Category Archives: MEMS

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter. Sales for the month of September 2017 were $36.0 billion, an increase of 22.2 percent over the September 2016 total of $29.4 billion and 2.8 percent more than the previous month’s total of $35.0 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

highest ever sales

“Global semiconductor sales increased sharply year-to-year in September, and year-to-date sales through September are more than 20 percent higher than at the same point last year,” said John Neuffer, SIA president and CEO. “The industry posted its highest-ever quarterly sales in Q3, and the global market is poised to reach its highest-ever annual revenue in 2017.”

Regionally, year-to-year and month-to-month sales increased in September across all markets: the Americas (40.7 percent year-to-year/5.9 percent month-to-month), China (19.9 percent/2.5 percent), Europe (19.0 percent/1.8 percent), Asia Pacific/All Other (16.8 percent/1.9 percent), and Japan (11.9 percent/0.5 percent).

“The Americas market continued to stand out, notching its largest year-to-year sales increase in more than seven years,” Neuffer said. “Standouts among semiconductor product categories included memory products like DRAM and NAND flash, both of which posted major year-to-year growth in September, as well as Logic products, which enjoyed double-digit growth year-to-year.”

FlexTech, a SEMI Strategic Association Partner announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag, incorporating a thin audio speaker. The product is aimed at applications in packaging, wearables prosthetics, soft robotics, smart tags, and smart cities and homes.

PARC will use ink jet printing to build prototypes of the paper-like smart tags capable of producing audio signals, on a silver-printed polyethylene naphthalene (PEN) or polyimide (PI) substrate. They will develop and demonstrate a process for bonding chips, and printing active and passive components, as well as interconnects on the flexible substrate, essential in meeting the project goals for ruggedness and form factor. PARC will also focus on printing actuators to create thin film audio speakers. The technology will enable custom systems to be built on demand.

“Over the last 15 years PARC has been a pioneer in the exciting field of printed electronics.  We are pleased to continue our collaboration with SEMI-FlexTech in a project which takes advantage of the wide range of expertise on the PARC staff,” said Bob Street, project technical lead at PARC. “This new project is technically challenging because it combines a number of novel technologies needed to achieve stringent requirements, including the capability for a thin, paper-like film to produce clear speech audio.  We are looking forward to the challenge and implications for commercial products.”

In 2014, FlexTech awarded PARC with a project grant to develop printed sensors. Partly because of this work, it is now possible to print transistor circuits in a fully additive fashion, and to combine these with sensors, actuators and other electronic components.

“We have had a long, fruitful relationship with PARC and look forward to excellent results from this project which clearly advances innovation in flexible, printable electronics, enabling solutions that lead to safer, healthier lives,” said Melissa Grupen-Shemansky, CTO at SEMI-FlexTech. “In addition to pushing the boundaries in electronics, PARC pays attention to manufacturability and affordability, ensuring developments are scalable from R&D to production.”

PARC and SEMI-FlexTech staff envisage additive manufacturing delivering intelligence into electronics fabricated on demand, including smart packaging and wearable devices in conformal shapes. At the heart of this development are material science, novel printing technologies as well as process driven design that will deliver libraries of smart components and systems. The constituent “inks” of this technology are nanomaterials, molecular semiconductors, inorganic composites and silicon chiplets that together form circuits, sensors, light emitters, batteries, and more, integrated directly into products of all shapes, sizes and textures.

FlexTech’s R&D program is supported by the U.S. Army Research Laboratory (ARL), based in Adelphi, MD.

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 – 2022.

Under this dynamic context, Yole Group of Companies including Yole and its sister company System Plus Consulting proposes today a comprehensive review of the technology evolution, market trends and competitive landscape, with two reports, MEMS Packaging and MEMS Packaging: Reverse Technology Review.

The MEMS packaging report offers a deep understanding of the packaging over the years, detailed roadmap for future solutions, related market metrics and detailed analysis of the supply chain. In parallel, the MEMS Packaging: Reverse Technology Review details a comparative technology review and discloses insights into the packaging structure and technology of 80+ consumer and 20+ automotive MEMS devices developed by leading players: Robert Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…

The MEMS packaging market is becoming more and more attractive, offering important business opportunities for advanced packaging companies. What are the market needs? What are the conditions to penetrate this market? Are the technologies “ready to use”? Through its analyses, Yole Group believes that companies which will be successful, are the ones that will adapt their technologies portfolio to match with the market evolution and ensure their market shares. Yole and System Plus Consulting’s analysts put a spotlight today on MEMS packaging.

MEMS devices are characterized by a wide range of different designs and manufacturing technologies, with no standardized processes. As a consequence, many technical challenges are in place and create a strong competition between packaging companies.

“Players have to take into account specifies of each component as well as many application constraints, from the need to low cost packaging for consumer applications to the ability to withstand high temperature and harsh environment for automotive and aeronautics packaging,” explained Dr. Eric Mounier, Senior Technology & Market Analylst at Yole.

MEMS application scope is broad, very fragmented and diversified. Therefore, under its annual report, Status of the MEMS Industry, Yole’s MEMS & Sensors team analyzed more than 200+ applications. Thus, MEMS packaging must always cope with different end-application requirements. It includes for example, protection in different media, hermeticity, interconnection type, and thermal management. This context creates many issues within the packaging industry, which faces different package configurations (open/ closed package).

Under System Plus Consulting’s report, MEMS Packaging: Reverse Technology Review, the company analyzed more than 100 MEMS components developed by the major manufacturers. This review is a relevant comparison between the main existing packaging solutions. It includes the encapsulation processes, the preferred interconnection methods as well as the latest innovations. System Plus Consulting also evaluated the components in term of integration and functionalities.

“No tremendous changes in packaging platforms are expected,” commented Audrey Lahrach, in charge of costing analyses at System Plus Consulting.“But we rather see a change in the complexity of existing platforms to respond to the growing needs of sensor fusions.” Therefore, combining inertial and pressure sensors is now a reality. For example TDK/InvenSense released this month a high-performance “7-Axis” motion tracking device targeting drone applications and based on an exclusive assembly step stacking the 3-axis gyroscope, the 3-axis accelerometer and a barometric pressure sensor (1).

Driven by the complexity associated with the move to 5G and therefore the increasing demand for RF filters in 4G/5G, the largest MEMS growth will be for RF MEMS, especially BAW filters (2).
“The real opportunity of MEMS packaging is carried by RF MEMS devices as the number of units could be multiplied by five by 2022,” confirmed Dr. Mounier from Yole. Optical MEMS including micro mirrors and micro bolometers are second with a 28.5% CAGR, driven by consumer, automotive, and security applications.

Acoustic and ultrasonic sensors including microphones are third. Demand for audio processing is particularly strong, with high unit growth for MEMS microphones targeted at increasingly sophisticated applications that use the microphone to continuously sense what is happening around it.

But why is the MEMS packaging industry becoming so attractive? Yole identified several reasons:
“OSATs already have very low package margins due to fierce competition” asserted Emilie Jolivet, Technology & Market Analyst at Yole. And she added: “And it will be difficult for such companies to lower the cost further.”

The second factor is related to the importance of testing steps. Because every MEMS is different, testing strategies defined by MEMS devices manufacturers are usually dedicated to one device type and account for a significant fraction of the final cost.

The third reason is focused on the packaging’s material cost that is playing a key role within the attractiveness of the MEMS packaging business.

At the end, the strong CAGR of certain devices such as RF MEMS devices, also directly impacts the MEMS packaging industry with numerous opportunities to ensure larger volumes and better margins.

More than a dozen product categories in optoelectronics, sensors and actuators, and discretes semiconductors (O-S-D) are on track to set record-high annual sales this year, according to a new update of IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discrete Semiconductors.  Driven by the expansion of the Internet of Things (IoT), increasing levels of intelligent embedded controls, and some inventory replenishment in commodity discretes, the diverse O-S-D marketplace is having a banner year with combined sales across all three semiconductor segments expected to grow 10.5% in 2017 to a record-high $75.0 billion, says the O-S-D Report update.

In 2017, above average sales growth rates are being achieved in all but one major O-S-D product category—lamp devices, which are now expected to be flat in 2017 because of continued price erosion in light-emitting diodes (LEDs) for solid-state lighting applications.  Figure 1 compares annual growth rates in five major O-S-D product categories, based on the updated 2017 sales projection.

Figure 1

Figure 1

For the first time since 2014, all three O-S-D market segments are on pace to see sales growth in 2017. Moreover, 2017 is expected to be the first year since 2011 when all three O-S-D market segments set record-high annual sales volumes, according to IC Insights’ update.

The 2017 double-digit percent increase will be the highest growth rate for combined O-S-D sales since the strong 2010 recovery from the 2009 semiconductor downturn that coincided with the 2008-2009 financial crisis and global economic recession.  Total O-S-D revenues are now forecast to reach a ninth consecutive annual record high level of $80.5 billion in 2018, which will be a 7.4% increase from 2017 sales, says the O-S-D Report update.

After a rare decline of 3.6% in 2016, optoelectronics is recovering this year with sales now projected to grow 8.1% in 2017 to an all-time high of $36.7 billion, thanks to strong double-digit sales increases in CMOS image sensors (+22%), light sensors (+19%), optical-network laser transmitters (+15%), and infrared devices (+14%).

Meanwhile, record-high revenues for sensors and actuators are being fueled by the expansion of IoT and new automated controls in a wide range of systems—including more self-driving features in cars. Sensors/actuator sales are now expected to climb 17.5% in 2017 to $13.9 billion, marking the strongest growth year for this market segment since 2010.  Sales of sensors and actuators made with microelectromechanical systems (MEMS) technology are forecast to rise by 18.5% in 2017 to a record-high $11.6 billion.  The O-S-D Report update shows all-time high sales being reached in 2017 with strong double-digit growth in actuators (+20%), pressure sensor, including MEMS microphone chips (+18%), and acceleration/yaw sensors (+17%).

Even the commodity-filled discretes market is thriving in 2017 with worldwide sales projected to rise 10.3% to $24.1 billion, which will finally surpass the current peak of $23.4 billion set in 2011.  Sales of power transistors, which account for more than half of the discretes market segment, are forecast to grow 9.0% in 2017 to a record-high $14.0 billion, according to the new O-S-D Report update.

NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas. The company will showcase its new contactless fingerprint-on-card solution while also demonstrating a new world benchmark for payment card transactions speeds.

Fingerprint sensors on payment cards

The fingerprint-on-card solution gives payment network operators and banks a secure, convenient and fast payment card option to consumers. Coupling dual interface cards with an integrated fingerprint sensor enables faster transactions without the need for end-users to enter a PIN number.

“The result provides a secure and dramatically more convenient way for consumers to make payments. The convenience provided by mobile payment in today’s NFC-based mobile wallets can now be replicated with cards. It is also ideal for use in other form factors and applications such as electronic passports,” said Rafael Sotomayor, senior vice president and general manager of secure transactions and identification business. “The breakthrough reinforces NXP’s commitment to the payment and secure identification space by helping our customers deliver next-generation applications and solutions to the market.”

To ensure a lower barrier of entry for card makers, the company’s secure fingerprint authentication solution on cards does not require a battery and easily fits into standard card maker equipment as part of the broader payment ecosystem. Cards with fingerprint authentication are fully compliant with existing EMVCo point-of-sales (POS) systems.

New Benchmark for Blazing Transaction Speeds

Demonstrating seamless, fast, and smart card transaction experiences, the NXP high-performance platform makes it possible to achieve M/Chip transactions speeds of <200 ms, surpassing the industry requirement of 300 ms.

“This increased level of performance offers flexibility to add new features or higher crypto countermeasures and still meet current industry transaction requirement,” said Sotomayor. “The requirement for faster payment transaction will continue, and NXP is committed to providing the performance to meet these needs and make contactless transactions faster and flawless.”

NXP Demonstrations at Money 20/20 Las Vegas 2017

NXP will demonstrate these technology breakthroughs at its exclusive reception on October 24, 2017, in The Venetian.

Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, and Knowles Corporation (NYSE: KN), jointly announced today that Microsemi has entered into a definitive agreement to acquire the high performance timing business of Vectron International, a Knowles company, for $130 million.

Vectron is a world leader in the design, manufacture and marketing of frequency control, sensor and hybrid solutions using the very latest techniques in both bulk acoustic wave (BAW) and surface acoustic wave (SAW)-based designs from DC to microwave frequencies. Products include crystals and crystal oscillators; frequency translators; clock and data recovery products; SAW filters; SAW oscillators; crystal filters; SAW and BAW based sensors and components used in telecommunications, data communications, frequency synthesizers, timing, navigation, military, aerospace, medical and instrumentation systems.

“Microsemi is focused on building the industry’s most comprehensive portfolio of high value timing solutions,” said James J. Peterson, Microsemi’s chairman and CEO. “Vectron’s highly complementary technology suite expands our product offering with differentiated technology and allows Microsemi to sell more to its tier one customers in the aerospace and defense, communications and industrial markets while improving upon the operating performance of the combined model as we execute on significant synergy opportunities.”

Microsemi expects the acquisition to be immediately accretive once closed.  The transaction is subject to customary closing conditions and is currently expected to close in Microsemi’s fiscal first quarter ending December 2017.

As of this date, Microsemi remains comfortable with its July 28, 2017 non-GAAP guidance for its fourth fiscal quarter of 2017 ended Oct. 1, 2017. Microsemi currently intends to announce its fourth fiscal quarter results on Nov. 9, 2017.

The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit (Nasdaq: INFO).

In a new free ebook entitled “The Internet of Things: a movement, not a market,” IHS Markit details how the IoT is revolutionizing the competitive landscape by transforming everyday business practices and opening new windows of opportunity.

According to the ebook, global data transmissions are expected to increase from 20 to 25 percent annually to 50 percent per year, on average, in the next 15 years.

“The emerging IoT movement is impacting virtually all stages of industry and nearly all market areas — from raw materials to production to distribution and even the consumption of final goods,” said Jenalea Howell, research director for IoT connectivity and smart cities at IHS Markit. “This represents a constantly evolving movement of profound change in how humans interact with machines, information and even each other.”

IHS Markit has identified four foundational, interconnected pillars at the core of the IoT movement: connect, collect, compute and create. The entire IoT is built upon these four innovational pillars:

  • New connections of devices and information
  • Enhanced collection of data that grows from the connections of devices and information
  • Advanced computation that transforms collected data into new possibilities
  • Unique creation of new interactions, business models and solutions.

“While internet-connected devices hold tremendous potential, many companies are having difficulty identifying a consistent IoT strategy,” Howell said. “The four Cs of IoT — connect, collect, compute, create — offer a pathway to navigate and take advantage of the changes and opportunities brought about by the IoT revolution.”

The process of extracting natural gas from the earth or transporting it through pipelines can release methane into the atmosphere. Methane, the primary component of natural gas, is a greenhouse gas with a warming potential approximately 25 times larger than carbon dioxide, making it very efficient at trapping atmospheric heat energy. A new chip-based methane spectrometer, that is smaller than a dime, could one day make it easier to monitor for efficiency and leaks over large areas.

Scientists from IBM Thomas J. Watson Research Center in Yorktown Heights, NY, developed the new methane spectrometer, which is smaller than today’s standard spectrometers and more economical to manufacture. In Optica, The Optical Society’s journal for high impact research, the researchers detail the new spectrometer and show that it can detect methane in concentrations as low as 100 parts-per-million.

Low maintenance, high impact

The spectrometer is based on silicon photonics technology, which means it is an optical device made of silicon, the material used to make computer chips. Because the same high-volume manufacturing methods used for computer chips can be applied to make the chip-based methane spectrometer, the spectrometer along with a housing and a battery or solar power source might cost as little as a few hundred dollars if produced in large quantities.

“Compared with a cost of tens of thousands of dollars for today’s commercially available methane-detecting optical sensors, volume-manufacturing would translate to a significant value proposition for the chip spectrometer,” said William Green, leader of the IBM Research team. “Moreover, with no moving parts and no fundamental requirement for precise temperature control, this type of sensor could operate for years with almost no maintenance.”

Such low-cost, robust spectrometers could lead to exciting new applications. For example, the IBM team is working with partners in the oil and gas industry on a project that would use the spectrometers to detect methane leaks, saving companies the time and money involved in trying to find and fix leaks using in-person inspection of thousands of sites.

“During natural gas extraction and distribution, methane can leak into the air when equipment on the well malfunctions, valves get stuck, or there’s a crack in the pipeline,” said Green. “We’re developing a way to use this spectrometer-on-a-chip to create a network of sensors that could be distributed over a well pad, for example. Data from these sensors would be processed with IBM’s physical analytics software to automatically pinpoint the location of a leak as well as quantify the leak magnitude.”

Methane is a trace gas, the classification given to gases that make up less than 1 percent of the volume of Earth’s atmosphere. Although the researchers demonstrated methane detection, the same approach could be used for sensing the presence of other individual trace gases. It could also be used to detect multiple gases simultaneously.

“Our long-term vision is to incorporate these types of sensors into the home and things people use every day such as their cell phones or vehicles. They could be useful for detecting pollution, dangerous carbon monoxide levels or other molecules of interest,” said Eric Zhang, a member of the research team. “Because this spectrometer offers a platform for multispecies detection, it could also one day be used for health monitoring through breath analysis.”

Shrinking the spectrometer

The new device uses an approach known as absorption spectroscopy, which requires laser light at the wavelength uniquely absorbed by the molecule being measured. In a traditional absorption spectroscopy setup, the laser travels through the air, or free-space, until it reaches a detector. Measuring the light that reaches the detector reveals how much light was absorbed by the molecules of interest in the air and can be used to calculate the concentration of them present.

The new system uses a similar approach, but instead of a free-space setup, the laser travels through a narrow silicon waveguide that follows a 10-centimeter-long serpentine pattern on top of a chip measuring 16 square millimeters. Some of the light is trapped inside the waveguide while about 25 percent of the light extends outside of the silicon into the ambient air, where it can interact with trace gas molecules passing nearby the sensor waveguide. The researchers used near infrared laser light (1650 nanometer wavelength) for methane detection.

To increase the sensitivity of the device, the investigators carefully measured and controlled factors that contribute to noise and false absorption signals, fine-tuned the spectrometer’s design and determined the waveguide geometrical parameters that would produce favorable results.

Side-by-side comparison

To compare the new spectrometer’s performance with that of a standard free-space spectrometer, they placed the devices into an environmental chamber and released controlled concentrations of methane. The researchers found that the chip-based spectrometer provided accuracy on-par with the free-space sensor despite having 75 percent less light interacting with the air compared to the free-space design. Furthermore, the fundamental sensitivity of the chip sensor was quantified by measuring the smallest discernable change in methane concentration, showing performance comparable to free-space spectrometers developed in other laboratories.

“Although silicon photonics systems — especially those that use refractive index changes for sensing — have been explored previously, the innovative part of our work was to use this type of system to detect very weak absorption signals from small concentrations of methane, and our comprehensive analysis of the noise and minimum detection limits of our sensor chip,” said Zhang.

The current version of the spectrometer requires light to enter and exit the chip via optical fibers. However, the researchers are working to incorporate the light source and detectors onto the chip, which would create an essentially electrical device with no fiber connections required. Unlike current free-space sensors, the chip then does not require special sample or optical preparation. Next year, they plan to start field testing the spectrometers by placing them into a larger network that includes other off-the-shelf sensors.

“Our work shows that all of the knowledge behind silicon photonics manufacturing, packaging, and component design can be brought into the optical sensor space, to build high-volume manufactured and, in principle, low cost sensors, ultimately enabling an entirely new set of applications for this technology,” said Green.

Piezoelectric materials are used for applications ranging from the spark igniter in barbeque grills to the transducers needed by medical ultrasound imaging. Thin-film piezoelectrics, with dimensions on the scale of micrometers or smaller, offer potential for new applications where smaller dimensions or a lower voltage operation are required.

Researchers at Pennsylvania State University have demonstrated a new technique for making piezoelectric microelectromechanical systems (MEMS) by connecting a sample of lead zirconate titanate (PZT) piezoelectric thin films to flexible polymer substrates. Doctoral candidate Tianning Liu and her co-authors report their results this week in the Journal of Applied Physics, from AIP Publishing.

Electroded thin-film PZT on a flexible polyimide substrate of relatively large area. Credit: Tianning Liu

Electroded thin-film PZT on a flexible polyimide substrate of relatively large area. Credit: Tianning Liu

“There’s a rich history of work on piezoelectric thin films, but films on rigid substrates have limitations that come from the substrate,” said Thomas N. Jackson, a professor at Penn State and one of the paper’s authors. “This work opens up new areas for thin-film piezoelectrics that reduce the dependence on the substrate.”

The researchers grew polycrystalline PZT thin films on a silicon substrate with a zinc oxide release layer, to which they added a thin layer of polyimide. They then used acetic acid to etch away the zinc oxide, releasing the 1-micrometer thick PZT film with the polyimide layer from the silicon substrate. The PZT film on polyimide is flexible while possessing enhanced material properties compared to the films grown on rigid substrates.

Piezoelectric devices rely on the ability of some substances like PZT to generate electric charges when physically deformed, or inversely to deform when an electric field is applied to them. Growing high-quality PZT films, however, typically requires temperatures in excess of 650 degrees Celsius, almost 300 degrees hotter than what polyimide is able to withstand without degrading.

Most current piezoelectric device applications use bulk materials, which hampers miniaturization, precludes significant flexibility, and necessitates high-voltage operation.

“For example, if you’re looking at putting an ultrasound transducer in a catheter, a PZT film on a polymer substrate would allow you to wrap the transducer around the circumference of the catheter,” Liu said. “This could allow for significant miniaturization, and should provide more information for the clinician.”

The performance of many piezoelectric thin films has been limited by substrate clamping, a phenomenon in which the rigid substrate constrains the movement of the piezoelectric material’s domain walls and degrades its properties. Some work has been done crystallizing PZT at temperatures that are compatible with polymeric materials, for example using laser crystallization, but results thus far have led to porous thin films and inferior material properties.

The released thin films on polyimide that the researchers developed had a 45 percent increase in remanent polarization over silicon substrate controls, indicating a substantial mitigation in substrate clamping and improved performance. Even then, Liu said, much work remains before thin-film MEMS devices can compete with bulk piezoelectric systems.

“There’s still a big gap between putting PZT on thin film and bulk,” she said. “It’s not as big as between bulk and substrate, but there are also things like more defects that contribute to the lower response of the thin-film materials.”

Today, SEMI announced that SEMICON Japan, the exposition for the electronics manufacturing supply chain in Japan, will focus on smart applications as key drivers of the electronics industry. Over 30,000 attendees are expected to convene at SEMICON Japan at Tokyo Big Sight in Tokyo on December 13-15. Registration for the exhibition and programs is now open.

Both on the exhibition floors and in sessions, smart applications will be featured, including Smart Automotive, Smart Manufacturing, Smart MedTech and the Internet of Things (IoT), bringing the theme, “Dreams Start Here” to life.

Smart Automotive – On the show floor, Toyota and Tesla will share new Smart Automotive technologies. Two dedicated forums on Smart Automotive will be featured at SEMICON Japan:

  • IoT Key Technology Forum: Companies, including Nissan Motors, NVIDIA andHitachi Automotive Systems will share their perspectives on the future of Smart Automotive.
  • Smart Mobility Forum: The technologies shaping our future mobile society, including autonomous bus systems, robot cars and drones, are featured.

Smart Manufacturing – The Smart Manufacturing Forum will share the latest on advanced  manufacturing lines from two Japanese solution providers ─ Fuji Machine Manufacturing and Yokogawa Electric. On the exhibition floor, Peer Group, Siemens and Yokogawa Electric will showcase the technologies and products.

Smart MedTech – The Smart Healthcare Forum will feature the Internet Association Japan and Hitachi who will explore the development of medical electronics and the latest technologies and solutions brought by IoT and AI. On the show floor, companies providing key enabling technologies for wearable devices including JINS, Toyobo and YUASA Systems will exhibit in the Flexible Hybrid Electronics area.

WORLD OF IOT – Many of the above exhibits on smart applications and their enabling technologies will be located at the WORLD OF IOT, a technology showcase highlighting the companies, products, technologies, and applications enabling the IoT revolution. WORLD OF IOT will have more than 70 exhibitors including Fujitsu, Hitachi, IBM, Micron, Nokia, Panasonic, Soft Bank and Sony. SEMICON Japan also features two sessions on IoT technologies:

  • IoT Global Trends Forum: Executives from leading technology companies, including Arm, Intel and Sony, will discuss the technology development needed to reach a smarter and more connected world.
  • IoT Connectivity Forum: Presentations by wireless communication technology companies Ericsson and NTT Docomo on next-generation technology including 5G and LPWA, needed to accelerate the Industrial IoT and Smart Manufacturing.

 

All about Drones – SEMICON Japan will also present “All about Drones”─a spotlight on drones, a growing application of sensor and actuator technologies. A tear-down drone exhibit, drone lectures, and a demonstration area will allow visitors fly drones.

Osamu Nakamura, president of SEMI Japan said, “With all these exhibits and sessions, the semiconductor manufacturing supply chain will intersect with the growing application markets, technologies and players to find new opportunities for collaboration, innovation and growth. That’s why ‘Dreams Start Here’ at SEMICON Japan.”

For more information on the SEMICON Japan exposition and programs, visit http://www.semiconjapan.org/en.