Category Archives: MEMS

SEMICON Russia, a meeting place of the entire micro- and nanoelectronics industry in Russia, will take place from 16 to 18 June in Moscow. SEMICON Russia Exhibition is scheduled for 17-18 June with traditional location at Expocentre fairgrounds.  With programs that include the Microelectronics Market Conference, an Exhibition, TechARENA sessions and presentations, SEMICON Russia offers advanced opportunities for networking and cooperation with local and foreign professionals.  The event features the latest developments and emerging new markets, in addition to an opportunity to connect with customers, partners and investors. In 2015, SEMICON Russia features a new program TechARENA, consisting of sessions on Intelligent Systems and Semiconductor Optoelectronics. In addition, SEMICON Russia offers its exhibitors a TechLOUNGE where they can present their latest products and innovations. Over 130 exhibitors from 15 countries — including international and regional leading suppliers of equipment, materials and services — are expected to be on the show floor and more than 1500 attendees.

The Microelectronics Market Conference takes place on 16 June the day before the exhibition opening in Expocentre. It is devoted to the creation of large-scale manufacture of electronics in the Russian regions: markets, technology and government support.   The event is a unique opportunity to get a comprehensive perspective of the market situation, with panel discussions which include open debates. The Conference is attended by the representatives of federal and regional organizations and agencies, top and middle managers of major Russian and foreign companies, development institutions, Research Studies Institutes, industrial clusters, Russian and foreign experts.

Conference speakers include: Heinz Kundert, President of SEMI Europe; Alena Fomina, Managing director of JSC “CNII Elektronika;” Pavel Rudnik, Deputy Director, the Department of Innovative Development of the Ministry of Economic Development of the Russian Federation;  Dmitry Krinitskiy, Head of the Department for regional policy and cooperation with authorities, JSC “RUSNANO”; Denis Mironov, Vice-Chairman of Saint Petersburg Industrial Policy Innovations Committee; and  Evgeny Shakhmatov, Head of Samara State Aerospace University. For details about the agenda, please visit http://www.semiconrussia.org/en/Programs/Overview.

From 17 to 18 June, the Expocentre in Moscow will host the eighth SEMICON Russia exhibition, where leading companies from around the world will showcase their products, equipment, technology, facilities and services. Every year SEMICON Russia becomes a must-visit event for the global industry community: consumers, developers, engineers and researchers interested in the application and development of microelectronics technologies including: MEMS technology packaging, A3B5 electronics, photovoltaics, and flexible electronics. SEMICON Russia 2015 exhibitors include: SVCS s.r.o., Maicom Quarz GmbH, DIPAUL group, Eltech SPb, JSC, Schenker Deutschland AG, FÄTH, IMEC, M+W Group, STMicroelectronics, «NPP «ESTO» Isc, Zelenograd Innovation cluster Technounity.  Exhibiting companies are from Russia, Germany, Belarus, Czech Republic, France, UK, Netherlands, Singapore, Japan, the Netherlands, Sweden, and Italy.

“Despite global challenges, we believe that now is the time to strengthen the Russian industry. As the №1 global trade association committed to microelectronics industry development worldwide, SEMI will continue the effort to support the Russian microelectronic industry. Russian companies are looking for technical partnerships to improve competitiveness. SEMICON Russia is discussing new opportunities— including public-private partnership project development.  The semiconductor (and related) industries are also supported by the government and other local organizations, making SEMICON Russia an ideal place to connect to the industry, said Heinz Kundert, President of SEMI Europe.

On 17 June, for the first time TechARENA will present the “Smart Systems” session, which will provide an overview of global developments, future applications and markets. The session will focus on building successful cooperation with the Russian companies and funding possibilities.  In addition, the “Semiconductor Optoelectronics” session will take place on the 18 June at TechARENA in honor of the International Year of Light (YIL2015) and light-based technologies declared by the United Nations. This session will give an overview of the current trends and developments of the semiconductor optoelectronics technologies in Russia. Leading Russian and European experts and specialists will provide the R&D results and implementation projects, and review current and potential collaboration between Russian and other world players in this field. Within the framework of TechARENA program, SEMICON Russia exhibitors will make presentations. Visitors of SEMICON Russia get a free access to all TechARENA events.

For more information on SEMICON Russia 2015, please visit: http://www.semiconrussia.org

Total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march through the current cyclical period and top one trillion units for the first time in 2017, according to IC Insights’ forecast presented in the 2015 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry. Semiconductor shipments in excess of one trillion units are forecast to be the new normal beginning in 2017.

Figure 1 shows that semiconductor unit shipments are forecast to increase to 1,024.5 billion devices in 2017 from 32.6 billion in 1978, which amounts to average annual growth of 9.2 percent over the 39 year period and demonstrates how increasingly dependent the world is on semiconductors. From 2009 to 2014, the average annual growth rate of semiconductor units was 7.6 percent—somewhat slower than the long-term growth rate—due to global economic uncertainties through that five-year period. Stronger 8.2 percent annual growth is forecast from 2014 to 2019 as momentum strengthens for electronic systems.

semi units

The strongest annual increase in semiconductor unit growth over the time span shown in Figure 1 was 34 percent in 1984; the biggest decline was 19 percent in 2001 following the dot-com bust. Semiconductor unit shipments first topped the 100-billion mark in 1987, exceeded 500-billion units for the first time in 2006 and then surpassed 600-billion units in 2007 before the global financial meltdown and recession caused semiconductor shipments to fall in 2008 and 2009, the only time the industry has experienced a back-to-back decline in unit shipments. Semiconductor unit growth then surged 25 percent in 2010, the second-highest growth rate since 1978. IC Insights forecasts semiconductor unit growth of 10.0 percent in 2015 and 11.0 percent in 2016. The semiconductor unit growth rate is forecast to fall to only 3.4 percent in 2017, enough to push annual shipments beyond one trillion devices for the first time.

Interestingly, the percentage split of IC and O-S-D devices within total semiconductor units has remained fairly steady despite advances in integrated circuit technology and the blending of functions to reduce chip count within systems. In 1978, O-S-D devices accounted for 79 percent of semiconductor units and ICs represented 21 percent. Almost 40 years later in 2017, O-S-D devices are forecast to account for 74 percent of total semiconductor units, compared to 26 percent for ICs (Figure 2).

semi units 2

Further details on IC, O-S-D, and total semiconductor unit and market trends are provided in the 2015 edition of IC Insights’ flagship report, The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry.

The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2015) will be held May 3-6 in Saratoga Springs, New York. The conference will feature 37 hours of technical presentations and 90+ speakers covering all aspects of advanced semiconductor manufacturing. This year’s event features a panel discussion on “Semiconductor Manufacturing: Keeping the Silicon Magic Alive,” with panelists from DARPA, GE Global Research, Lam Research and Rochester Institute of Technology.  The event features a tutorial on graphene presented by Dr. Paul L. McEuen, professor of Physics, Cornell University, and a second tutorial, on memory, presented by Dr. Gurtej Sandhu, IEEE Fellow and director of Advanced Technology Development at Micron Technology, Inc.

ASMC 2015 offers keynote talks by Dr. Thomas Caulfield, senior VP and GM of GLOBALFOUNDRIES; Dr. Frances M. Ross of the Nanoscale Materials Analysis Department at T.J. Watson Research Center, IBM Corporation; and Robert Maire, president of Semiconductor Advisors LLC.

ASMC technology tracks and poster presenters will address numerous topics, including:

  • 3D/TSV
  • Advanced Equipment and Materials
  • Advanced Metrology
  • Advanced Patterning/Design for Manufacturing
  • Advanced Process Control (APC)
  • Contamination Free Manufacturing (CFM)
  • Data and Yield Management; Defect Inspection
  • Equipment Reliability and Productivity Enhancement
  • Factory Optimization
  • Yield and Reliability Enhancement

ASMC also holds an interactive poster session and reception, which provides an ideal opportunity for networking between authors and conference attendees. During this session, participants can engage authors in in-depth discussions of a wide range of issues.

ASMC 2015 corporate sponsors include Applied Materials, ChemTrace, CNW, Edwards, KLA-Tencor, NY Loves Nanotech, and MSP.  Technical and supporting sponsors include: Institute of Electrical & Electronics Engineers (IEEE); IEEE Electron Devices Society (EDS); and IEEE Components, Packaging and Manufacturing Technology Society (CPMT); Saratoga Convention & Tourism Board; and Saratoga Economic Development Corporation (SEDC).

Registration for ASMC 2015 is available at www.semi.org/asmc2015.

Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz. This achievement demonstrates the potential of downscaled CMOS for cheap millimeter-wave (mm-wave) radar systems that can be used for accurate presence and motion detection.

Mm-wave radar technology is used in advanced driver assistance systems (ADAS) to improve safety in blurry conditions such as dust, fog and darkness, where image-based driver assistance systems lack robustness. It also offers longer range, higher precision and invisible mounting capabilities compared to ultrasound sensors. Imec’s 79GHz radar solution is based on advanced (28nm) CMOS technology, and it is an attractive alternative to the current SiGe-based technology as it offers a path to a low-power, compact and integrated solution. Moreover, at the expected high manufacturing volumes, CMOS technology is intrinsically low-cost.

Imec’s and Panasonic’s transceiver chip contains a control loop to suppress the spillover from the transmitter into the receiver without affecting the RF performance. With a power consumption of 260mW, the output power of the transmitter is 11dBm, while the RX gain is 35dB with a noise figure below 7dB and a TX-to-RX spillover suppression of 15dB. Thanks to the wide modulation bandwidth, the achievable depth resolution is 7.5cm.

“We are pleased with these excellent performance results on 28nm CMOS technology, and excited about the new opportunities they present for mm-wave radar systems, not only for automotive radar, but also for other applications such as smart homes, unmanned aerial vehicles (UAVs), robotics and others.” stated Wim Van Thillo, program director Perceptive Systems for the Internet of Things at imec. “This transceiver chip is an important milestone we have realized in our pursuit of a complete high-performance radar system fully integrated onto a single chip.”

Interested companies have access to imec’s CMOS-based 79GHz radar technology by joining imec’s industrial affiliation program or through IP licensing.

The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia. The event promises to be larger and more comprehensive than its predecessor SEMICON Singapore, which has been held annually since 1993, with an expanded programme and larger audience base focusing on Southeast Asia communities in the semiconductor and microelectronics sector. The expanded strategy for the new SEMICON Southeast Asia Show — between Singapore, Malaysia and potentially the rest of the regions — will open new business opportunities for customers and foster stronger cross-regional engagement, according to SEMI, the event organiser. SEMICON Southeast Asia will feature a tradeshow exhibition, networking events, market and technology seminars, and conferences.

The event will connect decision makers from leading and emerging semiconductor companies with important industry stakeholders from both the region and all over the world.  Penang was selected for the inaugural SEMICON Southeast Asia exhibition because of its reputation as the “Silicon Valley of the East” and Malaysia’s vibrant eco-system, coupled with the drive and support from the state government.  Focusing on key trends and technologies in semiconductor design and manufacturing, the event also addresses expanding applications markets like mobile devices and other connected “Internet of Things” (IoT) technologies, many of which require development of specialised materials, packaging, and test technologies, as well as new architectures and processes.

For 2015 and 2016, SEMI estimates spending of almost US$ 5 billion on front-end and back-end equipment in the Southeast Asia region, and another $14 billion in spending on materials including $11 billion on packaging-related materials. In addition, according to the SEMI (www.semi.org) World Fab Forecast, Southeast Asia is home to over 35 production fabs covering Foundry, Compound Semiconductors, MEMS, Power, LED, and other devices.

Ng Kai Fai, President of SEMI Southeast Asia, said, “Southeast Asia is a significant and exciting market for the semiconductor industry. In fact, the region contributes a substantial 27 percent of global assembly, test and production, on top of being the largest market for assembly and test equipment.”

“SEMICON Southeast Asia is a natural progression from its earlier SEMICON Singapore exhibition and actively unites industry participants throughout the region. In addition to offering a deep networking opportunity for industry stakeholders, the event is also a catalyst for industry players within the region to collaborate and innovate to become larger players in this US$ 19 billion industry. This year, we expect about 60 industry speakers and close to 200 companies to participate in SEMICON Southeast Asia,” he added.

According to En. Zulkefli Haji Sharif, CEO of Malaysia Convention & Exhibition Bureau, “We are delighted to be able to host SEMICON Southeast Asia here in 2015. This prestigious event will showcase the best of the semiconductor industry and attendees can expect to find out more about the latest developments in microelectronics field. We have the utmost confidence that Penang will live up to all expectations as an attractive business events destination, and that the event will be a benefit to local and global players alike.”

Early-bird pricing on paid programmes ends 20 March, so register now. For more information and exhibition opportunities, visit www.semiconsea.org.

As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Gartner, Inc. forecasts that 4.9 billion connected things will be in use in 2015, up 30 percent from 2014, and the figure will reach 25 billion by 2020. The analyst firm also projects that by 2017, 50 percent of IoT solutions will originate in startups that are less than three years old.

Meanwhile, the specter of an insecure and dangerous IoT is becoming increasingly worrisome; last month, the U.S. Federal Trade Commission publicly raised concerns of security risks associated with the rising number of interconnected systems and devices, and a top U.S. news organization reported that DARPA had wirelessly hacked into a major automotive OEM’s braking system. Additionally, a recent report from tech giant HP found that many IoT end-nodes are inherently insecure, with 70 percent of evaluated devices transmitting data via unencrypted network services.

Intent on applying its extensive expertise and proven technologies to address these trends, Freescale today announced several landmark programs intended to help establish standards and drive industry metrics for IoT security assurance. These initiatives include:

  • Teaming with the Embedded Microprocessor Benchmarking Consortium (EEMBC) to identify critical embedded security gaps and collaborate with other consortium members to establish guidelines that help IoT OEMs and system designers better secure IoT transactions and endpoints. Founding members of this coalition will convene in May at the second annual IoT Developers Conference in Santa Clara, California.
  • Establishing Freescale Security Labs – Centers of Excellence (CoEs) at Freescale’s headquarters and other locations worldwide, where the company, its partners and customers will focus on enhancement of IoT security technologies spanning from the cloud to the end-node. Alongside these CoEs is the commitment to allocate up to 10 percent of the company’s annual R&D budget on IoT security technologies.
  • Creating a program dedicated to educating startups on IoT security best practices and providing best-in-class security support through Freescale’s partner ecosystem.

Security challenges represent nothing less than an existential threat to the IoT movement, before it really has a chance to take off,” said Gregg Lowe, President and CEO of Freescale Semiconductor. “Freescale is addressing these challenges head-on to help ensure a future where secure solutions power every node of the IoT — from end devices to the network to the cloud.”

At this year’s Consumer Electronics Show in Las Vegas, the big theme was the “Internet of things” — the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Realizing that vision, however, requires transmitters that are powerful enough to broadcast to devices dozens of yards away but energy-efficient enough to last for months — or even to harvest energy from heat or mechanical vibrations.

“A key challenge is designing these circuits with extremely low standby power, because most of these devices are just sitting idling, waiting for some event to trigger a communication,” explains Anantha Chandrakasan, the Joseph F. and Nancy P. Keithley Professor in Electrical Engineering at MIT. “When it’s on, you want to be as efficient as possible, and when it’s off, you want to really cut off the off-state power, the leakage power.”

This week, at the Institute of Electrical and Electronics Engineers’ International Solid-State Circuits Conference, Chandrakasan’s group will present a new transmitter design that reduces off-state leakage 100-fold. At the same time, it provides adequate power for Bluetooth transmission, or for the even longer-range 802.15.4 wireless-communication protocol.

“The trick is that we borrow techniques that we use to reduce the leakage power in digital circuits,” Chandrakasan explains. The basic element of a digital circuit is a transistor, in which two electrical leads are connected by a semiconducting material, such as silicon. In their native states, semiconductors are not particularly good conductors. But in a transistor, the semiconductor has a second wire sitting on top of it, which runs perpendicularly to the electrical leads. Sending a positive charge through this wire — known as the gate — draws electrons toward it. The concentration of electrons creates a bridge that current can cross between the leads.

But while semiconductors are not naturally very good conductors, neither are they perfect insulators. Even when no charge is applied to the gate, some current still leaks across the transistor. It’s not much, but over time, it can make a big difference in the battery life of a device that spends most of its time sitting idle.

Going negative

Chandrakasan — along with Arun Paidimarri, an MIT graduate student in electrical engineering and computer science and first author on the paper, and Nathan Ickes, a research scientist in Chandrakasan’s lab — reduces the leakage by applying a negative charge to the gate when the transmitter is idle. That drives electrons away from the electrical leads, making the semiconductor a much better insulator.

Of course, that strategy works only if generating the negative charge consumes less energy than the circuit would otherwise lose to leakage. In tests conducted on a prototype chip fabricated through the Taiwan Semiconductor Manufacturing Company’s research program, the MIT researchers found that their circuit spent only 20 picowatts of power to save 10,000 picowatts in leakage.

To generate the negative charge efficiently, the MIT researchers use a circuit known as a charge pump, which is a small network of capacitors — electronic components that can store charge — and switches. When the charge pump is exposed to the voltage that drives the chip, charge builds up in one of the capacitors. Throwing one of the switches connects the positive end of the capacitor to the ground, causing a current to flow out the other end. This process is repeated over and over. The only real power drain comes from throwing the switch, which happens about 15 times a second.

Turned on

To make the transmitter more efficient when it’s active, the researchers adopted techniques that have long been a feature of work in Chandrakasan’s group. Ordinarily, the frequency at which a transmitter can broadcast is a function of its voltage. But the MIT researchers decomposed the problem of generating an electromagnetic signal into discrete steps, only some of which require higher voltages. For those steps, the circuit uses capacitors and inductors to increase voltage locally. That keeps the overall voltage of the circuit down, while still enabling high-frequency transmissions.

What those efficiencies mean for battery life depends on how frequently the transmitter is operational. But if it can get away with broadcasting only every hour or so, the researchers’ circuit can reduce power consumption 100-fold.

Newly developed tiny antennas, likened to spotlights on the nanoscale, offer the potential to measure food safety, identify pollutants in the air and even quickly diagnose and treat cancer, according to the Australian scientists who created them. The new antennas are cubic in shape. They do a better job than previous spherical ones at directing an ultra-narrow beam of light where it is needed, with little or no loss due to heating and scattering, they say.

In a paper published in the Journal of Applied Physics, from AIP Publishing, Debabrata Sikdar of Monash University in Victoria, Australia, and colleagues describe these and other envisioned applications for their nanocubes in “laboratories-on-a-chip.” The cubes, composed of insulating, rather than conducting or semiconducting materials as were the spherical versions, are easier to fabricate as well as more effective, he says.

Sikdar’s paper presents analysis and simulation of 200-nanometer dielectric (nonconductive) nanoncubes placed in the path of visible and near-infrared light sources. The nanocubes are arranged in a chain, and the space between them can be adjusted to fine-tune the light beam as needed for various applications. As the separation between cubes increases, the angular width of the beam narrows and directionality improves, the researchers say.

“Unidirectional nanoantennas induce directionality to any omnidirectional light emitters like microlasers, nanolasers or spasers, and even quantum dots,” Sikdar said in an interview. Spasers are similar to lasers, but employ minute oscillations of electrons rather than light. Quantum dots are tiny crystals that produce specific colors, based on their size, and are widely used in color televisions. “Analogous to nanoscale spotlights, the cubic antennas focus light with precise control over direction and beam width,” he said.

The new cubic nanoantennas have the potential to revolutionize the infant field of nano-electromechanical systems (NEMS). “These unidirectional nanoantennas are most suitable for integrated optics-based biosensors to detect proteins, DNA, antibodies, enzymes, etc., in truly portable lab-on-a-chip platforms of the future,” Sikdar said. “They can also potentially replace the lossy on-chip IC (integrated circuit) interconnects, via transmitting optical signals within and among ICs, to ensure ultrafast data processing while minimizing device heating,” he added.

Sikdar and his colleagues plan to begin constructing unidirectional cubic NEMS antennas in the near future at the Melbourne Center for Nanofabrication. “We would like to collaborate with other research groups across the world, making all these wonders possible,” he said.

North America-based manufacturers of semiconductor equipment posted $1.31 billion in orders worldwide in January 2015 (three-month average basis) and a book-to-bill ratio of 1.03, according to the January EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in January 2015 was $1.31 billion. The bookings figure is 4.9 percent lower than the final December 2014 level of $1.38 billion, and is 2.6 percent higher than the January 2014 order level of $1.28 billion.

The three-month average of worldwide billings in January 2015 was $1.28 billion. The billings figure is 8.6 percent lower than the final December 2014 level of $1.40 billion, and is 3.5 percent higher than the January 2014 billings level of $1.23 billion.

“2014 was a strong growth year for the semiconductor equipment industry, and both bookings and billings at the start of this year are comparable to the early 2014 figures,” said SEMI president and CEO Denny McGuirk. “Given the positive outlook for the semiconductor industry in 2015 and based on current capex announcements, we expect the equipment market to continue to grow this year.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

August 2014 

$1,293.4

$1,346.1

1.04

September 2014 

$1,256.5

$1,186.2

0.94

October 2014 

$1,184.2

$1,102.3

0.93

November 2014 

$1,189.4

$1,216.8

1.02

December 2014 (final)

$1,395.9

$1,381.5

0.99

January 2015 (prelim)

$1,276.3

$1,313.6

1.03

Source: SEMI, February 2015

Pulsed measurements are defined in Part 1, and common pulsed measurement challenges are discussed in Part 2.

By DAVID WYBAN, Keithley Instruments, a Tektronix Company, Solon, Ohio

Performing a DC measurement starts with applying the test signal (typically a DC voltage), then waiting long enough for all the transients in the DUT and the test system to settle out. The measurements themselves are typically performed using a sigma-delta or integrating-type analog-to-digital converter (ADC). The conversion takes place over one or more power line cycles to eliminate noise in the measurements due to ambient power line noise in the test environment. Multiple measurements are often averaged to increase accuracy. It can take 100ms or longer to acquire a single reading using DC measurement techniques.

In contrast, pulsed measurements are fast. The test signal is applied only briefly before the signal is returned to some base level. To fit measurements into these short windows, sigma-delta ADCs are run at sub-power-line interval integration times; sometimes, the even faster successive approximation register (SAR) type ADCs are used. Because of these high speeds, readings from pulsed measurements are noisier than readings returned by DC measurements. However, in on-wafer semiconductor testing, pulse testing techniques are essential to prevent device damage or destruction. Wafers have no heat sinking to pull away heat generated by current flow; if DC currents were used, the heat would increase rapidly until the device was destroyed. Pulse testing allows applying test signals for very short periods, avoiding this heat buildup and damage.

Why use pulsed measurements?

The most common reason for using pulsed measurements is to reduce joule heating (i.e., device self-heating). When a test signal is applied to a DUT, the device consumes power and turns it into heat, increasing the device’s temperature. The longer that power is applied, the hotter the device becomes, which affects its electrical characteristics. If a DUT’s temperature can’t be kept constant, it can’t be characterized accurately. However, with pulsed testing, power is only applied to the DUT briefly, minimizing self-heating. Duty cycles of 1 percent or less are recommended to reduce the average power dissipated by the device over time. Pulsed measurements are designed to minimize the power applied to the device so much that its internal temperature rise is nearly zero, so heating will have little or no effect on the measurements.

Because they minimize joule heating, pulsed measurements are widely used in nanotechnology research, such as when characterizing delicate materials and structures like CNT FETs, semiconductor nanowires, graphene-based devices, molecular- based electronics and MEMs structures. The heat produced with traditional DC measurement techniques could easily alter or destroy them.

To survive high levels of continuous DC power, devices like MOSFETs and IGBTs require packaging with a solid metal backing and even heat-sinking. However, during the early stages of device development, packaging these experimental devices would be much too costly and time consuming, so early testing is performed at the wafer level. Because pulsed testing minimizes the power applied to a device, it allows for complete characterization of these devices on the probe station, reducing the cost of test.

The reduction in joule heating that pulsed testing allows also simplifies the process of characterizing devices at varying temperatures. Semiconductor devices are typically so small that it is impossible
to measure their temperature directly with a probe. With pulsed measurements, however, the self- heating of the device can be made so insignificant that its internal temperature can be assumed to be equal to the surrounding ambient temperature. To characterize the device at a specific temperature, simply change the surrounding ambient temperature with a thermal chamber or temperature-controlled heat sink. Once the device has reached thermal equilibrium at the new ambient temperature, repeat the pulsed measurements to characterize the device at the new temperature.

Pulsed measurements are also useful for extending instruments’ operating boundaries. A growing number of power semiconductor devices are capable of operating at 100A or higher, but building an instrument capable of sourcing this much DC current would be prohibitive. However, when delivering pulse mode power, these high power outputs are only for very short intervals, which can be done by storing the required energy from a smaller power supply within capacitors and delivering it all in one short burst. This allows instruments like the Model 2651A High Power SourceMeter SMU instrument to combine sourcing up to 50A with precision current and voltage measurements.

Pulsed I-V vs. transient measurements

Pulsed measurements come in two forms, pulsed I-V and transient. Pulsed I-V (FIGURE 1) is a technique for gathering DC-like current vs. voltage curves using pulses rather than DC signals. In the pulsed I-V technique, the current and voltage is measured near the end of the flat top of the pulse, before the falling edge. In this technique, the shape of the pulse is extremely important because it determines the quality of the measurement. If the top of the pulse has not settled before this measurement is taken, the resulting reading will be noisy and or incorrect. Sigma-delta or integrating ADCs should be configured to perform their conversion over as much of this flat top as possible to maximize accuracy and reduce measurement noise.

FIGURE 1. Pulse I-V technique.

FIGURE 1. Pulse I-V technique.

Two techniques can improve the accuracy of pulsed I-V measurements. If the width of the pulse and measurement speed permit, multiple measurements made during the flat portion of the pulse can be averaged together to create a “spot mean” measurement. This technique is commonly employed with instruments that use high speed Summation Approximation Register (SAR) ADCs, which perform conversions quickly, often at rates of 1μs per sample or faster, thereby sacrificing resolution for speed. At these high speeds, many samples can be made during the flat portion of the pulse. Averaging as many samples as possible enhances the resolution of the measurements and reduces noise. Many instruments have averaging filters that can be used to produce a single reading. If even greater accuracy is required, the measurement can be repeated over several pulses and the readings averaged to get a single reading. To obtain valid results using this method, the individual pulsed measurements should be made in quick succession to avoid variations in the readings due to changes in temperature or humidity.

Transient pulsed measurements (FIGURE 2) are performed by sampling the signal at high speed to create a signal vs. time waveform. An oscilloscope is often used for these measurements but they can also be made with traditional DC instruments by running the ADCs at high speed. Some DC instruments even include high-speed SAR type ADCs for performing transient pulsed measurements. Transient measurements are useful for investigating device behaviors like self-heating and charge trapping.

FIGURE 2. Transient pulse measurements.

FIGURE 2. Transient pulse measurements.

Instrumentation options

The simplest pulse measurement instrumentation option is a pulse generator to source the pulse combined with an oscilloscope to measure the pulse (FIGURE 3). Voltage measurements can be made by connecting a probe from the scope directly to the DUT; current measurements can be made by connecting a current probe around one of the DUT test leads. If a current probe is unavailable, a precision shunt resistor can be placed in series with the device and the voltage across the shunt measured with a standard probe, then converted to current using a math function in the scope. This simple setup offers a variety of advantages. Pulse generators provide full control over pulse width, pulse period, rise time and fall time. They are capable of pulse widths as narrow as 10 nanoseconds and rise and fall times as short as 2-3 nanoseconds. Oscilloscopes are ideal for transient pulse measurements because of their ability to sample the signal at very high speeds.

FIGURE 3. Pulse measurement using a pulse generator and an oscilloscope. Voltage is measured across the device with a voltage probe and current through the device is measured with a current probe.

FIGURE 3. Pulse measurement using a pulse generator and an oscilloscope. Voltage is measured across the device with a voltage probe and current through the device is measured with a current probe.

Although a simple pulse generator/oscilloscope combination is good for fast transient pulse measurements, it’s not appropriate for all pulse measurement applications. A scope’s measurement resolution is relatively low (8–12 bits). Because scopes are designed to capture waveforms, they’re not well suited for making pulse I-V measurements. Although the built-in pulse measure functions can help with measuring the level of a pulse, this represents only a single point on the I-V curve. Generating a complete curve with this setup would be time consuming, requiring either manual data collection or a lot of programming. Pulse generators are typically limited to outputting 10-20V max with a current delivery capability of only a couple hundred milliamps, which would limit this setup to lower power devices and/or lower power tests. Test setup can also be complex. Getting the desired voltage at the device requires impedance matching with the pulse generator. If a shunt resistor is used to measure current, then the voltage drop across this resistor must be taken into account as well.

Curve tracers were all-in-one instruments designed specifically for I-V characterization of 2- and 3-terminal power semiconductor devices. They featured high current and high voltage supplies for stimulating the device and a configurable voltage/ current source for stimulating the device’s control terminal, a built-in test fixture for making connections, a scope like display for real-time feedback, and a knob for controlling the magnitude of the output. However, Source measure unit (SMU) instruments (FIGURE 4) have now largely taken up the functions they once performed.

FIGURE 4. Model 2620B System SourceMeter SMU instrument.

FIGURE 4. Model 2620B System SourceMeter SMU instrument.

SMU instruments combine the source capabilities of a precision power supply with the measurement capabilities of a high accuracy DMM. Although originally designed for making extremely accurate DC measurements, SMU instruments have been enhanced to include pulse measurement capabilities as well. These instruments can source much higher currents in pulse mode than in DC mode. For example, the Keithley Model 2602B SourceMeter SMU instrument can output up to 3A DC and up to 10A pulsed. For applications that require even high currents, the Model 2651A SourceMeter SMU instrument can output up 20A DC or 50A pulsed. If two Model 2651As are configured in parallel, pulse current outputs up to 100A are possible.

SMU instruments can source both voltage and current with high accuracy thanks to an active feedback loop that monitors the output and adjusts it as necessary to achieve the programmed output value. They can even sense voltage remotely, directly at the DUT, using a second set of test leads, ensuring the correct voltage at the device. These instruments measure with high precision as well, with dual 28-bit delta-sigma or integrating-type ADCs. Using these ADCs along with their flexible sourcing engines, SMUs can perform very accurate pulse I-V measurement sweeps to characterize devices. Some, including the Model 2651A, also include two SAR-type ADCs that can sample at 1 mega-sample per second with 18-bit resolution, making them excellent for transient pulse measurements as well.

In addition, some SMU instruments offer excellent low current capability, with ranges as low as 100pA with 100aA resolution. Their wide dynamic range makes SMU instruments an excellent choice for both ON- and OFF-state device characterization. Also, because they combine sourcing and measurement in a single instrument, SMU instruments reduce the number of instruments involved, which not only simplifies triggering and programming but reduces the overall cost of test.

Although SMU instruments are often used for pulse measurements, they don’t operate in the same way as a typical pulse generator. For example, an SMU instrument’s rise and fall times cannot be controlled by the user; they depend on the instrument’s gain and bandwidth of the feedback loop. Because these loops are designed to generate little or no overshoot when stepping the source, the minimum width of the pulses they produce are not as short as those possible from a pulse generator. However, an SMU instrument can produce pulse widths as short as 50–100μs, which minimizes device self-heating.

The terminology used to describe a pulse when using SMU instruments differs slightly from that used with pulse generators. Rather than referring to the output levels in the pulse as amplitude and base or the high level and the low level, with SMU instruments, the high level is referred to as the pulse level and the low level as the bias level. The term bias level originates from the SMU’s roots in DC testing where one terminal of a device might be biased with a fixed level. Pulse width is still used with SMU instruments, but its definition is slightly different. Given that rise and fall times cannot be set directly and vary with the range in use and the load connected to the output, pulse width can’t be accurately defined by Full Width at Half Maximum (FWHM). (refer to the sidebar for more information on FWHM). Instead, for most SMU instruments, pulse width is defined as the time from the start of the rising edge to the start of the falling edge, points chosen because they are under the user’s control.

In other words, the user can set the pulse width by setting the time between when the source is told to go to the pulse level and then told to go back to the bias level.

FIGURE 5. A pulse measure unit card combines the capabilities of a pulse generator and a high resolution oscilloscope.

FIGURE 5. A pulse measure unit card combines the capabilities of a pulse generator and a high resolution oscilloscope.

Pulse measure units (PMUs) combine the capabilities of a pulse generator and a high-resolution oscilloscope, which are sometimes implemented as card-based solutions designed to plug into a test mainframe. Keithley’s Model 4225-PMU, designed for use with the Model 4200 Semiconductor Charac- terization System (FIGURE 5), is one example. It has two independent channels capable of sourcing up to 40V at up to 800mA. Like a standard pulse generator, users can define all parameters of the pulse shape. Pulse widths as narrow as 60ns and rise and fall times as short as 20ns make it well suited for characterizing devices with fast transients. A Segment Arb mode allows outputting multi-level pulse waveforms in separately defined segments, with separate voltage levels and durations for each. Each PMU channel is capable of measuring both current and voltage using two 14-bit 200MS/s ADCs per channel for a total of four ADCs per card. Additionally, all four ADCs are capable of sampling together synchronously at full speed. By combining a pulse generator with scope- like measurement capability in one instrument, a PMU can not only make high-resolution transient pulse measurements but also perform pulse I-V measurement sweeps easily using a spot mean method for enhanced resolution.

EGBERT WOELK, PH.D., is director of marketing at Dow Electronic Materials, North Andover, MA. ROGER LOO, PH.D., is a principal scientist at imec, Leuven, Belgium.