Category Archives: MEMS

The international technology group SCHOTT is expanding its HermeS wafers with hermetically sealed, solid through glass vias (TGV) into MEMS applications. HermeS glass substrates are fully gastight, and therefore enable long-term, robust enclosures for MEMS devices. The fine-pitched vias reliably conduct electrical signals and guide power into and out of the MEMS device. Since HermeS glass can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3-D wafer-level chip-size packaging (WLCSP) possible. Thanks to its extremely high reliability, HermeS wafers provide advantages for MEMS devices used in industrial, medical, and radio-frequency (RF) applications.

MEMS-powered devices and sensors must function perfectly over long periods of time, even when they are exposed to extremely harsh environments, such as pressure sensors in corrosive industrial production lines. The reliability and performance of the MEMS device depends on the long-term robustness of the MEMS packaging technology. SCHOTT’s HermeS solution with TGV offers several customer advantages over other technologies, such as through silicon vias or hermetic ceramic packaging, due to glass’ superior material characteristics compared to silicon or ceramics.

First, due to the higher mechanical, thermal, and chemical resistance of glass, the packaging is especially reliable, leading to long-term performance of the MEMS device. Second, thanks to the low dielectric constant of glass and the ability to use highly conductive via materials, HermeS wafer packaging also offers excellent RF performance. Finally, the optical transparency of the glass wafer enables better processing and quality control during the production process of a MEMS device.

“Based on the key features of our material, SCHOTT identified three major applications in which the HermeS TGV substrates offer significant advantages over competitive solutions,” said Yutaka Onezawa, Sales Manager for HermeS at SCHOTT Electronic Packaging. When used in industrial hermetic MEMS sensors, HermeS glass wafers enable long-term, reliable, and extremely rugged packaging of industrial sensors. Equipped with SCHOTT’s product, medical electronics can be packaged robustly to withstand body fluids and sterilization cycles over long periods of time. For RF MEMS, HermeS wafers provide superior RF properties through absolute hermeticity in an extremely miniaturized design.

SCHOTT’s HermeS TGV substrates also allow for the miniaturization of MEMS-powered devices, a reduction in package die size, and a more compact design. The footprint can be reduced by up to 80 percent compared to conventional ceramic packaging.

“We are also able to apply state-of-the-art, wafer-scale bonding, such as anodic bonding with silicon, glass frit, and solder. Thanks to our vast competencies, our customers can rely on a complete packaged solution with a total cost-of-ownership advantage regarding yield and process reduction,” added Onezawa.

SCHOTT offers HermeS TGV substrates made from three proprietary glass types: BOROFLOAT 33 floated borosilicate glass, AF32 eco alkali-free flat glass, and D263 T eco borosilicate glass. HermeS TGV substrates are one example of how SCHOTT’s 130 years of expertise in special-purpose glass and 70 years of experience in electronic packaging help guide the development and production of the company’s new products.

Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags. The partners will develop these new NFC tags using metal-oxide (IGZO) thin-film transistor (TFT) technology on plastic film. The flexible chips will be integrated into game cards as a part of Cartamundi’s larger strategy of developing game cards for the connected generation.

Holst Centre, imec and Cartamundi engineers will look into NFC circuit design and TFT processing options, and will investigate routes for up-scaling of the production. By realizing the NFC tags using chips based on IGZO TFT technology on plastic film, the manufacturing cost can be kept low. Moreover, the ultra-thin and flexible form factor required for paper-embedded NFC applications can be realized.

Currently, Cartamundi NV embeds silicon-based NFC chips in their game cards, connecting traditional game play with electronic devices such as smartphones and tablets. The advanced IGZO TFT technology that will be used addresses the game card industry call for much thinner, more flexible and virtually unbreakable NFC chips. Such chips are essential to improve and broaden the applicability of interactive technology for game cards, compared to the currently-used silicon based NFC chips. Next to technical specifications, this next-generation of NFC tags will better balance manufacturing cost and additional functionalities.

Chris Van Doorslaer, CEO of Cartamundi, explains: “Cartamundi is committed to creating products that connect families and friends of every generation to enhance the valuable quality time they share during the day. With Holst Centre’s and imec’s thin-film and nano-electronics expertise, we’re connecting the physical with the digital which will enable lightweight smart devices with additional value and content for consumers.”

“Not only will Cartamundi be working on the NFC chip of the future, but it will also reinvent the industry’s standards in assembly process and the conversion into game cards,” says  Steven Nietvelt, chief innovation and marketing officer at Cartamundi. “All of this is part of an ongoing process of technological innovation inside Cartamundi. I am glad our innovation engineers will collaborate with the strongest technological researchers and developers in the field at imec and Holst Centre. We are going to need all expertise on board. Because basically what we are creating is game-changing technology.”

“Imec and Holst Centre aim to shape the future and our collaboration with Cartamundi  will do so for the future of gaming technology and connected devices,” says Paul Heremans, Department Director Thin Film Electronics at imec and Technology Director at the Holst Centre. “Chip technology has penetrated society’s daily life right down to game cards. We are excited to work with Cartamundi to improve the personal experience that gaming delivers.”

Combo sensors continue their growth in a market expected to reach US$ 1.4 billion in 2019 overcoming discrete sensors. Yole Développement (Yole), the market research and strategy consulting company, proposes a deep analysis of the inertial combos for consumer application, with its new report, “6&9 Axis Sensors Consumer Inertial Combos”. According to Yole’s analysis, cellphones and tablets still drive the market but wearables will soon take their place in the landscape.

From the players’ side, Yole’s analysts announced: “The ‘big 4′ companies in inertial MEMS share 75% of the consumer inertial combos market.” They saw that STMicroelectronics (STM) lost high-end smartphone share; in parallel, a strong challenge came from InvenSense and Bosch Sensortec, who both, won Apple’s business.

STM is still the global leader in the inertial consumer sensor market with 40 percent market share. InvenSense and Bosch Sensortec hardly compete with it today. InvenSense grew strongly, reaching more than 12 percent, going ahead of Bosch in the inertial market.

“The ‘big 4,’ including AKM, are preparing for the future, with InvenSense holding an advantage as it seems to be ahead in the competition on 9-axis sensors, which are found in a large numbers of products in development, including Google Glass,” said Guillaume Girardin, Technology & Market Analyst, MEMS & Sensors at Yole Développement. “Prices are still dropping sharply, with 6-axis IMUs sold to some large volume customers at less than $1 in 2013,” he added.

To stay in the race, leaders are going to introduce technical innovations: monolithic integration of 6-axis IMUs into 9-axis IMUs, TSVs, chip scale packaging, and active capping.

Current challengers and newcomers are eyeing this combo opportunity and expect to take market share, even though the supply chain is consolidating. Kionix, Freescale, Alps Electric, Fairchild, Maxim and more than 10 other companies are targeting this market space, but the leaders are well established and competition is hard.

New business models are developing and more fabless companies are likely to be involved in the combo market. Details on newcomer technologies and roadmaps are provided in the report.

The combo sensor market is estimated at US$420 million in 2013, US$585 million in 2014, growing to US$1.4 billion in 2019. This represents 28% of the global inertial consumer market in 2014, and will grow to almost 60 percent by 2019. “While smartphones and tablets are still driving volume increases and adoption of combos, the picture should be different in 2019,” said Dr Eric Mounier, Senior Analyst, MEMS devices & Technologies at Yole. “Combo sensors will take a significant portion of total market share, but opportunities will remain for discrete sensors, from accelerometers used in basic activity trackers to gyroscopes for camera module stabilization,” he added.

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Carbonics, Inc., aims to revolutionize traditional electronics by employing earth-abundant carbon nanomaterials to vastly improve the power consumption and performance of wireless products that include next-generation smartphone and wearable devices.

The Los Angeles-based company leverages advanced carbon research conducted at UCLA and USC and is backed by a $5.5 million investment from TAQNIA International. Carbonics intends to incorporate carbon nanomaterials into semiconductor radio frequency (RF) components to reduce battery demands and increase device efficiency.

While many carbon-based nanomaterials under development are focused on semiconductors such as logic microchip processors, Carbonics technology focuses on replacing existing semiconductor RF transistor devices—ubiquitous components found in all wireless products.

“Carbonics technology will allow smartphones to be charged once a week instead of once a day, and these same devices won’t heat up in your hand,” said Carbonics CEO Kos Galatsis. “Consumers don’t want to deal with these limitations, and existing scaled semiconductor technologies need new materials and designs to improve the user experience.”

Harnessing the power of carbon

Mobile wireless, wireless infrastructure, broadband and satellite communications for consumer, defense, big data and emerging markets such as wearables, are on a growth trajectory. The driver of increased data requirements is demand for high-resolution video, VOIP (Voice Over Internet Protocol), file sharing, big-data analytics and interactive gaming.

Increased mobile traffic has created a need for RF semiconductor solutions that deliver better signal quality, higher data rates, lower noise, higher linearity and less power consumption. Carbonics technology not only offers increased power efficiency, but it also offers performance enhancements such as superior linearity across a wide bandwidth. Such capabilities enable 4G LTE (2GHz), next generation-WiFi such as WiGig (60GHz) and advanced imaging capability for biometric security (>100GHz) to operate using the same single active nanodevice transistor.

Carbonics is currently fabricating RF transistor prototypes to customer specifications, with products scheduled for manufacturing via foundry partners in the second half of 2015.

The company is made up of seasoned technologists and entrepreneurs. Galatsis is a nanotechnologist and former UCLA professor and researcher with more than a decade of experience driving semiconductor technology programs. Co-founder Hani Enaya is an energy and semiconductor technologist with experience in structured finance and international development.

Additionally, Carbonics technology is a product of university research driven by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies. Enaya is also a SRC graduate from North Carolina State University.

“SRC research has a strong track record of providing new technology for its sponsors and available for licensing for new businesses,” said Gilroy Vandentop, executive director of SRC’s STARnet program. “We are delighted to see SRC-funded researchers moving technology opportunities from the laboratory to industry.”

GigOptix, Inc., a supplier of advanced high speed semiconductor components, today announced the appointment of Darren Ma as Vice President and Chief Financial Officer, effective November 18, 2014. Mr. Ma, who joined GigOptix from the position of Controller of the Power Management and High Reliability and Systems Innovation business units with Semtech Corporation, replaces Curt Sacks who has separated from the company to pursue other interests.

“I am delighted with the addition of Darren to our executive team, as he is the perfect partner to assume the CFO position at GigOptix as the company moves to the next phase of its growth and scalability,” said Dr. Avi Katz, Chairman and Chief Executive Officer of GigOptix, Inc. “I am very impressed with Darren’s leadership, business acumen, financial expertise and understanding of the semiconductor high speed communication industry, and I’m confident that his appointment to the CFO role will provide GigOptix with solid financial leadership as well as an additional energetic business partner on our executive team.”

“Joining GigOptix as Vice President and CFO is an exceptional opportunity for me to apply my experience in the semiconductor market as a contributing member of the executive team,” said Mr. Ma. “I am pleased to be part of this growing and leading-edge technology company as we launch our plans for continued growth in 2015 and beyond.”

“I want to personally thank Curt for the many important contributions he made since joining GigOptix through the Endwave acquisition in 2011. He leaves GigOptix in a much stronger financial position and I wish him much success in the future,” said Dr. Katz.

Mr. Ma brings more than a decade of financial management and leadership experience in the semiconductor industry to GigOptix. Prior to joining GigOptix, Mr. Ma worked in roles of increasing responsibility at Semtech Corporation, most recently serving as Business Unit Controller where he led the financial performance for the Power Management and High Reliability and Systems Innovation business units. Prior to Semtech, Mr. Ma served in numerous finance roles at Intel, where he began his career, and senior finance and financial planning and analysis positions at Fisher Investments.

Mr. Ma holds a Bachelor’s in Managerial Economics, graduating with honors, from the University of California, Davis. He also received his Masters of Business Administration from Arizona State University.

The Semiconductor Industry Association (SIA) today announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman and Dr. Necip Sayiner, president, CEO and director of Intersil, as its 2015 vice chairman.

“We are excited to welcome Brian Krzanich as SIA’s 2015 chairman,” said Brian Toohey, SIA president and CEO. “His exceptional understanding of semiconductor issues and extensive industry experience make him uniquely qualified to help tackle our industry’s challenges and lead us into the future. We appreciate his many achievements and look forward to his leadership in 2015 as SIA chairman.”

Krzanich became the CEO of Intel in May 2013. He has progressed through a series of technical and leadership roles at Intel, most recently serving as the COO since January 2012. As COO, his responsibilities included leading an organization of more than 50,000 employees spanning Intel’s Technology and Manufacturing Group, Intel Custom Foundry, supply chain operations, the NAND Solutions group, human resources, information technology and Intel’s China strategy. Prior to becoming COO, Krzanich held senior leadership positions within Intel’s manufacturing organization. Krzanich began his career at Intel in 1982 in New Mexico as a process engineer.

“On the cusp of innovations such as the Internet of Things, wearable devices and smart cities, the U.S. semiconductor industry is poised for growth,” said Krzanich. “I look forward to collaborating with colleagues and policymakers to ensure that our industry reaches its full potential, continues to create jobs and keeps America at the forefront of technological advancement.”

Dr. Sayiner joined Intersil as president, CEO and director in March 2013. Prior to joining Intersil, he served as president, CEO and director of Silicon Laboratories from September 2005 to April 2012. Previously, Sayiner held various leadership positions at Agere Systems Inc., which included Executive Vice President and General Manager, Enterprise and Networking Division from August 2004 to September 2005; and Vice President and General Manager, Networking ICs Division from March 2002 to August 2004.

“Necip Sayiner has extensive industry experience and a strong technical background,” Toohey said. “His skills and leadership will be a tremendous asset to our association as we work to enact pro-innovation policies and build a stronger semiconductor industry in the U.S. We welcome him as 2015 SIA vice chairman.”

“I’m pleased to be supporting the SIA as vice chairman and helping to drive awareness of the importance of the semiconductor industry to our nation’s economic health,” said Sayiner. “Now more than ever, it is vital that we fight for government policies that promote growth and competitiveness.”

mCube, provider of the world’s smallest MEMS motion sensors, today announced the company secured three awards at last week’s MEMS Executive Congress for its significant innovations in MEMS and sensors. Based on online votes from colleagues, partners, suppliers and customers, mCube was named “MEMS Start-Up of the Year” and its leading accelerometers secured runner up for “Best MEMS/Sensor Device of the Year.” In addition, mCube’s iGyro, the industry’s first software-based gyroscope, took first place in the MEMS & Sensors Technology Showcase, where six finalists competed on stage and were voted on by conference attendees.

Named MEMS Start-Up of the Year

mCube was honored as the “MEMS Start-Up the Year” in the second annual “Best in MEMS and Sensors Innovation Awards” celebrating innovation in the MEMS and sensors industry. These awards are granted to individuals, organizations and businesses that have made a positive and substantive impact on the world through their MEMS and sensors technology, and are selected via online votes by colleagues, partners, suppliers, and customers.

mCube took first place in the 4th Annual MEMS/Sensors Technology Showcase, a live demo where six finalists competed for attendees’ votes and the title of “winner.” As part of the showcase, mCube demonstrated the industry’s first software-based gyroscope optimized for Android smartphones and tablets. By enabling “virtual” gyroscope functionality on all mobile devices, mCube’s iGyro delivers immersive, 9DoF (9 Degrees of Freedom) motion gaming and augmented reality experiences to phone and tablet users, while halving the power, cost and board space compared to hardware-based discrete solutions.

With more than 70 million units of its leading accelerometers shipped, mCube was voted runner up for the “Best MEMS/Sensor Device of the Year.” The award is granted to individuals, organizations and businesses that have impacted the world with its MEMS and sensor technology, and highlights the rapid success mCube has made since its inception in 2009.

Making a paper airplane in school used to mean trouble. Today it signals a promising discovery in materials science research that could help next-generation technology –like wearable energy storage devices- get off the ground. Researchers at Drexel University and Dalian University of Technology in China have chemically engineered a new, electrically conductive nanomaterial that is flexible enough to fold, but strong enough to support many times its own weight. They believe it can be used to improve electrical energy storage, water filtration and radiofrequency shielding in technology from portable electronics to coaxial cables.

Finding or making a thin material that is useful for holding and disbursing an electric charge and can be contorted into a variety of shapes, is a rarity in the field of materials science. Tensile strength -the strength of the material when it is stretched- and compressive strength –its ability to support weight- are valuable characteristics for these materials because, at just a few atoms thick, their utility figures almost entirely on their physical versatility.

“Take the electrode of the small lithium-ion battery that powers your watch, for example, ideally the conductive material in that electrode would be very small –so you don’t have a bulky watch strapped to your wrist- and hold enough energy to run your watch for a long period of time,” said Michel Barsoum, PhD, Distinguished Professor in the College of Engineering. “But what if we wanted to make the watch’s wristband into the battery? Then we’d still want to use a conductive material that is very thin and can store energy, but it would also need to be flexible enough to bend around your wrist. As you can see, just by changing one physical property of the material –flexibility or tensile strength- we open a new world of possibilities.”

This flexible new material, which the group has identified as a conductive polymer nanocomposite, is the latest expression of the ongoing research in Drexel’s Department of Materials Science and Engineering on a family of composite two-dimensional materials called MXenes.

This development was facilitated by collaboration between research groups of Yury Gogotsi, PhD, Distinguished University and Trustee Chair professor in the College of Engineering at Drexel, and Jieshan Qiu, vice dean for research of the School of Chemical Engineering at Dalian University of Technology in China. Zheng Ling, a doctoral student from Dalian, spent a year at Drexel, spearheading the research that led to the first MXene-polymer composites. The researchat Drexel was funded by grants from the National Science Foundation and the U.S. Department of Energy.

The Drexel team has been diligently examining MXenes like a paleontologist carefully brushing away sediment to unearth a scientific treasure. Since inventing the layered carbide material in 2011 the engineers are finding ways to take advantage of its chemical and physical makeup to create conductive materials with a variety of other useful properties.

One of the most successful ways they’ve developed to help MXenes express their array of abilities is a process, called intercalation, which involves adding various chemical compounds in a liquid form. This allows the molecules to settle between the layers of the MXene and, in doing so, alter its physical and chemical properties. Some of the first, and most impressive of their findings, showed that MXenes have a great potential for energy storage.

 

To produce the flexible conductive polymer nanocomposite, the researchers intercalated the titanium carbide MXene, with polyvinyl alcohol (PVA) –a polymer widely used as the paper adhesive known as school or Elmer’s glue, and often found in the recipes for colloids such as hair gel and silly putty. They also intercalated with a polymer called PDDA (polydiallyldimethylammonium chloride) commonly used as a coagulant in water purification systems.

“The uniqueness of MXenes comes from the fact that their surface is full of functional groups, such as hydroxyl, leading to a tight bonding between the MXene flakes and polymer molecules, while preserving the metallic conductivity of nanometer-thin carbide layers.  This leads to a nanocomposite with a unique combination of properties,” Gogotsi said.

The results of both sets of MXene testing were recently published in the Proceedings of the National Academy of Sciences. In the paper, the researchers report that the material exhibits increased ability to store charge over the original MXene; and 300-400 percent improvement in strength.

“We have shown that the volumetric capacitance of an MXene-polymer nanocomposite can be much higher compared to conventional carbon-based electrodes or even graphene,” said Chang Ren, Gogotsi’s doctoral student at Drexel. “When mixing MXene with PVA containing some electrolyte salt, the polymer plays the role of electrolyte, but it also improves the capacitance because it slightly enlarges the interlayer space between MXene flakes, allowing ions to penetrate deep into the electrode; ions also stay trapped near the MXene flakes by the polymer. With these conductive electrodes and no liquid electrolyte, we can eventually eliminate metal current collectors and make lighter and thinner supercapacitors.”

Though just a few atoms thick, the MXene-polymer nanocomposite material shows exceptional strength -especially when rolled into a tube.

 

The testing also revealed hydrophilic properties of the nanocomposite, which means that it could have uses in water treatment systems, such as membrane for water purification or desalinization, because it remains stable in water without breaking up or dissolving.

In addition, because the material is extremely flexible, it can be rolled into a tube, which early tests have indicated only serves to increase its mechanical strength. These characteristics mark the trail heads of a variety of paths for research on this nanocomposite material for applications from flexible armor to aerospace components. The next step for the group will be to examine how varying ratios of MXene and polymer will affect the properties of the resulting nanocomposite and also exploring other MXenes and stronger and tougher polymers for structural applications.

Freescale Semiconductor has been named a 2015 CES Innovation Awards Honoree for its Wearable Reference Platform (WaRP). WaRP is a community-based, Internet of Things platform offering designers unique product development flexibility in the quickly evolving consumer wearables market. It encourages design creativity by addressing key development challenges such as battery life, miniaturization, cost and usability.

Announced last night in New York City at the 2015 International CES Unveiled New York, the CES Innovation Awards is an annual competition honoring outstanding design and engineering in consumer technology products. Products entered in this prestigious program are judged by a preeminent panel of independent industrial designers, engineers and members of the trade media, to recognize cutting-edge consumer electronics products across 28 product categories.

An honoree in the Embedded Technologies category, WaRP is a flexible platform built on a hybrid architecture that enables systems designers to move from prototype to product quickly and easily for a broad range of fitness, healthcare and infotainment wearables. The system-level development kit supports embedded wireless charging, incorporates Freescale processors and sensors, and comes with open-source software, a battery and a touchscreen LCD module. WaRP is a result of collaboration among Freescale, CircuitCo, Kynetics and Revolution Robotics.

“We are proud to be among the chosen CES Innovation Honorees, and look forward to seeing many new, imaginative wearable products made possible by the WaRP platform,” said Sujata Neidig, consumer market business development manager for Freescale. “We also want to congratulate our customer and fellow awardee AMPL Labs for the creative use of Freescale technology they’ve packed into their SmartBackpack, which is a great example of adding intelligence to everyday items.”

Freescale customer AMPL Labs was named a 2015 CES Innovation Awards Honoree in the Portable Power and Computer Accessories categories. The company’s SmartBackpack provides connected, on-the-go consumers with a versatile portable charging system, advanced protection of electronics carried in the bag, and wireless connectivity with mobile devices.

Freescale’s Kinetis KL26 microcontroller enabled AMPL Labs to design the backpack’s intelligence, which monitors battery levels, controls power flow for charging devices and communicates with mobile devices using Bluetooth LE. The backpack also utilizes several Freescale sensors, including an accelerometer and pressure sensors. The Freescale Freedom Development Platform (FRDM-KL26Z) enabled AMPL Labs to prototype quickly and efficiently.

“We are honored to win this prestigious CES award and to highlight the innovative ways we are using Freescale chips, technology and tools to make common, everyday things smarter,” said Michael Patton, CEO of AMPL Labs.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today applauded a long-sought deal between the U.S. and China to expand the Information Technology Agreement (ITA), a key trade pact that promotes fair and open trade by providing for duty-free treatment of certain information and communications technology (ICT) products, including semiconductors.

Following negotiations on the sideline of the Asia-Pacific Economic Cooperation (APEC) Leaders’ meeting in Beijing, President Obama announced a bilateral agreement on the product scope of an expanded ITA that includes next generation semiconductors, static converters and inductors, and an array of technology products including medical devices, GPS devices, software media, ICT testing instruments, and others. This breakthrough bilateral agreement will enable all negotiators to return to Geneva to finalize a pluri-lateral ITA deal, with full talks targeted for December.

“The ITA has played a central role in helping the U.S. semiconductor industry drive innovation, create jobs, lower consumer prices and connect communities throughout the world,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “Today’s agreement between the U.S. and China to expand the ITA is a hard-fought victory for the U.S. semiconductor industry and a big win for the U.S. economy and consumers around the world. We look forward to all ITA countries finalizing a deal as soon as possible.”

An expanded ITA – with an estimated value of over $1.4 trillion of annual world trade – represents one of the most valuable agreements for the global high tech industry in nearly two decades. It provides the first opportunity to include newly developed products resulting from the dynamic technological developments in the information technology sector since 1996, when the ITA was originally concluded.

U.S. negotiators sought expanded coverage for new and innovative semiconductor products, including multi-component semiconductors (MCOs). MCOs comprise a growing share of the global semiconductor market, and will be key to continued growth and innovation in a vast range of downstream products, services, and sectors, providing the basis for much needed economic growth and jobs. Inclusion of MCOs in an expanded ITA would save the industry $150 to $300 million in global annual tariffs. U.S. semiconductor companies stand to benefit significantly from expanding the ITA, given that semiconductors are one of America’s top exports.

As the trend toward “smart” products continues, demand for advanced semiconductor products like MCOs has been growing consistently in the past few years and will continue to do so in the future. According to industry experts and SIA estimates, global sales of MCOs are estimated to grow by 10 percent annually over the next 5 years.

“Expanding the ITA to keep pace with the latest technologies will fuel foreign and domestic semiconductor design and manufacturing investments, reduce costs for consumers, promote exports, and strengthen overall semiconductor sector development and growth,” said Toohey. “SIA would like to extend sincere thanks to President Obama and the U.S. negotiating team for achieving this strong and successful outcome for American businesses and consumers.”