Category Archives: MEMS

IBM’s announcement that they had produced the world’s smallest computer back in March raised a few eyebrows at the University of Michigan, home of the previous champion of tiny computing.

Now, the Michigan team has gone even smaller, with a device that measures just 0.3 mm to a side—dwarfed by a grain of rice.

The reason for the curiosity is that IBM’s claim calls for a re-examination of what constitutes a computer. Previous systems, including the 2x2x4mm Michigan Micro Mote, retain their programming and data even when they are not externally powered.

Unplug a desktop computer, and its program and data are still there when it boots itself up once the power is back. These new microdevices, from IBM and now Michigan, lose all prior programming and data as soon as they lose power.

“We are not sure if they should be called computers or not. It’s more of a matter of opinion whether they have the minimum functionality required,” said David Blaauw, a professor of electrical and computer engineering, who led the development of the new system together with Dennis Sylvester, also a professor of ECE, and Jamie Phillips, an Arthur F. Thurnau Professor and professor of ECE.

In addition to the RAM and photovoltaics, the new computing devices have processors and wireless transmitters and receivers. Because they are too small to have conventional radio antennae, they receive and transmit data with visible light. A base station provides light for power and programming, and it receives the data.

One of the big challenges in making a computer about 1/10th the size of IBM’s was how to run at very low power when the system packaging had to be transparent. The light from the base station—and from the device’s own transmission LED—can induce currents in its tiny circuits.

“We basically had to invent new ways of approaching circuit design that would be equally low power but could also tolerate light,” Blaauw said.

For example, that meant exchanging diodes, which can act like tiny solar cells, for switched capacitors.

Another challenge was achieving high accuracy while running on low power, which makes many of the usual electrical signals (like charge, current and voltage) noisier.

Designed as a precision temperature sensor, the new device converts temperatures into time intervals, defined with electronic pulses. The intervals are measured on-chip against a steady time interval sent by the base station and then converted into a temperature. As a result, the computer can report temperatures in minuscule regions—such as a cluster of cells—with an error of about 0.1 degrees Celsius.

The system is very flexible and could be reimagined for a variety of purposes, but the team chose precision temperature measurements because of a need in oncology. Their longstanding collaborator, Gary Luker, a professor of radiology and biomedical engineering, wants to answer questions about temperature in tumors.

Some studies suggest that tumors run hotter than normal tissue, but the data isn’t solid enough for confidence on the issue. Temperature may also help in evaluating cancer treatments.

“Since the temperature sensor is small and biocompatible, we can implant it into a mouse and cancer cells grow around it,” Luker said. “We are using this temperature sensor to investigate variations in temperature within a tumor versus normal tissue and if we can use changes in temperature to determine success or failure of therapy.”

Even as Luker’s experiments run, Blaauw, Sylvester and Phillips look forward to what purposes others will find for their latest microcomputing device.

“When we first made our millimeter system, we actually didn’t know exactly all the things it would be useful for. But once we published it, we started receiving dozens and dozens and dozens of inquiries,” Blaauw said.

And that device, the Michigan Micro Mote, may turn out to be the world’s smallest computer even still—depending on what the community decides are a computer’s minimum requirements.

What good is a tiny computer? Applications of the Michigan Micro Mote:

  • Pressure sensing inside the eye for glaucoma diagnosis
  • Cancer studies
  • Oil reservoir monitoring
  • Biochemical process monitoring
  • Surveillance: audio and visual
  • Tiny snail studies

The study was presented June 21 at the 2018 Symposia on VLSI Technology and Circuits. The paper is titled “A 0.04mm3 16nW Wireless and Batteryless Sensor System with Integrated Cortex-M0+ Processor and Optical Communication for Cellular Temperature Measurement.”

The work was done in collaboration with Mie Fujitsu Semiconductor Ltd. Japan and Fujitsu Electronics America Inc.

Microelectrodes can be used for direct measurement of electrical signals in the brain or heart. These applications require soft materials, however. With existing methods, attaching electrodes to such materials poses significant challenges. A team at the Technical University of Munich (TUM) has now succeeded in printing electrodes directly onto several soft substrates.

Researchers from TUM and Forschungszentrum Jülich have successfully teamed up to perform inkjet printing onto a gummy bear. This might initially sound like scientists at play – but it may in fact point the way forward to major changes in medical diagnostics. For one thing, it was not an image or logo that Prof. Bernhard Wolfrum’s team deposited on the chewy candy, but rather a microelectrode array. These components, comprised of a large number of electrodes, can detect voltage changes resulting from activity in neurons or muscle cells, for example.

Researchers from the Technical University of Munich (TUM) have succeeded in printing microelectrode arrays directly onto several soft substrates. Soft materials are better suited for devices that directly measure electrical signals from organs like the brain or heart. Credit: N. Adly / TUM

Second, gummy bears have a property that is important when using microelectrode arrays in living cells: they are soft. Microelectrode arrays have been around for a long time. In their original form, they consist of hard materials such as silicon. This results in several disadvantages when they come into contact with living cells. In the laboratory, their hardness affects the shape and organization of the cells, for example. And inside the body, the hard materials can trigger inflammation or the loss of organ functionalities.

Rapid prototyping with inkjet printers

When electrode arrays are placed on soft materials, these problems are avoided. This has sparked intensive research into these solutions. Until now, most initiatives have used traditional methods, which are time-consuming and require access to expensive specialized laboratories. “If you instead print the electrodes, you can produce a prototype relatively quickly and cheaply. The same applies if you need to rework it,” says Bernhard Wolfrum, Professor of Neuroelectronics at TUM. “Rapid prototyping of this kind enables us to work in entirely new ways.”

Wolfrum and his team work with a high-tech version of an inkjet printer. The electrodes themselves are printed with carbon-based ink. To prevent the sensors from picking up stray signals, a neutral protective layer is then added to the carbon paths.

Materials for various applications

The researchers tested the process on various substrates, including PDMS (polydimethylsiloxane) – a soft form of silicon – agarose – a substance commonly used in biology experiments – and finally various forms of gelatin, including a gummy bear that was first melted and then allowed to harden. Each of these materials has properties suitable for certain applications. For example, gelatin-coated implants can reduce unwanted reactions in living tissue.

Through experiments with cell cultures, the team was able to confirm that the sensors provide reliable measurements. With an average width of 30 micrometers, they also permit measurements on a single cell or just a few cells. This is difficult to achieve with established printing methods.

“The difficulty is in fine-tuning all of the components – both the technical set-up of the printer and the composition of the ink,” says Nouran Adly, the first author of the study. “In the case of PDMS, for example, we had to use a pre-treatment we developed just to get the ink to adhere to the surface.”

Wide range of potential applications

Printed microelectrode arrays on soft materials could be used in many different areas. They are suitable not only for rapid prototyping in research, but could also change the way patients are treated. “In the future, similar soft structures could be used to monitor nerve or heart functions in the body, for example, or even serve as a pacemaker,” says Prof. Wolfrum. At present he is working with his team to print more complex three-dimensional microelectrode arrays. They are also studying printable sensors that react selectively to chemical substances, and not only to voltage fluctuations.

STMicroelectronics CEO Jean-Marc Chery and SEMI President and CEO Ajit Manocha will kick off the co-located SEMIMEMS & Sensors Industry Group’s (SEMI-MSIG’s) European MEMS & Sensors Summit 2018 and European Imaging & Sensors Summit (September 19-21 in Grenoble, France). Global technology leaders will examine the influence of megatrends, such as artificial and autonomous intelligence, hyperscale data centers, cybersecurity, authentication, human-machine interface, and virtual reality/augmented reality (VR/AR) on MEMS, sensors and imaging. Speakers will also explore new platforms, models and materials that support the performance and volume requirements of tomorrow’s MEMS, sensors and imaging devices.

In his executive keynote, NXP Semiconductors SVP/CTO Lars Reger will discuss the powerful decentralized ways that sensors allow cars to perform more human-like decision-making in autonomous driving. Mr. Reger will highlight a complex automotive ecosystem that requires both MEMS and non-MEMS sensors — as well as other electronic measurement and control systems — to advance the autonomous vehicles of today and tomorrow. CEA Leti CEO Emmanuel Sabonnadière will present on how innovation is feeding technology, providing an overview on operational excellence, innovations in technology, talent management and leadership. An additional executive keynote speaker from Renault will be announced soon.

“Our European Summits offer influential stakeholders a unique forum to explore the technological developments — and manufacturing and materials advancements — that will dramatically improve MEMS, sensors and imaging technologies — and the markets in which they play,” said Laith Altimime, president, SEMI Europe. “Whether partners, competitors, suppliers or end-customers, attendees will also benefit from mutual engagement during the exhibition and networking events that make our European Summits so unique.”

Other Highlights

  • Feature Presentations

o   Megatrends impacts on the MEMS business — Eric Mounier, Yole Développement

o   Future trends and drivers for sensors markets — Dr. Michael Alexander, Roland Berger

o   Disruption in the authentication sensor market — Manuel Tagliavini, IHS Markit

o   Image sensors technology innovations enabling market megatrends — Roberto Bez, LFoundry

o   Embracing design for manufacturing in MEMS – success and disappointment — Ian Roane, Micralyne

o   Advanced substrates for MEMS and photonic applications — Vesa-Pekka Lempinen, Okmetic Oy

o   Sensors enabling smart HMI — Christian Mandl, Infineon Technologies

o   Image and vision sensors, systems and applications for smart cities — Thierry Ligozat, Teledyne e2v

o   Trends and recent developments in 3D microscopy for biomedical applications — Michael Kempe, Carl Zeiss AG

o   AI-enabled imaging at the edge — Petronel Bigiogi, XPERI

  • MEMS and Imaging Technology Showcase — several strictly vetted companies will perform live demos of their MEMS-, imaging- or sensors-based products as they compete for audience votes.
  • Joint Show-Floor Exhibition
  • Networking events such as the welcome reception and a gala dinner held for both MEMS and Sensors and Imaging & Sensors Summit attendees
  • MEMS & Sensors Summit: stay in touch via Twitter at www.twitter.com (use #MEMSEU).
  • Imaging & Sensors Summit: stay in touch via Twitter at www.twitter.com (use #imagingEU).
  • Registration: registration is open now, with early-bird pricing available until August 17, 2018. Visit: http://www.semi.org/eu/mems-and-sensors-2018-registration

 

SEMI-MSIG’s Summits will be held at the WTC in Grenoble, France, in the heart of the French Silicon Valley (5-7 Place Robert Schuman, 38000 Grenoble, France). Premier sponsors of the Summits include: Gold Sponsors ASE Group, Presto Engineering, Inc. and SUSS MicroTec Group; Silver Sponsors Applied Materials, EV Group, LFoundry, and SPTS Technologies. Event sponsors include: JSR Micro N.V., Materion, Okmetic, and Trymax.

FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors, power and other key electronic components. SEMI-FlexTech plans to announce multiple awards to teams or organizations with research and development capability in the U.S. White paper proposals are due July 9, 2018, at 5:00 PM PDT. Review the full Request for Proposal (RFP) for more information about the submission process here.

In partnership with the U.S Army Research Laboratories (ARL), SEMI-FlexTech is seeking proposals for projects that advance heterogeneous packaging for FHE including integrated systems, system architecture and design, and integrated power management components such as batteries, supercapacitors, and energy harvesting.

SEMI-FlexTech’s Technical Council will evaluate and rank proposals, prioritize and manage projects, and administer funding. Grant recipients must match the fund award with cash and in-kind contributions to cover total project cost. Historically, grant recipients have provided, on average, more than 60 percent of project costs. A product demonstration is also required for award consideration.

“This solicitation emphasizes FHE for the Internet of Things (IoT) as we seek to advance the state of the art and incorporate thinned ICs, flexible and printed electronics, power and sensors into a flexible, conformal, low-power package,” explained Melissa Grupen-Shemansky, Executive Director and CTO of SEMI-FlexTech. “The SEMI-FlexTech program is designed to engage multi-disciplinary teams from across the supply chain to develop creative solutions that accelerate the introduction of new FHE technologies.”

SEMI-FlexTech will fund technical approaches that are revolutionary or carry high risk as well as lower-risk evolutionary approaches with shorter development and delivery timetables. SEMI-FlexTech funds research and development initiatives that fall within the U.S. government’s Technology Readiness Levels (TRLs) 3-6 and Manufacturing Readiness Levels (MRLs) 1-3.

Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies—including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless—will account for 55 percent of connectivity integrated circuit (IC) shipments in 2018, according to a new report from business information provider IHS Markit (Nasdaq: INFO). Over the next five years, wireless connectivity will play an increasingly crucial role in market segments including automotive and transportation, commercial and industrial electronics, communications, computers, consumer and medical.

“Massive IoT use cases requiring long battery life, deep coverage and mobility are fueling demand for cellular and low-power wireless,” said Julian Watson, senior principal analyst for IoT at IHS Markit. “WLAN, Bluetooth and Zigbee are already entrenched in the home automation and consumer electronics segments. And in the coming years, wireless is going to have a huge impact on industries such as healthcare, where providers will lean heavily on wireless connectivity to track and trace costly equipment across large sites and to monitor the condition of patients within domestic settings.”

The IoT opportunity is also spurring competition among wireless technologies such as Bluetooth, Wi-Fi and Long Term Evolution (LTE) and challengers like long-range wide area network (LoRaWAN), Sigfox and Thread. “The diversity of IoT use cases requires multiple technologies, and because of this we’ll see competition between technologies intensify,” Watson said. “The end result is that connectivity technologies will either compete, complement or combine—and whatever is most cost-effective will win out.”

Five connectivity technologies to watch

In its new Connectivity Technologies report, IHS Markit identifies five connectivity technologies to watch:

5G

The move to 5G will trigger significant investment across the value chain from 2020 to 2030, with $2.4 trillion in capital expenditures during this time frame. 5G will start by addressing enhanced broadband uses cases, but industry, not humans, will be the chief 5G driver. Most growth in new subscriber connections will come from industrial use cases rather than consumer markets.

Narrowband IoT (NB-IoT)

NB-IoT enables connectivity in devices used in a wide array of applications such as utilities, digital sensor monitoring, agriculture, location-based services and smart cities. Strong NB-IoT deployment in China and Europe will continue, while LTE Cat-M1 will remain dominant in the US. Asia is projected to account for 88 percent of global NB-IoT connections in 2020.

LoRa

Despite intense competition from NB-IoT, LoRa is the low-power WAN (LPWAN) technology of choice for private networks and non-traditional service providers such as cable operators due to its accessibility and differentiation. LoRa has earned a leading role in the LPWAN market, with more than 32 million nodes shipped in 2017, growing to over 57 million nodes in 2018.

Bluetooth mesh

Bluetooth’s momentum and massive installed base gives it an advantage that will be hard for incumbent technologies like Zigbee to challenge. Although it is still perceived as a consumer technology, mesh technology will allow Bluetooth to cross over into commercial and industrial applications such as lighting and building automation, with an anticipated 392 million lighting and building automation device shipments in 2022.

802.11ax

As greater numbers of Wi-Fi–enabled devices are added into homes and enterprises, the 802.11ax standard will gain more prominence in the marketplace and is expected to become the de facto Wi-Fi standard in the next decade. The 802.11ax market will grow rapidly beginning in 2020, after the Wi-Fi alliance launches a certification program. 802.11ax chipset revenue is expected to reach $855 million in 2022.

IC Insights recently released its Update to its 2018 IC Market Drivers Report.  The Update includes IC Insights’ latest outlooks on the smartphone, automotive, PC/tablet and Internet of Things (IoT) markets.

The $93.9 billion top-line projection for total IoT systems sales in 2018 remains unchanged from the original MD18 forecast released in November 2017, but dollar volumes in end-use categories were adjusted due to slight changes in expected growth rates and also because $2.5 billion in revenues were reclassified and moved from the large connected cities segment to the broad-ranging Industrial Internet group, which covers most commercial applications, including medical.  IoT systems revenues for industrial Internet applications are now forecast to grow 17.7% in 2018 to $35.9 billion, while the connected cities segment—covering government-funded infrastructure, “smart” roadways and bridges, streetlights, power grids and other utilities, public-safety video security networks, environmental and weather monitors, and other systems—is expected to increase 7.0% this year to $38.8 billion.

The strongest growth in 2018 is still expected to occur in the IoT-connected vehicle category, which is forecast to rise 21.6% this year to $4.5 billion.  IoT sales generated by connected home systems are forecast to grow 16.0% in 2018 to $2.9 billion, while the wearable category (including Internet-enabled smartwatches and medical units) is expected to rise 12.4% to $11.8 billion this year.

The report’s update lowers the projected 2016-2021 sales growth rate in three IoT end-use market categories with wearable systems going from a CAGR of 12.8% to 11.9%; connected homes applications dropping from a CAGR of 16.8% to 14.8%; and the industrial Internet segment being eased back from a CAGR of 18.7% to 17.8% in the five-year period.  The sales growth forecast in connected vehicle systems remains unchanged at a strong CAGR of 22.9% between 2016 and 2021. Automotive Internet applications are accelerating as carmakers race each other to add more automated controls and driver-assist features for greater safety and create vehicles that are aware of their locations, road conditions, and changes in weather as well as communicate with each other.   The five-year growth forecast in the connected cities category has been raised slightly, going from a CAGR of 6.3% to a 6.5% annual rate of increase in the MD18 update (Figure 1).

Figure 1

 

The MEMS pressure sensor market is still driven by automotive applications. Established automotive applications increase MEMS pressure sensors adoption in the integrating systems, and also widespread their geographical adoption especially in China thanks to new automotive regulation.
Consumer is the second pressure sensor business with new consumer applications including wearables, electronic cigarette, drones, which are giving attractive perspectives to the devices’ manufacturers.

MEMS pressure sensor technologies are basically segmented into piezoresistive and capacitive categories. Both two technologies are not hugely different in terms of performance but capacitive is limited to absolute pressure applications. Today piezoresistive is leading the industry in terms of market share, and that will probably continue in the future despite growing adoption of capacitive technology in consumer application.

To complement Yole Développement (Yole) technology & market report, MEMS Pressure Sensor Market and Technologies 2018, System Plus Consulting, part of Yole Group of Companies, has conducted a unique comparative review of pressure sensors chips, modules and TPMS.

Under this new MEMS Pressure Sensor Comparison 2018 report, the reverse engineering & costing company provides insights into the structures, technical choices, designs, processes, supply chain positions and costs of a selection of key MEMS pressure sensors. 7 consumer, 14 industrial and 13 automotive MEMS pressure sensor products from the leading suppliers are so deeply analyzed in System Plus Consulting’s study. Suppliers include All Sensors, Amphenol, APM, Bosch, Denso, First Sensor, Fuji Electric, Freescale/NXP, Honeywell, Infineon, Melexis, Merit SensorSystems, Mitsubishi Electric, Nagano Keiki, Sensata, Sensirion, SMI and STMicroelectronics.

The MEMS pressure sensors comparison from System Plus Consulting points out the diversity of devices and related technologies, which are a characteristic of this industry. All manufacturing process flows and cost reviews are detailed in this report to highlight the technical choices made by each player, according to the market segments.

“In this new analysis, we identified lot of different manufacturing processes”, comments Audrey Lahrach, Cost Engineer at System Plus Consulting. “Indeed MEMS pressure devices’ packaging and pressure range differ widely according to application.”

System Plus Consulting’s report includes multiple comparisons based on physical analyses of 34 MEMS pressure sensor components. It offers buyers and device manufacturers the unique possibility of understanding MEMS pressure sensor technology evolution, and comparing product costs.

Yole releases today its annual MEMS technology & market analysis: Status of the MEMS Industry. This 2018 edition presents the MEMS device market along with key industry changes and trends. The market research and strategy consulting company is following the MEMS industry for a while, tracking more than 200 applications and 300 MEMS companies. This report is a significant combination all of these applications into more than 15 major MEMS devices. This 15th version includes: global macro economical megatrends and their impact on MEMS and sensors business – MEMS and sensors market forecast – manufacturers rankings – analysis by device and application.

“MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period,” reported Dr. Eric Mounier, Principal Analyst, MEMS & Photonics, at Yole Développement (Yole). “The consumer market segment is showing the biggest share, with more than 50% . The good news is that almost all MEMS devices will contribute to this growth.”

 

However, the RF industry is still playing a key role in the MEMS industry development. Excluding RF, the MEMS market will grow at 9% over 2018 – 2023. With RF MEMS devices, CAGR reaches 17.5% during the same period. Driven by the complexities associated with the move to 5G and the higher number of bands it brings, there is an increasing demand for RF filters in 4G/5G, making RF MEMS (mainly BAW filters) the largest-growing MEMS segment.

Amongst the numerous existing MEMS devices, inkjet heads will grow, with the consumer market representing more than 70% of printhead market demand. This market recorded its first signs of recovery in the first half of 2017, a trend confirmed in the second half of the year. This recovery was noticed both in disposable and fixed printheads. Most consumer players show discernable growth: for example, HP has recorded a 2% growth in consumer printer revenue since 2016, and Canon has confirmed a progression in sales for inkjet printers, with strong demand in Asia.

Numerous pressure sensor applications also contribute to market expansion. Indeed, it is interesting to see that, although it is one of the oldest MEMS technologies, pressure sensor keeps growing. In automotive, pressure sensors have the highest number of applications, with many advantages such resistance to toxic exhaust gas and harsh environments, higher accuracy, and the development of intelligent tires that deliver more information on tire status (especially for future autonomous cars). For consumer, mobiles and smartphones still account for 90% of pressure sensor sales, and cost reduction is the priority vs. size reduction because size is already very small. Although there are no big “killer” applications expected in the future, new applications are emerging: smart homes, electronic cigarette, drones, and wearables, to name several. (1)

Then after, are coming the MEMS microphones. Such MEMS components have been in the spotlight for a long time and have expressed one of the highest CAGRs of any MEMS technology over the last five years. “In the range of US$105 million in 2008, the MEMS microphone market was worth US$402 million in 2012 and reached the US$1 billion milestone in 2016”, asserts Guillaume Girardin, Director of the Photonics, Sensing and Display division at Yole. “Currently, almost 4.5 billion units are shipped annually. The main application is mobile phones, which comprise 85% of shipment volumes, in a consumer market that makes up 98% of the total shipment volume. Tablets and PCs/laptops take second and third place, with 5% and 3.2% of total shipment volumes, respectively.” (2)

Step by step, the uncooled IR imager market keeps growing. This is due to a continuous price decrease over the last few years stemming from new technologies such as WLP and silicon lenses, as well as increasing acceptance from customers. As prices continue falling, we believe the market for uncooled IR imaging technology will continue finding new applications in the coming years. More results will be detailed during the 3rd Executive Infrared Imaging Forum, powered by Yole and taking place on September 7 in Shenzhen, China: Full program

All MEMS market segments including inertial, optical MEMS, microfluidics, new micro components and more … are deeply analyzed in Yole’s annual MEMS report, Status of the MEMS Industry. A full description of this technology & market analysis is available in the MEMS & Sensor reports section, on i-micronews.com.

In this new edition, Yole’s team is also analyzing the market positioning of the MEMS device manufacturers and their annual revenue. What is the status of the 2017 Top MEMS manufacturers? 
• In 2017, the biggest surprise was Broadcom becoming the #1 MEMS player. As growth continues for RF, driven by an increasing number of filters/phones and by the front-end module’s increasing value, it is likely that RF players will still dominate the top 2018 rankings. 
• In parallel, most MEMS players showed positive growth in 2016 – 2017. Established players, Robert Bosch, STMicroelectronics and HP were “shaken” by Broadcom’s growth but still performed well. For example, the German leader, Robert Bosch enjoyed growth of approximately US$100 million. Inkjet heads players also had a good overall performance compared to previous years. In addition, the company, SiTime displayed the most impressive growth, exceeding 100%. Other MEMS players posting significant growth are: FormFactor, benefiting from the semiconductor business’s excellent health; and ULIS, with uncooled IR imaging still growing annually into multiple applications including consumer – thermography, firefighting, night vision, smartphones, drones, and military.

In 2016, the top 30 MEMS players totaled more than US$9,238 million. In 2017, that number increased to US$9,881 million.

 

Infrared spectroscopy is the benchmark method for detecting and analyzing organic compounds. But it requires complicated procedures and large, expensive instruments, making device miniaturization challenging and hindering its use for some industrial and medical applications and for data collection out in the field, such as for measuring pollutant concentrations. Furthermore, it is fundamentally limited by low sensitivities and therefore requires large sample amounts.

However, scientists at EPFL’s School of Engineering and at Australian National University (ANU) have developed a compact and sensitive nanophotonic system that can identify a molecule’s absorption characteristics without using conventional spectrometry.

The authors show a pixelated sensor metasurface for molecular spectroscopy. It consists of metapixels designed to concentrate light into nanometer-sized volumes in order to amplify and detect the absorption fingerprint of analyte molecules at specific resonance wavelengths. Simultaneous imaging-based read-out of all metapixels provides a spatial map of the molecular absorption fingerprint sampled at the individual resonance wavelengths. This pixelated absorption map can be seen as a two-dimensional barcode of the molecular fingerprint, which encodes the characteristic absorption bands as distinct features of the resulting image. Credit: EPFL

Their system consists of an engineered surface covered with hundreds of tiny sensors called metapixels, which can generate a distinct bar code for every molecule that the surface comes into contact with. These bar codes can be massively analyzed and classified using advanced pattern recognition and sorting technology such as artificial neural networks. This research – which sits at the crossroads of physics, nanotechnology and big data – has been published in Science.

Translating molecules into bar codes

The chemical bonds in organic molecules each have a specific orientation and vibrational mode. That means every molecule has a set of characteristic energy levels, which are commonly located in the mid-infrared range – corresponding to wavelengths of around 4 to 10 microns. Therefore, each type of molecule absorbs light at different frequencies, giving each one a unique “signature.” Infrared spectroscopy detects whether a given molecule is present in a sample by seeing if the sample absorbs light rays at the molecule’s signature frequencies. However, such analyses require lab instruments with a hefty size and price tag.

The pioneering system developed by the EPFL scientists is both highly sensitive and capable of being miniaturized; it uses nanostructures that can trap light on the nanoscale and thereby provide very high detection levels for samples on the surface. “The molecules we want to detect are nanometric in scale, so bridging this size gap is an essential step,” says Hatice Altug, head of EPFL’s BioNanoPhotonic Systems Laboratory and a coauthor of the study.

The system’s nanostructures are grouped into what are called metapixels so that each one resonates at a different frequency. When a molecule comes into contact with the surface, the way the molecule absorbs light changes the behavior of all the metapixels it touches.

“Importantly, the metapixels are arranged in such a way that different vibrational frequencies are mapped to different areas on the surface,” says Andreas Tittl, lead author of the study.

This creates a pixelated map of light absorption that can be translated into a molecular bar code – all without using a spectrometer.

The scientists have already used their system to detect polymers, pesticides and organic compounds. What’s more, their system is compatible with CMOS technology.

“Thanks to our sensors’ unique optical properties, we can generate bar codes even with broadband light sources and detectors,” says Aleksandrs Leitis, a coauthor of the study.

There are a number of potential applications for this new system. “For instance, it could be used to make portable medical testing devices that generate bar codes for each of the biomarkers found in a blood sample,” says Dragomir Neshev, another coauthor of the study.

Artificial intelligence could be used in conjunction with this new technology to create and process a whole library of molecular bar codes for compounds ranging from protein and DNA to pesticides and polymers. That would give researchers a new tool for quickly and accurately spotting miniscule amounts of compounds present in complex samples.

Imec today announced at the International Microwave Symposium (IMS, Philadelphia, USA), the world’s first CMOS 140GHz radar-on-chip system with integrated antennas in standard 28nm technology. The achievement is an important step in the development of radar-based sensors for a myriad of smart intuitive applications, such as building security, remote health monitoring of car drivers, breathing and heart rate of patients, and gesture recognition for man-machine interaction.

Radars are extremely promising as sensors for contactless, non-intrusive interaction in internet-of-things applications such as people detection & classification, vital signs monitoring and gesture interfacing. A wide adoption will only be possible if radars achieve a higher resolution, become much smaller, more power-efficient to run, and cheaper to produce and to buy. This is what imec’s research on 140GHz radar technology targets.

This low-power 140GHz radar solution comprises an imec proprietary two antenna SISO (Single Input Single Output) radar transceiver chip and a frequency modulated continuous wave phase-locked loop (FMCW PLL), off-the shelf ADCs and FPGA and a Matlab chain. The transceiver features on-chip antennas achieving a gain close to 3dBi. The excellent radar link budgets are supported thanks to the transmitter Effective Isotropic Radiated Power (EIRP)  that exceeds 9dBm and a receiver noise figure below 6.4dB. The total power consumption for transmitter and receiver remains below 500mW, which can be further reduced by duty cycling. The FMCW PLL  enables  fast slopes up to 500MHz/ms over a 10GHz bandwidth around 140GHz with a slope linearity error below 0.5% and has a power consumption below 50mW. The FPGA contains real-time implementation of basic radar processing functions such as FFTs (Fast Fourier Transforms) and filters, and is complemented by a Matlab chain for detections, CFAR (Constant False Alarm Rate), direction-of-arrival estimation and other advanced radar processing.

“With our prototype radar, we have demonstrated all critical specs for radar technology in 28nm standard CMOS technology,” said Wim Van Thillo, IoT program director at imec. “We are well advanced in incorporating multiple antenna paths in our most recent generation solution, which will enable a fine angular resolution of 1.5cm in a complete MIMO radar form factor of only a few square centimeters. We expect this prototype in the lab by the end of 2018, at which point our partners can start building their application demonstrators. First applications are expected to be person detection and classification for smart buildings, remote car driver vital signs monitoring (as cars evolve towards self-driving vehicles), and gesture recognition for intuitive man-machine interactions. Plenty more innovations will be enabled by this technology, once app developers start working with it.”

This imec 140GHz radar open innovation R&D collaborative program has been endorsed by Panasonic, and imec invites potential interested parties to join.