Category Archives: MEMS

ClassOne Technology, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates, has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand.

“We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt. “Most of these users are now focusing on capabilities they couldn’t get before, like wafer-level packaging and More than Moore technologies.”

Witt explained that wafer-level packaging (WLP) has been used for some time with 300mm and larger substrates — but the equipment has not been available for 200mm. “Fortunately, ClassOne focuses specifically on the smaller-wafer markets,” said Witt. “At a very affordable price, we deliver the new technology and advanced 3D features they’re looking for. For example, our Solstice® line of multifunctional electroplating systems enables high-efficiency Cu Through Silicon Via (TSV), Pillar, Bump and Barrier Plating and other capabilities that WLP requires. And that’s one major reason they’re coming to us.”

ClassOne reports that many of the new buyers are keenly interested in More than Moore (MtM) technologies to increase functionality while reducing cost per device. They are producing compound semiconductors, LEDs, MEMS, RF, Wi-Fi and a range of IoT-related sensors and other devices. ClassOne cites the combination of ≤200mm-specific tools, advanced capabilities and affordable pricing as the primary driver behind the current equipment-buying surge in emerging markets.

ClassOne Technology offers a selection of new-technology wet processing tools designed for 75mm to 200mm wafer users. These include three different models of Solstice electroplating systems for production and development as well as the Trident families of Spin-Rinse-Dryers and Spray Solvent Tools. All are priced at less than half of what similarly configured systems from the larger manufacturers would cost — which is why the ClassOne lines are often described as delivering “Advanced Wet Processing for the Rest of Us.”

EV Group (EVG), a supplier of wafer bonding and lithography equipment, together with the Korea National NanoFab Center (President Jae Young Lee, NNFC), a nano-technology R&D infrastructure for academia, research institutes and the industry, announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays. The ongoing work has been carried out within a joint-development program (JDP) established between the two partners in November 2015. This collaborative research has been partly funded by the Nano-Open-Innovation-Lab Project of the NNFC.

Korea National NanoFab Center (NNFC)

Korea National NanoFab Center (NNFC)

The goal of the EVG-NNFC JDP is the development of optimized materials, the process technology for structure replication, and the industrial implementation of the AR coatings for large-area substrates. The NNFC research team under its director Dr. Jae Hong Park is responsible for the development of the materials and the “reversible nano-molding” process, which can be compatible with EVG’s proprietary SmartNIL UV-nanoimprint lithography (UV-NIL) technology. EVG is responsible for optimizing the UV-NIL replication process and transferring the technology from the R&D phase on current 200mm round substrates to large panel sizes.

Outstanding preliminary results

EVG and the NNFC have successfully demonstrated an anti-reflective coating with excellent structure replication that provides over 97-percent transmittance and a surface hardness of 3H, which is superior to most other polymeric coatings. By contrast, current commercial thin-film coatings only provide up to 92-percent transmittance. The JDP partners achieved these results by applying EVG’s SmartNIL technology on 200-mm round substrates using a polymer material developed by the NNFC. This material was developed for performing the reversible nano molding process at the NNFC, and is compliant with commercial standards for display coating.

In the next phase of the program, EVG and the NNFC plan to promote these promising results to initiate partnerships with end-users that are interested in joining the JDP to help commercialize the new AR coating. The goal of this next phase is the qualification of the novel anti-reflective coating technology for industrial use through the NNFC, and the implementation of the process by EVG to high-volume panel manufacturing on large screen sizes, such as Gen 2 (370 mm x 470 mm) panels and beyond. In addition to this specific project, EVG and the NNFC plan to investigate other application areas leveraging nanostructures and NIL technology.

“As part of our Triple-i philosophy of invent-innovate-implement, EV Group has a long history of engagements with groups across the nanotechnology value chain–from research institutes and materials suppliers to manufacturers–to develop new processes and devices, and bring them into production,” stated WeonSik Yang, general manager of EV Group Korea, Ltd. “We’re pleased to have the opportunity to participate in this level of cooperation with our partners in Korea, namely the NNFC, and see the efforts of our previous cooperation bearing fruit. On behalf of EVG, I would like to extend my sincerest thanks to Dr. Jae Hong Park as well as NNFC President Jae Young Lee for their dedication and support for this project. We look forward to working with local industrial partners to commercialize this novel display coating technology and process to support large-area display manufacturing.”

EVG and the NNFC presented the results of this JDP at the recent NANO KOREA symposium and exhibition in Goyang, Korea. A copy of the poster summarizing the results can be downloaded at http://www.evgroup.com/en/about/news/2016_12_NNFC/.

 

The National NanoFab Center (NNFC) is a nanotechnology and semiconductors R&D center, located in Daejeon City, Korea.

Leti researchers have demonstrated that memristive devices are excellent candidates to emulate synaptic plasticity, the capability of synapses to enhance or diminish their connectivity between neurons, which is widely believed to be the cellular basis for learning and memory.

The breakthrough was presented today at IEDM 2016 in San Francisco in the paper, “Experimental Demonstration of Short and Long Term Synaptic Plasticity Using OxRAM Multi k-bit Arrays for Reliable Detection in Highly Noisy Input Data”.

Neural systems such as the human brain exhibit various types and time periods of plasticity, e.g. synaptic modifications can last anywhere from seconds to days or months. However, prior research in utilizing synaptic plasticity using memristive devices relied primarily on simplified rules for plasticity and learning.

The project team, which includes researchers from Leti’s sister institute at CEA Tech, List, along with INSERM and Clinatec, proposed an architecture that implements both short- and long-term plasticity (STP and LTP) using RRAM devices.

“While implementing a learning rule for permanent modifications – LTP, based on spike-timing-dependent plasticity – we also incorporated the possibility of short-term modifications with STP, based on the Tsodyks/Markram model,” said Elisa Vianello, Leti non-volatile memories and cognitive computing specialist/research engineer.  “We showed the benefits of utilizing both kinds of plasticity with visual pattern extraction and decoding of neural signals. LTP allows our artificial neural networks to learn patterns, and STP makes the learning process very robust against environmental noise.”

Resistive random-access memory (RRAM) devices coupled with a spike-coding scheme are key to implementing unsupervised learning with minimal hardware footprint and low power consumption. Embedding neuromorphic learning into low-power devices could enable design of autonomous systems, such as a brain-machine interface that makes decisions based on real-time, on-line processing of in-vivo recorded biological signals. Biological data are intrinsically highly noisy and the proposed combined LTP and STP learning rule is a powerful technique to improve the detection/recognition rate. This approach may enable the design of autonomous implantable devices for rehabilitation purposes.

Leti, which has worked on RRAM to develop hardware neuromorphic architectures since 2010, is the coordinator of the H2020 European project NeuRAM3. That project is working on fabricating a chip with architecture that supports state-of-the-art machine-learning algorithms and spike-based learning mechanisms.

Leti will present 13 papers at the conference, three of which are invited.

At the 2016 IEEE International Electron Devices Meeting, in a special poster session on MRAM, world-leading research and innovation hub for nano-electronics and digital technology imec presented a 8nm p-MTJ device with 100 percent tunnel magnetoresistance (TMR) and coercive field as high 1500Oe. This world’s smallest device enables the establishment of a manufacturing process for high-density spin-transfer-torque magnetic random access memory (STT-MRAM) arrays that meet the requirements of the 10nm and beyond logic node for embedded non-volatile memory applications. It also paves the way for high density stand-alone applications.

STT-MRAM has the potential to become the first embedded non-volatile memory technology on advanced logic nodes for advanced applications and is also considered an alternative to conventional dynamic random access memory (DRAM). The core element of an STT-MRAM is a magnetic tunnel junction (MTJ) in which a thin dielectric layer is sandwiched between a magnetic reference layer and a magnetic free layer, where writing of the memory cell is performed by switching the magnetization of the free layer. STT-MRAMs exhibit non-volatility, high-speed, low-voltage switching and nearly unlimited read/write endurance. However, significant challenges towards commercialization remain, primarily in scaling the processes for higher densities and in increasing the device switching current.

In addressing these challenges, imec scientists have demonstrated for the first time an electrical functional p-MTJ device as small as 8nm. Despite the small dimensions, the device exhibits a high TMR of 100 percent, a coercivity (Hc) of 1500Oe and a spin torque efficiency -the ratio of the thermal stability and switching current- as high as three. The p-MTJ stack, featuring a free layer and reference layer of CoFeB-based multilayer stacks, was developed on 300mm silicon wafers and the fabrication process is compatible with the thermal budget of standard CMOS back-end-of-line (BEOL) technology.

Moreover, imec integrated arrays of p-MTJ devices into a 1T1MTJ structure to build STT-MRAM Megabit arrays with pitches down to 100nm, proving that the technology meets the dimensional requirements for the 10nm logic node and beyond.

Imec’s research into advanced memory is performed in cooperation with imec’s key partners in its core CMOS programs including GlobalFoundries, Micron, Qualcomm, Sony and TSMC.

Delivering a power punch


December 5, 2016

Energy storage units that can be integrated into wearable and flexible electronic systems are becoming increasingly important in today’s world. A research team from KAUST has now developed a microsupercapacitor that exploits three-dimensional porous electrodes. These micropower units are expected to enable a new generation of “smart”products, such as self-powered sensors for wearables, security, structural health monitoring and “internet of things” applications.

Three-dimensional porous electrodes could lead to smaller and efficient integrated power sources.

Three-dimensional porous electrodes could lead to smaller and efficient integrated power sources.

However, for these units to be tiny yet still efficient, the highest energy density must go into the smallest area.

One approach to carrying this out is to construct microbatteries using films with a thickness of just a few micrometers or less and to replace traditional electrolytes with solid-state ones. Thin film batteries have demonstrated relatively high energy density, which is the amount of energy they can store in a given area. However, they are afflicted by limited cycle life and poor power density, meaning they are slow to charge and discharge.

Microsupercapacitors are a faster alternative, and these may prove suitable for applications requiring power pulsing and very long cycle life.

“Also, while batteries must be charged at a constant voltage, a supercapacitor charges most efficiently by drawing the maximum current that the source can supply, irrespective of voltage,” said KAUST Professor of Material Science and Engineering Husam Alshareef from the University’s Functional Nanomaterials & Devices group.

This makes supercapacitors more appealing for self-powered system applications where the power source may be intermittent.

Alshareef’s team has now developed integrated microsupercapacitors with vertically-scaled three-dimensional porous current collectors made from nickel foams to improve microsupercapacitor performance. The pores in the foam work to increase the surface area.

“This three-dimensional porous architecture allows excellent electrolyte permeability, good conductivity and faster ion transportation with maximum mass-loading of active material, which increase energy and power density in a given area,” Alshareef said.

The microsupercapacitors were also asymmetric, using two different electrode materials for the cathode (nickel cobalt sulfide) and anode (carbon nanofiber), which nearly doubled the operating voltage. As a result, while delivering high power density (four milliwatts per square centimeter), the microsupercapacitors had an energy density of 200 microwatt-hours per square centimeter.

This is superior to state-of-the-art microsupercapacitors, which achieve between one and forty microwatt-hours per square centimeter, and is comparable to various types of thin film batteries. These high capacities were maintained even after 10,000 operating cycles.

“The high energy and power density achieve in these devices may meet the demand of on-chip storage for various types of integrated microsystems,” noted KAUST Ph.D. student Qiu Jiang, the lead author of the study.

QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator Partner Program, a collaborative ecosystem that facilitates 22FDX system-on-chip (SoC) design and reduces time-to-market for customers.

“QuickLogic’s partnership with GLOBALFOUNDRIES adds a unique dimension to the FDX program by offering customers ultra-low power embedded FPGA (eFPGA) Intellectual Property, complete software tools and a compiler,” said Brian Faith, president and CEO at QuickLogic Corporation. “This new capability provides users with a high level of design and product flexibility which will help lower costs and allow products to be easily customized to meet various and evolving market requirements.”

“GLOBALFOUNDRIES’ FDXcelerator program is a comprehensive design ecosystem that provides customers with the support and resources they need to get FDX FD-SOI technologies to market as quickly as possible,” said Alain Mutricy, senior vice president of Product Management at GLOBALFOUNDRIES. “Leveraging QuickLogic’s FPGA expertise will provide inherent hardware flexibility for FDX-based SoC designs and gain a critical time-to-market advantage for a broad range of embedded, battery powered and IoT applications.”

The FDXcelerator Partner Program builds upon GLOBALFOUNDRIES’ industry-first FD-SOI roadmap, a lower-cost migration path for designers on advanced nodes that is optimized for low power applications. By participating, FDXcelerator Partners commit to provide specific resources, including EDA tools, IP, silicon platforms, reference designs, design services and packaging and test solutions. The program is based on an open framework which enables members to minimize development time and cost while simultaneously leveraging the inherent power and performance advantages of FDX technology.

Current members of the FDXcelerator Partner Program also include Synopsys, Cadence, INVECAS, VeriSilicon, CEA Leti, Dream Chip, and Encore Semi.

Integrated circuit sales for connections to the Internet of Things are forecast to grow more than three times faster than total IC revenues during the last half of this decade, according to IC Insights’ new 2017 Integrated Circuit Market Drivers report.  ICs used to embed Internet of Things (IoT) functionality into a wide range of systems, sensors, and objects are expected to generate sales of $12.8 billion in 2016, says the new report, which becomes available this week.

Between 2015 and 2020, IoT integrated circuit sales are projected to rise by a compound annual growth rate (CAGR) of 13.3% compared to 4.3% for the entire IC market, which is projected to reach $354.7 billion in four years versus $287.1 billion last year, based on the forecast in the 492-page report.  As shown in Figure 1, strong five-year IC sales growth rates are also expected in automotive (a CAGR of 10.3%), medical electronics (a CAGR of 7.3%), digital TVs (a CAGR of 5.9%), and server computers (a CAGR of 5.4%).

Cellphone IC sales—the biggest end-use market application for integrated circuits—are expected to grow by a CAGR of 4.8% in the 2015-2020 period.  Saturation in smartphone markets and economic weakness in some developing regions are expected to curb cellphone IC market growth in the next four years after sales increased by a CAGR of 10.8% between 2010 and 2015.  Meanwhile, weak and negative IC sales growth rates are expected to continue in standard personal computers, set-top boxes, touchscreen tablets, and video game consoles.

The new 2017 IC Market Drivers report shows 2016 integrated circuit sales for IoT applications climbing nearly 19% compared to 2015 to an estimated $12.8 billion, followed by the automotive segment increasing about 12% to $22.9 billion, medical electronics rising 9% to $4.9 billion, and digital TV systems growing 4% to $12.9 billion this year.  The report estimates IC sales growth in server computers being about 3% in 2016 to $15.1 billion, cellphones being 2% to $74.2 billion, and set-top boxes being 2% to $5.7 billion.  Meanwhile, standard PC integrated circuit sales are estimated to be down 5% in 2016 to $54.6 billion while video game console IC revenues are expected to finish this year with a 4% drop to $8.9 billion and tablet IC sales are on track to decline 10% to $12.1 billion in 2016, according to IC Insights’ new report.

Figure 1

Figure 1

DGIST announced that Professor Kyung-in Jang’s research team from the Department of Robotics Engineering succeeded in developing bio-signal measuring electrodes that can be mounted on Internet of Things (IoT) devices through joint research with a research team led by professor John Rogers of the University of Illinois, USA.

Optical image of bio-signal measurement electrode design developed by Professor Jang's research team. The electrode generates such a large force that it holds the circular magnet located under the glass only by attraction (gravitation) of the magnetic field. Credit: DGIST

Optical image of bio-signal measurement electrode design developed by Professor Jang’s research team. The electrode generates such a large force that it holds the circular magnet located under the glass only by attraction (gravitation) of the magnetic field. Credit: DGIST

The bio-signal measuring electrodes developed by the research team can be easily mounted on IoT devices for health diagnosis, thus they can measure bio-signals such as brain waves and electrocardiograms without additional analysis and measurement equipment while not interfering or restricting human activities.

Conventional hydro-gel based electrodes required external analysis and measurement devices to measure bio-signals due to their pulpy gel forms, which made their attachment to and detachment from IoT devices instable. In addition, since these electrodes were wet-bonded to the skin, there have been disadvantages that the characteristics of the electrodes deteriorated or their performance decreased when the electrodes were dried in the air over a long period.

In contrast, the electrodes developed by Professor Kyung-in Jang can be easily interlocked as if they are a part of IoT devices for health diagnosis. Also, since they are composed only of polymer and metal materials, they have the advantage of there being no possibility of drying in the air.

The bio-signal measurement electrodes developed by the research team consist of a composite material in which a magnetic material is folded with a soft and adhesive polymer, with a conductive electrode material wrapped around the composite material. The conductive electrode material electrically connects the bottom surface touching the skin and the top surface touching the electrode of the IoT device.

Electrodes with this structure reacting to the magnetic field can be easily attached and detached by using the attraction that occurs between the magnet and the electrode mounted on the IoT devices. Then, through the conductive electrode materials that connect the skin and the electrode part of the IoT device, the electric signals generated on the skin can be directly transmitted to the IoT device for health diagnosis.

The research team succeeded in storing and analyzing brain waves (electroencephalogram, EEG), electrocardiograms (ECG), eye movements (electrooculogram, EOG), and limb movements and muscle contractions (electromyogram, EMG) of the wearer for a long period through an experiment in which IoT devices with the electrodes are attached to various parts of the human body.

The bio-signal measurement electrodes can measure the bioelectric signal generated from the skin without loss or noise by using the IoT platform, thus they are expected to be applicable to the medical and healthcare fields since they cannot only measure the electrical signals of the body, but also analyze various forms of bio-signals such as body temperature change, skin change, and in-body ion concentration change.

Professor Kyung-in Jang said, “We have secured the source technology that can diagnose the state of human health anytime and anywhere by combining bio-electrode technology with IoT platforms utilizing advanced high-tech composite materials. We will carry out subsequent research to make it applicable for diseases that require ongoing medical diagnosis such as diabetes, insomnia, and epilepsy, and to make it available to people in medically vulnerable areas such as remote mountainous and rural areas.”

The Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking announced the Lab4MEMS project as the winner of its 2016 Innovation Award during the European Nanoelectronics Forum, in Rome, Italy.

At its launch in January 2014, Lab4MEMS was identified as a Key Enabling Technology Pilot-Line project for next-generation Micro-Electro-Mechanical Systems (MEMS) devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging to enhance the next generation of smart sensors, actuators, micro-pumps, and energy harvesters. These technologies were recognized as important contributors to future data-storage, printing, healthcare, automotive, industrial-control, and smart-building applications, as well as consumer applications such as smartphones and navigation devices.

In accepting the award, Roberto Zafalon, General Project Coordinator of Lab4MEMS and the European Programs Manager in R&D and Public Affairs for STMicroelectronics Italy said, “The ECSEL Innovation Award highlights the excellent results the Lab4MEMS team achieved through the project’s execution and the high impact of its successes. In particular, Lab4MEMS developed innovative MEMS solutions with advanced piezoelectric and magnetic materials, including advanced 3D Packaging technologies.”

In coordinating the €28m[1], 36-month Lab4MEMS project, ST led the team of twenty partners, which included universities, research institutions, and technology businesses across ten European countries. ST’s MEMS facilities in Italy and Malta contributed their complete set of manufacturing competencies for next-generation devices, spanning design and fabrication to test and packaging to the project.

Lab4MEMS’ devices, technologies, and application improvements emphasized:

  • Micro-actuators, micro-pumps, sensors, and energy scavengers integrated on silicon-based MEMS using piezoelectric thin-films (PZT), for applications in Data Storage, Printing, Health Care, Automotive, Energy Scavenging, and Autofocus Lenses.
  • Magnetic-field sensors, for applications in consumer applications such as GPS positioning, indoor navigation, and mobile phones.
  • Advanced packaging technologies and vertical interconnections, including flip chip, Through Silicon Via (TSV) or Through Mold Via (TMV) for full 3D integration, which could be used in Consumer and Healthcare applications such as body-area sensors and remote monitoring.

All of these successes contributed to the Lab4MEMS project and are available to benefit the contributors. These participants were Politecnico di Torino (Italy); Fondazione Istituto Italiano di Tecnologia (Italy); Politecnico di Milano (Italy); Consorzio Nazionale Interuniversitario per la Nanoelettronica (Italy); Commissariat à l’Energie Atomique et aux énergies alternatives (France); SERMA Technologies SA (France); STMicroelectronics Ltd. (Malta); Universita ta Malta (Malta); Solmates BV (Netherlands); Cavendish Kinetics BV (Netherlands); Okmetic OYJ (Finland); VTT (Finland); Picosun OY (Finland); KLA-Tencor ICOS (Belgium); Universitatea Politehnica din Bucuresti (Romania); Instytut Technologii Elektronowej (Poland); Stiftelsen SINTEF (Norway); Sonitor Technologies AS (Norway); BESI GmbH (Austria).

Technavio’s latest report on the global industrial embedded systems market provides an analysis on the most important trends expected to impact the market outlook from 2016-2020. Technavio defines an emerging trend as a factor that has the potential to significantly impact the market and contribute to its growth or decline.

Bharath Kanniappan, a lead analyst from Technavio, specializing in research on industrial automation sector, says, “Industrial embedded systems are widely used in both process and discrete industries. Industries such as oil and gas, power, cement, chemical, and automotive, and pulp and paper, among others, have harsh operating conditions and require robust automation systems.”

New trends such as vision systems, multi-core processors, and power efficiency capabilities have further augmented the utility and scope of the industrial embedded hardware market. The latest developments in embedded hardware are the incorporation of embedded sensors in the form of nano blobs in materials used to build industrial robots, thus enabling the machines to achieve increased conductivity and superior sensitivity. Such attributes let robots safely interact with objects and human beings in industrial environments. Such developments are an impetus to the growing embedded hardware market.

The top three emerging trends driving the global industrial embedded systems market according to Technavio automation research analysts are:

  • Increased adoption of multi-core processors
  • Rise of wireless connectivity
  • Advancement of materials used in embedded systems

Increased adoption of multi-core processors

Earlier, 8-bit microcontrollers were the most commonly used in industrial embedded systems such as motor control, industrial process control, actuators, sensors, and robotics. However, industrial technology has advanced to include complex capabilities such as wireless connectivity, imaging, and smart sensors, and this has propelled the demand for advanced and efficient algorithms. Hence, vendors are designing single chips with multiple cores to enhance applications, increase reliability, reduce power consumption, and lower overall operational costs.

“The Compact RIO industrial embedded controller from National Instruments has a dual core processor which has enabled the integration of latest technologies such as Xilinx Kintex 7 FPGAs and 64-bit Intel Atom E3800 SoC,” according to Bharath.

Rise of wireless connectivity

IoT enables prompt collection, storage, and transmission of data, which allows rapid analysis and decision making by experts across international borders. Recent developments in sensor technologies (such as wireless sensor nodes) can be integrated with wireless networking protocols like ZigBee and Wi-Fi. Previously industrial embedded systems were operating as stand-online systems. Currently, due to the high demand of IoT and wireless protocols including near field communications and long range protocols in various industries, industrial embedded systems are adopting wireless SoC architecture.

Wireless connectivity in industrial embedded systems has enabled Internet connectivity and subsequently increased the market prospects of industrial embedded systems during the forecast period.

Advancement of materials used in embedded systems

Previously sensors used in industries could collect and interpret information only at the point of contact between the sensor and the object. This is a major limiting factor in the use of industrial sensors. Hence newer materials are being developed which can incorporate multiple embedded technologies and augment the functioning of sensors. Using new composite materials such as ceramic hybrid polymers and polydimethylsiloxane, the lifespan of embedded systems remains unaffected as these materials redirect stress away from these electronic devices.

By successful incorporation of embedded systems in these materials and the use of finite-element-analysis (FEA) software, sensors can perform their function beyond the limits of the contact point by using analysis of predictive stress and strain patterns. These superior sensors can be utilized for effective and efficient predictive maintenance in various industries.

The key vendors are as follows:

  • Atmel
  • Intel
  • National Instruments
  • Infineon Technologies

About Technavio

Technavio is a leading global technology research and advisory company. The company develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries. Technavio has about 300 analysts globally who specialize in customized consulting and business research assignments across the latest leading edge technologies.

Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.