Category Archives: MEMS

Silicon Labs, a provider of semiconductor and software solutions for the Internet of Things (IoT) and Digi-Key, a developer of electronic component selection, availability and delivery, today announced an IoT design contest for pioneering developers who want to create connected “things” that will help make the world a smarter, more connected and energy-friendly place. Co-sponsored by Silicon Labs and Digi-Key, the “Your IoT Connected World” design contest is open to inventors of all skill levels, from professional embedded developers and seasoned makers to electronics enthusiasts.

The contest runs now through July 17, with three winners to be announced on August 3, 2015. Visitors to the www.YourIoTContest.com site will vote to decide on 15 finalists, and expert judges from Silicon Labs and Digi-Key will choose the three winners. Each winner will select the Silicon Labs components they need (microcontrollers, wireless chips, sensors, boards and more – valued up to $10,000) to bring their prize-winning IoT ideas to market as commercially viable products.

“The silicon and software technology needed to make ‘your IoT’ a reality is available today, and it’s up to pioneering developers like you to create the next IoT innovations that will help save time and energy, enhance health and security, and improve the quality of life for people everywhere,” said Peter Vancorenland, vice president of engineering and IoT solutions at Silicon Labs. “This is your chance to bring your groundbreaking IoT ideas to market, enabled by Silicon Labs development tools and kickstarted by $10,000 in Silicon Labs components.”

“Whether designers are solving an existing problem or creating a totally new invention, ideas are limited only by the developer’s imagination,” said David Sandys, director of technical marketing for Digi-Key. “Winning IoT designs may include innovations like connected home devices, smart appliances, lighting control systems, wearable technology, security systems, wireless sensor networks and much more.”

To get started, simply visit www.YourIoTContest.com. All IoT designs must contain a Silicon Labs microcontroller (MCU) product. Each contestant must submit photos or a brief video overview of their IoT product design. Silicon Labs offers a wide array of 8-bit and 32-bit MCUs, wireless ICs, interface chips, optical and environmental sensors, and development tools for IoT applications, all available through Digi-Key. To help simplify the evaluation, design and prototyping process, Silicon Labs’ Simplicity Studio development platform can be downloaded at no charge at www.silabs.com/simplicity-studio.

The competition is open to contestants in selected countries in the Americas and EMEA including Austria, Belgium, Brazil, Canada (excluding Quebec), the Czech Republic, Denmark, Finland, France, Germany, Hungary, Ireland, Israel, Italy, Mexico, Norway, Poland, Portugal, Spain, Sweden, Turkey, the United Kingdom and the United States.

Creating large amounts of polymer nanofibers dispersed in liquid is a challenge that has vexed researchers for years. But engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

In a paper published online in Advanced Materials, the NC State researchers and colleagues from industry, including NC State start-up company Xanofi, describe the method that allows them to fabricate polymer nanofibers on a massive scale.

The method – fine-tuned after nearly a decade of increasing success in producing micro- and nanoparticles of different shapes – works as simply as dropping liquid solution of a polymer in a beaker containing a spinning cylinder. Glycerin – a common and safe liquid that has many uses – is used to shear the polymer solution inside the beaker along with an antisolvent like water. When you take out the rotating cylinder, says Dr. Orlin Velev, Invista Professor of Chemical and Biomolecular Engineering at NC State and the corresponding author of the paper describing the research, you find a mat of nanofibers wrapped around it.

When they first started investigating the liquid shearing process, the researchers created polymer microrods, which could have various useful applications in foams and consumer products.

“However, while investigating the shear process we came up with something strange. We discovered that these rods were really just pieces of ‘broken’ fibers,” Velev said. “We didn’t quite have the conditions set perfectly at that time. If you get the conditions right, the fibers don’t break.”

NC State patented the liquid shear process in 2006 and in a series of subsequent patents while Velev and his colleagues continued to work to perfect the process and its outcome. First, they created microfibers and nanoribbons as they investigated the process.

“Microfibers, nanorods and nanoribbons are interesting and potentially useful, but you really want nanofibers,” Velev said. “We achieved this during the scaling up and commercialization of the technology.”

Velev engaged with NC State’s Office of Technology Transfer and the university’s TEC (The Entrepreneurship Collaborative) program to commercialize the discoveries. They worked with the experienced entrepreneur Miles Wright to start a company called Xanofi to advance the quest for nanofibers and the most efficient way to make mass quantities of them.

“We can now create kilograms of nanofibers per hour using this simple continuous flow process, which when scaled up becomes a ‘nanofiber gusher,'” Velev said. “Depending on the concentrations of liquids, polymers and antisolvents, you can create multiple types of nanomaterials of different shapes and sizes.”

“Large quantities are paramount in nanomanufacturing, so anything scalable is important,” said Wright, the CEO of Xanofi and a co-author on the paper. “When we produce the nanofibers via continuous flow, we get exactly the same nanofibers you would get if you were producing small quantities of them. The fabrication of these materials in liquid is advantageous because you can create truly three-dimensional nanofiber substrates with very, very high overall surface area. This leads to many enhanced products ranging from filters to cell scaffolds, printable bioinks, battery separators, plus many more.”

Smaller and more powerful medical systems are driving up sales of ICs, sensors, and other devices for the medical semiconductor market.  IC Insights believes medical semiconductor sales growth will strengthen this year and next before sliding back in the next expected economic slowdown in 2017 (Figure 1). Between 2013 and 2018, worldwide medical semiconductor sales are projected to rise by a compound annual growth rate (CAGR) of 12.3 percent, reaching $8.2 billion in the final year of the forecast.  In the 2008-2013 period (which included the 2009 downturn), medical semiconductor sales grew by a CAGR of 6.9 percent.

medical semiconductor sales

The IC portion of the medical semiconductor business is expected to rise by a CAGR of 10.7 percent to $6.6 billion in 2018 while the marketshare for optoelectronics, sensors/actuators, and discretes (O-S-D) is forecast to grow by an annual rate of 20.3 percent to $1.6 billion that year (primarily due to strong demand for solid-state sensors and optical imaging devices).

ICs and other semiconductor technologies continue to play key roles in reshaping and redefining medical systems. With more medical imaging systems being digitized and healthcare equipment running under computer control, IC-driven advancements are happening almost as quickly as they are in mobile phones, and many consumer electronics. Government certification can slow some system introductions. The scaling of IC feature sizes, system-on-chip (SoC) designs, improvements in sensors, and powerful analog frontend (AFE) data converters are reducing the size of medical diagnostic equipment and the cost of using them.

Developments of new medical systems for imaging and diagnostics, treatment, and surgery are heading in two different directions as equipment makers respond to growing pressures for lower costs and increased availability of healthcare worldwide. In one direction, new medical equipment is becoming smaller and less expensive so that systems can be used in the rooms of hospital patients, clinics, and doctor offices. These systems cost one-quarter to one-tenth the price of large diagnostic equipment—such as traditional MRI and CT scanners, which can cost $1 million and are normally installed in medical-imaging centers or in dedicated hospital examination rooms.

Also, lower-cost wearable medical systems and fitness monitors, which can wirelessly transmit vital signs and other readings to doctors or be used as “activity trackers” for health-conscious individuals, are seeing tremendous growth. In some cases, medical and fitness-monitoring applications can be performed directly by smartphones using their embedded sensors and downloaded software apps. However, medically certified mobile healthcare devices are usually required in most countries for monitoring patients and the elderly in their homes. The information is sent to doctors via wireless connections to cellphones or the Internet.

The second major trend in medical equipment is the development of more powerful and integrated systems, which are expensive but promise to lower healthcare costs by detecting cancer and diseases sooner and supporting less invasive surgery for quick recovery times and shorter stays in hospitals. Computer-assisted surgery systems, surgical robots, and operating-room automation are among new technologies being pursued by some hospitals in developed markets.

High growth in lower-cost systems along with the rising price tag of more sophisticated hospital equipment in developed country markets is expected to increase total medical electronics systems sales by a CAGR of 8.2 percent between 2013 and 2018, to $70.1 billion in the final year of the forecast.

Additional details on the IC market for medical and wearable electronic is included in the 2015 edition of IC Insights’ IC Market Drivers—A Study of Emerging and Major End-Use Applications Fueling Demand for Integrated Circuits.

Graphene quantum dots made from coal, introduced in 2013 by the Rice University lab of chemist James Tour, can be engineered for specific semiconducting properties in either of two single-step processes.

Vials hold solutions with graphene quantum dots that fluoresce in different colors depending on the dots' size. Techniques to produce the dots in specific sizes using coal as a source were developed at Rice University. Credit: Tour Group/Rice University

Vials hold solutions with graphene quantum dots that fluoresce in different colors depending on the dots’ size. Techniques to produce the dots in specific sizes using coal as a source were developed at Rice University.
Credit: Tour Group/Rice University

In a new study this week in the American Chemical Society journal Applied Materials & Interfaces, Tour and colleagues demonstrated fine control over the graphene oxide dots’ size-dependent band gap, the property that makes them semiconductors. Quantum dots are semiconducting materials that are small enough to exhibit quantum mechanical properties that only appear at the nanoscale.

Tour’s group found they could produce quantum dots with specific semiconducting properties by sorting them through ultrafiltration, a method commonly used in municipal and industrial water filtration and in food production.

The other single-step process involved direct control of the reaction temperature in the oxidation process that reduced coal to quantum dots. The researchers found hotter temperatures produced smaller dots, which had different semiconducting properties.

Tour said graphene quantum dots may prove highly efficient in applications ranging from medical imaging to additions to fabrics and upholstery for brighter and longer-lasting colors.

“Quantum dots generally cost about $1 million per kilogram and we can now make them in an inexpensive reaction between coal and acid, followed by separation. And the coal is less than $100 per ton.”

The dots in these experiments all come from treatment of anthracite, a kind of coal. The processes produce batches in specific sizes between 4.5 and 70 nanometers in diameter.

Graphene quantum dots are photoluminescent, which means they emit light of a particular wavelength in response to incoming light of a different wavelength. The emitted light ranges from green (smaller dots) to orange-red (larger dots). Because the emitted color also depends on the dots’ size, this property can also be tuned, Tour said. The lab found quantum dots that emit blue light were easiest to produce from bituminous coal.

The researchers suggested their quantum dots may also enhance sensing, electronic and photovoltaic applications. For instance, catalytic reactions could be enhanced by manipulating the reactive edges of quantum dots. Their fluorescence could make them suitable for metal or chemical detection applications by tuning to avoid interference with the target materials’ emissions.

Global electronic components distributor Digi-Key Corporation, a provider of electronic component selection, availability and delivery, has partnered with AKM Semiconductor Inc., to facilitate the global distribution of AKM’s products.

In accordance with this renewed agreement, Digi-Key has added a number of AKM’s most reputable products to its selection, which include recently released Premium Audio Products, high bandwidth current sensors and industry’s lowest power PMICs tailored for the wearable market.

“We are pleased to announce our agreement with AKM Semiconductor to expand with a global distribution agreement,” said David Stein, Digi-Key’s Vice President of Semiconductor. “In addition to already popular electronic compass, we are excited to offer AKM’s high performance data converters, a variety of unique magnetic sensors and more new products to our customers worldwide.”

Asahi Kasei Microdevices Corporation (AKM) is a Japan-based company designs and manufactures CMOS mixed signal integrated circuits and magnetic sensors for applications including audio, multimedia, consumer electronics, industrial infrastructure, and telecommunications.

Digi-Key Corporation, based in Thief River Falls, Minn., is a global, full-service provider of both prototype/design and production quantities of electronic components, offering more than three million products from over 650 quality name-brand manufacturers

Entrepix, Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced that it has expanded its foundry operations in Phoenix, Arizona by installing 300mm chemical mechanical planarization (CMP) processing. The new offering expands on the company’s existing 200mm and below foundry operations, allowing Entrepix to offer CMP R&D and volume production for all wafer sizes up to 300mm.

To achieve this capability, Entrepix added AMAT Reflexion and Ebara F-REX 300 CMP polishing platforms in its Class 100 cleanroom. Both systems are available for various applications, including various dielectrics, metals and substrates. Additionally, the systems can be used for screening or comparing consumable sets (pads, slurries, pad conditioners and cleaning chemistries) across both platforms.

“Our foundry operations offer our customers a capability that is unique in the industry,” said Tim Tobin, CEO of Entrepix. “Our CMP consumable customers can benefit from creating independent, non-biased performance data for their products.”

The Entrepix foundry provides complete CMP solutions for customers at any level of development or production. This flexible manufacturing model improves financial performance by optimizing internal efficiencies and reducing time to revenue.

Entrepix Inc. serves the semiconductor and related industries as a provider of chemical mechanical polishing (CMP) production, integration and optimization services to IDMs, OEMs, MEMS, nanotechnology and CMP consumables suppliers. The company renews technology for existing and emerging CMP users by refurbishing semiconductor equipment or adapting the equipment for use in novel applications, such as airbag sensors and photovoltaics.

Poised for more growth


March 17, 2015

By Christian G. Dieseldorff, Industry Research & Statistics Group, SEMI

The most recent edition of the SEMI World Fab Forecast report — which tracks fab spending for construction and equipment, as well as capacity changes, and technology nodes transitions and product type changes by fab — reveals a positive forecast. The report shows that fab equipment spending in 2014 increased 20 percent, is expected to rise 15 percent in 2015, with another increase of 2-4 percent in 2016. Spending on construction projects, which typically represents new cleanroom projects, will see a significant decline in 2015 with -32 percent, but is expected to increase by 32 percent in 2016.  Since its last publication in November 2014, about 270 updates were made including data on 17 new facilities.

Fab Equipment/Fab Construction (2013-2016)

 

2013

2014

2015

2016
Fab equipment* 

$29.4

$35.2

$40.5

$41 to $42
Change % Fab equipment

-10.0%

19.8%

15.0%

2% to 4%
Fab construction US$

$8.8

$7.7

$5.2

$6.9
Change % construction

13.6%

-11.0%

-32.0%

+32.0%

* Chart US$, in billions; Source: SEMI, March 2015; SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment and spending on facilities for installation.

The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment and spending on facilities for installation.

Fab spending, such as construction spending and equipment spending, are fractions of a company’s total capital expenditure (capex). Typically, if capex shows a trend to increase, fab spending will follow.  Capex for most of the large semiconductor companies is expected to increase by eight percent in 2015, and grow another three percent in 2016. These increases are driven by new fab construction projects and also ramp of new technology nodes. Spending on construction projects, which typically represents new cleanroom projects, will experience a significant -32 percent decline in 2015, but is expected to rebound by 32 percent in 2016.

With worldwide capex growth of 8 percent, fab equipment spending is expected to increase by 15 percent in 2015.  At this point, SEMI’s data predict a slowdown of fab equipment spending in 2016 to low single digits.  No negative change is currently expected in our forecast scenario. Looking back to the last 25 years, after two years of growth a negative year typically followed. This may not be the case this time. Developments in the industry are pointing to a small but positive 2016.

Most fab equipment spending in 2015 is for foundry, memory, and Logic+MPU. Discretes including LED remain at about 4 percent share, MEMS/Other about 2-3 percent and Analog at less than1 percent.  Distribution will not change for 2016, except for foundry spending, which continues to increase year-over-year.

Comparing regions across the world, according to SEMI, the highest fab equipment spending in 2015 will occur in Taiwan, with US$ 11.9 billion, followed by Korea with US$ 9 billion.  The region with third largest spending, the Americas, is forecast to spend about US$ 7 billion.  Yet growth will decline in the Americas, by 12 percent in 2015, and decline by 12 percent in 2016 again.  Fourth in spending is China, with US$ 4.7 billion in 2015 and US$ 4.2 billion in 2016. In other regions, Japan’s spending will grow by about 6 percent in 2015, to US$ 4 billion; and 2 percent in 2016, to US$ 4.2 billion.  The Europe/Mideast region will see growth of about 20 percent (US$ 2.7 billion) in 2015 and over 30 percent (US$ 3.5 billion) in 2016. South East Asia is expected to grow by about 15 percent (US$ 1.3 billion) in 2015 and 70 percent (US$ 2.2 billion) in 2016.

New facilities beginning construction in 2015 and 2016 will start equipping in 2016 or later. SEMI’s data show that seven new facilities will start construction in 2015 (including one LED and one shell). In 2016, construction will possibly begin on five or six new fabs.

2015 is expected to be the second consecutive year in equipment spending growth. Our positive outlook for the year is based on spending trends we are tracking as part of our fab investment research. As noted in some of the examples cited above, the “bottom’s up” company-by-company and fab-by-fab approach points to strong investments by foundries and memory companies driving this year’s growth. Learn more about the SEMI fab databases at: www.semi.org/MarketInfo/FabDatabase.

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced two new configurations to its EVG 580 ComBond series of automated high-vacuum covalent wafer bonding systems. Addressing the needs of universities and R&D institutes, and high-volume manufacturing (HVM) requirements, respectively, both system configurations achieve electrically conductive and oxide-free bonds of materials with different lattice constants and coefficients of thermal expansion at room temperature.

Applications that demand room-temperature bonding of substrates with very different material properties and that are supported by the EVG580 ComBond series include advanced engineered substrates, power devices, stacked solar cells and emerging technologies such as silicon photonics.

The new entry-level EVG580 ComBond system for universities and R&D institutes comes with one cassette station or manual load port as well as a single-arm robot, supporting up to three process modules. The EVG580 ComBond HVM system can be configured with two cassette stations or an equipment front-end module with up to four cassettes for continuous mode operation, as well as comes with a dual-arm robot to support up to six process modules for maximum throughput.

Both new ComBond system configurations, as well as the standard system that can accommodate up to five process modules, are built on a modular platform supporting wafers up to 200mm in diameter. In addition to one or more bond chambers, the systems feature a dedicated ComBond Activation Module (CAM), which provides advanced surface preparation by directing energized particles to the substrate surface to achieve a contamination-free and oxide-free bond interface. The systems operate in a high-vacuum-process environment with base pressures in the range of 5×10-8 mbar, which prevents re-oxidation of the treated wafers prior to the bonding step.

“The EVG580 ComBond system with its standard five-module configuration, which was launched last autumn, has already demonstrated its capabilities with multiple R&D partners and customers,” stated Dr. Thomas Glinsner, corporate product management director at EV Group. “With the new three-module system, we will now make this breakthrough technology available to universities and smaller R&D institutes, which often are at the forefront of pioneering advanced electronic materials and device research, such as heterogeneous integration of compound semiconductors for silicon photonics and other leading-edge applications. All ComBond systems can be further customized to address specific application development needs, such as with special metrology modules utilizing free ports of the high-vacuum handling.”

wafer bonding ev group

Building on the highly successful inaugural program Innovation Village, SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders. The SEMICON Europa technology and business program agenda addresses the critical issues and challenges facing the microelectronics industries and provides information, education, and guidance for industry professional to move innovations and products to market. This year’s Innovation Village will bring together the most innovative European start-up and growth companies with leading investors from semiconductor and related industries.  New in 2015 is cooperation with the incubator “HighTech Startbahn” from Dresden with their Investors Congress “HighTech Venture Days.” As a result, the Innovation Village program has expanded to a four-day event with 60 selected companies, six high-tech sectors, speed presentations (pitches) and 60+ investors.

The goal of Innovation Village is to encourage exchanges between high-tech ventures and industry relevant investors. Participating start-up and growth companies have the opportunity to exhibit for three days at individual kiosks in the Innovation Village exhibition hall, presenting their innovations in a series of short pitches.  The Innovation Village features 40 private pitches to investors only, plus 20 public pitches — focusing on Information Communication Technology (ICT), Micro- and Nanotechnology and related applications, Materials Science, Environment and Energy Technology, Machinery and Plant Engineering, Industry 4.0 and Life Science and Automotive.

With a dedicated conference program on innovation and a live demonstration day for innovation products and applications, Innovation Village provides a uniquely valuable platform for both high-tech ventures as well as investors. The Innovation Village exhibition hall will also host several key industry companies and investors in exclusive booths with private meeting space.

“Saxony has gained a reputation for being one of Europe’s leading regions in innovative research,” says Heinz Kundert, president of SEMI Europe. “With the Innovation Village coming to Dresden for the first time, it is an excellent occasion to demonstrate the region’s capabilities for innovative technologies and products.”

“Dresden has proven to be one of Europe’s leading cities for IC manufacturing and microelectronics driven technology. The region is also host to a high number of innovations based start-ups,” says Bettina Vossberg, Chairwoman of the Board of Directors, HighTech Startbahn. “With the enhancement of both our strong concepts, it is an excellent occasion to demonstrate Europe’s capabilities in innovation and commercialization of new technologies.”

Innovation Village will represent the most viable new technology in Europe. Interested start-ups and growth companies are invited to fill out a Request for Participation (RFP) form online at the SEMICON Europa website (www.semiconeuropa.org). The ventures are encouraged to apply as early as possible. RFPs will be judged by SEMICON Europa Innovation Village Committee and HighTech Startbahn experts in venture capitalism and new technology investment: Tobias Jahn (3M New Ventures); Tony Chao (Applied Ventures LLC), Claus Schmidt (Robert Bosch Venture GmbH), Jim Traynor (TEL Venture), Christophe Desrumeaux (CEA Investissement), Jong Sang Choi (Samsung Ventures), Jean-Marc Girard (Air Liquid Electronics), Jean-Marc Bally (ASTER Capital), Erkki Aaltonen (VTT Ventures) and Pascal Vanluchene (Capital-E).

To encourage visibility for both investors and early stage innovative ventures, Innovation Village conferences and the exhibition will be free-of-charge for all SEMICON Europa visitors. Speakers will attract diverse visitors, including large companies, SMEs, and start-ups to the Innovation Village area. Dedicated innovation lounge areas set amidst the exhibition kiosks will allow visitors, investors and start-ups to interact with each other.

Samsung, Apple and Chinese OEMs will drive revenue in the light sensor market to grow 16 percent between 2013 and 2016, according to a new report released today from IHS Inc., a global source of critical information and insight.

The latest MEMS & Sensors report from IHS, Shining a Light on a Colourful Market, found that revenues will reach $767 million in 2016, a 16 percent rise in three years (2013 to 2016).

“Between 2013 and 2015, there has been a rapid adoption of light sensor units, mostly thanks to Samsung,” said Marwan Boustany, senior analyst for MEMS and Sensors at IHS Technology. “Samsung has led the mass adoption of RGB sensors, gesture sensors, optical pulse sensors and even UV sensors in this timeframe.”

Apple and Samsung lead the pack, but Chinese firms are on their heels

In 2014, Samsung accounted for 43 percent of light sensor spending in handsets. The company spent $271.8 million on light sensors in 2014, with a sizeable portion of this coming from the apathetically received pulse sensor.

Apple is the second largest buyer of light sensors after Samsung and spent $129.5 million in 2014. Apple accounted for 19 percent of light sensor spending in handsets in 2014 because Apple uses custom and high performance parts. IHS forecasts that by 2017, Apple will adopt a 3-in-1 package because solutions that offer both the size and performance it seeks should be available by this time.

Chinese Original Equipment Manufacturers (OEMs) represented 23 percent of light sensor spending in 2014, mostly on standard low cost components and a small percentage of high cost, high performance parts.

“The Chinese market remains a place where anything and everything can be tried as companies try to find any and every means to differentiate or at least match flagships from Samsung and Apple,” Boustany said. “Chinese OEMs are also characterized by preferring to have several suppliers for their sensors, ranging from three to six or more suppliers. The Chinese market is very competitive with price being the key element for most OEMs.”

Top sensor suppliers and new champions

Ams claimed the top spot in terms of revenue and units thanks to its range of customers and its key design wins with Samsung flagships and its spread across Apple products. Ams shipped 744 million sensors in 2014.

Maxim followed in second place. “Maxim managed to be a top performer in the consumer light sensor market, with 132 million light sensors shipped in 2014, with the majority of these being optical pulse sensors going into Samsung’s flagship devices.

The important news in 2014 is the rapid rise of companies like Sitronix, Elan and Everlight. “Sitronix has been successful at being a second or third source to a range of top tier companies, which means it can grow safely and rapidly,” Boustany said. “In 2014, it achieved about $25 million for a 69 percent revenue growth.”

Light_sensor_units_-_IHS_Technology