Category Archives: MEMS

Driven by the need for intelligent connected devices in industrial and commercial applications, the number of connected Internet of Things (IoT) devices globally will grow to more than 31 billion in 2018, according to new analysis from business information provider IHS Markit (Nasdaq: INFO). The commercial and industrial sector, powered by building automation, industrial automation and lighting, is forecast to account for about half of all new connected devices between 2018 and 2030.

“The IoT is not a recent phenomenon, but what is new is it’s now working hand in hand with other transformative technologies like artificial intelligence and the cloud,” said Jenalea Howell, research director for IoT connectivity and smart cities at IHS Markit. “This is fueling the convergence of verticals such as industrial IoT, smart cities and buildings, and the connected home, and it’s increasing competitiveness.”

In its latest IoT Trend Watch report, IHS Markit identifies four key drivers and the trends that will impact the IoT this year and beyond:

Innovation and competitiveness

  • The IoT opportunity has attracted numerous duplicative and overlapping wireless solutions such as Bluetooth, Wi-Fi, 5G, NB-IoT, LoRa and Sigfox. Standards consolidation lies ahead, but confusion and fragmentation will dominate in the near term.
  • Enterprises are leveraging the location of data as a competitive advantage — and as a result, a hybrid approach to cloud and data center management is taking hold. More and more companies will employ both on-premises data centers and off-premises cloud services to manage their IT infrastructure.

Business models

  • 5G builds upon earlier investments in M2M (machine-to-machine) and traditional IoT applications, enabling significant increases in economies of scale that drive adoption and utilization across all sectors of industry. Improved low-power requirements, the ability to operate on licensed and unlicensed spectrum, and better coverage will drive significantly lower costs across the IoT.
  • Cellular IoT gateways, which facilitate WAN connectivity, will be integral to edge computing deployments. 2018 will bring increased focus on compute capabilities and enhanced security for cellular IoT gateways.

Standardization and security

  • Cybersecurity is a leading concern for IoT adopters. IoT deployments face critical cybersecurity risks because there are potentially many more IoT devices to secure compared to traditional IT infrastructure devices, presenting increased risk to traditional communications and computing systems, as well as physical health and safety.
  • Despite the promise it holds, blockchain — a technology for securely storing and transferring data — is not a panacea. Initially, IoT applications for blockchain technology will focus on asset tracking and management.

Wireless technology innovation

  • IoT platforms are becoming more integrated. Currently, there are more than 400 IoT platform providers. Many vendors are using integration to compete more effectively, providing highly integrated functionality for IoT application developers and adopters.
  • Significant innovation will occur when IoT app developers can leverage data from myriad deployed sensors, machines and data stores. A key inflection point for the IoT will be the gradual shift from the current “Intranets of Things” deployment model to one where data can be exposed, discovered, entitled and shared with third-party IoT application developers.

IHS Markit provides insight and analysis for more than 25 connectivity technologies in 34 application segments used for the IoT.

Microprocessors, which first appeared in the early 1970s as 4-bit computing devices for calculators, are among the most complex integrated circuits on the market today.  During the past four decades, powerful microprocessors have evolved into highly parallel multi-core 64-bit designs that contain all the functions of a computer’s central processing unit (CPU) as well as a growing number of system-level functions and accelerator blocks for graphics, video, and emerging artificial intelligence (AI) applications.  MPUs are the “brains” of personal computers, servers, and large mainframes, but they can also be used for embedded processing in a wide range of systems, such as networking gear, computer peripherals, medical and industrial equipment, cars, televisions, set-top boxes, video-game consoles, wearable products and Internet of Things applications.  The recently released 2018 edition of IC Insights’ McClean Report shows that the fastest growing types of microprocessors in the last five years have been mobile system-on-chip (SoC) designs for tablets and data-handling cellphones and MPUs used in embedded-processing applications (Figure 1).

Figure 1

Figure 1

The McClean Report also forecasts that 52% of 2018 MPU sales will come from sales of all types of microprocessors used as CPUs in standard PCs, servers, and large computers.  As shown in Figure 2, only about 16% of MPU sales are expected from embedded applications in 2018, with the rest coming from mobile application processors used in tablets (4%) and cellphones (28%).  Cellphone and tablet MPUs exclude baseband processors, which handle modem transmissions in cellular networks and are counted in the wireless communications segment of the special-purpose logic IC product category. A little over half of 2018 microprocessor sales are expected to come from x86 MPUs for computer CPUs sold by Intel and rival Advanced Micro Devices.

Figure 2

Figure 2

Cellphone and tablet SoC processors were the main growth drivers in microprocessors during the first half of this decade, but slowdowns have hit both of these MPU categories since 2015.  Market saturation and the maturing of the smartphone segment have stalled unit growth in cellular handsets.  Cellphone application processor shipments were flat in 2016 and 2017 and are forecast to rise just 0.3% in 2018 to reach a record high of nearly 1.8 billion units in the year.

The microprocessor business continues to be dominated by the world’s largest IC maker, Intel (Samsung was the world’s largest semiconductor supplier in 2017). Intel’s share of total MPU sales had been more than 75% during most of the last decade, but that percentage is now slightly less than 60% because of stronger growth in cellphones and tablets that contain ARM-based SoC processors.  For nearly 20 years, Intel’s huge MPU business for personal computers has primarily competed with just one other major x86 processor supplier—AMD—but increases in the use of smartphones and tablets to access the Internet for a variety of applications has caused a paradigm shift in personal computing, which is often characterized as the “Post-PC era.”

This year, AMD looks to continue its aggressive comeback effort in x86-based server processors that it started in 2017 with the rollout of highly parallel MPUs built with the company’s new Zen microarchitecture. Intel has responded by increasing the number of 64-bit x86 CPUs in its Xeon processors. Intel, AMD, Nvidia, Qualcomm, and others are also increasing emphasis of processors and co-processor accelerators for machine-learning AI in servers, personal computing platforms, smartphones and embedded processing.

The 2018 McClean Report shows that the total MPU market is forecast to rise 4% to $74.5 billion in 2018, following market growth of 5% in 2017 and 9% in 2016.  Through 2022, total MPU sales are expected to increase at a compound annual growth rate of 3.4%.  Total microprocessor units are expected to rise 2% in 2018, the same growth rate as 2017, to 2.6 billion units.  Through the forecast period, total MPU units are forecast to rise by a CAGR of 2.1%.

When it comes to processing power, the human brain just can’t be beat.

Packed within the squishy, football-sized organ are somewhere around 100 billion neurons. At any given moment, a single neuron can relay instructions to thousands of other neurons via synapses — the spaces between neurons, across which neurotransmitters are exchanged. There are more than 100 trillion synapses that mediate neuron signaling in the brain, strengthening some connections while pruning others, in a process that enables the brain to recognize patterns, remember facts, and carry out other learning tasks, at lightning speeds.

Researchers in the emerging field of “neuromorphic computing” have attempted to design computer chips that work like the human brain. Instead of carrying out computations based on binary, on/off signaling, like digital chips do today, the elements of a “brain on a chip” would work in an analog fashion, exchanging a gradient of signals, or “weights,” much like neurons that activate in various ways depending on the type and number of ions that flow across a synapse.

In this way, small neuromorphic chips could, like the brain, efficiently process millions of streams of parallel computations that are currently only possible with large banks of supercomputers. But one significant hangup on the way to such portable artificial intelligence has been the neural synapse, which has been particularly tricky to reproduce in hardware.

Now engineers at MIT have designed an artificial synapse in such a way that they can precisely control the strength of an electric current flowing across it, similar to the way ions flow between neurons. The team has built a small chip with artificial synapses, made from silicon germanium. In simulations, the researchers found that the chip and its synapses could be used to recognize samples of handwriting, with 95 percent accuracy.

The design, published today in the journal Nature Materials, is a major step toward building portable, low-power neuromorphic chips for use in pattern recognition and other learning tasks.

The research was led by Jeehwan Kim, the Class of 1947 Career Development Assistant Professor in the departments of Mechanical Engineering and Materials Science and Engineering, and a principal investigator in MIT’s Research Laboratory of Electronics and Microsystems Technology Laboratories. His co-authors are Shinhyun Choi (first author), Scott Tan (co-first author), Zefan Li, Yunjo Kim, Chanyeol Choi, and Hanwool Yeon of MIT, along with Pai-Yu Chen and Shimeng Yu of Arizona State University.

Too many paths

Most neuromorphic chip designs attempt to emulate the synaptic connection between neurons using two conductive layers separated by a “switching medium,” or synapse-like space. When a voltage is applied, ions should move in the switching medium to create conductive filaments, similarly to how the “weight” of a synapse changes.

But it’s been difficult to control the flow of ions in existing designs. Kim says that’s because most switching mediums, made of amorphous materials, have unlimited possible paths through which ions can travel — a bit like Pachinko, a mechanical arcade game that funnels small steel balls down through a series of pins and levers, which act to either divert or direct the balls out of the machine.

Like Pachinko, existing switching mediums contain multiple paths that make it difficult to predict where ions will make it through. Kim says that can create unwanted nonuniformity in a synapse’s performance.

“Once you apply some voltage to represent some data with your artificial neuron, you have to erase and be able to write it again in the exact same way,” Kim says. “But in an amorphous solid, when you write again, the ions go in different directions because there are lots of defects. This stream is changing, and it’s hard to control. That’s the biggest problem — nonuniformity of the artificial synapse.”

A perfect mismatch

Instead of using amorphous materials as an artificial synapse, Kim and his colleagues looked to single-crystalline silicon, a defect-free conducting material made from atoms arranged in a continuously ordered alignment. The team sought to create a precise, one-dimensional line defect, or dislocation, through the silicon, through which ions could predictably flow.

To do so, the researchers started with a wafer of silicon, resembling, at microscopic resolution, a chicken-wire pattern. They then grew a similar pattern of silicon germanium — a material also used commonly in transistors — on top of the silicon wafer. Silicon germanium’s lattice is slightly larger than that of silicon, and Kim found that together, the two perfectly mismatched materials can form a funnel-like dislocation, creating a single path through which ions can flow.

The researchers fabricated a neuromorphic chip consisting of artificial synapses made from silicon germanium, each synapse measuring about 25 nanometers across. They applied voltage to each synapse and found that all synapses exhibited more or less the same current, or flow of ions, with about a 4 percent variation between synapses — a much more uniform performance compared with synapses made from amorphous material.

They also tested a single synapse over multiple trials, applying the same voltage over 700 cycles, and found the synapse exhibited the same current, with just 1 percent variation from cycle to cycle.

“This is the most uniform device we could achieve, which is the key to demonstrating artificial neural networks,” Kim says.

Writing, recognized

As a final test, Kim’s team explored how its device would perform if it were to carry out actual learning tasks — specifically, recognizing samples of handwriting, which researchers consider to be a first practical test for neuromorphic chips. Such chips would consist of “input/hidden/output neurons,” each connected to other “neurons” via filament-based artificial synapses.

Scientists believe such stacks of neural nets can be made to “learn.” For instance, when fed an input that is a handwritten ‘1,’ with an output that labels it as ‘1,’ certain output neurons will be activated by input neurons and weights from an artificial synapse. When more examples of handwritten ‘1s’ are fed into the same chip, the same output neurons may be activated when they sense similar features between different samples of the same letter, thus “learning” in a fashion similar to what the brain does.

Kim and his colleagues ran a computer simulation of an artificial neural network consisting of three sheets of neural layers connected via two layers of artificial synapses, the properties of which they based on measurements from their actual neuromorphic chip. They fed into their simulation tens of thousands of samples from a handwritten recognition dataset commonly used by neuromorphic designers, and found that their neural network hardware recognized handwritten samples 95 percent of the time, compared to the 97 percent accuracy of existing software algorithms.

The team is in the process of fabricating a working neuromorphic chip that can carry out handwriting-recognition tasks, not in simulation but in reality. Looking beyond handwriting, Kim says the team’s artificial synapse design will enable much smaller, portable neural network devices that can perform complex computations that currently are only possible with large supercomputers.

“Ultimately we want a chip as big as a fingernail to replace one big supercomputer,” Kim says. “This opens a stepping stone to produce real artificial hardware.”

This research was supported in part by the National Science Foundation.

Silicon chips from STMicroelectronics (NYSE: STM) have enabled new zForce AIR(TM) touch-sensing modules from Neonode (NASDAQ: NEON), the optical sensor technology company.

Neonode’s compact, low-power, and easy-to-use modules add touch interaction to any USB- or I2C-connected object and work with any type of display or surface, including steel, wood, plastic, glass, skin, or even nothing, able to detect touch interactions in mid-air. The innovative approach uses laser-generated infrared light to track touch or gesture control, combining millimeter precision with ultra-fast response. The non-visible-spectrum light doesn’t impact display quality, add glare, or shift colors.

The new Neonode family of touch-sensors uses a programmable mixed-signal custom System-on-Chip (SoC) and an STM32 Arm® Cortex® microcontroller from ST for scanning laser diodes and IR beams to determine the exact position and movements of fingers, hands, or other reflective objects in the light path. Multiple objects can be tracked simultaneously and interpreted as touches or gestures with extreme accuracy: the coordinates are relayed up to 500 times per second with virtually zero delay.

“ST’s leading-edge chip-design capabilities and manufacturing processes have enabled us to build an innovative, high-performance optical-sensor system that is highly complex yet cost-competitive,” said Andreas Bunge, CEO of Neonode. “The advanced mixed-signal SoC and STM32 microcontroller at the heart of our new zForce AIR modules deliver the right combination of touch-control precision in real-time, low power consumption, and configurability.”

“This innovative sensing technology can make any object, surface, or space touch- interactive, bringing complete freedom of design,” said Iain Currie, Vice President North Europe Sales, STMicroelectronics. “Neonode’s decision to use ST technologies confirms our enabling role in the development of advanced applications that break new ground in man-machine interaction.”

Now available for immediate shipment worldwide through Digi-Key Electronics, the zForce AIR(TM) Touch Sensor modules will be displayed on ST’s stand at Embedded World 2018 (February 27 – March 1, Nuremberg).

Leti, a research institute at CEA Tech, has invented a lens-free microscope technology that provides point-of-care diagnosis for spinal meningitis. Outlined in a paper presented at Photonics West, the new technology provides immediate results and eliminates errors in counting white blood cells (leukocytes) in cerebrospinal fluid, which is required to diagnose the infection.

Spinal meningitis is an acute inflammation of the membranes covering the brain and spinal cord, which can be fatal within 24 hours. Until now, early diagnosis of the infection required an operator using an optical microscope to manually count white blood cells in cerebrospinal fluid.

“Until now, this process has been operator dependent, which limits where it can be used and increases the likelihood of errors in counting blood cells,” said Sophie NhuAn Morel, a co-author of the paper. “In our study, manual counts produced different results among five doctors.”

The bulky equipment and intensive human involvement, which can take 5-20 minutes to make a proper cell counting, make the traditional procedure unsuited for point-of-care diagnosis. As a result, meningitis cannot be diagnosed in emergencies or operating rooms, or during routine medical care in developing countries.

Reported in a paper titled “Lens-free Microscopy of Cerebrospinal Fluid for the Laboratory Diagnosis of Meningitis”, Leti’s lens-free, operator-free technology requires fewer than 10 microliters of cerebrospinal fluid to differentiate between white blood cells (leukocytes) and red blood cells (erythrocytes) in a point-of-care environment, using very small equipment.

“Leti’s lens-free technology can count leukocytes and erythrocytes almost in real-time and can be used in many different environments outside the lab,” Morel said.

The lens-free microscope was tested on 200 patients at Marseille Timone Hospital in France to detect or confirm spinal meningitis. A blind lens-free microscopic analysis of 116 cerebrospinal fluid specimens, including six cases of microbiologicallyconfirmed infectious meningitis, yielded a 100 percent sensitivity and a 79 percent specificity. Adapted lens-free microscopy is thus emerging as an operator-independent technique for rapidly counting leukocytes and erythrocytes in cerebrospinal fluid. In particular, this technique is well suited to the rapid diagnosis of meningitis at point-of-care labs.

In the near future, the reconstruction of both the magnitude and phase images from the raw diffraction pattern will allow the classification and numeration of all the blood cells in less than two minutes.

Leti, a technology research institute at CEA Tech, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry.

The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensors.

Ultimately, the researchers believe their device design – a combination of a carbon nanotube antenna and diode rectifier – could compete with conventional photovoltaic technologies for producing electricity from sunlight and other sources. The same technology used in the rectennas could also directly convert thermal energy to electricity.

Georgia Tech researchers have developed a new higher efficiency rectenna design. Here, the device’s ability to convert blue light to electricity is tested. (Credit: Christopher Moore, Georgia Tech)

Georgia Tech researchers have developed a new higher efficiency rectenna design. Here, the device’s ability to convert blue light to electricity is tested. (Credit: Christopher Moore, Georgia Tech)

“This work takes a significant leap forward in both fundamental understanding and practical efficiency for the optical rectenna device,” said Baratunde Cola, an associate professor in the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. “It opens up this technology to many more researchers who can join forces with us to advance the optical rectenna technology to help power a range of applications, including space flight.”

The research was reported January 26 in the journal Advanced Electronic Materials. The work has been supported by the U.S. Army Research Office under the Young Investigator Program, and by the National Science Foundation.

Optical rectennas operate by coupling the light’s electromagnetic field to an antenna, in this case an array of multiwall carbon nanotubes whose ends have been opened. The electromagnetic field creates an oscillation in the antenna, producing an alternating flow of electrons. When the electron flow reaches a peak at one end of the antenna, the diode closes, trapping the electrons, then re-opens to capture the next oscillation, creating a current flow.

The switching must occur at terahertz frequencies to match the light. The junction between the antenna and diode must provide minimal resistance to electrons flowing through it while open, yet prevent leakage while closed.

“The name of the game is maximizing the number of electrons that get excited in the carbon nanotube, and then having a switch that is fast enough to capture them at their peak,” Cola explained. “The faster you switch, the more electrons you can catch on one side of the oscillation.”

To provide a low work function – ease of electron flow – the researchers initially used calcium as the metal in their oxide insulator – metal diode junction. But calcium breaks down rapidly in air, meaning the device had to be encapsulated during operation – and fabricated in a glovebox. That made the optical rectenna both impractical for most applications and difficult to fabricate.

So Cola, NSF Graduate Research Fellow Erik Anderson and Research Engineer Thomas Bougher replaced the calcium with aluminum and tried a variety of oxide materials on the carbon nanotubes before settling on a bilayer material composed of alumina (Al2O3) and hafnium dioxide (HfO2). The combination coating for the carbon nanotube junction, created through an atomic deposition process, provides the quantum mechanical electron tunneling properties required by engineering the oxide electronic properties instead of the metals, which allows air stable metals with higher work functions than calcium to be used.

Rectennas fabricated with the new combination have remained functional for as long as a year. Other metal oxides could also be used, Cola said.

The researchers also engineered the slope of the hill down which the electrons fall in the tunneling process. That also helped increase the efficiency, and allows the use of a variety of oxide materials. The new design also increased the asymmetry of the diodes, which boosted efficiency.

“By working with the oxide electron affinity, we were able to increase the asymmetry by more than ten-fold, making this diode design more attractive,” said Cola. “That’s really where we got the efficiency gain in this new version of the device.”

Optical rectennas could theoretically compete with photovoltaic materials for converting sunlight into electricity. PV materials operate using a different principle, in which photons knock electrons from the atoms of certain materials. The electrons are collected into electrical current.

In September 2015 in the journal Nature Nanotechnology, Cola and Bougher reported the first optical rectenna – a device that had been proposed theoretically for more than 40 years, but never demonstrated.

The early version reported in the journal produced power at microvolt levels. The rectenna now produces power in the millivolt range and conversion efficiency has gone from 10-5 to 10-3 – still very low, but a significant gain.

“Though there still is room for significant improvement, this puts the voltage in the range where you could see optical rectennas operating low-power sensors,” Cola said. “There are a lot of device geometry steps you could take to do something useful with the optical rectenna today in voltage-driven devices that don’t require significant current.”

Cola believes the rectennas could be useful for powering internet of things devices, especially if they can be used to produce electricity from scavenged thermal energy. For converting heat to electricity, the principle is the same as for light – capturing oscillations in a field with the broadband carbon nanotube antenna.

“People have been excited about thermoelectric generators, but there are many limitations on getting a system that works effectively,” he said. “We believe that the rectenna technology will be the best approach for harvesting heat economically.”

In future work, the research team hopes to optimize the antenna operation, and improve their theoretical understanding of how the rectenna works, allowing further optimization. One day, Cola hopes the devices will help accelerate space travel, producing power for electric thrusters that will boost spacecraft.

“Our end game is to see carbon nanotube optical rectennas working on Mars and in the spacecraft that takes us to Mars,” he said.

This work was supported by the Army Research Office under the Young Investigator Program agreement W911NF-13-1-0491 and the National Science Foundation Graduate Research Fellowship program under grant DGE-1650044. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the sponsoring organizations.

The worldwide race to create more, better and reliable quantum processors is progressing fast, as a team of TU Delft scientists led by Professor Vandersypen has realised yet again. In a neck-and-neck race with their competitors, they showed that quantum information of an electron spin can be transported to a photon, in a silicon quantum chip. This is important in order to connect quantum bits across the chip and allowing to scale up to large numbers of qubits. Their work was published today in the journal Science.

The quantum computer of the future will be able to carry out computations far beyond the capacity of today's computers. Credit: TU Delft

The quantum computer of the future will be able to carry out computations far beyond the capacity of today’s computers. Credit: TU Delft

The quantum computer of the future will be able to carry out computations far beyond the capacity of today’s computers. Quantum superpositions and entanglement of quantum bits (qubits) make it possible to perform parallel computations. Scientists and companies worldwide are engaged in creating increasingly better quantum chips with more and more quantum bits. QuTech in Delft is working hard on several types of quantum chips.

Familiar material

The core of the quantum chips is made of silicon. “This is a material that we are very familiar with,” explains Professor Lieven Vandersypen of QuTech and the Kavli Institute of Nanoscience Delft, “Silicon is widely used in transistors and so can be found in all electronic devices.” But silicon is also a very promising material for quantum technology. PhD candidate Guoji Zheng: “We can use electrical fields to capture single electrons in silicon for use as quantum bits (qubits). This is an attractive material as it ensures the information in the qubit can be stored for a long time.”

Large systems

Making useful computations requires large numbers of qubits and it is this upscaling to large numbers that is providing a challenge worldwide. “To use a lot of qubits at the same time, they need to be connected to each other; there needs to be good communication”, explains researcher Nodar Samkharadze. At present the electrons that are captured as qubits in silicon can only make direct contact with their immediate neighbours. Nodar: “That makes it tricky to scale up to large numbers of qubits.”

Neck-and-neck race

Other quantum systems use photons for long-distance interactions. For years, this was also a major goal for silicon. Only in recent years have various scientists made progress on this. The Delft scientists have now shown that a single electron spin and a single photon can be coupled on a silicon chip. This coupling makes it possible in principle to transfer quantum information between a spin and a photon. Guoji Zheng: “This is important to connect distant quantum bits on a silicon chip, thereby paving the way to upscaling quantum bits on silicon chips.”

On to the next step

Vandersypen is proud of his team: “My team achieved this result in a relatively short time and under great pressure from worldwide competition.” It is a true Delft breakthrough: “The substrate is made in Delft, the chip created in the Delft cleanrooms, and all measurements carried out at QuTech,” adds Nodar Samkharadze. The scientists are now working hard on the next steps. Vandersypen: “The goal now is to transfer the information via a photon from on electron spin to another.”

Accurately measuring electric fields is important in a variety of applications, such as weather forecasting, process control on industrial machinery, or ensuring the safety of people working on high-voltage power lines. Yet from a technological perspective, this is no easy task.

In a break from the design principle that has been followed by all other measuring devices to date, a research team at TU Wien has now developed a silicon-based sensor as a microelectromechanical system (MEMS). Devised in conjunction with the Department for Integrated Sensor Systems at Danube University Krems, this sensor has the major advantage that it does not distort the very electric field it is currently measuring. An introduction to the new sensor has also been published in the electronics journal “Nature Electronics”.

Tiny new sensor -- compared to a one-cent-coin. Credit: TU Wien

Tiny new sensor — compared to a one-cent-coin. Credit: TU Wien

Distorting measuring devices

“The equipment currently used to measure electric field strength has some significant downsides,” explains Andreas Kainz from the Institute of Sensor and Actuator Systems (Faculty of Electrical Engineering, TU Wien). “These devices contain parts that become electrically charged. Conductive metallic components can significantly alter the field being measured; an effect that becomes even more pronounced if the device also has to be grounded to provide a reference point for the measurement.” Such equipment also tends to be relatively impractical and difficult to transport.

The sensor developed by the team at TU Wien is made from silicon and is based on a very simple concept: small, grid-shaped silicon structures measuring just a few micrometres in size are fixed onto a small spring. When the silicon is exposed to an electric field, a force is exerted on the silicon crystals, causing the spring to slightly compress or extend.

These tiny movements now need to be made visible, for which an optical solution has been designed: an additional grid located above the movable silicon grid is lined up so precisely that the grid openings on one grid are concealed by the other. When an electric field is present, the movable structure moves slightly out of perfect alignment with the fixed grid, allowing light to pass through the openings. This light is measured, from which the strength of the electric field can be calculated by an appropriately calibrated device.

Prototype achieves impressive levels of precision

The new silicon sensor does not measure the direction of the electric field, but its strength. It can be used for fields of a relatively low frequency of up to one kilohertz. “Using our prototype, we have been able to reliably measure weak fields of less than 200 volts per metre,” says Andreas Kainz. “This means our system is already performing at roughly the same level as existing products, even though it is significantly smaller and much simpler.” And there is still a great deal of potential for improvement, too: “Other methods of measurement are already mature approaches – we are just starting out. In future it will certainly be possible to achieve even significantly better results with our microelectromechanical sensor,” adds Andreas Kainz confidently.

Imec today announced that it will demonstrate its very first shortwave infrared (SWIR) range hyperspectral imaging camera at next week’s SPIE Photonics West in San Francisco. The SWIR range provides discriminatory information on all kinds of materials, paving the way to hyperspectral imaging applications in food sorting, waste management, machine vision, precision agriculture and medical diagnostics. Imec’s SWIR camera integrates CMOS-based spectral filters together with InGaAs-based imagers, thus combining the compact and low-cost capabilities of CMOS technology with the spectral range of InGaAs.

Semiconductor CMOS-based hyperspectral imaging filters, as designed and manufactured by imec for the past five years, have been utilized in a manner where they are integrated monolithically onto silicon-based CMOS image sensors, which has a sensitivity range from 400 – 1000 nm visible and near-IR (VNIR) range. However, it is expected that more than half of commercial multi and hyperspectral imaging applications need discriminative spectral data in the 1000 – 1700 nm SWIR range.

“SWIR range is key for hyperspectral imaging as it provides extremely valuable quantitative information about water, fatness, lipid and protein content of organic and inorganic matters like food, plants, human tissues, pharmaceutical powders, as well as key discriminatory characteristics about plastics, paper, wood and many other material properties,” commented Andy Lambrechts, program manager for integrated imaging activities at imec. “It was a natural evolution for imec to extend its offering into the SWIR range while leveraging its core capabilities in optical filter design and manufacturing, as well as its growing expertise in designing compact, low-cost and robust hyperspectral imaging system solutions to ensure this complex technology delivers on its promises.”

Imec’s initial SWIR range hyperspectral imaging cameras feature both linescan ‘stepped filter’ designs with 32 to 100 or more spectral bands, as well as snapshot mosaic solutions enabling the capture of 4 to 16 bands in real-time at video-rate speeds. Cameras with both USB3.0 and GIGE interface are currently in the field undergoing qualification with strategic partners.

“The InGaAs imager industry is at a turning point,” explained Jerome Baron, business development manager of integrated imaging and vision systems at imec. “As the market recognizes the numerous applications of SWIR range hyperspectral imaging cameras beyond its traditional military, remote sensing and scientific niche fields, the time is right for organizations such as imec to enable compact, robust and low-cost hyperspectral imaging cameras in the SWIR range too. Imec’s objectives will be to advance this offering among the most price sensitive volume markets for this technology which include food sorting, waste management and recycling, industrial machine vision, precision agriculture and medical diagnostics.”

The first SWIR range hyperspectral imaging cameras will be demonstrated through Feb. 1 at SPIE Photonics West, booth #4321 in the North Hall of Moscone center in San Francisco.

By Jay Chittooran, Manager, Public Policy, SEMI

International trade is one of the best tools to spur growth and create high-skill and high-paying jobs. Over 40 million American jobs rely on trade, and this is particularly true in the semiconductor supply chain. Over the past three decades, the semiconductor industry has averaged nearly double-digit growth rates in revenue and, by 2030, the semiconductor supply chain is forecast to reach $1 trillion. Trade paves the way for this growth.

Unfortunately, despite its importance to the industry, trade has been transformed from an economic issue into a political one, raising many new trade challenges to companies throughout the semiconductor industry.

GHz-ChinaChina’s investments in the industry will continue to anchor the country as a major force in the semiconductor supply chain. China’s outsized spending has spawned concern among other countries about the implications of these investments. According to SEMI’s World Fab Forecast, 20 fabs are being built in China – and construction on 14 more is rumored to begin in the near term – compared to the 10 fabs under construction in the rest of the world. China is clearly outpacing the pack.

The Trump Administration has levied intense criticism of China, citing unfair trade practices, especially related to intellectual property issues. The U.S. Trade Representative has launched a Section 301 investigation into whether China’s practice of forced technology transfer has discriminated against U.S. consumers. Even as the probe unfolds, expectations are growing that the United States will take action against China, raising fears of not only possible retaliation in time but rising animosity between two trading partners that rely deeply on each other.

A number of other open investigations also cloud the future. The Administration launched two separate Section 232 investigations into steel and aluminum industry practices by China, claiming Chinese overproduction of both items are a threat to national security. The findings from these investigations will be submitted to the President, who, in the coming weeks, will decide an appropriate response, which could include imposing tariffs and quotas.

Another high priority area is Korea. While U.S. threats to withdraw from the U.S.-Korea Free Trade Agreement (KORUS) reached a fever pitch in August, rhetoric has since tempered. Informal discussions between the countries on how best to amend the trade deal are ongoing. The number of KORUS implementation issues aside, continued engagement with Korea – instead of scrapping a comprehensive, bilateral trade deal – will be critically important for the industry.

Lastly, negotiations to modernize the North American Free Trade Agreement (NAFTA) will continue this year. The United States wants to conclude talks by the end of March, but with the deadline fast approaching and the promise of resolution waning, tensions are running high. Notably, the outcome of the NAFTA talks will inform and set the tone for other trade action.

What’s more, a number of other actions on trade will take place this year. As we wrote recently, Congress has moved to reform the Committee on Foreign Investment in the United States (CFIUS), a government body designed to review sales and transfer of ownership of U.S. companies to foreign entities. Efforts have also started to revise the export control regime – a key component to improving global market access and making international trade more equitable.

SEMI will continue its work on behalf of its members around the globe to open up new markets and lessen the burden of regulations on cross-border trade and commerce. In addition, SEMI will continue to educate policymakers on the critical importance of unobstructed trade in continuing to push the rapid advance of semiconductors and the emerging technologies they enable into the future. If you are interested in more information on trade, or how to be involved in SEMI’s public policy program, please contact Jay Chittooran, Manager, Public Policy, at [email protected].