Category Archives: MEMS

For more than a decade, engineers have been eyeing the finish line in the race to shrink the size of components in integrated circuits. They knew that the laws of physics had set a 5-nanometer threshold on the size of transistor gates among conventional semiconductors, about one-quarter the size of high-end 20-nanometer-gate transistors now on the market.

Some laws are made to be broken, or at least challenged.

A research team led by faculty scientist Ali Javey at the Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) has done just that by creating a transistor with a working 1-nanometer gate. For comparison, a strand of human hair is about 50,000 nanometers thick.

This is a schematic of a transistor with a molybdenum disulfide channel and 1-nanometer carbon nanotube gate. Credit: Sujay Desai/Berkeley Lab

This is a schematic of a transistor with a molybdenum disulfide channel and 1-nanometer carbon nanotube gate. Credit: Sujay Desai/Berkeley Lab

“We made the smallest transistor reported to date,” said Javey, a lead principal investigator of the Electronic Materials program in Berkeley Lab’s Materials Science Division. “The gate length is considered a defining dimension of the transistor. We demonstrated a 1-nanometer-gate transistor, showing that with the choice of proper materials, there is a lot more room to shrink our electronics.”

The key was to use carbon nanotubes and molybdenum disulfide (MoS2), an engine lubricant commonly sold in auto parts shops. MoS2 is part of a family of materials with immense potential for applications in LEDs, lasers, nanoscale transistors, solar cells, and more.

The findings will appear in the Oct. 7 issue of the journal Science. Other investigators on this paper include Jeff Bokor, a faculty senior scientist at Berkeley Lab and a professor at UC Berkeley; Chenming Hu, a professor at UC Berkeley; Moon Kim, a professor at the University of Texas at Dallas; and H.S. Philip Wong, a professor at Stanford University.

The development could be key to keeping alive Intel co-founder Gordon Moore’s prediction that the density of transistors on integrated circuits would double every two years, enabling the increased performance of our laptops, mobile phones, televisions, and other electronics.

“The semiconductor industry has long assumed that any gate below 5 nanometers wouldn’t work, so anything below that was not even considered,” said study lead author Sujay Desai, a graduate student in Javey’s lab. “This research shows that sub-5-nanometer gates should not be discounted. Industry has been squeezing every last bit of capability out of silicon. By changing the material from silicon to MoS2, we can make a transistor with a gate that is just 1 nanometer in length, and operate it like a switch.”

When ‘electrons are out of control’

Transistors consist of three terminals: a source, a drain, and a gate. Current flows from the source to the drain, and that flow is controlled by the gate, which switches on and off in response to the voltage applied.

Both silicon and MoS2 have a crystalline lattice structure, but electrons flowing through silicon are lighter and encounter less resistance compared with MoS2. That is a boon when the gate is 5 nanometers or longer. But below that length, a quantum mechanical phenomenon called tunneling kicks in, and the gate barrier is no longer able to keep the electrons from barging through from the source to the drain terminals.

“This means we can’t turn off the transistors,” said Desai. “The electrons are out of control.”

Because electrons flowing through MoS2 are heavier, their flow can be controlled with smaller gate lengths. MoS2 can also be scaled down to atomically thin sheets, about 0.65 nanometers thick, with a lower dielectric constant, a measure reflecting the ability of a material to store energy in an electric field. Both of these properties, in addition to the mass of the electron, help improve the control of the flow of current inside the transistor when the gate length is reduced to 1 nanometer.

Once they settled on MoS2 as the semiconductor material, it was time to construct the gate. Making a 1-nanometer structure, it turns out, is no small feat. Conventional lithography techniques don’t work well at that scale, so the researchers turned to carbon nanotubes, hollow cylindrical tubes with diameters as small as 1 nanometer.

They then measured the electrical properties of the devices to show that the MoS2 transistor with the carbon nanotube gate effectively controlled the flow of electrons.

“This work demonstrated the shortest transistor ever,” said Javey, who is also a UC Berkeley professor of electrical engineering and computer sciences. “However, it’s a proof of concept. We have not yet packed these transistors onto a chip, and we haven’t done this billions of times over. We also have not developed self-aligned fabrication schemes for reducing parasitic resistances in the device. But this work is important to show that we are no longer limited to a 5-nanometer gate for our transistors. Moore’s Law can continue a while longer by proper engineering of the semiconductor material and device architecture.”

STMicroelectronics (NYSE: STM) and WiTricity, an industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer. The goal is to “cut the last cord,” bringing convenience to the powering and charging of consumer electronics, Internet of Things (IoT) devices, as well as medical, industrial, and automotive applications.

WiTricity and ST are developing semiconductor solutions that combine WiTricity’s foundational intellectual property and wireless power-transfer mixed-signal IC-design expertise, with ST’s leadership in power-semiconductor design, fabrication, and packaging capabilities and resources. For the consumer electronics and IoT markets, power transmit and receive systems built with these new semiconductors aim to deliver spatial freedom, as well as wireless fast charging of one or more devices at the same time. Dubbed “Wireless Charging 2.0,” the semiconductor solutions built with the magnetic resonance technology will also have unique advantages over current technology, including being able to efficiently charge metal-body smartphones, tablets, and smartwatches.

The contemplated semiconductor offerings include designs that comply with the AirFuel magnetic resonance specification as well as multi-mode solutions that incorporate both resonant and inductive charging. The AirFuel Alliance, a global organization dedicated to delivering the best wireless-charging experience for consumer electronics, is driving an interoperable ecosystem of wireless-charging Power Transfer Transmit Units (PTUs) and Power Receive Units (PRUs) that enable users to charge their devices everywhere; in their homes and offices to public spaces and even in their vehicles.

Beyond the consumer market, WiTricity is the global technology leader in wireless power for automotive, industrial and medical applications. ST and WiTricity demonstrated high-power wireless-transfer technology for electric vehicle charging at APEC 2016 in Long Beach California. For the automotive industry, WiTricity recently announced wireless “park-and-charge” development kits using their industry-leading 11kW solution for electric- and hybrid-vehicle charging. The solution has successfully been tested by the Society of Automotive Engineers (SAE) for inclusion in a new global standard.

“Combining the expertise of WiTricity, the innovator in wireless power-transfer and magnetic resonance technology with ST’s resources and key IP, including Smart Power technologies and RF Bluetooth low energy, allows us to deliver complete, efficient wireless-charging solutions that increase convenience and ease of use while delighting consumers and exceeding their expectations,” said Matteo Lo Presti, Vice President and General Manager, Analog, in the Analog and MEMS Group, STMicroelectronics. “Game-changing technology from this ST and WiTricity collaboration will enable product designers across the globe to rid the world of cumbersome wires and charging cables and allow us to promote a broader set of our own semiconductor offerings into these emerging markets.”

“STMicroelectronics is a global leader in semiconductor solutions for power electronics and a compelling choice to rapidly commercialize fast and efficient wireless-charging chipsets based on WiTricity’s silicon designs and magnetic-resonance technology,” said Alex Gruzen, CEO of WiTricity. “With ST’s vast experience in semiconductor design and fabrication, as well as its access to leaders in the consumer electronics, automotive, and industrial markets, this collaboration puts us in a strong position to accelerate the adoption of resonance-enabled wireless charging.

Leti, an institute of CEA Tech, and the Institute for Information Industry of Taiwan (III), a non-profit non-governmental technology development organization, today announced an agreement for mutual exploration of a wide range of information and communications technology (ICT) related to the Internet of Things (IoT) and 5G wireless connectivity.

The five-year collaboration will include, but is not limited to, joint development and implementation of IoT and 5G based Smart ICT solutions for the EU and Taiwan, and scientific information exchanges.  Also envisioned are cross-invitations to scientific events, joint implementation of international collaborative projects and partnerships, and work on experimental platforms and test beds that can be used to provide real-world validation of solutions.

Leti’s background in IoT and 5G systems, including spectrum management, radio access technologies and protocols, as well as IoT open platforms for large-scale systems, will be a primary contribution, along with its technological roadmaps. In addition to its expertise in IoT systems, III will provide access to Taiwanese technology platforms, as well as industry-driven requirements and use cases.

“Our two organizations have very complementary skills and ecosystems, and it’s a pleasure to launch our collaboration. Together we have an excellent opportunity to pilot and demonstrate innovative 5G and IoT-related solutions that will be useful for industries and individuals in Taiwan and the EU,” said Leti CEO Marie Semeria at the official signing ceremony in Taipei, held during a Leti workshop event there.

“Taiwan is currently supporting and promoting IoT and smart city. The service and platform that based on IoT technology will be the key factor for industrial development. III and Leti’s collaboration will significantly enhance our ability to pursue our mission of promoting industrial applications, R&D technologies, and IoT infrastructures,” commented III Executive Vice President Pao-Chung Ho. “We look forward to our information exchange and collaboration, and to building a creative and effective long-term research partnership between our teams.”

imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications. The SoC combines an unprecedented number of biomedical analog interfaces into a single chip, on-board digital signal processing, high fidelity operation, and multi-day monitoring capability with a single battery.  Thanks to its small form factor, the SoC can be easily integrated in new innovative designs enabling maximum user comfort. This new SoC is an enabler towards the transformation of today’s mainly curative approach to healthcare to one that is preventative, predictive and personalized.

biomed hub

The biomedical analog interfaces include three ECG channels, photo-plethysmography (PPG), galvanic skin response (GSR), two multi-frequency bio-impedance (BIO-Z) channels to support new applications such as impedance-tomography, body fluid analysis and stroke volume measurements, and three reconfigurable channels.

While high performance multi-modal analog readouts have been demonstrated, they lack on-board signal processing capabilities, or are too large in size. Alternatively, existing reconfigurable readouts are smaller, but have limited performance. Imec’s and Holst Centre’s SoC moves beyond current solutions and combines advanced biomedical readouts, supported by an ARM Cortex M0+ controller and accelerators for sample-rate conversion, matrix processing, data compaction, and power management circuitry (PMIC).  The PMIC operates from a battery source (2.9- 4.5V) and generates the required voltages for the readout IC. It supports dynamic voltage scaling optimized for, but not limited to, low power and high performance applications, and can be fully customized for specific healthcare applications.

“There is a clear need for accurate and reliable bio-sensing in wearables, and we are working on the building blocks to enable this,” stated Chris Van Hoof, program director wearable health at imec. “Our new SoC sensor hub underscores patient-centric capabilities and can be integrated in numerous wearable fitness and healthcare applications such as patch monitors, chest band heart rate monitors, respiration or hydration monitors and devices for blood-pressure calculation.”

Silicon Labs (NASDAQ: SLAB) today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT). This strategic acquisition helps simplify IoT design for all developers by combining a commercial-grade embedded RTOS with Silicon Labs’ IoT expertise and solutions. Micrium’s RTOS and software tools will continue to be available to all silicon partners worldwide, giving customers a wide range of options, even when using non-Silicon Labs hardware. Micrium will continue to fully support existing as well as new customers.

Founded in 1999, Micrium has consistently held a leadership position in embedded software components. The company’s flagship µC/OS RTOS family is recognized for reliability, performance, dependability, impeccable source code and extensive documentation.

“With an installed base of millions of devices, Micrium’s RTOS software has established itself as one of the most reliable and trusted platforms over the last 10 years,” said Jean-Michel Orsat, Chief Technology Officer, ICT Standards and Connectivity Solutions at Somfy. “Micrium has been a rock-solid RTOS solution partner for Somfy, and we look forward to using Micrium’s RTOS software family for years to come, delivering the reliability and performance we need for our IoT applications.”

Micrium’s widely deployed RTOS software has been ported to more than 50 microcontroller architectures and has a global footprint with more than 250,000 downloads across all embedded vertical markets, with solutions certified to meet safety-critical standards for medical electronics, avionics, communications, consumer electronics and industrial control.

“By combining forces with Silicon Labs, the Micrium team will drive advances in embedded connectivity for the IoT while giving customers a flexible choice of hardware platforms, wireless stacks and development tools based on the industry’s foremost embedded RTOS,” said Jean J. Labrosse, Founder, CEO and President of Micrium. “We will continue to provide our customers with an exceptional level of support, which is a Micrium hallmark.”

The combination of Micrium’s RTOS and Silicon Labs’ multiprotocol SoCs, wireless modules, wireless stacks and Simplicity Studio development tools gives customers a faster, easier on-ramp from connected devices to the cloud with end-to-end solutions for embedded IoT design.

“IoT products are increasingly defined by software. Explosive growth of memory/processor capabilities in low-end embedded products is driving a greater need for RTOS software in connected device applications,” said Daniel Cooley, Senior Vice President and General Manager of Silicon Labs’ IoT products. “The acquisition of Micrium means that connected device makers will have easier access to a proven embedded RTOS geared toward multiprotocol silicon, software and solutions from Silicon Labs.”

STMicroelectronics (NYSE: STM) today revealed its contributions to an intelligent toothbrush system from Oral-B. ST’s motion-sensing and control chip inside the toothbrush help develop healthier brushing habits.

Brushing incorrectly can negatively affect oral health. To help people brush like their dental professional recommends and avoid these common oral-health issues, the Oral-B GENIUS intelligent toothbrush system combines revolutionary Position Detection technology with Triple Pressure Control and a Professional Timer.

ST’s low-power 3-axis accelerometer captures permanently the orientation of the toothbrush handle while the user is brushing. ST’s 8-bit STM8 microcontroller performs pre-processing of the accelerometer data and other housekeeping functions on the GENIUS toothbrush and leverages ST’s advanced packaging technologies for miniaturization.

“Our contribution to improving personal healthcare through an electronic toothbrush that brushes like your dental professional recommends is yet another example of how semiconductor technologies help people get more from life,” said Kevin Gagnon, Vice President of Central Sales, Americas Region, STMicroelectronics. “A powerful demonstration of the exceptional creativity of the Oral-B technology team, the GENIUS smart electronic toothbrush is a testament to the variety of highly innovative products that ST’s solutions can be used to develop and bring to market.”

Leti, an institute of CEA Tech, announced today it has joined the Stanford SystemX Alliance, a network of 100 renowned Stanford University professors and 27 world-class companies, joining forces in a pre-competitive environment to define tomorrow’s research strategies. Leti’s participation bridges the gap between two worlds – academia and industry. 

The alliance is a collaboration between Stanford researchers and over two-dozen leading global technology companies – such as Google, Huawei, Xilinx, Intel, Qualcomm, Toshiba, Infineon, and many more – that focuses on hardware and software at all levels of the system stack. Topics range from materials and devices to systems and applications in electronics, networks, energy, mobility, bio-interfaces, sensors and other technological domains.

Together, the SystemX partners are working on research strategies that should lead to a wide range of next generation applications, including the highly anticipated self-driving car and future artificial-intelligence systems that will improve performance and operation of our mobile, medical, smart-home solutions and devices.

Following his recent visit to Leti, Stanford System X Director Rick Bahr said, “Leti’s extensive, advanced clean room facilities and expertise are truly impressive, and I can see now that Stanford and Leti are very complementary. It makes real sense for us to find more ways to work together on developing new technologies and their demonstrators.”

“The alliance provides an avenue for worldwide strategic discussions and, more importantly, allows both research partners and industry leaders to stay ahead of the game,” said Barbara De Salvo, Leti’s scientific director.

“Leti brings its scientific excellence and expertise on technology transfer, and will have access to Stanford’s top-notch upstream research and network,” she added. “Stanford’s dynamic culture will inspire Leti on the road to new scientific territories and lead to strong programs with the Silicon Valley ecosystem.”

Leti will share its innovative research results during several SystemX events and explore ambitious, innovative and collaborative projects together with other partners of the Alliance.

Cypress Semiconductor Corp. (Nasdaq:  CY) and Hackster today announced a global design competition that gives engineers the opportunity to prototype their innovative ideas that sense the world around us for use in the growing Internet of Things (IoT) market, home appliances, and consumer and industrial applications. The Sensing the World Challenge will use Cypress’s easy-to-use CY8CKIT-048 PSoC Analog Coprocessor Pioneer Kit as the development hardware platform. Hackster will select a winner from three regions—the Americas, Asia Pacific and Australia, and Europe and Africa—and each will receive an Oculus Rift virtual reality headset and development kit. Designers can sign up and find more information at www.hackster.io/contests/cypress-sensing-the-world-contest.

“People generally associate the IoT with connectivity, but most next-gen applications start with the ability to sense real-world conditions,” said Adam Benzion, co-founder and CEO of Hackster. “This new design challenge unleashes the imaginations of the worldwide Hackster community. Thanks to the Cypress PSoC Analog Coprocessor, they can develop a huge range of innovative applications with its mix of sensor input combinations.”

“I can’t wait to see what the creative minds of the Hackster community will develop with the rich, flexible analog resources they have to work with in this design contest,” said John Weil, vice president of MCU marketing at Cypress. “The PSoC Analog Coprocessor allows engineers to simply create cost-effective systems with precise, highly sensitive analog sensors. And our intuitive PSoC Creator integrated design environment enables rapid prototyping and design iterations with hardware and software flexibility.”

Initial proposals for the Sensing the World Challenge will be accepted through 11:55 p.m. Pacific Time on October 30, 2016, and 100 entries will be selected to receive the PSoC Analog Coprocessor Pioneer Kit to create a prototype of their idea. Projects will be due by 11:55 p.m. Pacific Time on January 8, 2017 and the regional winners will be announced on January 18.

Cypress will be demonstrating its PSoC portfolio, including the PSoC Analog Coprocessor, at World Maker Faire from October 1-2, 2016 at the New York Hall of Science in booth number 3206 in Zone 3.

The PSoC Analog Coprocessor integrates efficient and powerful signal processing with an ARM® Cortex® M0+ core and programmable analog blocks, including a new Universal Analog Block (UAB) that can be configured with GUI-based software components. This combination simplifies the design of custom analog front ends for multiple sensor interfaces by allowing engineers to update sensor features quickly with no hardware or host processor software changes, while also reducing BOM costs. For example, in home automation applications, engineers can easily configure the device to continuously monitor multiple sensors, such as temperature, humidity, ambient light, motion and sound, allowing the host to stay in a standby low-power mode. Future design changes to support new sensor types can also be easily implemented by reconfiguring the programmable analog blocks. More information on the PSoC Analog Coprocessor is available at www.cypress.com/PSoCAnalog.

The design of custom sensor interfaces is enabled by Cypress’s free PSoC Creator Integrated Design Environment (IDE), which simplifies system design by enabling concurrent hardware and firmware development using PSoC Components—free embedded ICs represented by an icon in the IDE. Engineers can easily configure the programmable analog blocks in the PSoC Analog Coprocessor by dragging and dropping components on the PSoC Creator schematic and customizing them with graphical component configuration tools. The components offer fully engineered embedded initialization, calibration and temperature correction algorithms.

SiTime Corporation, a MEMS and analog semiconductor company and a wholly owned subsidiary of MegaChips Corporation (Tokyo Stock Exchange: 6875), today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators. These precision devices are engineered to solve long-standing timing problems in telecommunications and networking equipment.

“Network densification is driving rapid deployment of equipment in uncontrolled environments such as basements, curbsides, rooftops, and on poles. Precision timing components in these systems must now operate in the presence of high temperature, thermal shock, vibration and unpredictable airflow. Service providers are questioning if quartz technology is up to this challenge,” said Rajesh Vashist, CEO at SiTime. “Customers have enthusiastically validated SiTime’s MEMS-based Elite Platform, as it uniquely solves such environmental issues. We believe that our new Elite solutions will transform the $1.5 billiontelecommunications and networking timing market.”

Elite timing solutions are based on an innovative DualMEMS architecture with TurboCompensation. This architecture delivers exceptional dynamic performance with three key elements:

  • Robust, reliable, and proven TempFlat MEMS that eliminates activity dips and enables 30 times better vibration immunity than quartz
  • DualMEMS temperature sensing with 100% accurate thermal coupling that enables 40 times faster temperature tracking, which ensures the best performance under airflow and rapid temperature changes
  • Highly integrated mixed-signal circuits with on-chip regulators, a TDC (temperature to digital converter) and a low-noise PLL that deliver 5 times better immunity to power-supply noise, 30 uK temperature resolution that is 10 times better than quartz, and support for any frequency between 1 and 700 MHz

“New telecom infrastructure uses 4G/5G small cells and Synchronous Ethernet to increase network data capacity; the high-power components that are used in such systems will have high and constantly changing heat loads,” said Joe Madden, founder and principal analyst at Mobile Experts. “The dynamic performance of precision timing components during rapid temperature change will become a critical requirement in such equipment. MEMS technology inherently performs better in the presence of dynamic environmental conditions, and has become a very interesting alternative to quartz technology.”

By David W. Price and Douglas G. Sutherland

Author’s Note: The Process Watch series explores key concepts about process control—defect inspection and metrology—for the semiconductor industry. Following the previous installments, which examined the 10 fundamental truths of process control, this new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing. 

Introduction

In a previous Process Watch article [1], we showed that big excursions are usually easy to detect but finding small excursions requires a combination of high capture rate and low noise. We also made the point that, in our experience, it’s usually the smaller excursions which end up costing the fab more in lost product. Catastrophic excursions have a large initial impact but are almost always detected quickly. By contrast, smaller “micro-excursions” sometimes last for weeks, exposing hundreds or thousands of lots to suppressed yield.

Figure 1 shows an example of a micro-excursion. For reference, the top chart depicts what is actually happening in the fab with an excursion occurring at lot number 300. The middle chart shows the same excursion through the eyes of an effective inspection strategy; while there is some noise due to sampling and imperfect capture rate, it is generally possible to identify the excursion within a few lots. The bottom chart shows how this excursion would look if the fab employed a compromised inspection strategy—low capture rate, high capture rate variability, or a large number of defects that are not of interest; in this case, dozens of lots are exposed before the fab engineer can identify the excursion with enough confidence to take corrective action.

Figure 1. Illustration of a micro-excursion. Top: what is actually happening in the fab. Middle: the excursion through the lens of an effective control strategy (average 2.5 exposed lots). Bottom: the excursion from the perspective of a compromised inspection strategy (~40 exposed lots).

Figure 1. Illustration of a micro-excursion. Top: what is actually happening in the fab. Middle: the excursion through the lens of an effective control strategy (average 2.5 exposed lots). Bottom: the excursion from the perspective of a compromised inspection strategy (~40 exposed lots).

Unfortunately, the scenario depicted in the bottom of Figure 1 is all too common. Seemingly innocuous cost-saving tactics such as reduced sampling or using a less sensitive inspector can quickly render a control strategy to be ineffective [2]. Moreover, the fab may gain a false sense of security that the layer is being effectively monitored by virtue of its ability to find the larger excursions. 

Micro-Excursions 

Table 1 illustrates the difference between catastrophic and micro-excursions. As the name implies, micro-excursions are subtle shifts away from the baseline. Of course, excursions may also take the form of anything in between these two.

Table 1: Catastrophic vs. Micro-Excursions

Table 1: Catastrophic vs. Micro-Excursions

Such baseline shifts happen to most, if not all, process tools—after all, that’s why fabs employ rigorous preventative maintenance (PM) schedules. But PM’s are expensive (parts, labor, lost production time), therefore fabs tend to put them off as long as possible.

Because the individual micro-excursions are so small, they are difficult observe from end-of-line (EOL) yield data. They are frequently only seen in EOL yield data through the cumulative impact of dozens of micro-excursions occurring simultaneously; even then it more often appears to be baseline yield loss. As a result, fab engineers sometimes use the terms “salami slicing” or “penny shaving” since these phrases describe how a series of many small actions can, as an accumulated whole, produce a large result [3].

Micro-excursions are typically brought to an end because: (a) a fab detects them and puts the tool responsible for the excursion down; or, (b) the fab gets lucky and a regular PM resolves the problem and restores the tool to its baseline. In the latter case, the fab may never know there was a problem.

The Superposition of Multiple Simultaneous Micro-Excursions

To understand the combined impact of these multiple micro-excursions, it is important to recognize:

  1. Micro-excursions on different layers (different process tools) will come and go at different times
  2. Micro-excursions have different magnitudes in defectivity or baseline shift
  3. Micro-excursions have different durations

In other words, each micro-excursion has a characteristic phase, amplitude and wavelength. Indeed, it is helpful to imagine individual micro-excursions as wave forms which combine to create a cumulative wave form. Mathematically, we can apply the Principle of Superposition [4] to model the resulting impact on yield from the contributing micro-excursions.

Figure 2 illustrates the cumulative effect of one, five, and 10 micro-excursions happening simultaneously in a 1,000 step semiconductor process. In this case, we are assuming a baseline yield of 90 percent, that each micro-excursion has a magnitude of 2 percent baseline yield loss, and that they are detected on the 10th lot after it starts. As expected, the impact of a single micro-excursion is negligible but the combined impact is large.

Figure 2. The cumulative impact of one, five, and 10 simultaneous micro-excursions happening in a 1,000 step process: increased yield loss and yield variation.

Figure 2. The cumulative impact of one, five, and 10 simultaneous micro-excursions happening in a 1,000 step process: increased yield loss and yield variation.

It is interesting to note that the bottom curve in Figure 2 would seem to suggest that the fab is suffering from a baseline yield problem. However, what appears to be 80 percent baseline yield is actually 90 percent baseline yield with multiple simultaneous micro-excursions, which brings the average yield down to 80 percent. This distinction is important since it points to different approaches in how the fab might go about improving the average yield. A true baseline yield problem would suggest that the fab devote resources to run experiments to evaluate potential process improvements (design of experiments (DOEs), split lot experiments, failure analysis, etc.). These activities would ultimately prove frustrating as the engineers would be trying to pinpoint a dozen constantly-changing sources of yield loss.

The fab engineer who correctly surmises that this yield loss is, in fact, driven by micro-excursions would instead focus on implementing tighter process tool monitoring strategies. Specifically, they would examine the sensitivity and frequency of process tool monitor inspections; depending on the process tool, these monitors could be bare wafer inspectors on blanket wafers and/or laser scanning inspectors on product wafers. The goal is to ensure these inspections provide timely detection of small micro-excursions, not just the big excursions.

The impact of an improved process tool monitoring strategy can be seen in Figure 3. By improving the capture rate (sensitivity), reducing the number of non-critical defects (by doing pre/post inspections or using an effective binning routine), and reducing other sources of noise, the fab can bring the exposed product down from 40 lots to 2.5 lots. This, in turn, significantly reduces the yield loss and yield variation.

Figure 3. The impact of 10 simultaneous micro-excursions for the fab with a compromised inspection strategy (brown curve, ~40 lots at risk), and a fab with an effective process tool monitoring strategy (blue curve, ~2.5 lots at risk).

Figure 3. The impact of 10 simultaneous micro-excursions for the fab with a compromised inspection strategy (brown curve, ~40 lots at risk), and a fab with an effective process tool monitoring strategy (blue curve, ~2.5 lots at risk).

Summary

Most fabs do a good job of finding the catastrophic defect excursions. Micro-excursions are much more common and much harder to detect. There are usually very small excursions happening simultaneously at many different layers that go completely undetected. The superposition of these micro-excursions leads to unexplained yield loss and unexplained yield variation.

As a yield engineer, you must be wary of this. An inspection strategy that guards only against catastrophic excursions can create the false sense of security that the layer is being effectively monitored—when in reality you are missing many of these smaller events that chip away or “salami slice” your yield.

References:

About the Author: 

Dr. David W. Price is a Senior Director at KLA-Tencor Corp. Dr. Douglas Sutherland is a Principal Scientist at KLA-Tencor Corp. Over the last 10 years, Dr. Price and Dr. Sutherland have worked directly with more than 50 semiconductor IC manufacturers to help them optimize their overall inspection strategy to achieve the lowest total cost. This series of articles attempts to summarize some of the universal lessons they have observed through these engagements.