Category Archives: MEMS

Today, we’re surrounded by a variety of electronic devices that are moving increasingly closer to us – we can attach and wear them, or even implant electronics inside our bodies.

Many types of smart devices are readily available and convenient to use. The goal now is to make wearable electronics that are flexible, sustainable and powered by ambient renewable energy.

This last goal inspired a group of Korea Advanced Institute of Science and Technology (KAIST) researchers to explore how the attractive physical features of zinc oxide (ZnO) materials could be more effectively used to tap into abundant mechanical energy sources to power micro devices. They discovered that inserting aluminum nitride insulating layers into ZnO-based energy harvesting devices led to a significant improvement of the devices’ performance. The researchers report their findings in the journal Applied Physics Letters, from AIP Publishing.

“Mechanical energy exists everywhere, all the time, and in a variety of forms – including movement, sound and vibration. The conversion from mechanical energy to electrical energy is a reliable approach to obtain electricity for powering the sustainable, wireless and flexible devices – free of environmental limitations,” explained Giwan Yoon, a professor in the Department of Electrical Engineering at KAIST.

Piezoelectric materials such as ZnO, as well as several others, have the ability to convert mechanical energy to electrical energy, and vice versa. “ZnO nanostructures are particularly suitable as nanogenerator functional elements, thanks to their numerous virtues including transparency, lead-free biocompatibility, nanostructural formability, chemical stability, and coupled piezoelectric and semiconductor properties,” noted Yoon.

The key concept behind the group’s work? Flexible ZnO-based micro energy harvesting devices, aka “nanogenerators,” can essentially be comprised of piezoelectric ZnO nanorod or nanowire arrays sandwiched between two electrodes formed on the flexible substrates. In brief, the working mechanisms involved can be explained as a transient flow of electrons driven by the piezoelectric potential.

“When flexible devices can be easily mechanically deformed by various external excitations, strained ZnO nanorods or nanowires tend to generate polarized charges, which, in turn, generate piezoelectronic fields,” said Yoon. “This allows charges to accumulate on electrodes and it generates an external current flow, which leads to electronic signals. Either we can use the electrical output signals directly or store them in energy storage devices.”

Other researchers have reported that the use of insulating materials can help provide an extremely large potential barrier. “This makes it critically important that insulating materials are carefully selected and designed – taking both the material properties and the device operation mechanism into consideration,” said Eunju Lee, a postdoctoral researcher in Yoon’s group.

To date, however, there have been few efforts made to develop new insulating materials and assess their applicability to nanogenerator devices or determine their effects on the device output performance.

The KAIST researchers proposed, for the first time, new piezoelectric ZnO/aluminum nitride (AlN) stacked layers for use in nanogenerators.

“We discovered that inserting AlN insulating layers into ZnO-based harvesting devices led to a significant improvement of their performance – regardless of the layer thickness and/or layer position in the devices,” said Lee. “Also, the output voltage performance and polarity seem to depend on the relative position and thickness of the stacked ZnO and AlN layers, but this needs to be explored further.”

The group’s findings are expected to provide an effective approach for realizing highly energy-efficient ZnO-based micro energy harvesting devices. “This is particularly useful for self-powered electronic systems that require both ubiquity and sustainability – portable communication devices, healthcare monitoring devices, environmental monitoring devices and implantable medical devices,” pointed out Yoon. And there are potentially many other applications.

Next up, Yoon and colleagues plan to pursue a more in-depth study to gain a much more precise and comprehensive understanding of device operation mechanisms. “We’ll also explore the optimum device configurations and dimensions based on the operation mechanism analysis work,” he added.

The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology.

“We know that technology has the capability to change the world: from the Gutenberg printing press to the steam engine to the microchip,” said Ian Weightman, vice president, research & operations, IHS Technology. “But how can we determine which technologies are likely to have the greatest potential to transform the future of the human race? What is the process to distinguish among the innovations that will have limited impact and those that will be remembered as milestones on the path of progress? How can you tell the difference between the VHS and Betamax of tomorrow’s technologies?”

“To answer these questions, IHS Technology gathered its leading experts representing the technology supply chain from electronic components to finished products across applications markets ranging from consumer, media, and telecom; to industrial, medical, and power. These experts were asked to nominate and vote for their top 10 most impactful technologies over the next five years.”

The top three technologies were: 3-D printing in third place; cloud computing/big data at No. 2; and the Internet of Everything coming out on top.

Manufacturing moves to next dimension with 3-D printing

Also called additive manufacturing, 3-D printing encourages design innovation by facilitating the creation of new structures and shapes, and allows limitless product complexity without additional production costs. It also greatly speeds up time to market by making the idea-to-prototype cycle much shorter.

Total revenue for the 3-D printing industry is forecast to grow by nearly 40 percent annually through 2020, when the aggregated market size is expected to exceed $35.0 billion, up from $5.6 billion in 2014.

Cloud computing/big data brings metamorphosis to computing and consumer markets

The cloud has become a ubiquitous description for on-demand provisioning of data, storage, computing power and services that are touching nearly every consumer and enterprise across the globe. Together with data analytics and mobile broadband, the cloud and big data are poised to reshape almost every facet of the consumer digital lifestyle experience and dramatically impact enterprise information technology (IT) strategies, while creating new opportunities and challenges for the various nodes in the entire information, communications and technology (ICT) value chain.

The cloud is transformational in the business landscape, changing the way enterprises interact with their suppliers, customers and developers.

The big data and data analytics segment is a separate but related transformational technology that harnesses the power of the cloud to analyze data for disparate sources to uncover hidden patterns, enable predictive analysis and achieve huge efficiencies in performance.

IHS forecasts that global enterprise IT spending on cloud-based architectures will double to approximately $230 billion in 2017, up from about $115 billion in 2012.

The Internet of Things becomes the Internet of Everything

The world is in the early stages of the Internet of Things (IoT)—a technological evolution that is based on the way that Internet-connected devices can be used to enhance communication, automate complex industrial processes and generate a wealth of information. To provide some context on the magnitude of this evolution, more than 80 billion Internet-connected devices are projected to be in use in 2024, up from less than 20 billion in 2014, as presented in the attached figure.

While the IoT concept is still relatively new, it is already transforming into a broader model: the Internet of Everything (IoE). The metamorphosis covers not just the number of devices but envisages a complete departure from the way these devices have used the Internet in the past.

Most of the connected devices in place today largely require direct human interaction and are used for the consumption of content and entertainment. The majority of the more than 80 billion future connections will be employed to monitor and control systems, machines and objects—including lights, thermostats, window locks and under-the-hood automotive electronics.

Other transformative technologies identified by IHS Technology analysts were:

  • Artificial intelligence
  • Biometrics
  • Flexible displays
  • Sensors
  • Advanced user interfaces
  • Graphene
  • Energy storage and advanced battery technologies

2015-01-12_Connectable_Devices

With new cost-sensitive semiconductor devices driving capacity demand, 200mm wafer size and currently existing (legacy) fabs are seeing a renaissance,  SEMI completed a thorough study of the secondary fab equipment market to identify the market size and to capture key trends and issues impacting this industry segment. SEMI interviewed and surveyed integrated device makers (IDMs) and foundries. Companies were asked to provide information pertaining to the acquisition of previously installed tools for 150mm, 200mm, and 300mm manufacturing. The SEMI Secondary Fab Equipment Report is new, unique coverage for the industry. The report contains 26 pages and 29 figures and charts. The target audience is expected to be companies serving the secondary fab equipment supply chain, IDMs and foundries, and other industry analysts who need data to benchmark and analyze this market.

The semiconductor industry is maturing where annual double-digit fab capacity additions are less frequent, and the industry is spending in the range of $30 billion per year in new fab equipment. Investment in “legacy” fabs is important in manufacturing semiconductor products, including the emerging Internet of Things (IoT) class of devices and sensors, and remains a sizeable portion of the industries manufacturing base:

  • 150mm and 200mm fab capacity represent approximately 40 percent of the total installed fab capacity
  • 200mm fab capacity is on the rise, led by foundries that are increasing 200mm capacity by about 7 percent through to 2016 compared to 2012 levels
  • New applications related to mobility, sensing, and IoT are expected to provide opportunities for manufacturers with 200mm fabs

Out of the total US$ 27 billion spent in 2013 on fab equipment and US$ 31 billion spent on fab equipment  in 2014, secondary fab equipment represents approximately 5 percent of the total, or US$ 1.5 billion, annually. For 2014, 200mm fab investments by leading foundries and IDMs resulted in a 45 percent increase in spending for secondary 200mm equipment. Foundries are estimated to represent half of the 200mm equipment spending in 2014.

In developing the report, SEMI interviewed and surveyed IDMs and foundries. Direct spending input was obtained from 28 companies, and estimates were made for another 12 companies based on known capex plans, quarterly financial statements and transcripts, and capacity investment trends tracked by the SEMI World Fab Forecast database. The focus of the new report is on secondary fab equipment spending; secondary test equipment and assembly and packaging equipment were not included in this study. To order the report, visit www.semi.org/en/node/53676. For information on all SEMI Market research reports, visit www.semi.org/en/MarketInfo. For information on SEMI, visit www.semi.org

GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, and Linear Dimensions Semiconductor Inc., a semiconductor company specializing in low power analog and mixed signal integrated circuits, today announced that they are working together to manufacture a 14-channel programmable reference from Linear Dimensions for multiple markets including IoT (Internet of Things) sensor and wearable device applications.

The LND1114 is a 14-channel reference designed to meet the tuning needs of emerging IoT sensors and Wearable applications.  The LND1114 is available in QFN-3×2.2mm form factor, and is the world’s smallest programmable multi-channel reference product.  With a typical drift of only 13uV after 10 years at 70C, low temperature drift and an initial accuracy of 0.2%, the LND1114 is ideally suited for precision sensor biasing.

GLOBALFOUNDRIES’ advanced process and development capabilities have allowed Linear Dimensions to engineer an analog non-volatile tuning solution ideally positioned for emerging wearable and portable IoT sensor applications,” said David Schie, CEO of Linear Dimensions.   “Devices such as wearable health and fitness products, cell phones, consumer cameras, media players and headsets are increasingly integrating multiple single and multi-function sensors to offer added functionality.  These multiple sensors all require specific biasing and tuning to operate correctly.  The LND1114 is a revolutionary new way to bias and tune precision devices because it offers multiple channels with unparalleled accuracy and flexibility, in a smaller footprint just a fraction of the size of existing solutions.’

“As sensor based applications proliferate, and wearables become more popular in the market, technologies that enable such devices become extremely important,” said Gregg Bartlett, senior vice president of product management at GLOBALFOUNDRIES. “We will continue to provide differentiated technology platforms from 350nm to 28nm that our customers can use for innovative products in the rapidly growing IoT and wearable markets.  By partnering with Linear Dimensions we have been able to leverage our world-class analog processing capabilities to offer tuning and biasing performance that has not previously been available in such a small form factor.”

GLOBALFOUNDRIES has a solid track record of providing semiconductor technologies to a variety of market segments including mobility, industrial, automotive and computing. In mainstream technologies, GLOBALFOUNDRIES offers modular platforms on technology nodes from 180nm to 40nm on both 200mm and 300mm wafers, with additional process modules such as analog, power management, radio frequency (RF), embedded non-volatile memory (eNVM) and Micro-Electro-Mechanical Systems (MEMS).

Wafer volume production for Linear Dimensions’ 14-channel programmable floating gate reference program is expected to start in Q3 2015 in GLOBALFOUNDRIES manufacturing facility in Singapore.

SEMI today announced a “Call for Papers” for SEMICON West, North America’s premier microelectronics event, to be held July 14-16 at the Moscone Center in San Francisco, Calif. The “Call for Papers” includes the Semiconductor Technology Symposium and the popular TechXPOT programs. Presentation abstracts are due March 20, 2015.

SEMICON West 2015 will be attended by nearly 27,000 semiconductor and related microelectronics industry professionals and feature more than 60 hours of technical sessions, led by the most informed and influential experts in the world. For 2015, SEMICON West will feature two “Generation Next” Pavilions — a new concept in topic-based engagement, which will connect exhibits, technical sessions, and networking events to current, critical industry topics, engaging exhibitors and visitors in an immersive exhibition experience.  In addition, the “standing-room only” success of the SEMICON West TechXPOT programs prompted the creation of the Semiconductor Technology Symposium (STS) at the 2014 event.

In 2015, the STS program continues with programs on leading-edge chip manufacturing held in a classroom setting with reserved seating adjacent to the show floor in the North Hall of Moscone Center. STS will offer technology trends, developments and new technology information in the areas of advanced materials and processing, lithography, metrology, 450mm, advanced packaging, and 3D-IC.  Test Vision 2020, the leading semiconductor test conference focusing on ATE and high-volume manufacturing, is part of the STS program in Moscone Center.

TechXPOT programs in the Moscone Center North and South Halls will continue focusing on special topics in semiconductor manufacturing, and adjacent and related microelectronics technologies.

For the Semiconductor Technology Symposium and for TechXPOT sessions, SEMI is soliciting technical presentations in the following areas:

  • Advanced lithography/Advanced films
  • Advanced materials and processes
  • Contamination control for advanced materials
  • New and advanced metrology solutions
  • Interconnect challenges at sub-10nm
  • Substrates: Materials research beyond Silicon
  • Other process implications for manufacturing next-generation transistors
  • Accelerating and improving yield
  • Silicon Photonics
  • Disruptive compound semiconductor technologies
  • Manufacturing advanced power semiconductors
  • Improving Yield on Non-Planar ICs
  • Failure analysis
  • Advanced packaging
  • Design for packaging
  • Semiconductor test
  • Design for test
  • Application Level Testing
  • Technologies for Emerging Markets & Applications
  • What’s next in MEMS?
  • How manufacturing of IoT devices will impact IC fabrication
  • How IoT and 3D printing will be used in IC manufacturing in the future
  • Printed and flexible electronics
  • Packaging of MEMS and Sensors
  • SiP for Power and RF
  • Heterogeneous Integration for SiP and Modules

“There are many exciting challenges facing the industry today,” said Karen Savala, President of SEMI Americas. “We are pleased that SEMICON West continues to serve as the premier forum where industry leaders share their insight on these issues.”

SEMICON West 2015 “Call for Participants”:  Prospective presenters are invited to submit abstracts (maximum 500 words) on key industry issues and topics in the areas listed above for consideration. Presentations should focus on the latest developments and innovations in these technology areas, inclusive of supporting data. Submissions may be made online from the “Call for Participants” website at: www.semiconwest.org/Participate/SPCFP. The deadline is March 20.

“Generation Next” Pavilions (Advanced Substrate Engineering; Packaging): These two new Generation Next Pavilions will be held in conjunction with technical sessions (STS and TechXPOTs) at SEMICON West — addressing critical issues, challenges, and opportunities. For more information about exhibiting opportunities within these new Pavilions, contact Nick Antonopoulos at [email protected] or +1.408.943.6986.

Silicon Innovation Forum (SIF) “Call for Startups”:  SEMI will host its 3rd Annual Silicon Innovation Forum at SEMICON West 2015 and is now accepting early applications to participate. The Silicon Innovation Forum (SIF) provides a stage for new and emerging innovators, industry leaders, strategic investors, and venture capitalists to discuss the needs and requirements of the industry’s innovation engine. Participants will gain insights into technology, capital, partnership, and collaboration strategies necessary for mutual success. For more information, please email Ray Morgan, director of Outreach at [email protected].  SIF application: 2015 SIF Showcase Request for Participation. The deadline is March 20.

About SEMICON West

SEMICON West is the flagship annual event for the global microelectronics industry, showcasing the people, products, and technologies driving the design and manufacture of advanced microelectronics. SEMICON West attracts the world’s leading technology companies serving the microelectronics supply chain and the largest audience of influential buyers, industry leaders, decision-makers, technologists, analysts, and media of any industry event in North America. SEMICON West 2015 is projected to bring together more than 27,000 international attendees, more than 700 global companies, and feature more than 60 hours of technical, business, and networking programs. For more information, visit www.semiconwest.org.

SEMI today announced the launch of the European MEMS Summit, to be held on 17-18 September 2015 in Milan, Italy.  With a 13 percent CAGR over the period of 2013-2019 (predicted by Yole Developpement), and the expected growth from the Internet of Things (IoT), the MEMS market has taken on a new importance — making collaboration around new business and technologies critically important.

The European MEMS Summit will address MEMS technologies, manufacturing, applications and time-to-growth. Over the course of the two-day event, more than 20 keynote and invited speakers from the entire supply chain will share their perspectives and latest updates, including participation by European MEMS leaders. Fabless, foundries, IDMs, OSATs, equipment and materials companies will deliver talks on MEMS and sensors. In addition, a focused industry exhibition will complement the conferences offering with additional networking opportunities.

Industry issues to be discussed at the conference:

  • Market drivers for MEMS applications and technology
  • Impact and opportunities arising from IoT and sensor-centric applications
  • Innovations in technology including new detection principles
  • Managing quick ramp up and product changeover — challenges for the supply chain
  • Standardization as a driver for cost reduction?
  • Trends relative to fabless and foundries business model

These issues are increasingly critical to maintaining MEMS growth and leading executives support this new SEMI event. “Bosch highly welcomes this new SEMI event in Europe since European manufacturers play a leading role in this industry,” says Stefan Finkbeiner, CEO of Bosch Sensortec.  Benedetto Vigna, executive VP and general manager of the Analog, MEMS and Sensors Group at STMicroelectronics, states that “With a significant part of MEMS success centered near Milan, the city offers the perfect backdrop for this event highlighting the technology’s magnificence and exceptional value.”

Conference speakers will address innovation in technology, with presentations covering new detection principles, new technologies, increased importance of software, as well as new types of MEMS devices. Challenges in the supply chain and the need for a more efficient MEMS-based ecosystem will also be explored during the Summit. Speakers will examine the potential evolution of MEMS fabless and foundries and the need for deeper collaboration between partners.

Business topics will cover macro market trends and feature specific talks on MEMS business challenges, possible industry consolidation and the expected advantages of standardization. Applications of MEMS in different segments including consumer, automotive, industrial, healthcare, and wearable will be discussed. IoT, the sensor-centric phenomenon, will present significant opportunities for MEMS.

The conference program is developed by a steering committee composed of MEMS industry professionals including ASE, Bosch Sensortec, CEA-Leti, EV Group, Fraunhofer ENAS, Fraunhofer IZM, Freescale Semiconductor, IHS, Okmetic, Sencio, SPTS, STMicroelectronics, SUSS MicroTec, X-Fab and Yole Developpement.

Please visit www.semi.org/europeanMEMSSummit for more information and to register for the European MEMS Summit email list, with important updates about the event. For more information on SEMI, visit www.semi.org.

SEMI Europe will ring in the New Year by holding the first major, international 3D TSV event of 2015. On January 19-21, members of the 3D TSV industry will convene in Grenoble, France for the 3rd edition of the European 3D TSV Summit. This year’s theme: Enabling Smarter Systems.

The European 3D TSV Summit’s 2015 conference will feature Keynote and Invited Speakers, a Market Briefing and a Panel Discussion. The Panel Discussion, moderated by Jean-Christophe Eloy, CEO and founder of Yole Développement, is entitled “From TSV Technology to Final Products – What Business for 3D Smart Systems ?” Panelists from AMKOR, Qualcomm, ams AG and AMD, will share their viewpoints on the 3D TSV market and the shift that many companies are beginning to make from 3D TSV technology development to the commercialization phase. Attendees can expect a lively discussion about the next big steps for the 3D-IC market.

The conference will be accompanied by a sold-out industry exhibition, featuring over 25 important industry players. Conference attendees will be invited to visit the exhibition during coffee and lunch breaks. In addition, the event will offer numerous opportunities for networking including a gala dinner and a one-on-one meeting service with dedicated private meeting spaces. With more than 125 companies planning to be present (including GlobalFoundries, STMicroelectronics, HP, Microsoft, AMD, Qualcomm, IBM, Infineon, AMKOR, ASE, NANIUM, Silex, XFAB, EVGroup, SPTS, and more…) the event promises to be a ripe ground for important professional meetings.

For more information about registration for the European 3D TSV Summit 2015 visit the event’s website:  www.semi.org/European3DTSVSummit. For more information about the remaining sponsorship opportunities, contact Jérôme Boutant: [email protected]

InvenSense, Inc., a provider of intelligent sensor solutions, announced that since starting shipment of MEMS-based sensors in late 2006, it will reach 1 billion devices shipped in Q1 of calendar 2015. InvenSense additionally announced that, since being the world’s first manufacturer of a single chip 6-axis product family for the mobile, wearable, smart home, automotive, and industrial markets, will now surpass over five hundred million units shipped worldwide in Q1 CY15.

The market demand for ‘AlwaysOn’ sensing in consumer electronics has been growing at a rapid pace with the proliferation of premium smart phones. Yole Développement forecasts the MEMS Sensors industry is primed to grow from an estimated $13B in 2014, to $24B by 2019. InvenSense has a history of innovation, a strong patent portfolio, and has achieved numerous technological firsts, culminating in receiving its fourth prestigious award from the Global Semiconductor Alliance (GSA) for the third consecutive year. Additionally, InvenSense was again ranked among the fastest growing semiconductor companies in Deloitte’s 2014 Technology Fast 500 List of Fastest Growing Companies in North America and market watcher IHS iSuppli named InvenSense one of “the top suppliers of motion sensors today.”

“Opportunities for InvenSense’s technology in imaging, motion, sound, and navigation continue to be strong,” said Behrooz Abdi, CEO and President, InvenSense, Inc. “We are pleased with the number of new customer products featuring InvenSense’s integrated 6-axis System on Chips (SoCs) including the strong and growing adoption into the Internet of Things (IoT) market, and we’re encouraged by the continuing validation of our Sensing Everything™ strategy.”

InvenSense is exhibiting in booth #35806 in South Hall 4 at the 2015 Consumer Electronics Show taking place in Las Vegas, Nevada from January 6 – 9, 2015.

Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference (“ICCAD”), which was recently held at Hong Kong Science Park.

As a keynote speaker at the event, Henry Liu, senior director of marketing at HLMC, said, “With the development of smart automotive, smart grid, smart home and smart medical services, among other sectors, coupled with the pursuit among the general population of a simpler lifestyle and more efficient management of one’s day to day affairs, IoT has become the new hot topic of the market. The development of the market is set to further promote the prosperity of the semiconductor industry as semiconductor components are the basic core and data gateway of IoT equipment.”

According to Cisco IBSG, IoT connections worldwide are expected to reach 50 billion units, a milestone that is expected to have a profound impact on both consumers and vendors around the world. Currently, many of the world’s leading IC producers are accelerating expansion into the IoT sector in preparation for building their own ecosystem.

As one of the most advanced 12-inch wafer foundries in mainland China, HLMC’s technology starts from 55nm technology node and mainly covers 55nm LP, 40nm LP and 28nm LP as well as 55nm HV, 55nm eFlash and specialty technology. HLMC provides customers with low-cost wafer foundry solutions.  During the annual event, Chris Shao, senior director of Technology Development Division 1 at HLMC, shared features of the 55nm embedded flash technology with attendees. The 55nm embedded flash technology, one of the company’s core process platforms, provides the following advantages:

  • Core device: 1.2V; IO device: 2.5V or 5V; low working voltage and power consumption
  • Embedded SONOS technology based on standard COMS process without any need to change features and model of standard device
  • Complete retention of 55nm low power logic process-based IP bank
  • Only three additional layers of photomask are required for application of SONOS technology based on standard CMOS process, compared with 9-12 layers when using others processes, lowering manufacturing costs
  • Continuous downscaling to more advanced process nodes

Looking back the year of 2014, the IC manufacturing industry has made several great achievements: the industry’s sub-sector wafer foundry is on track to having a record year in terms of output value, as a result of the introduction of new mobile communication products and demands for special manufacturing processes used for IoT devices. The semiconductor facilities benefitting from IoT are expected to grow more rapidly than the overall semiconductor industry. Cisco IBSG estimates that 50 billion IoT products will be in existence by 2020, generating an output value of USD 14.4 trillion. Henry Liu stressed that HLMC is optimistic about the future of IoT and expressed confidence that the Company’s excellent manufacturing abilities and reliable quality management will serve to assure that it will be able to provide Chinese IC designers as well as customers worldwide with low-cost wafer foundry solutions for the IoT applications sector, including smartphones, tablets, smart TVs, set-top boxes, banking cards and automotive electronics.

MEMSensing Microsystems Co. and Semiconductor Manufacturing International Corporation jointly announced the launch of the world’s smallest 3-axis accelerometer MSA330, which utilizes SMIC’s CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.

By vertically integrating the 3-axis accelerometer device with CMOS ASIC into a single package of 1.075×1.075×0.60mm3 (LxWxH), MSA330 achieves about 30% shrink in footprint and 70% reduction in the total size compared to the latest commercial products. It is also the thinnest of its kind, only 0.5mm after SMT and 0.6mm in total height including 0.2mm solder balls. MSA330 would be competitive not only in overall fabrication costs through all wafer level fabrication and packaging but also in miniaturization particularly for mobile and wearable applications.

“The success in MSA330 signifies SMIC the major breakthrough achieved in its fabrication of CMOS integrated MEMS devices and TSV-based wafer level packaging technologies, which is expected to enter commercial production within 2015. Such accomplishment would further benefit SMIC in broadening its manufacturing capabilities and foundry services into fabricating MEMS devices and wafer level packaging open to global MEMS customers,” said Dr. Shiuh-Wuu Lee, Executive Vice President of Technology Development of SMIC.

“MEMSensing is SMIC’s 1st domestic MEMS customer, and also one of its earliest customers worldwide which can be dated back to as early as 2009. MSA330 is the world’s 1st MEMS accelerometer enabled by WLCSP (Wafer Level Chip Scale Packaging), which is based on WLP and TSV technology. This approach belongs to the latest generation for MEMS accelerometer fabrication while other competitors are still lagging one step behind. The success for MSA330 product development proves that MEMSensing has now broadened its MEMS sensor product portfolio beyond the existing MEMS microphone and pressure sensors. We plan to allocate more resources to cooperate with SMIC to develop other advanced products and make an effort to further enrich China’s domestic MEMS industry chain,” said Dr. Li Gang, CEO of MEMSensing.