Category Archives: MEMS

A team of Columbia Engineering researchers has invented a technology–full-duplex radio integrated circuits (ICs)–that can be implemented in nanoscale CMOS to enable simultaneous transmission and reception at the same frequency in a wireless radio. Up to now, this has been thought to be impossible: transmitters and receivers either work at different times or at the same time but at different frequencies. The Columbia team, led by Electrical Engineering Associate Professor Harish Krishnaswamy, is the first to demonstrate an IC that can accomplish this. The researchers presented their work at the International Solid-State Circuits Conference (ISSCC) in San Francisco on February 25.

“This is a game-changer,” says Krishnaswamy. “By leveraging our new technology, networks can effectively double the frequency spectrum resources available for devices like smartphones and tablets.”

CoSMIC (Columbia high-Speed and Mm-wave IC) Lab full-duplex transceiver IC that can be implemented in nanoscale CMOS to enable simultaneous transmission and reception at the same frequency in a wireless radio. Image courtesy Jin Zhou and Harish Krishnaswamy, Columbia Engineering

CoSMIC (Columbia high-Speed and Mm-wave IC) Lab full-duplex transceiver IC that can be implemented in nanoscale CMOS to enable simultaneous transmission and reception at the same frequency in a wireless radio.
Image courtesy Jin Zhou and Harish Krishnaswamy, Columbia Engineering

In the era of Big Data, the current frequency spectrum crisis is one of the biggest challenges researchers are grappling with and it is clear that today’s wireless networks will not be able to support tomorrow’s data deluge. Today’s standards, such as 4G/LTE, already support 40 different frequency bands, and there is no space left at radio frequencies for future expansion. At the same time, the grand challenge of the next-generation 5G network is to increase the data capacity by 1,000 times.

So the ability to have a transmitter and receiver re-use the same frequency has the potential to immediately double the data capacity of today’s networks. Krishnaswamy notes that other research groups and startup companies have demonstrated the theoretical feasibility of simultaneous transmission and reception at the same frequency, but no one has yet been able to build tiny nanoscale ICs with this capability.

“Our work is the first to demonstrate an IC that can receive and transmit simultaneously,” he says. “Doing this in an IC is critical if we are to have widespread impact and bring this functionality to handheld devices such as cellular handsets, mobile devices such as tablets for WiFi, and in cellular and WiFi base stations to support full duplex communications.”

The biggest challenge the team faced with full duplex was canceling the transmitter’s echo. Imagine that you are trying to listen to someone whisper from far away while at the same time someone else is yelling while standing next to you. If you can cancel the echo of the person yelling, you can hear the other person whispering.

“If everyone could do this, everyone could talk and listen at the same time, and conversations would take half the amount of time and resources as they take right now,” explains Jin Zhou, Krishnaswamy’s PhD student and the paper’s lead author. “Transmitter echo or ‘self-interference’ cancellation has been a fundamental challenge, especially when performed in a tiny nanoscale IC, and we have found a way to solve that challenge.”

Krishnaswamy and Zhou plan next to test a number of full-duplex nodes to understand what the gains are at the network level. “We are working closely with Electrical Engineering Associate Professor Gil Zussman’s group, who are network theory experts here at Columbia Engineering,” Krishnaswamy adds. “It will be very exciting if we are indeed able to deliver the promised performance gains.”

Borrowing a trick from nature, engineers from the University of California at Berkeley have created an incredibly thin, chameleon-like material that can be made to change color — on demand — by simply applying a minute amount of force.

This new material-of-many-colors offers intriguing possibilities for an entirely new class of display technologies, color-shifting camouflage, and sensors that can detect otherwise imperceptible defects in buildings, bridges, and aircraft.

“This is the first time anybody has made a flexible chameleon-like skin that can change color simply by flexing it,” said Connie J. Chang-Hasnain, a member of the Berkeley team and co-author on a paper published today in Optica, The Optical Society’s (OSA) new high-impact journal.

By precisely etching tiny features — smaller than a wavelength of light — onto a silicon film one thousand times thinner than a human hair, the researchers were able to select the range of colors the material would reflect, depending on how it was flexed and bent.

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A Material that’s a Horse of a Different Color

The colors we typically see in paints, fabrics, and other natural substances occur when white, broad spectrum light strikes their surfaces. The unique chemical composition of each surface then absorbs various bands, or wavelengths of light. Those that aren’t absorbed are reflected back, with shorter wavelengths giving objects a blue hue and longer wavelengths appearing redder and the entire rainbow of possible combinations in between. Changing the color of a surface, such as the leaves on the trees in autumn, requires a change in chemical make-up.

Recently, engineers and scientists have been exploring another approach, one that would create designer colors without the use of chemical dyes and pigments. Rather than controlling the chemical composition of a material, it’s possible to control the surface features on the tiniest of scales so they interact and reflect particular wavelengths of light. This type of “structural color” is much less common in nature, but is used by some butterflies and beetles to create a particularly iridescent display of color.

Controlling light with structures rather than traditional optics is not new. In astronomy, for example, evenly spaced slits known as diffraction gratings are routinely used to direct light and spread it into its component colors. Efforts to control color with this technique, however, have proved impractical because the optical losses are simply too great.

The authors of the Optica paper applied a similar principle, though with a radically different design, to achieve the color control they were looking for. In place of slits cut into a film they instead etched rows of ridges onto a single, thin layer of silicon. Rather than spreading the light into a complete rainbow, however, these ridges — or bars — reflect a very specific wavelength of light. By “tuning” the spaces between the bars, it’s possible to select the specific color to be reflected. Unlike the slits in a diffraction grating, however, the silicon bars were extremely efficient and readily reflected the frequency of light they were tuned to.

Flexibility Is the Key to Control

Since the spacing, or period, of the bars is the key to controlling the color they reflect, the researchers realized it would be possible to subtly shift the period — and therefore the color — by flexing or bending the material.

“If you have a surface with very precise structures, spaced so they can interact with a specific wavelength of light, you can change its properties and how it interacts with light by changing its dimensions,” said Chang-Hasnain.

Earlier efforts to develop a flexible, color shifting surface fell short on a number of fronts. Metallic surfaces, which are easy to etch, were inefficient, reflecting only a portion of the light they received. Other surfaces were too thick, limiting their applications, or too rigid, preventing them from being flexed with sufficient control.

The Berkeley researchers were able to overcome both these hurdles by forming their grating bars using a semiconductor layer of silicon approximately 120 nanometers thick. Its flexibility was imparted by embedding the silicon bars into a flexible layer of silicone. As the silicone was bent or flexed, the period of the grating spacings responded in kind.

The semiconductor material also allowed the team to create a skin that was incredibly thin, perfectly flat, and easy to manufacture with the desired surface properties. This produces materials that reflect precise and very pure colors and that are highly efficient, reflecting up to 83 percent of the incoming light.

Their initial design, subjected to a change in period of a mere 25 nanometers, created brilliant colors that could be shifted from green to yellow, orange, and red – across a 39-nanometer range of wavelengths. Future designs, the researchers believe, could cover a wider range of colors and reflect light with even greater efficiency.

Chameleon Skin with Multiple Applications

For this demonstration, the researchers created a one-centimeter square layer of color-shifting silicon. Future developments would be needed to create a material large enough for commercial applications.

“The next step is to make this larger-scale and there are facilities already that could do so,” said Chang-Hasnain. “At that point, we hope to be able to find applications in entertainment, security, and monitoring.”

For consumers, this chameleon material could be used in a new class of display technologies, adding brilliant color presentations to outdoor entertainment venues. It also may be possible to create an active camouflage on the exterior of vehicles that would change color to better match the surrounding environment.

More day-to-day applications could include sensors that would change color to indicate that structural fatigue was stressing critical components on bridges, buildings, or the wings of airplanes.

“This is the first time anyone has achieved such a broad range of color on a one-layer, thin and flexible surface,” concluded Change-Hasnain. “I think it’s extremely cool.”

IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.  The complete list of all 33 major IC product categories ranked by the updated forecast growth rates for 2015 is shown in Figure 1.  Eleven product categories (led by Automotive Special Purpose Logic, DRAM, and Automotive Application-Specific Analog devices) are expected to exceed the 7 percent growth rate forecast for the total IC market this year.  Five of the eleven categories are forecast to see double-digit growth in 2015.  The total number of IC categories forecast to register sales growth in 2015 drops slightly to 27 products from 28 in 2014.

IC Insights forecasts a solid growth year for automotive-specific ICs.  In addition to Automotive Special Purpose Logic and Automotive Application-Specific Analog, “intelligent” cars are contributing to growth in the 32-bit MCU market. Driver information systems, throttle control, and semi-autonomous driving features such as self-parking, advanced cruise control, and collision-avoidance are some of the systems that rely on 32-bit MCUs.  In the next few years, complex 32-bit MCUs are expected to account for over 25 percent of the processing power in vehicles.

Automotive is forecast to be among the strongest electronic systems market in 2015.  The automotive segment is expected to register a compound annual growth rate of 6.5 percent in the 2014-2019 timeperiod compared to projected CAGRs of 6.8 percent for communications, 4.3 percent for consumer, 4.2 percent for computer, 4.5 percent for industrial, and 2.7 percent for government/military.  Despite automotive being one of the fastest growing electronic system markets over the next five years, automotive’s share of the total IC market is forecast to be only 8 percent in 2015 and remain less than 10 percent through 2019.

Big gains in the DRAM average selling price (ASP) the past two years resulted in greater-than-30 percent growth for the DRAM market in both 2013 and 2014.  DRAM ASP growth is expected to subside this year but demand for mobile DRAM is forecast to help this memory market category grow another 14 percent, placing it second among the 33 IC product categories shown, according to the newly refreshed forecast.

IC Insights 0312 Fig 1

 

Growth of Cellphone Application MPUs (10 percent) is forecast to remain near the top on the growth list for a fifth consecutive year. Meanwhile, the previously high-flying Tablet MPU market is forecast to sputter to just 3 percent growth in 2015 as demand for tablets slows and ASPs decline. Other IC categories that support mobile systems are expected to see better-than-industry-average growth in 2015, including gains of 9 percent for NAND flash and 8 percent for Power Management Analog.

Increased sales of medical/personal health electronic systems and the growth of the Internet of Things will help the markets for Industrial/Other Application-Specific Analog and 32-bit MCU devices outpace total IC market growth in 2015, as well.

SEMI today announced an update of the SEMI World Fab Forecast report which updates outlooks for 2015 and 2016. The SEMI report reveals that fab equipment spending in 2014 increased almost 20 percent and will rise 15 percent in 2015, increasing only 2-4 percent in 2016. Since November 2014, SEMI has made 270 updates on its World Fab Forecast report, which tracks fab spending for construction and equipment, as well as capacity changes, and technology nodes transitions and product type changes by fab.

2013

2014

2015

2016

Fab equipment*

$29.4

$35.2

$40.5

$41 to $42

Change % Fab equipment

-10.0%

19.8%

15.0%

2% to 4%

Fab construction US$

$8.8

$7.7

$5.2

$6.9

Change % construction

13.6%

-11.0%

-32.0%

+32.0%

* Chart US$, in billions; Source: SEMI, March 2015

The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment and spending on facilities for installation.

Fab spending, such as construction spending and equipment spending, are fractions of a company’s total capital expenditure (capex). Typically, if capex shows a trend to increase, fab spending will follow.  Capex for most of the large semiconductor companies is expected to increase by 8 percent in 2015, and grow another 3 percent in 2016. These increases are driven by new fab construction projects and also ramp of new technology nodes. Spending on construction projects, which typically represents new cleanroom projects, will experience a significant -32 percent decline in 2015, but is expected to rebound by 32 percent in 2016.

Comparing regions across the world, according to SEMI, the highest fab equipment spending in 2015 will occur in Taiwan, with US$ 11.9 billion, followed by Korea with US$ 9 billion.  The region with third largest spending, the Americas, is forecast to spend about US$ 7 billion.  Yet growth will decline in the Americas, by 12 percent in 2015, and decline by 12 percent in 2016 again.  Fourth in spending is China, with US$ 4.7 billion in 2015 and US$ 4.2 billion in 2016. In other regions, Japan’s spending will grow by about 6 percent in 2015, to US$ 4 billion; and 2 percent in 2016, to US$ 4.2 billion.  The Europe/Mideast region will see growth of about 20 percent (US$ 2.7 billion) in 2015 and over 30 percent (US$ 3.5 billion) in 2016. South East Asia is expected to grow by about 15 percent (US$ 1.3 billion) in 2015 and 70 percent (US$ 2.2 billion) in 2016.

2015 is expected to be the second consecutive year in equipment spending growth. SEMI’s positive outlook for the year is based on spending trends tracked as part of our fab investment research. The “bottom’s up” company-by-company and fab-by-fab approach points to strong investments by foundries and memory companies driving this year’s growth.

The SEMI World Fab Forecast Report lists over 40 facilities making DRAM products. Many facilities have major spending for equipment and construction planned for 2015.

A frequency comb source is a light source with a spectrum containing thousands of laser lines. The development of these sources has been revolutionary for fundamental science. It has allowed the construction of a link between the optical part of the electromagnetic spectrum and the radio frequency part. As such, it has allowed researchers to determine optical frequencies with an unprecedented precision. Amongst others, frequency comb light sources have been used in optical clocks enabling precise time keeping. The enormous impact of frequency comb light sources on science was highlighted in 2005, when the Nobel Prize for physics was awarded to Prof. T. Haensch and Prof J. Hall for their work on optical frequency metrology using frequency combs.

Lately, frequency combs have been used to target more real life applications. In several experiments, it has been shown that the specific properties of the sources can be used to do fast, high-resolution spectroscopy over a broad spectrum. However, traditional comb sources are not at the right wavelength spectrum for doing spectroscopy.

Ghent University, imec, the Max Planck Institute for Quantum Optics in Garching and the Auckland University in New Zealand have developed mid-infrared frequency combs, working in the mid-infrared molecular fingerprinting region of the electromagnetic spectrum. In this wavelength region, many molecules have specific absorption bands that can be used in spectroscopy to determine the presence and concentration of these molecules in samples. The researchers successfully realized the broad frequency combs, by combining the strong light-matter interaction in silicon with its broad transparency window. By fabricating so-called nanowire silicon photonics waveguides to confine the light in a very small area waveguide, they further enhanced the strong light-matter interaction allowing them to broaden the spectrum of the frequency combs into the mid-infrared. The achievements were possible through the use of a unique pump laser source, previously developed by ICFO, Spain. The results are an important step towards a small-footprint chip scale mid-infrared frequency comb source. Such sources could act as sensitive cheap gas sensors in the mid-infrared. These would be important for example for environmental monitoring for measuring air-pollution or in medical diagnostics as a cheap tool to do breath analysis. It is worth noting that the reported work has been the result of collaboration between three grants of the European Research Council (ERC), i.e. Multicomb, Miracle and InSpectra.

IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

The new and disruptive 3D configurations and assemblies created by this IRT Nanoelec/CMP initiative are designed to promote 3D integration.

This service, the first of its kind, extends CMP’s regular MPW offer by using mature 3D post-process technologies at wafer level from IRT Nanoelec. These technologies include through-silicon-vias (TSV, via last), fine-pitch vertical interconnects (micro pillar with solder) and specific finishing for 3D integration like under-bump metallurgy (UBM). These 3D modules will enable a wide panel of new, full 3D architectures, like multiple-die stacking with flip-chip, side-by-side heterogeneous integration, and 3D partitioning of different CMOS dies issued from CMP runs.

3D integration is highly complementary to traditional CMOS scaling, and has very strong potential in terms of size reduction, heterogeneous integration, miniaturization, performance improvements and, possibly, reduction of costs at the system level. The technology is now emerging in more and more applications, such as FPGA, 3D memories and MEMS, and involves wafer-level processing on dedicated runs.

The new platform provides for the first time access to post-process 3D technologies after regular CMOS MPW runs, for proof of concept, prototypes and/or small series production. This enables a large group of users to take advantage of cost division made possible, at silicon level, by the MPW regular services followed by post-process technologies. In addition, it allows 3D-MPW users to divide the cost of post processing. This benefits a large group of customers, such as universities, SMEs, research institutes and systems integrators, that usually do not have access to the 3D modules at large foundries.

These 3D post-process technologies require very limited re-design of existing chips, and will be initially used for specific CMOS nodes available at CMP. They may be extended in the future, depending on demand. CMP is responsible for supporting, checking and compiling the customer’s requests, while IRT Nanoelec, which has a very strong background in 3D integration – in particular through the institute CEA-Leti – will manage the 3D post-processing.

TowerJazz, a specialty foundry, announced today it has begun mass production of an IR sensor used by Intel in one of its new 3D sensing solutions. Intel chose TowerJazz’s CMOS image sensor (CIS) platform, specifically its unique IS11 process, due to its unparalleled pixel performance at near infrared light with very high speed, high quantum efficiency (QE) and high optical resolution.

“Partnering with TowerJazz was a part of our success in producing our advanced image sensor for 3D imaging and was a natural choice as they were able to offer the required technical specifications and performance for this breakthrough technology,” said Sagi Ben Moshe, Director Depth Camera Engineering, Intel Corporation.

The unique pixel developed by TowerJazz for Intel is a 3.5um global shutter very fast pixel that allows high quantum efficiency at near infrared light, specifically at the scanning laser wavelength with high sensor resolution.

“This collaboration between Intel and TowerJazz was a natural fit. Intel’s leadership in this market, combined with our leading technology that provides outstanding pixel performance for near IR 3D imaging, along with the proximity of our Israel fab with Intel Israel, the group developing this technology, was an ideal alignment,” said Russell Ellwanger, Chief Executive Officer, TowerJazz. “We are very excited to partner with Intel to produce lifestyle changing technology that will revolutionize the way we interact with devices in both our professional and personal lives. We highly value our business relationship with Intel and look forward to further collaboration on their sensing technology.”

“It is truly amazing and thrilling to see our lengthy experience in the imaging field and our own CMOS image sensor technology developed in-house, combined with all of the R&D work we have undertaken for many years come to fruition in such a groundbreaking way,” said Dr. Avi Strum, Vice President and General Manager, CMOS Image Sensor Business Unit, TowerJazz. “Intel sensing solutions will bring consumers new experiences and will change the way people capture and share 3D images. We are very proud of our work with Intel and our ability to assist them in bringing cutting-edge technologies to market quickly and in high volume.”

Mentor Graphics Corp. today announced it has acquired the business assets of Tanner EDA, a tool provider for the design, layout and verification of analog/mixed-signal (AMS) and MEMS integrated circuits. With this acquisition, more designers will now have access to Tanner’s AMS products based on the strength and reach of the Mentor Graphics global sales organization. All Tanner EDA products as well as existing AMS products from Mentor will continue to be available and supported.

“Tanner EDA has built an outstanding reputation as the price performance leader for the design, layout and verification of AMS ICs, MEMS and IoT devices,” said Greg Lebsack, President of Tanner EDA. “We are excited to join Mentor Graphics where we can leverage their extensive technology leadership and global footprint. We view this transaction as very positive for Tanner EDA’s customers, employees and the industry as a whole.”

Harvest Management Partners, LLC advised Tanner Research, Inc. regarding the sale of the assets of Tanner EDA.  Terms of the deal were not disclosed.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.5 billion for the month of January 2015, the industry’s highest-ever January total and an increase of 8.7 percent from January 2014 when sales were $26.3 billion. Global sales from January 2015 were 2 percent lower than the December 2014 total of $29.1 billion, reflecting normal seasonal trends. Regionally, sales in the Americas increased by 16.4 percent compared to last January to lead all regional markets. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“After a record-setting 2014, the global semiconductor industry is off to a promising start to 2015, posting its highest-ever January sales led by impressive growth in the Americas market,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Global sales have increased on a year-to-year basis for 21 consecutive months and remain strong across most regions and product categories.”

Regionally, year-to-year sales increased in the Americas (16.4 percent) and Asia Pacific (10.7 percent), but decreased in Europe (-0.2 percent) and Japan (-8 percent). Sales decreased compared to the previous month in Asia Pacific (-0.8 percent), Europe (-2 percent), the Americas (-3.3 percent), and Japan (-6.4 percent).

January 2015
Billions
Month-to-Month Sales
Market Last Month Current Month % Change
Americas 6.73 6.51 -3.3%
Europe 3.01 2.94 -2.0%
Japan 2.80 2.62 -6.4%
Asia Pacific 16.59 16.46 -0.8%
Total 29.13 28.53 -2.0%
Year-to-Year Sales
Market Last Year Current Month % Change
Americas 5.59 6.51 16.4%
Europe 2.95 2.94 -0.2%
Japan 2.84 2.62 -8.0%
Asia Pacific 14.87 16.46 10.7%
Total 26.25 28.53 8.7%
Three-Month-Moving Average Sales
Market Aug/Sep/Oct Nov/Dec/Jan % Change
Americas 6.41 6.51 1.5%
Europe 3.21 2.94 -8.2%
Japan 3.01 2.62 -13.1%
Asia Pacific 17.05 16.46 -3.5%
Total 29.68 28.53 -3.9%

Cypress Semiconductor Corp., in conjunction with its strategic partner IDEX ASA, today introduced a fingerprint reader solution designed to bring reliable, easy-to-use user authentication to smartphones, tablets, wearables and other mobile devices. The TrueTouch Fingerprint Reader uses proprietary sensing circuitry and a unique touch sensor design to provide best-in-class fingerprint image quality and pattern matching accuracy—improving security and delivering a superior user experience. The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.

Consumers have increasingly embraced fingerprint readers as an alternative to keying in complex usernames, PINs and passwords. Mobile device OEMs and companies that sell via the Internet have gravitated toward the technology as the most secure way to validate a user’s identity. Demand for fingerprint readers in mobile devices is forecast to grow at a compound annual rate of 47 percent through 2019, reaching annual shipments of more than 700 million units.

Cypress will showcase its TrueTouch Fingerprint Reader, along with its extensive portfolio of capacitive touchscreen and touch-sensing solutions, at Mobile World Congress 2015 from March 2-5 in Hall 2, Stand 2C26MR at Fira Gran Via in Barcelona.

TrueTouch Fingerprint Reader block diagram

“The barriers to entry are considerable in the emerging market for fingerprint readers, in part because of the highly specialized IP and complete solution that is required to compete,” said T.J. Rodgers, President and CEO of Cypress. “Our relationship with IDEX will enable us to provide our top-tier mobile customers with a globally deployable fingerprint sensing solution, including a sensor, Android drivers and a software stack. With our industry-leading CapSense capacitive touch-sensing controllers, and our TrueTouch touchscreen solutions, Cypress will have an unmatched portfolio for mobile user interfaces.”

“We are extremely pleased with the performance of our new generation touch sensor developed in record time through our partnership with Cypress,” said Dr. Hemant Mardia, CEO of IDEX ASA. “The combination of IDEX’s breakthrough imaging performance, matching algorithm and patented sensor IP with Cypress’s award-winning programmable system-on-chip technology delivers best in class fingerprint matching. This product has been designed based on fundamentally new technology to meet our OEM customers’ demands for usability and security strength from small touch sensors.”