Category Archives: MEMS

Nanoelectronics research center imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology. The joint research on silicon-based optical interconnects is expected to deliver benefits including high speed, low power consumption and cost savings.

Silicon photonics is a key enabling technology expected to revolutionise optical communications by paving the way for the creation of highly integrated, low power optical transceivers used for data transmission and telecommunications.

Huawei has now joined imec’s research program which focuses on optimizing bandwidth density, power consumption, thermal robustness and cost at the system level. Huawei engineers will work closely with imec’s R&D team in Leuven, Belgium, with a view to achieving technological progress in this vital area for delivering connectivity matching the needs of the Europe of tomorrow.

In 2013, Huawei acquired photonics company Caliopa spin-off from imec and UGent, thereby adding silicon photonics research to its European R&D portfolio. Delivering on its commitment of boosting Caliopa’s development, Huawei has been investing in its human resources and infrastructure, prompting it to move offices to keep step with its rapid growth.

“This is an important next step in our collaboration with Huawei on silicon photonics. This collaboration, together with Huawei’s recent acquisition of our spin-off Caliopa that focuses on developing silicon photonics-based optical transceivers for the telecommunications industry, shows that our silicon photonics research is important for advancing next-generation high-bandwidth ICT solutions,” stated Luc Van den hove, president and CEO at imec.“We expect this partnership to give a further boost to our silicon photonics research over the coming years.”

“Having acquired cutting-edge expertise in the field of silicon photonics thanks to our acquisition of Caliopa last year, this partnership with imec is the logical next move towards next-generation optical communication. By combining our strengths in this strategic area, we can deliver ICT innovation that translates into value for businesses and consumers in Europe and beyond,” said Hudson Liu, CEO at Huawei Belgium.

Imec’s role as a global leader in the field of silicon electronics, combined with Caliopa’s expertise in this field – leveraged by Huawei’s global reach – make this new partnership a strategic advantage for all sides.

Thanks to Huawei’s global platform and network, the company can bring silicon photonics research results to the market, effectively speeding up the commercialisation of its products. This means creating a win-win situation where R&D success translates into industrial achievement: the expertise achieved in Belgium will make a direct contribution to improving communications technology at a global level.

The collaboration further deepens Huawei’s engagement with the European research ecosystem in pursuit of its strategy to build a better-connected Europe by investing in local talent. The announcement follows the recent purchase of Internet of Things pioneering company Neul in the UK, the launch of an innovation centre in Walldorf, Germany, and the opening of an R&D site in Sophia Antipolis, France.

Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion. The post-merger company will generate more than $2 billion in revenue annually.

“This merger represents the combination of two smart, profitable, passionately entrepreneurial companies that are No. 1 in their respective memory markets and have successfully diversified into embedded processing,” said Rodgers, Cypress’s founding president and CEO. “Our combined company will be a leading provider of embedded MCUs and specialized memories. We will also have extraordinary opportunities for EPS accretion due to the synergy in virtually every area of our enterprises.”

Under the terms of the agreement, Spansion shareholders will receive 2.457 Cypress shares for each Spansion share they own. The shareholders of each company will own approximately 50 percent of the post-merger company. The company will have an eight-person board of directors consisting of four Cypress directors, including T.J. Rodgers and Eric Benhamou, and four Spansion directors, including John Kispert and Ray Bingham, the Spansion chairman, who will serve as the non-executive chairman of the combined company, which will be headquartered in San Jose, California and called Cypress Semiconductor Corporation.

The merger is expected to achieve more than $135 million in cost synergies on an annualized basis within three years and to be accretive to non-GAAP earnings within the first full year after the transaction closes. The combined company will continue to pay $0.11per share in quarterly dividends to shareholders.

“Bringing together these high-performing organizations creates operating efficiencies and economies of scale, and will deliver maximum value for our shareholders, new opportunities for employees and an improved experience for our customers,” said John Kispert, CEO of Spansion. “With unparalleled expertise, global reach in markets like Japan and market-leading products for automotive, IoT, industrial and communications markets, the new company is well positioned to deliver best-of-breed solutions and execute on our long-term vision of adding value through embedded system-on-chip solutions.”

The closing of the transaction is subject to customary conditions, including approval by Cypress and Spansion stockholders and review by regulators in the U.S., Germany and China. The transaction has been unanimously approved by the boards of directors of both companies. Cypress and Spansion expect the deal to close in the first half of 2015.

Jefferies LLC and Morgan Stanley & Co. LLC served as financial advisors and Fenwick & West and Latham & Watkins acted as legal counsel to Spansion. Qatalyst Partners acted as financial advisor and Wilson Sonsini Goodrich & Rosati acted as legal counsel to Cypress.

SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3 percent to $38.0 billion in 2014, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.  In 2015, strong positive growth is expected to continue, resulting in a global market increase of 15.2 percent before moderating in 2016.

The SEMI Year-end Forecast predicts that wafer processing equipment, the largest product segment by dollar value, is anticipated to increase 17.8 percent in 2014 to total $29.9 billion. The forecast predicts that the market for assembly and packaging equipment will increase by 30.6 percent to $3.0 billion in 2014. The market for semiconductor test equipment is forecast to increase by 26.5 percent, reaching $3.4 billion this year. The “Other Front End” category (fab facilities, mask/reticle, and wafer manufacturing equipment) is expected to increase 14.8 percent in 2014.

For 2014, Taiwan, North America, and South Korea remain the largest spending regions.  In terms of percentage growth, SEMI forecasts that in 2015, Europe will reach equipment sales of $3.9 billion (47.9 percent increase over 2014), Taiwan will reach $12.3 billion (28.1 percent increase), and South Korea sales will hit $8.0 billion (25.0 percent increase).

The following results are given in terms of market size in billions of U.S. dollars:

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market.

SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains.

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the NILPhotonics Competence Center, which is designed to assist customers in leveraging EVG’s suite of nanoimprint lithography (NIL) solutions to enable new and enhanced products and applications in the field of photonics. These include light emitting diodes (LEDs) and photovoltaic (PV) cells, where NIL-enabled photonic structures can improve light extraction and light capturing, respectively, as well as laser diodes, where photonic structures enable the tailoring of device characteristics to improve performance. The NILPhotonics Competence Center includes dedicated, global process teams, pilot-line production facilities and services at its cleanrooms at EVG’s headquarters in Austria as well as its subsidiaries in North America and Japan.

nanoimprint

“Nanoimprint lithography is an enabling technology for the design and manufacture of all kinds of photonic structures, which can significantly shorten time to market and lower cost of production compared to conventional technologies, such as electron-beam writing and stepper systems for optical lithography,” stated Markus Wimplinger, corporate technology development and IP director at EV Group. “For example, compared with conventional lithography, our full-wafer nanoimprinting technology can pattern true three-dimensional structures in the sub-micron to nano-range as well as features as small as 20nm, which opens up a range of new photonic applications. With our NILPhotonics Competence Center, we’re not just providing our customers with the most advanced NIL systems; we’re also working closely with them during product development to help them determine how best to optimize their product designs and processes to take advantage of the resolution and cost-of-ownership benefits that NIL brings.”

The new NILPhotonics Competence Center builds on more than 15 years of NIL experience at EVG with the largest installed base of NIL systems worldwide. EVG’s NIL equipment portfolio includes the recently introduced EVG7200 UV-NIL system, which supports EVG’s next-generation SmartNIL large-area soft NIL process for high-volume manufacturing. The EVG7200 with SmartNIL provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches.

Slideshow: IEDM 2014 Preview


November 26, 2014

This year, the IEEE International Electron Devices Meeting (IEDM) celebrates 60 years of reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. The conference scope not only encompasses devices in silicon, compound and organic semiconductors, but also in emerging material systems. In 2014 there is an increased emphasis on circuit and process technology interaction, energy harvesting, bio-snesors and bioMEMS, power devices, magnetics and spintronics, two dimensional electronics and devices for non-Boolean computing.

Solid State Technology will be reporting insights from bloggers and industry partners during the conference, and this slideshow provides an advance look at some of the most newsworthy topics and papers to be presented at the annual meeting, to be held at the Hilton San Francisco Union Square Hotel from December 15-17, 2014.

Click here to launch slideshow

Bay Bridge, San Francisco at dusk

 

Related news and blogs: 

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

Slideshow: IEDM 2013 Highlights

The improvements in random access memory that have driven many advances of the digital age owe much to the innovative application of physics and chemistry at the atomic scale.

Accordingly, a team led by UNL researchers has employed a Nobel Prize-winning material and common household chemical to enhance the properties of a component primed for the next generation of high-speed, high-capacity RAM.

The team, which published its findings in the Nov. 24 edition of the journal Nature Communications, engineered and tested improvements in the performance of a memory structure known as a ferroelectric tunnel junction.

The junction features a ferroelectric layer 100,000 times thinner than a sheet of paper, so thin that electrons can “tunnel” through it. This layer resides between two electrodes that can reverse the direction of its polarization — the alignment of positive and negative charges used to represent “0” and “1” in binary computing — by applying electric voltage to it.

The researchers became the first to design a ferroelectric junction with electrodes made of graphene, a carbon material only one atom thick. While its extreme conductivity makes graphene especially suited for small-scale electronics, the authors’ primary interest lay in how it accommodated nearly any type of molecule — specifically, ammonia — they placed between it and the ferroelectric layer.

A junction’s polarity determines its resistance to tunneling current, with one direction allowing current to flow and the other strongly reducing it. The researchers found that their graphene-ammonia combination increased the disparity between these “on” and “off” conditions, a prized outcome that improves the reliability of RAM devices and allows them to read data without having to rewrite it.

“This is one of the most important differences between previous technology that has already been commercialized and this emergent ferroelectric technology,” said Alexei Gruverman, a Charles Bessey Professor of physics who co-authored the study.

Ferroelectric materials naturally boast the quality of “non-volatility,” meaning they maintain their polarization — and can hence retain stored information — even in the absence of an external power source. However, the infinitesimal space between the positive and negative charges in a tunnel junction makes maintaining this polarization especially difficult, Gruverman said.

“In all memory devices, there is a gradual relaxation, or decrease, of this polarization,” he said. “The thinner the ferroelectric layer is, the more difficult it is to keep these polarization charges separate, as there is a stronger driving force in the material that tries to get rid of it.”

Gruverman said the team’s graphene-ammonia combination also shows promise for addressing this prevalent issue, significantly improving the stability of the junction’s polarization during the study.

Gruverman’s UNL co-authors included Haidong Lu and Dong Jik Kim, postdoctoral researchers in physics and astronomy; Alexey Lipatov, a postdoctoral researcher in chemistry; Evgeny Tsymbal, George Holmes University Professor of physics and astronomy; and Alexander Sinitskii, assistant professor of chemistry. The study was also authored by researchers from the University of Wisconsin-Madison and the Moscow-based Kurnakov Institute for General and Inorganic Chemistry.

The team’s research was conducted with the assistance of UNL’s Materials Research Science and Engineering Center — part of a nationwide network of MRSECs sponsored by the National Science Foundation — and also received support from the U.S. Department of Energy.

Nature Communications is the Nature Publishing Group’s multidisciplinary online journal of research in all areas of the biological, physical and chemical sciences.

A potential path to identify imperfections and improve the quality of nanomaterials for use in next-generation solar cells has emerged from a collaboration of University of Oregon and industry researchers.

To increase light-harvesting efficiency of solar cells beyond silicon’s limit of about 29 percent, manufacturers have used layers of chemically synthesized semiconductor nanocrystals. Properties of quantum dots that are produced are manipulated by controlling the synthetic process and surface chemical structure.

This process, however, creates imperfections at the surface-forming trap states that limit device performance. Until recently, improvements in production quality have relied on feedback provided by traditional characterization techniques that probe average properties of large numbers of quantum dots.

“We want to use these materials in real devices, but they are not yet optimized,” said co-author Christian F. Gervasi, a UO doctoral student.

In their study, detailed in the Journal of Physical Chemistry Letters, researchers investigated electronic states of lead sulfide nanocrystals. By using a specially designed scanning tunneling microscope, researchers created atomic-scale maps of the density of states in individual nanocrystals. This allowed them to pinpoint the energies and localization of charge traps associated with defects in the nanocrystal surface structure that are detrimental to electron propagation.

The microscope was designed in the lab of co-author George V. Nazin, a professor in the UO Department of Chemistry and Biochemistry. Its use was described in a previous paper in the same journal, in which Nazin’s lab members were able to visualize the internal structures of electronic waves trapped by external electrostatic charges in carbon nanotubes.

“This technology is really cool,” said Peter Palomaki, senior scientist for Voxtel Nanophotonics and co-author on the new paper. “When you really dig down into the science at a very fundamental level, this problem has always been an open-ended question. This paper is just the tip of the iceberg in terms of being able to understand what’s going on.”

The insight, he said, should help manufacturers tweak their synthesis of nanocrystals used in a variety of electronic devices. Co-author Thomas Allen, also a senior scientist at Voxtel, agreed. The project began after Allen heard Gervasi and Nazin discussing the microscope’s capabilities.

“We wanted to see what the microscope could accomplish, and it turns out that it gives us a lot of information about the trap states and the depths of trap states in our quantum dots,” said Allen, who joined Voxtel after completing the Industrial Internship Program in the UO’s Materials Science Institute. “The information will help us fine-tune the ligand chemistry to make better devices for photovoltaics, detectors and sensors.”

The trap states seen by the microscope in this project may explain why nanoparticle-based solar cells have not yet been commercialized, Nazin said.

“Nanoparticles are not always stable. It is a fundamental problem. When you synthesize something at this scale you don’t necessarily get the same structure for all of the quantum dots. Working at the atomic scale can produce large variations in the electronic states. Our tool allows us to see these states directly and allow us to provide feedback on the materials.”

North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 0.93 means that $93 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in October 2014 was $1.10 billion. The bookings figure is 7.0 percent lower than the final September 2014 level of $1.19 billion, and is 1.9 percent lower than the October 2013 order level of $1.12 billion.

The three-month average of worldwide billings in October 2014 was $1.18 billion. The billings figure is 5.8 percent lower than the final September 2014 level of $1.26 billion, and is 10.6 percent higher than the October 2013 billings level of $1.07 billion.

“While the global semiconductor equipment industry will see strong double-digit growth this year and is slated for further growth in 2015, order activity posted by North American suppliers has moderated, resulting in a book-to-bill ratio below parity for two consecutive months,” said SEMI president and CEO Denny McGuirk.

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

May 2014

$1,407.8

$1,407.0

1.00

June 2014

$1,327.5

$1,455.0

1.10

July 2014

$1,319.1

$1,417.1

1.07

August 2014

$1,293.4

$1,346.1

1.04

September 2014 (final)

$1,256.5

$1,186.2

0.94

October 2014 (prelim)

$1,184.0

$1,102.9

0.93

Source: SEMI, November 2014 

ON Semiconductor Corporation today announced that Paul A. Mascarenas has joined its Board of Directors. The Board also appointed Mr. Mascarenas to its Science and Technology Committee.

“Paul Mascarenas is an outstanding addition to our Board of Directors,” said Dan McCranie, chairman of ON Semiconductor’s Board of Directors. “Paul brings significant technical strategy, planning and R&D experience in the automotive industry from his leadership and strategic planning roles at Ford Motor Co. Automotive electronics remains a primary focus for ON Semiconductor, currently accounting for approximately 30 percent of annual revenues. Mascarenas will be valuable addition to the Board as we continue to grow our automotive business and align the company toward our vision of becoming the premier supplier of energy efficient system solutions worldwide.”

Paul A. Mascarenas served as the Chief Technical Officer and Vice President of Research and Advanced Engineering at Ford Motor Co. from Jan. 1, 2011 to Sept. 30, 2014, where he oversaw Ford’s worldwide research organization as well as the development and implementation of the company’s technology strategy and plans. From 2007 to 2010, Mr. Mascarenas served as Ford’s Vice President of Engineering, and from 2005 to 2007 he served as Vice President of North American Vehicle Programs. During his tenure with Ford, which began in 1982, Mr. Mascarenas held various development and engineering positions both in the U.S. and Europe. Mr. Mascarenas holds a mechanical engineering degree from the University of London, King’s College in England as well as an honorary doctorate degree from Chongqing University in China. He currently serves as the President of FISITA – The International Federation of Automotive Engineering Societies.

ON Semiconductor offers a portfolio of energy efficient power and signal management, logic, discrete and custom solutions to help design engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications.

X-FAB MEMS Foundry today announced it received the “MEMS Foundry of the Year” award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group’s 10th annual MEMS Executive Congress held in Scottsdale, Arizona last week. X-FAB MEMS Foundry was chosen from among five finalists in an open voting process; it also was named runner-up in the “MEMS Supplier of the Year” category. The MEMS Industry Group is a trade association that advances MEMS and sensors across global markets.

X-FAB MEMS Foundry is part of the X-FAB group, a high-volume foundry service provider with five manufacturing facilities worldwide that manufacture MEMS, CMOS and SOI technologies on 150mm and 200mm platforms. MEMS devices include pressure sensors, micro-mirrors, microphones and microfluidic devices used in a wide variety of applications.

Dr. Peter Merz, MEMS Business Unit Manager at X-FAB, said, “X-FAB is honored to receive the prized ‘MEMS Foundry of the Year’ award. We believe this achievement reflects the quality and excellence we deliver to our MEMS customers worldwide. Our commitment to enabling the commercialization of MEMS in the medical, automotive, consumer and mobile market sectors is demonstrated by our strong growth in MEMS revenues – 35-percent compound annual growth rate since 2010 – and the addition of two new MEMS fabs this year.”

MEMS devices manufactured by X-FAB can be either discrete or integrated with a range of leading analog/mixed-signal CMOS technologies down to 180 nanometers, leading to innovative solutions in terms of performance and form-factor. X-FAB offers both customer-specific processing and market-ready open-platform process technologies for pressure sensors, inertial sensors and thermopiles. It provides quick access to MEMS technologies and fast time to market for both small and large companies. MEMS customers seeking to integrate MEMS and CMOS on a single chip have direct access to X-FAB’s CMOS fabs.

X-FAB is an analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications.