacturers are turning towards diversification of product offerings. Growing demand for high-quality SMT equipment from contract and OEM manufacturers is poised to benefit the market. In addition, rising demand for light emitting diodes (LED) technology is fuelling demand for SMT equipment. Driven by growing popularity of LEDs, SMT equipment manufacturers are ramping up their production capacity to address demand from commercial and consumer electronics sectors.

Additionally, miniaturization of components is spurring the need for sophisticated SMT placement and inspection equipment. Eliminating rework, improving manufacturing processes, reducing associated costs, increasing yield and enhancing margins represent key benefits driving adoption of SMT inspection equipment. With modern day automobiles coming equipped with high-end entertainment, connectivity systems, and driver safety features, increased integration of power electronics is generating significant demand for SMT equipment in the automobile industry.

As stated by the new market research report on surface mount technology (SMT) equipment, Asia-Pacific represents the single largest market worldwide. With robust pace of industrialization, infrastructure development and GDP growth, the region offers bright growth prospects. Latin America, trailing a CAGR of 7.2% over the analysis period, is projected to emerge as the fastest growing market. While growth in the SMT equipment market in Europe continues to remain subdued amidst volatile economic conditions, long term prospects remain positive with EU gearing up to revive its position in the hardware and manufacturing industry and supporting innovative startups and electronics manufacturing clusters in the region.

SMT placement equipment represents the largest product segment within the SMT equipment market. Growth in the segment is attributed to the burgeoning momentum and thriving product innovation in the electronics market. Though product miniaturization is the most significant factor contributing to the resurgence and subsequent buoyancy in the SMT placement equipment segment, the need for higher accuracy placement equipment, improved speed and flexibility also play vital roles in driving growth. In the SMT Inspection Systems market, Automatic X-Ray Inspection (AXI) Equipment and Automatic Optical Inspection (AOI) Equipment are expected to gain traction over next few years. AXI equipment is expected to gain from the integration of computer tomography and intuitive programming. AOI equipment is projected to benefit from machine vision-based algorithms that feature easy programming capability, flexibility, and enhanced ability to detect faults and with few false call rates.

Major players in the market include ASM Assembly Systems GmbH & Co. KG, Assembléon Netherlands BV, Conceptronic, CyberOptics Corporation, Fuji Machine Manufacturing Co. Ltd., Heller Industries Inc., Juki Automation Systems Inc., Koh Young Technology Inc., Panasonic Corporation, Saki Corporation, and Universal Instruments among others.

The research report titled “Surface Mount Technology (SMT) Equipment: A Global Strategic Business Report” announced by Global Industry Analysts Inc., provides a comprehensive review of market trends, issues, product innovations/introduction, mergers, acquisitions and other strategic industry activities.

In either a cautious or a more aggressive scenario, LED applications will certainly be the key drivers for the bulk GaN market, according to Yole Développement.

There is no doubt that LED technology will take market share over the traditional lamp and tube business. The recent announcements from LED makers (> 150 lm/W now in production) are proving that the performance roadmap is in line with expectations: LED does as well and even better than traditional bulbs and tubes.

Native bulk GaN emerges as an alternative to sapphire or silicon, allowing further improvement of LED performance. Despite potential performance benefits for UHB-LEDs, massive adoption of GaN wafers remains hypothetical. Taking into account the historical price reductions of bulk GaN substrates, a base scenario outlines where the GaN on GaN LEDs will be limited only to niche markets.

“If the GaN industry succeeds in replying to the cost pressure from LED makers and the price of four inch GaN wafers falls below the breakeven price, a more significant adoption could be forecast. We see an about three times difference in terms of market volume for LED manufacturing between the two scenarios,” explains Dr Hong Lin, Market & Technology Analyst, Compound Semiconductors, at Yole Développement.

The demand of GaN substrates for LD applications will probably decrease below 20k TIE/yr threshold in the coming years.

Blu-ray applications now represent the largest market for blue LD applications. This market will increase in the short term with the arrival of the new generation game stations. However, Yole Développement believes that this growth will not persist, as more and more people will play games and watch movies online instead.

Despite the recent rapid development of blue and green laser diodes, Yole Développement sees two scenarios for the adoption of GaN based laser diodes for the emerging projector market. The price of LDs is the essential factor to consider.

Combining all applications, the demand for two inch GaN substrates will be more than two times higher in the aggressive scenario than in the base scenario. In the best case, the demand would keep relatively stable until 2020.

In R&D, non-polar and semi polar substrates have been proposed for LD manufacturing. In principle, the semi polar approach seems to be the most promising in terms of device performance. In practice, c-plane based devices still have better performance.

More than 85% commercial GaN wafers are produced by HVPE, dominated by Japanese companies.

Today, essentially all commercial GaN wafers are produced by HVPE, but the details of the growth process and separation techniques vary from company to company – for example, ammonothermal growth at Mitsubishi Chemical, and the new acidic ammonothermeral method at Soraa. Na-flux LPE growth seems promising, but Yole Développement’s analysts have not yet seen many GaN devices based on those substrates. It will take some time to convince the device producers.

Non-polar and semi polar substrates have attracted significant attention. However, the substrate size is still very small and unsuitable for mass production.

As of today, the GaN substrates market is currently heavily concentrated with 87 percent held by Japanese companies. Non-Japanese players are currently in small volume production or in R&D stage, too early to challenge the market leaders. Without exception, Japan will continue to dominate the Bulk/FS GaN market for the coming years.

LED GaN1

GaN substrates worldwide players (Yole Développement, November 2013)

Bulk GaN substrates for power electronics applications, a very challenging mission.

The GaN power device industry probably generated less than $2.5M in revenues in 2012. However, overall GaN activity has generated extra revenues as R&D contracts, qualification tests, and sampling for qualified customers was extremely buoyant. 16 out of 20 established power electronics companies are involved or will be involved in the GaN power industry.

Among the numerous substrates proposed for GaN power devices, bulk GaN solution is definitely beneficial to the device performance. However, Yole Développement remains quite pessimistic that bulk GaN could widely penetrate the power electronics segment unless 4” bulk GaN wafers can be in the $1,500 range by 2020.

The main reason is that, GaN power devices are positioned as a cost-effective solution, between incumbent Silicon and the ramping-up SiC technologies. If the $1,500 cost cannot be reached, then Yole Développement assumes no bulk GaN substrate will penetrate this market.

CHRISTIAN GREGOR DIESELDORFF, SEMI Industry Research & Statistics Group, San Jose, CA.

Some unexpected underdogs spur spending spree

Next year could be a golden year for the industry. While GDP in 2013 is generally about the same as in 2012, it is expected to rise in 2014, to 3.8 percent from 3.1 percent. Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about 8 percent. Semiconductor companies have adjusted their capital expenditure accordingly, and the SEMI World Fab Forecast data now indicates fab equipment spending for 2014 will reach historic highs.

The SEMI World Fab Forecast report tracks over 200 projects, with details revealing that fab equipment spending declines by 1 percent in 2013, but will increase 25 percent in 2014, including new, used and in-house equipment.

Overall fab spending in the first half of 2013 was slower, especially for fab equipment spending. Excluding a large purchase by GLOBALFOUNDRIES for used 300mm equipment from Promos (NT$20 to NT$30 billion) the decline in 2013 would have been -3.4 percent instead of -1 percent. Fab equipment spending is expected to be stronger in the second half of 2013, with a 30 to 40 percent increase over the first half, though the year will end with an overall equipment spending decrease of -1 percent.

SEMI’s data show a different outlook for fab construction projects, forecasting a 25 percent increase in 2013 and then a drop of 16 percent in 2014. Fabs being built this year will begin equipping next year which affects fab equipment spending.

Semiconductor device revenues did not grow in 2012 (dropped by about 2.7 percent), thus many companies slowed down capacity additions last year. With some improvement in the market, the SEMI data indicate that more capacity will be added in the 2nd half of 2013 and even more in 2014, for overall capacity growth of about 4 percent (FIGURE 1).

figure1
FIGURE 1. More capacity will be added in the 2nd half of 2013 and even more in 2014.


Underdog DRAM surges to the front of the pack

Fab equipment spending for dedicated foundries remains strong in 2013 ($12B) and in 2014 ($13B) — a growth rate of 5 percent in 2014. Foundry equipment spending growth rates have been more controlled and not changing as dramatically as in other industry segments. In the years prior to the economic downturn, fab equipment spending for DRAM was the highest spending industry segment. Since 2011, however, the dedicated foundry sector replaced DRAM as the leading industry sector (FIGURE 2).

Fab equipment spending growth for DRAM turned negative in 2011 and 2012, as companies consolidated or diverted memory capacity into other products such as System LSI. DRAM equipment spending dropped by double digits in 2011 and 2012 (-35 percent and -25 percent respectively). SEMI’s data show that this will change dramatically, with DRAM fab equipment spending surging by 17 percent in 2013 and at least 30 percent in 2014. Driven by increased average selling prices (ASPs), up by about 40 percent in 2013, companies will begin to see profit on DRAM and slowly invest in new capacity (FIGURE 3).

figure2
FIGURE 2. Since 2011, however, the dedicated foundry sector replaced DRAM as the leading industry sector.
figure3
FIGURE 3. Companies will begin to see profit on DRAM and slowly invest in new capacity.

An increase of about 2 to 3 percent for installed capacity for DRAM in 2014 is small but remarkable, given that the industry has not added any new DRAM capacity for years, and actually decreased capacity between 2011 and 2013.

The sector with largest growth rate for fab equipment spending in 2014 is expected to be Flash with 40 percent to 45 percent (YoY). Over the last few years, with fears of oversupply and price collapse, capacity additions for the Flash sector also stagnated. Some companies even stopped or reduced adding new capacity (for example, Sandisk in 2012 and in 2013), leading to a tight supply, but a rebound in capacity is expected in the 2nd half of 2013 and through 2014. SEMI’s reports show detailed predictions for robust spending in DRAM and Flash by several large companies.

For example, Micron, which officially acquired Elpida and Rexchip in July 2013, will dedicate almost half of its total 2014 capital expenditure to DRAM. After converting several fabs from memory to System LSI, rival Samsung is also expected to change tactics, spending less on System LSI and more on Memory in 2013 and 2014. Samsung’s Flash facility in China is expected to ramp to phase 1 by end of 2014. (The World Fab Forecast report reveals more detail on this and other surprising changes for S1 facilities and Line 16.) Overall fab equipment spending for Flash alone is expected to hit a record of almost $8B in 2014. The largest contributors are the Samsung fab in China and Line 16, Hynix M12 and M11, Flash Alliance fabs and Micron fabs.

MPU Joins DRAM as the next underdog
After Flash and DRAM, MPU is expected to show the next largest growth in 2014, with fab equipment spending growing by over 40 percent (YoY). While MPU languished in 2011 and 2012, and even dipped into negative growth in 2013, with low utilization in some fabs, Intel is now preparing for 14nm, kicking off an MPU surge for 2014. The World Fab Forecast report gives insight into Intel’s preparations for 14nm.

Semiconductor companies appear to have mastered the art of fast adaptation to chip prices and business developments. With improving prices for DRAM, similar changes steer various sectors of the industry into unprecedented growth. With GDP predictions around 3 to 4 percent, revenue expectations in upper single digits, and historic numbers for equipment spending, next year could be a golden year for many semiconductor companies and equipment manufacturers.

SEMI World Fab Forecast report
Since the last fab database publication at the end May 2013 SEMI’s worldwide dedicated analysis team has made 242 updates to 205 facilities (including Opto/LED fabs) in the database. The latest edition of the World Fab Forecast lists 1,147 facilities (including 247 Opto/LED facilities), with 66 facilities with various probabilities starting production this year and in the near future. We added 14 new facilities and closed 8 facilities.

The SEMI Worldwide Semiconductor Equipment Market Subscription (WWSEMS) data tracks only new equipment for fabs and test and assembly and packaging houses. The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment. •


CHRISTIAN GREGOR DIESELDORFF is the Senior Analyst, Director, Industry Research & Analysis Industry Research and Statistics Department at SEMI, San Jose, CA.

Despite a drop in global television unit demand in 2013, the semiconductor market for TVs is forecast to increase by an estimated seven percent to $13.1 billion, according to data presented in IC Insights’ upcoming IC Market Drivers 2014 report (Figure 1). Technologies such as wireless video connections, networking interfaces, multi-format decoders and LED backlighting have boosted the average semiconductor content in TV sets even as global TV unit shipments are forecast to decline by an estimated three percent in 2013, according to the report.

Figure 1

Figure 1

IC Insights projects that total global semiconductor revenue for televisions will grow 12 percent to $14.7 billion in 2014 due to an uptick in new TV sales in advance of the 2014 Winter Olympic Games and the 2014 FIFA World Cup.  Between 2012 and 2017, the semiconductor market for DTVs is forecast to grow at a healthy pace of 10 percent percent annually, increasing to $19.8 billion at the end of the forecast period.

Though the transition to digital TV broadcasting is largely complete in mature markets like North America, Western Europe, and Japan, the transition continues in emerging markets throughout Latin America and Asia-Pacific.  Through the forecast period, Chinese manufacturers are expected to flood the Asia-Pacific market with new (primarily low-cost) TVs.  However, it is worth noting that China’s leading TV makers, TCL Corp and Hisense Electric Co., also are accelerating their push into the U.S. market and trying to grab marketshare from Japanese and South Korean vendors.

Across all regions, shipments of Smart TVs and TVs with 3D technology are helping boost semiconductor content. The new IC Market Drivers report concludes, however, that both of these technologies face significant challenges in the next five years.  Challenges for Smart TV include fragmentation of platforms and standards and the strong likelihood for technology obsolescence after only a few years.

Meanwhile, the market for 3D TV took a hit earlier this year when ESPN announced that it planned to discontinue its 3D sports coverage and close its 3D sports channel by the end of 2013 to focus its time and efforts on improving traditional high-resolution broadcasts. 3D-equipped TVs are expected to grow to an estimated 23 percent of total TV shipments in 2013, but this may be a “false positive” since manufacturers now include 3D technology on many of their new TVs even though consumers aren’t using the feature.

A couple of technologies showing considerable promise are curved-panel organic LED (OLED) TVs and 4K or Ultra-high definition (UHD) TVs that feature twice the resolution of today’s existing HDTV sets. Additionally, the IC Market Drivers 2014 report points out that significant changes are underway as traditional cable and satellite service providers face new and renewed threats from Google, Apple, Amazon, Intel, and others to provide alternative methods to viewing one’s favorite shows.

One problem in developing more efficient organic LED light bulbs and displays for TVs and phones is that much of the light is polarized in one direction and thus trapped within the light-emitting diode, or LED. University of Utah physicists believe they have solved the problem by creating a new organic molecule that is shaped like rotelle – wagon-wheel pasta – rather than spaghetti.

The rotelle-shaped molecule – known as a “pi-conjugated spoked-wheel macrocycle” – acts the opposite of polarizing sunglasses, which screen out glare reflected off water and other surfaces and allow only direct sunlight to enter the eyes.

The new study showed wagon-wheel molecules emit light randomly in all directions – a necessary feature for a more efficient OLED, or organic LED. Existing OLEDs now in some smart phones and TVs use spaghetti-shaped polymers – chains of repeating molecular units – that emit only polarized light.

“This work shows it is possible to scramble the polarization of light from OLEDs and thereby build displays where light doesn’t get trapped inside the OLED,” says University of Utah physicist John Lupton, lead author of a study of the spoked-wheel-shaped molecules published online Sunday, Sept. 29 in the journal Nature Chemistry.

“We made a molecule that is perfectly symmetrical, and that makes the light it generates perfectly random,” he adds. “It can generate light more efficiently because it is scrambling the polarization. That holds promise for future OLEDs that would use less electricity and thus increase battery life for phones, and for OLED light bulbs that are more efficient and cheaper to operate.”

Lupton emphasizes the study is basic science, and new OLEDs based on the rotelle-shaped molecules are “quite a way down the road.”

He says OLEDs now are used in smart phones, particularly the Samsung Galaxy series; in pricey new super-thin TVs being introduced by Sony, Samsung, LG and others; and in lighting.

“OLEDs in smart phones have caught on because they are somewhat more efficient than conventional liquid-crystal displays like those used in the iPhone,” he says. “That means longer battery life. Samsung has already demonstrated flexible, full-color OLED displays for future roll-up smart phones.” Lupton says smart phones could produce light more efficiently using molecules that don’t trap as much light.

The large rotelle-shaped molecules also can “catch” other molecules and thus would make effective biological sensors; they also have potential use in solar cells and switches, he adds.

The study was funded by the Volkswagen Foundation, the German Chemical Industry Fund, the David and Lucille Packard Foundation and the European Research Council.

Lupton is a research professor of physics and astronomy at the University of Utah and also on the faculty of the University of Regensburg, Germany. He conducted the study with Utah physics graduate student Alexander Thiessen; Sigurd Höger, Vikas Aggarwal, Alissa Idelson, Daniel Kalle and Stefan-S. Jester of the University of Bonn; and Dominik Würsch, Thomas Stangl, Florian Steiner and Jan Vogelsang of the University of Regensburg.

Freeing Trapped Light

While conventional LEDs use silicon semiconductors, OLEDs in some of the latest cell phones and TVs are made with “pi-conjugated polymers,” which are plastic-like, organic semiconductors made of a chain of repeating molecular units.

“Conjugated polymers are a terrible mess,” Lupton says. “They now make only mediocre OLEDs, although people like to claim the opposite.”

For one thing, three-quarters of the light energy is in a state that normally is inaccessible – a problem addressed by another recent University of Utah study of OLEDs. Lupton says his study deals with another problem, which exists even if the other problem is overcome: the polarization of light in pi-conjugated polymers that leads to the “trapping” or loss of up to 80 percent of the light generated.

“Light is an oscillating field like a wave, and a wave moves in a certain direction,” Lupton says. “We call this direction of oscillation a polarization.”

Because polymers are long molecules like spaghetti, when an electrical current is applied to a polymer, “the electrons can only flow in one direction and that generates the light waves,” Lupton says. “Because those light waves only oscillate in one direction, the light can get trapped inside the OLED, which is a little bit like an optical fiber.”

That, he adds, is why even with the latest OLED smart phones, “your battery is dead in two days because the display uses a lot of the electricity.”

“The rotelle – technically called oligomers – are basically wrapped-up polymers,” Lupton says. “They all have the same shape, but they do not emit polarized light because they are round. They generate waves that vibrate in all directions. The light doesn’t have a fixed polarization; it doesn’t vibrate in a fixed direction. It always can get out.”

Lupton compares the ability of the wagon-wheel molecules to emit unpolarized light in all directions to what happens when a pencil is balanced perfectly on its tip and falls in a different, random direction each time.

Cooking up a Wagon Wheel-Shaped Molecule

The international team of physicists and chemists set out to make molecules that generate light waves in all directions rather than in a fixed direction. In the new study, they report how the created the spoked-wheel molecules, made images of them and did single-molecule experiments, including looking at photons, or light particles, emitted one at a time from a single molecule. In those experiments, they shined an ultraviolet light on the rotelle-shaped molecules to generate visible light photons.

“We showed that every photon that comes out has a scrambled polarization, the polarization changes randomly from photon to photon,” Lupton says.

The emitted light is blue-green, Lupton says, but images accompanying the paper – taken with a scanning tunneling electron microscope – show the rotelle- and spaghetti-shaped molecules with a false yellow-brown color to provide good contrast.

Each wagon-wheel molecule measures only six nanometers wide, which is large for a molecule but tiny compared with the 100,000 nanometer width of a human hair.

Using rotelle-shaped oligomers instead of spaghetti-shaped polymers, “in principle, we should be able to double the efficiency of getting the light out” – although that remains to be proved, Lupton says.

“Even if we scramble the polarization, we’re always going to have a bit of light trapped in the OLED,” he says. “Those losses are now 80 percent, and we probably could get down to 50 or 60 percent.”

As a modern culture, we crave artificial white lights — the brighter the better, and ideally using less energy than ever before. To meet the ever-escalating demand for more lighting in more places and to improve the bulbs used in sports stadiums, car headlights and street lamps, scientists are scrambling to create better light-emitting diodes (LEDs) — solid state lighting devices that are more energy efficient than conventional incandescent or fluorescent light sources.

Just one thing stands in the way: “droop,” the term for a scientific problem related to LEDs currently in use. Droop refers to the fact that LED efficiency falls as operating currents rise, making the lights too hot to power in large-scale applications. Many scientists are working on new methods for modifying LEDs and making progress toward cooler, bigger and brighter bulbs.

Now investigators at University of California, Santa Barbara, led by material scientists Kristin A. Denault and Michael Cantore, have devised an alternative means of creating high-power white light by using a different excitation source — a laser diode in combination with inorganic phosphors, instead of the traditional LEDs.

Their laser-based lighting options are high in efficiency and high in performance metrics, according to their study, which is described in the journal AIP Advances, which is produced by AIP Publishing.

“We found two ways to create high-intensity ‘cool’ white light, explained Denault. “In one we used a blue laser diode and yellow-emitting phosphor powder with a luminous flux of 252 lumens, which is comparable to current high-brightness white LEDs. For our second method, we used a near-ultra-violet laser diode and a combination of red-, green-, and blue-emitting phosphors.”

They also achieved a variety of other color temperatures with high color rendition, broadening the range of applications for these new lights, she said.