Category Archives: MEMS

A combination of device releases, price reductions, and company rationalizations marked the first quarter of 2016 (1Q16) in the worldwide wearables market. According to data from International Data Corporation, (IDC) Worldwide Quarterly Wearable Device Tracker, total shipment volumes reached 19.7 million units in 1Q16, an increase of 67.2% from the 11.8 million units shipped in 1Q15.

The first quarter saw its fair share of significant events to entice customers, with multiple fitness trackers and smartwatches introduced at the major technology shows; post-holiday price reductions on multiple wearables, including Apple’s Sport Watch; and greater participation within emerging wearables categories, particularly clothing and footwear. Conversely, several start-ups announced headcount reduction or shut down entirely, underscoring how competitive the wearables market has become.

“The good news is that the wearables market continues to mature and expand,” noted Ramon Llamas, research manager for IDC’s Wearables team. “The wearables that we see today are several steps ahead of what we saw when this market began, increasingly taking their cues from form, function, and fashion. That keeps them relevant. The downside is that it is becoming a crowded market, and not everyone is guaranteed success.”

Still, there are two areas where the market shows continued growth: smart watches and basic wearables (devices which do not run third party applications).

“There’s a clear bifurcation and growth within the wearables market,” said Jitesh Ubrani senior research analyst for IDC’s Mobile Device Trackers. “Smart watches attempt to offer holistic experiences by being everything to everyone, while basic wearables like fitness bands, connected clothing, or hearables have a focused approach and often offer specialized use cases.”

Ubrani continued, “It’s shortsighted to think that basic wearables and smart watches are in competition with each other. Right now, we see both as essential to expand the overall market. The unique feature sets combined with substantial differences in price and performance sets each category apart, and leaves plenty of room for both to grow over the next few years.”

Top Five Wearables Vendors

Fitbit began 2016 the same way it finished 2015: as the undisputed leader in the wearables market. The launch of its new Alta and Blaze devices resulted in million unit shipment volumes for each, pointing to a new chapter of fashion-oriented fitness trackers. It also points to significant declines for its previously successful Surge, Charge, Charge HR, and Flex product lines. Still, with a well-segmented portfolio, pricing strategy, and a strong brand, Fitbit’s position is well-established.

Xiaomi supplanted Apple in 1Q16 and captured the number 2 position. The company expanded its line of inexpensive fitness trackers to include heartrate monitoring and also recently launched a kids’ watch to help parents track their children. It should be pointed out that its success is solely based on China, and expanding beyond its home turf will continue to be its largest hurdle.

According to Apple CEO Tim Cook, the Watch has met the company’s expectations. Its total volumes and revenue trailed far behind its iPhone, iPad, and Mac product lines, and did little to stem their declines. Until the next version of the Watch comes out, it would appear that Apple will continuously update its watch bands to keep the product relevant.

Garmin finished slightly ahead of Samsung on the strength of its wristbands and watches appealing to a wide range of athletes, most especially golfers, runners, and fitness tracker enthusiasts. While the company added two fitness trackers with the vivoactive HR and the vivofit 3, Garmin launched its first eyeworn device, the Varia Vision In-Sight Display, for cyclists.

Samsung landed in the number 5 position on the success of its Gear S2 and Gear S2 Classic smartwatch. What sets the Gear S2 apart from most other smartwatches is that it is among the very few with a cellular connectivity version, forgoing the need to be constantly tethered to a smartphone. It is also compatible with Android smartphones beyond Samsung’s own, broadening its reach. However, its application selection trails behind what is available for Android Wear and watchOS.

BBK tied* with Samsung for fifth place worldwide. This is the second time that BBK finished among the top five vendors worldwide, having debuted in 3Q15 with its Y01 phone watch for children. The company returns with another phone watch for children, the Y02 with improved water resistance and durability.

Top Five Wearables Vendors, Shipments, Market Share and Year-Over-Year Growth, Q1 2016 (Units in Millions)
Vendor

1Q16 Unit
Shipments

1Q16 Market
Share

1Q15 Unit
Shipments

1Q15 Market
Share

Year-Over-
Year Growth
1. Fitbit 4.8 24.5 % 3.8 32.6 % 25.4 %
2. Xiaomi 3.7 19.0 % 2.6 22.4 % 41.8 %
3. Apple 1.5 7.5 % N/A 0.0 % N/A
4. Garmin 0.9 4.6 % 0.7 6.1 % 27.8 %
5. Samsung* 0.7 3.6 % 0.7 5.8 % 4.5 %
5. BBK* 0.7 3.6 % N/A 0.0 % N/A
Others 7.3 37.2 % 3.9 33.1 % 87.9 %
Total 19.7 100.0 % 11.8 100.0 % 67.2 %
Source: IDC Worldwide Quarterly Wearables Tracker, May 16, 2016

* IDC declares a statistical tie in the worldwide wearables market when there is less than one tenth of one percent (0.1%) difference in the unit shipment share of two or more vendors.

Top Five Basic Wearables Vendors, Shipments, Market Share and Year-Over-Year Growth, Q1 2016 (Units in Millions)
Vendor

1Q16 Unit
Shipments

1Q16 Market
Share

1Q15 Unit
Shipments

1Q15 Market
Share

Year-Over-
Year Growth
1. Fitbit 4.8 29.4 % 3.8 38.7 % 25.4 %
2. Xiaomi 3.7 22.8 % 2.6 26.6 % 41.8 %
3. Garmin 0.8 5.0 % 0.6 6.0 % 36.5 %
4. XTC 0.7 4.3 % N/A 0.0 % N/A
5. Lifesense 0.7 4.1 % N/A 0.0 % N/A
Others 5.7 34.5 % 2.9 28.7 % 98.2 %
Total 16.4 100.0 % 9.9 100.0 % 65.1 %
Source: IDC Worldwide Quarterly Wearables Tracker, May 16, 2016
Top Five Smartwatch Vendors, Shipments, Market Share and Year-Over-Year Growth, Q1 2016 (Units in Millions)
Vendor

1Q16 Unit
Shipments

1Q16 Market
Share

1Q15 Unit
Shipments

1Q15 Market
Share

Year-Over-
Year Growth
1. Apple 1.5 46.0 % N/A 0.0 % N/A
2. Samsung 0.7 20.9 % 0.5 29.8 % 40.5 %
3. Motorola 0.4 10.9 % 0.2 11.0 % 98.2 %
4. Huawei 0.2 4.7 % N/A 0.0 % N/A
5. Garmin 0.1 3.0 % 0.1 7.2 % -17.3 %
Others 0.5 14.5 % 0.8 52.0 % -44.2 %
Total 3.2 100.0 % 1.6 100.0 % 100.2 %
Source: IDC Worldwide Quarterly Wearables Tracker, May 16, 2016

Table Notes:

  • Data is preliminary and subject to change.
  • Vendor shipments are branded device shipments and exclude OEM sales for all vendors.
  • The “Vendor” represents the current parent company (or holding company) for all brands owned and operated as a subsidiary.
  • The table labeled “Top Five Wearables Vendors…” represents the sum of both basic and smart wearables equaling the total wearable market size.
  • The table labeled “Top Five Basic Wearables Vendors…” represents the total basic wearable market size.
  • The table labeled “Top Five Smartwatch Vendors…” does not equal total smart wearable market size as certain form factors (i.e. eyewear, wristbands) are excluded.

In addition to the tables above, an interactive graphic showing worldwide market share by device type over the previous five quarters is available here. The chart is intended for public use in online news articles and social media. Instructions on how to embed this graphic can be found by viewing this press release on IDC.com.

Silicon Integration Initiative (Si2), an Austin-based integrated circuit research and development joint venture, has launched a project to help designers reduce power consumption, a growing challenge for most system-on-chip designs. The project will develop new power modeling technology to estimate power consumption more easily and more accurately throughout the design process, especially during the earliest stages.

The end result will be a new power modeling standard to reduce resources and costs needed to develop virtually every type of SoC. Jerry Frenkil, director of OpenStandards, said that the Si2 Low Power Working Group, part of the newly restructured Si2 OpenStandards program, will lead this industry-wide effort.

“Every SoC design team is grappling with the continued need to reduce power consumption,” Frenkil said. “That’s especially true for mobile devices, but it’s also a concern throughout the electronics industry. One way to accomplish this is through improved multi-level power modeling techniques that better predict SoC power and performance. Right now there’s no commonly accepted way to develop an accurate estimation of power consumption early in the design phase. This often leads to designs being power inefficient, performance constrained, or both.”

Frenkil said the standard will also “enable more efficient and reliable power analyses and optimizations since the same model will be used from system-level design through gate level implementation and all phases in between.”

The approved specification will be contributed to the IEEE P2416 Standards Working Group for industry-wide distribution. Nagu Dhanwada, senior R&D engineer at IBM, chairs both the IEEE P2416 and Si2 Low Power Modeling Working Groups. “Since Si2 is an R&D joint venture, its members can work together to develop specifications, tests and proof-of-concepts with anti-trust protection. This specification will greatly accelerate standardization efforts within P2416, and testing prior to IEEE standardization will enable us to rapidly prove out the use of the new standard before it hits the street,” Dhanwada explained.

IEEE P2416 is an essential component of a coordinated IEEE effort focusing on system-level design. The IEEE 1801 standard currently expresses design intent. It’s latest update, IEEE 1801-2015, includes support for power modeling.

John Biggs, chair of the IEEE 1801 Working Group said, “Efforts of the Si2 Low Power Working Group will help the IEEE P2416 Working Group standardize the representation of power consumption data. The fruits of this work, in combination with the new power modeling capability in IEEE 1801-2015, should greatly ease the challenging task of energy aware system level design.”

The new Si2 model specification is expected to be completed in October. For more information about this project, contact Jerry Frenkil at [email protected]. For information about the Low Power Working Group and other OpenStandards programs, visit http://www.si2.org/openstandards/.

Founded in 1988, Si2 is a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools. All Si2 activities are carried out under the auspices of the The National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws. Si2’s international membership includes semiconductor foundries, fabless manufacturers, and EDA companies.

Samsung Electronics Co. Ltd. today recognized five of the best and brightest computer science and engineering students in the U.S. as it announced the inaugural class of the Samsung PhD Fellowship. Each student will receive a Fellowship award of $50,000 as well as mentorship to support their ground-breaking research.

The new PhD Fellowship program rewards those who dare to innovate. Jointly sponsored by Samsung Semiconductor and the Samsung Strategy and Innovation Center (SSIC), the program recognizes outstanding Ph.D. students working in five areas: Software and Memory System Solutions for Data Centers; Low-Power CPU and System IP Architecture and Designs; Advanced Semiconductor Devices, Materials and Simulation; Internet of Things; and Smart Machines.

Samsung launched the Fellowship program with a call for partner universities to nominate outstanding students working on the above topics. Twelve of the best-qualified nominees were selected as Finalists and invited to showcase events at the new headquarters in Silicon Valley or at the Samsung Austin R&D Center. Each student Finalist presented his or her research proposal to an audience of Samsung engineers, Lab directors, and innovation leaders and met many of them for interviews as well. Following these events, the five Fellows were selected from this terrific group.

Each Fellow will be connected to an engineer from one of the Samsung Semiconductor or SSIC Labs in Silicon Valley or Austin. This mentor will provide an industry perspective on their research and will invite the student to join Samsung for an internship.

“We are thrilled to be supporting these outstanding students through our Fellowship program. Samsung strives to be a leader in the creation of new technology, and a great way to do that is by supporting basic research and PhD training,” said Stefan Heuser, VP of Operations and Innovation for SSIC. “We were very impressed by the students nominated by the universities—all of them have made an impact in key areas of research. The Finalists were an even stronger group, and we are confident that they will become leaders in their fields. But the five Fellows are truly exceptional, and we look forward to working with them in the coming year. We thank the universities and all of the student nominees for their efforts and for their interest in our program.”

Following are the five Samsung PhD Fellows for 2016-2017:

  • Dinesh Jayaraman, “Embodied Learning for Visual Recognition”
    Nominating professor: Kristen Grauman, University of Texas at Austin
  • Jiajun Wu, “Computational Perception of Physical Object Properties”
    Nominating professors: William Freeman and Joshua Tenenbaum, MIT
  • Joy Arulraj, “Rethinking Database Systems for Next-Generation Memory Technologies and Real-Time Analytics”
    Nominating professor: Andy Pavlo, Carnegie Mellon University
  • Niranjini Rajagopal, “Sensor Fusion and Automatic Infrastructure Mapping for Indoor Localization Systems”
    Nominating professors: Anthony Rowe and Bruno Sinopoli, Carnegie Mellon University
  • Wooseok Lee, “Exploring Future Mobile Heterogeneous Multicore System Architectures”
    Nominating professors: Lizy John and Andreas Gerstlauer, University of Texas at Austin

Nominations for next year’s PhD Fellowship program will open in September 2016. Additional information about the Fellowship program can be found at: http://www.samsung.com/us/labs/fellowship/index.html

With discussion increasingly focused on autonomous vehicles and vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, demand is rising for electronic systems to support new, intelligent cars. Meanwhile, older, existing technology on high-end vehicles continues to migrate down to mid-range and low-end cars and technology-based aftermarket products are gaining momentum.

Given all the new electronic systems that have been added to automobiles in recent years, one might reason that this segment accounts for a large share of the total global electronic system sales. That’s simply not the case. On a worldwide basis, automotive electronics represented only 8.9% of the $1.42 trillion total 2015 worldwide electronic systems market, a slight increase from 8.6% in 2014. Automotive’s share of global electronic system production has increased only incrementally and is forecast to show only slight gains through 2019, when automotive electronics are forecast to account for 9.4% of global electronic systems sales. Despite the many new electronics systems that are being added in new vehicles, IC Insights believes pricing pressures on automotive ICs and electronic systems will prevent the automotive end-use application from accounting for much more than its current share of total electronic systems sales through 2019.

Figure 1 shows the quarterly market trends for the three largest automotive IC markets—Analog, MCU, and special-purpose logic. As shown, falling average selling prices in these three segments have largely offset unit growth over the past few years. In 2015, falling ASPs led to a 3% decline in the automotive IC market to $20.5 billion. Based on IC Insights’ forecast, the automotive IC market will return to growth in 2016, increasing 4.9% to $21.5 billion, as currency exchange rates stabilize and additional electronic systems (such as backup cameras) become mandatory equipment on new cars sold in the U.S. The automotive IC market is now forecast to reach $28.0 billion in 2019, which represents average annual growth of 5.8% from $21.1 billion in 2014. Based on IC Insights’ forecast, the 2019 automotive IC market will be 2.6x the size it was in 2009 when the market was only $10.6 billion—its low-point during the great recession.

Figure 1

Figure 1

Analog ICs and MCUs together accounted for 74% of the estimated $20.5 billion automotive IC market in 2015. Demand for automotive MCUs continues to expand as more vehicles are designed with embedded computer systems to address safety and efficiency issues demanded from legislators and consumers. As cars get smarter and more connected, demand is growing for memory and storage to support a wide array of applications, particularly those that require quick boot up times as soon as the driver turns the ignition key. DRAM and flash memory, which receive considerable attention in computing, consumer, and communication applications, are currently much less visible in the automotive IC market but memory ICs are expected to account for 12.0% of the 2019 automotive IC market, an increase from 7.8% in 2015.

The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month’s total of $26.0 billion. Sales from the first quarter of 2016 were $78.3 billion, down 5.5 percent compared to the previous quarter and 5.8 lower than the first quarter of 2015. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Global semiconductor sales increased in March for the first time in five months, but soft demand, market cyclicality, and macroeconomic conditions continue to impede more robust growth,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Q1 sales lagged behind last quarter across nearly all regional markets, with the Americas showing the sharpest decline.”

Regionally, month-to-month sales increased in Japan (4.8 percent), Asia Pacific/All Other (2.3 percent), and Europe (0.1 percent), but fell in China (-1.1 percent) and the Americas (-2.8 percent). Compared to the same month last year, sales in March increased in Japan (1.8 percent) and China (1.3 percent), but decreased in Asia Pacific/All Other (-6.4 percent), Europe (-9.8 percent), and the Americas (-15.8 percent).

“Eighty-three percent of U.S. semiconductor industry sales are into markets outside the U.S., so access to overseas markets is imperative to the long-term strength of our industry,” Neuffer said. “The Trans-Pacific Partnership (TPP) is a landmark trade agreement that would tear down myriad barriers to trade with countries in the Asia-Pacific. The TPP is good for the semiconductor industry, the tech sector, the American economy, and the global economy. Congress should approve it.”

March 2016

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.03

4.89

-2.8%

Europe

2.66

2.67

0.1%

Japan

2.47

2.59

4.8%

China

8.02

7.93

-1.1%

Asia Pacific/All Other

7.83

8.01

2.3%

Total

26.02

26.09

0.3%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.81

4.89

-15.8%

Europe

2.96

2.67

-9.8%

Japan

2.55

2.59

1.8%

China

7.83

7.93

1.3%

Asia Pacific/All Other

8.57

8.01

-6.4%

Total

27.70

26.09

-5.8%

Three-Month-Moving Average Sales

Market

Oct/Nov/Dec

Jan/Feb/Mar

% Change

Americas

5.75

4.89

-15.0%

Europe

2.77

2.67

-3.6%

Japan

2.57

2.59

0.8%

China

8.45

7.93

-6.1%

Asia Pacific/All Other

8.08

8.01

-0.8%

Total

27.62

26.09

-5.5%
Year-to-year percent change in world semiconductor revenues over the past 20 years.

Year-to-year percent change in world semiconductor revenues over the past 20 years.

By Lara Chamness, Industry Research and Statistics, SEMI

North America has a long and rich history of semiconductor manufacturing and innovation. As home to device manufacturers such as Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, NXP (Freescale), Fairchild, Avago, Qorvo, Microchip, ON Semiconductor, significant operations of Samsung, and leading fabless companies such as Qualcomm, Broadcom, NVIDIA, AMD, Apple, Marvell, and Xilinx, North America continues to play an important role in advanced semiconductor manufacturing and in device and system design. SEMI’s Fab Forecast shows that North America accounts for 14 percent of Worldwide Installed Fab capacity (excluding discretes).

Source: SEMI (www.semi.org)

In terms of revenues, IC Insights recently announced, that companies headquartered in the United States continue to capture the bulk of IDM and Fabless IC Sales.

  • U.S. companies account for 51 percent of IDM Companies IC Sales in 2015
  • U.S. companies account for 62 percent of Fabless Companies IC Sales in 2015

Due to the presence of leading device manufacturers, North America represents a significant portion of the new equipment market, annual spending on average over the past five years has been in excess of $7 billion. Spending for new equipment is expected to be approach $6 billion this year.

Source: SEMI/SEAJ; Forecast, SEMI (www.semi.org)

With such a large installed fab base, North America also claims a significant portion of the wafer fab materials market.  Comparing global fab capacity to global wafer fab market share, North America represents 18 percent of the Wafer Fab Materials market compared to 14 percent of global fab capacity. This is due to the advanced device manufacturing that occurs in the region, which requires more process steps and advanced materials which fetch higher average selling prices.

Regional Wafer Fab Materials Markets

Source: SEMI (www.semi.org)

The equipment market is expected to increase about 10 percent in North America this year due to sizable investments by GLOBALFOUNDRIES, Intel and Samsung, while the Wafer Fab Materials Market is expected to remain flat this year relative to last year. As companies like Apple, Intel, Qualcomm continue to innovate, North America will remain an essential force in both device and systems design and in semiconductor manufacturing.

Plan to attend the SEMI/Gartner Market Symposium at SEMICON West 2016 on Monday, July 11, for an update on the semiconductor market outlook.

Nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law theory and co-founder of Intel, is the recipient of its lifetime of innovation award. Imec’s annual award recognizes Dr. Moore’s visionary view, unrivalled innovation, and his profound impact on the global electronics industry.

In 1965, Dr. Moore predicted that the number of components on an integrated circuit (IC) would double every year for the coming 10 years, thereby making ICs and computer processing simultaneously faster, cheaper, and more powerful. In 1975, Dr. Moore revised the forecast rate to approximately every two years. Moore’s law turned out to be incredibly accurate, growing beyond its predictive character to become an industry driver that holds true today, 50 years later. Keeping up with Moore law’s progression has required a tremendous amount of engineering and commitment from the global semiconductor industry. While its meaning has evolved over generations, it has had a profound impact in many areas of technological change and progress.

“It is truly an honor to present imec’s lifetime innovation award to Dr. Moore, on behalf of all our global partners and our researchers,” stated Luc Van den hove, president and CEO of imec. “Dr. Moore’s name is synonymous with progress, and his vision has inspired and given direction to the entire semiconductor industry, which has revolutionized the way we compute, communicate, and interact. As the industry upholds this prediction and brings forth new innovations in chip technology, the future of Moore’s law will impact such things as healthcare, a sustainable climate, and safer transport all for the better.”

Dr. Moore began his career at Johns Hopkins University. He cofounded Fairchild Semiconductor in 1957 and launched Intel in 1968 together with Robert Noyce and Andy Grove. Today, Intel is a world leader in the design and manufacturing of integrated circuits and is the largest semiconductor company. Dr. Moore served as Intel CEO from 1975-1987, and then became its chairman of the board until his retirement in 1997.

“Although Moore’s law was created more than 50 years ago, it remains extremely valid and serves as a guide to what we innovate at imec,” continued Van den hove. “Throughout our organizations’ 32-year existence, we’ve worked at enabling Moore’s law and helping our partners innovate and develop the modern technology that society has embraced and demands. Dr. Moore’s legacy continues to be our mission and we are privileged to honor him.” 

Imec’s Lifetime of Innovation award is awarded to Dr. Moore on May 24, 2016 at its annual ITF Brussels, the flagship of imec’s worldwide ITF events.

By Debra Vogler, SEMI

The demand for smartphones and other portable devices that need efficient power management is driving the analog IC market. Additionally, growth is fueled by the Internet of Things (IoT) and the MEMS/sensors devices that enable it. To explore the supply chain opportunities within the analog sector, including MEMS/sensors, SEMI introduced the Analog and New Frontiers Program at SEMICON West 2016. This program — part of the Extended Supply Chain Forum — will feature four, hour-long sessions, each focusing on a different supply chain challenge or area of interest within the analog sector. One of the featured speakers will be Dr. Peter Hartwell, senior director of Advanced Technology at InvenSense. Dr. Hartwell’s pre-show interview provides a provocative look at supply chain challenges facing MEMS/sensors manufacturers.

Perhaps the most significant challenge facing manufacturers of MEMS/sensors is commoditization of sensors and where the profits end up. “The windfall is going to the people enabling the applications at the top,” Hartwell told SEMI. “Especially with mobile devices and IoT.” He pointed out that if there isn’t a way for value capture at the lowest levels – i.e., the companies that enable the systems and devices that create the IoT experience – he predicts a plateau of innovation. “We won’t have the resources to push technology forward, so as a sensor company, we are trying to find ways to move further up the value chain to extract some of that value.”

Moving up the value chain, however, requires sensor companies to become more aware of system considerations. Design convergence is one way to accomplish this. “We think of design convergence as SiPs (System in Package) or SoCs (System on a Chip),” said Hartwell. “We start to put together our sensors with other capabilities, whether that means having processing power in our package or looking at different kinds of sensors that come together.”

He speculates about a time when there will be a single-chip IoT device, i.e., a one-chip device comprising sensors, storage, radio, power management, and perhaps even energy harvesting. “Maybe that’s where the convergence goes.” Still, in the end, the challenge becomes how the industry gets the money back to the bottom of the supply chain. “We’re inching up towards where that money is by building those systems and understanding what it takes to make them.”

The fabless model for MEMS/sensors

Aside from the commoditization conundrum, Hartwell sees another supply chain opportunity arising if the industry embraces a truly fabless business model. Such a model would be based on companies that only design the devices with the process kits arising from different companies. The fundamental question with that scenario, Hartwell notes, is how the various MEMS/sensors houses differentiate themselves.

Hartwell noted that InvenSense embraces the fabless model — the company has a Shuttle program with its foundry partners, TSMC and GLOBALFOUNDRIES. The InvenSense Shuttle gives MEMS developers the opportunity to fabricate their designs on the patented InvenSense Fabrication MEMS-CMOS integrated platform. Though competitors are not able to take part in the Shuttle program, it is available to universities and start-up partner companies. That said, Hartwell noted that the company keeps its ‘cards pretty close to the vest.’ So the challenge is how to open up that model while retaining differentiation when fabs and foundries tend to want to wring out cost from process development by using as much standardization as possible.

“The million dollar question,” said Hartwell, “is could we ever get to the point where the foundry tells the sensor companies what to do — the EDA companies would love to see this happen because it would lead to standardization of design tools and simulators.”

Opportunities for test and the digital interface

Test and packaging are two more opportunity areas for the supply chain. Hartwell pointed out that most MEMS/sensors companies do their own testing using their own test infrastructure. “It’s one differentiator that we haven’t been willing to give up,” said Hartwell. “So this is an opportunity for someone to come in and turn over the apple cart.”

With the proliferation of sensors that need to interface with a multi-chip system comes the challenge of having to connect using more and more pins. And though the industry has solutions for a digital interface to the sensor world, additional work needs to focus on making that interface robust. Hartwell explained that multiple interrupts and digital lines are needed and it gets complicated when you have five, six, or seven sensors in a system. “There are just not enough pins,” said Hartwell. “So we’re seeing a change in the wiring and the interface will have to be something new to solve the integration problem, which has become nontrivial.” He further observed that IoT is driven by four attributes: size, cost, power, and performance. “To get to the promise of IoT, it will take breakthroughs to get to a trillion sensors. You will have to reduce size, cost, power and performance, and some of those by one or two orders of magnitude.”

Wringing out costs with packaging (or, “no” package)

Hartwell minces no words when it comes to tackling size and cost in MEMS: packaging is MEMS. “This is the biggest opportunity to take out size and cost,” Hartwell told SEMI. “The influence of packaging on the transducer can’t be ignored. Packaging hurts the size, it hurts performance, and it’s something for which I don’t want to pay. It’s a huge opportunity for a shift.”

For Hartwell, the crux of the challenge is how to take a single piece of silicon that has a 6-axis sensor system, and then test it, trim it, ship it, and put it into whatever system it’s going into without changing its trim. While chip-scale packaging could be the opportunity the MEMS industry needs, he wants to keep the options open for other ways to break the paradigm.

What’s clear is that ample business opportunities exist for the supply chain within the MEMS/sensors sector to get rid of cost and size, address the test challenge, get rid of the package, and finally, new ways to handle and assemble parts.

To learn more, attend the Analog and New Frontiers Forum (part of the Extended Supply Chain Forum) at SEMICON West. The forum will be held on Wednesday, July 13, in four, hour-long sessions on the Keynote Stage, North Hall, Moscone Center. Check the SEMICON West 2016 website for more details and a list of confirmed speakers for each of the sessions.

Cypress Semiconductor Corp. (Nasdaq:  CY) and Broadcom Limited (Nasdaq:  AVGO) today announced the signing of a definitive agreement under which Cypress will acquire Broadcom’s Wireless Internet of Things (IoT) business and related assets in an all-cash transaction valued at $550 million. Under the terms of the deal, Cypress will acquire Broadcom’s Wi-Fi, Bluetooth and Zigbee IoT product lines and intellectual property, along with its WICED brand and developer ecosystem. Broadcom’s IoT business unit, which employs approximately 430 people worldwide, generated $189 million in revenue during the last twelve months. The acquisition strengthens Cypress’s position in key embedded systems markets, such as automotive and industrial, and establishes it as a leader in the high-growth consumer IoT market, a segment that includes wearable electronics and home automation solutions.

The transaction, which has been approved by the board of directors of Cypress and Broadcom, is expected to close in the third calendar quarter of 2016, subject to customary conditions and regulatory approvals. Cypress expects the transaction to be accretive within a year of closing and to improve its gross margin, earnings and long-term revenue potential.

“Cypress is a significant player in the IoT today because of our ultra-low-power PSoC programmable system-on-chip technology, but we’ve only been able to pair it with generic radios so far. Now we have the highly regarded Broadcom IoT business—Wi-Fi, Bluetooth and Zigbee RF technologies—that will transform us into a force in IoT and provide us with new market opportunities as well,” Cypress President and CEO T.J. Rodgers said. “What we bring to the party is over 30,000 customers worldwide who need advanced, ultra-low-power wireless communication but only can absorb it in the form of an easy-to-use programmable embedded system solution.”

“We are thrilled to be joining forces with Cypress to address the fast growing IoT market,” Broadcom IoT General Manager Stephen DiFranco said. “With our IoT connectivity products, Cypress will be able to provide the connectivity; the MCU, system-on-chip, module and memory technologies; and the mature developer ecosystem that IoT designers require, creating an end-to-end portfolio of embedded solutions and a single IoT design platform.”

Under the terms of the deal, Broadcom will continue to focus on its wireless connectivity solutions for the access and mobility segments that are not IoT related, including serving set-top box, wireless access, smartphone, laptop and notebook customers. Cypress will capitalize on the rapidly growing Wi-Fi and Bluetooth connectivity (17% per year1) markets in consumer, industrial and automotive IoT segments.

“The robust, ready-to-scale WICED brand and developer network of module makers, value-added resellers (VARs), technology partners and ODMs who are already working with its technology will give us immediate revenue growth capability in new channels,” Rodgers said. “Cypress will continue to support and grow this network and to provide it with future generations of innovative, disruptive connected products. Cypress will also bring these new technologies to the automotive market, where we are already No. 3 worldwide in microcontrollers and memories, and where the connected car boom has just started.”

Greenhill & Co., LLC served as lead financial advisor, Bank of America Merrill Lynch served as financial advisor and is providing committed debt financing, subject to customary conditions, and Wilson Sonsini Goodrich & Rosati acted as legal counsel to Cypress for this transaction.

Cartamundi, imec and Holst Centre (set up by imec and TNO) are proud to announce to have just won the “Best Product” – Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi’s playing cards. The jury has hereby recognized the potential of this technology to become a gamechanger for the gaming industry, as well as for many other printed electronics applications in the Internet-of-Things domain.

With economic and form-factor advantages compared to traditional silicon-based technologies, Holst Centre’s and imec’s ultra-thin plastic RFID solution is essential to improve and broaden the applicability of electronics seamlessly integrated in paper. This enables Cartamundi to develop connected devices with additional value and content for consumers. At the conference, Cartamundi, imec and Holst Centre demonstrate an industry-first prototype of the ultra-thin flexible RFID chip integrated into a playing card. In each card, the RFID chip has a unique code that communicates wirelessly to an RFID reader, giving the cards in the game a unique digital identity.

Chris Van Doorslaer (CEO) is delighted with the award and sounds ambitious:

“Cartamundi’s ambition to embed wireless RFID tags in games and trading cards products is a ‘game changer’ indeed. The new technology will connect traditional game play with electronic devices like smartphones and tablets. As Cartamundi is committed to creating products that connect families and friends of every generation to enhance the valuable quality time they share during the day, this technology is a real enabler.”

“This is a thrilling development to demonstrate our TOLAE electronic technology integrated in the product of a partner company. TOLAE stands for Thin, Oxide and Large-Area Electronics”, stated Paul Heremans, department director of thin-film electronics at imec and technology director at the Holst Centre. “Our prototype thin-film RFID is thinner than paper—so thin that it can be invisibly embedded in paper products, such as playing cards. This key enabling technology will bring the cards and traditional games of our customer in direct connection with the Cloud. This achievement also opens up new applications in the IoT domain that we are exploring, to bring more data and possibilities to applications such as smart packaging, security paper, and maybe even banknotes.”

Steven Nietvelt Chief Technology & Innovation Officer: “This is Cartamundi at it’s very best: bringing new solutions to the ever creative game developing community. We are convinced the gaming community will be inspired by this technology. It can possibly enhance existing games but also allows for brand new concepts to arise.”

Imec and Cartamundi engineers will now explore up-scaling of the technology using a foundry production model.

This award would not have been possible without the support and advise of VLAIO. VLAIO played a substantial role by bringing all partners of the project together.

icards