Category Archives: MEMS

The global market for semiconductors used in electric vehicle (EV) charging stations for plug-in hybrid (PH) and battery electric vehicles (BEV) will continue to expand in the coming years, providing significant growth opportunities to semiconductor manufacturers.  Revenue from semiconductors used in EV charging stations reached $44 million in 2014 and is expected to grow at a compound annual growth rate (CAGR) of 39 percent to reach $233 million in 2019, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

“Fast charging is a necessary step to the strong adoption of EVs and a higher power rating is required to support these shorter charging times,” said Noman Akhtar, industrial semiconductors analyst for IHS Technology. “Electric vehicle charging stations with higher ratings require more power semiconductors, especially discrete semiconductor components, which will lead to increased semiconductor revenue growth.”

In 2014, the average price for semiconductor components in a level-two charging station — which could charge a battery in about five hours — was $143. By comparison, semiconductor components used in the latest fast-charging direct-current (DC) chargers now cost more than $1,000; however, they are capable of charging a vehicle battery to 80 percent of capacity in just 15 minutes.

Average selling prices of semiconductors used in communication modules are expected to increase over time, as the industry moves toward single system-on-chip (SoC) solutions that not only provide faster control, but also include the memory required for secure communications and other applications. “Better communication between the utility and the charger improves the stability of the electric grid,” Akhtar said. “The latest developments in communication interface ICs enable more secure and reliable information transfer.”

Teams of researchers from the University of Illinois at Urbana-Champaign (UIUC) have demonstrated a biosensor capable of counting the blood cells electrically using only a drop of blood. The blood cell count is among the most ubiquitous diagnostic tests in primary health care. The gold standard routinely used in hospitals and testing laboratories is a hematology analyzer, which is large and expensive equipment, and requires trained technicians and physical sample transportation. It slows turn-around time, limits throughput in hospitals, and limits accessibility in resource-limited settings. Bashir and his team have developed a biosensor to count red blood cell, platelet, and white blood cell counts, and its 3-part differential at the point-of-care while using only 11 microL of blood.

(a) Schematic of the biosensor used for total leukocyte and its differential counts. The inset shows the micro-fabricated coplanar electrodes aligned with the cell counting aperture of cross-section 15 µm x 15 µm. (b) Representative voltage pulses generated as the individual cells pass over the electrodes. (c) The pulse amplitude histogram shows the distinct populations of lymphocytes and granulocytes + monocytes. CREDIT: TECHNOLOGY

The microfluidic device can electrically count the different types of blood cells based on their size and membrane properties. To count leukocyte and its differentials, red blood cells are selectively lysed and the remaining white blood cells were individually counted. The specific cells like neutrophils were counted using multi-frequency analysis, which probe the membrane properties of the cells. However, for red blood cells and platelets, 1 microL of whole blood is diluted with PBS on-chip and the cells are counted electrically. The total time for measurement is under 20 minutes. The report appears in the December 2015 issue of the journal TECHNOLOGY.

“Our biosensor exhibits the potential to improve patient care in a spectrum of settings. One of the compelling is in resource-limited settings where laboratory tests are often inaccessible due to cost, poor prevalence of laboratory facilities, and the difficulty of follow-up upon receiving results that take days to process,” says Professor Rashid Bashir of the University of Illinois at Urbana-Champaign and Principal Investigator on the paper.

There exists a huge potential to translate our biosensor commercially for blood cell counts applications,” says Umer Hassan, Ph.D., the lead author on this paper. “The translation of our technology will result in minimal to no experience requirement for device operation. Even, patients can perform the test at the comfort of their home and share the results with their primary care physicians via electronic means too.” “The technology is scalable and in future, we plan to apply it to many other potential applications in the areas of animal diagnostics, blood transfusion analysis, ER/ICU applications and blood cell counting for chemotherapy management” says Professor Bashir. The clinical trials of the biosensor are done in collaboration with Carle Foundation Hospital, Urbana, IL.

The team from UIUC is working now to further develop a first portable prototype of the cell counter. “The cartridges will be disposable and the size of a credit card. The base unit or the reader will be portable and possibly hand-held. Our technology has the potential to reduce the cost of the test to less than $10 as compared to $100 or more currently charged,” says Umer.

Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.

The team modified a simple microfluidic channel with an array of vertically aligned carbon nanotubes — rolled lattices of carbon atoms that resemble tiny tubes of chicken wire. The researchers had previously devised a method for standing carbon nanotubes on their ends, like trees in a forest. With this method, they created a three-dimensional array of permeable carbon nanotubes within a microfluidic device, through which fluid can flow.

Now, in a study published this week in the Journal of Microengineering and Nanotechnology, the researchers have given the nanotube array the ability to trap certain particles. To do this, the team coated the array, layer by layer, with polymers of alternating electric charge.

“You can think of each nanotube in the forest as being concentrically coated with different layers of polymer,” says Brian Wardle, professor of aeronautics and astronautics at MIT. “If you drew it in cross-section, it would be like rings on a tree.”

Depending on the number of layers deposited, the researchers can create thicker or thinner nanotubes and thereby tailor the porosity of the forest to capture larger or smaller particles of interest.

The nanotubes’ polymer coating may also be chemically manipulated to bind specific bioparticles flowing through the forest. To test this idea, the researchers applied an established technique to treat the surface of the nanotubes with antibodies that bind to prostate specific antigen (PSA), a common experimental target. The polymer-coated arrays captured 40 percent more antigens, compared with arrays lacking the polymer coating.

Wardle says the combination of carbon nanotubes and multilayer coatings may help finely tune microfluidic devices to capture extremely small and rare particles, such as certain viruses and proteins.

“There are smaller bioparticles that contain very rich amounts of information that we don’t currently have the ability to access in point-of-care [medical testing] devices like microfluidic chips,” says Wardle, who is a co-author on the paper. “Carbon nanotube arrays could actually be a platform that could target that size of bioparticle.”

The paper’s lead author is Allison Yost, a former graduate student who is currently an engineer at Accion Systems. Others on the paper include graduate student Setareh Shahsavari; postdoc Roberta Polak; School of Engineering Professor of Teaching Innovation Gareth McKinley; professor of materials science and engineering Michael Rubner, and Raymond A. And Helen E. St. Laurent Professor of Chemical Engineering Robert Cohen.

A porous forest

Carbon nanotubes have been a subject of intense scientific study, as they possess exceptional electrical, mechanical, and optical properties. While their use in microfluidics has not been well explored, Wardle says carbon nanotubes are an ideal platform because their properties may be manipulated to attract certain nanometer-sized molecules. Additionally, carbon nanotubes are 99 percent porous, meaning a nanotube is about 1 percent carbon and 99 percent air.

“Which is what you need,” Wardle says. “You need to flow quantities of fluid through this material to shed all the millions of particles you don’t want to find and grab the one you do want to find.”

What’s more, Wardle says, a three-dimensional forest of carbon nanotubes would provide much more surface area on which target molecules may interact, compared with the two-dimensional surfaces in conventional microfluidics.

“The capture efficiency would scale with surface area,” Wardle notes.

A versatile array

The team integrated a three-dimensional array of carbon nanotubes into a microfluidic device by using chemical vapor deposition and photolithography to grow and pattern carbon nanotubes onto silicon wafers. They then grouped the nanotubes into a cylinder-shaped forest, measuring about 50 micrometers tall and 1 millimeter wide, and centered the array within a 3 millimeter-wide, 7-millimeter long microfluidic channel.

The researchers coated the nanotubes in successive layers of alternately charged polymer solutions in order to create distinct, binding layers around each nanotube. To do so, they flowed each solution through the channel and found they were able to create a more uniform coating with a gap between the top of the nanotube forest and the roof of the channel. Such a gap allowed solutions to flow over, then down into the forest, coating each individual nanotube. In the absence of a gap, solutions simply flowed around the forest, coating only the outer nanotubes.

After coating the nanotube array in layers of polymer solution, the researchers demonstrated that the array could be primed to detect a given molecule, by treating it with antibodies that typically bind to prostate specific antigen (PSA). They pumped in a solution containing small amounts of PSA and found that the array captured the antigen effectively, throughout the forest, rather than just on the outer surface of a typical microfluidic element.

Wardle says that the nanotube array is extremely versatile, as the carbon nanotubes may be manipulated mechanically, electrically, and optically, while the polymer coatings may be chemically altered to capture a wide range of particles. He says an immediate target may be biomarkers called exosomes, which are less than 100 nanometers wide and can be important signals of a disease’s progression.

“Science is really picking up on how much information these particles contain, and they’re sort of everywhere, but really hard to find, even with large-scale equipment,” Wardle says. “This type of device actually has all the characteristics and functionality that would allow you to go after bioparticles like exosomes and things that really truly are nanometer scale.”

ORBOTECH LTD. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development. Installed in 2015 at CEA-Leti’s facility in Grenoble, France, the Monarch300 joins the 200 and 300mm etch, CVD and PVD systems previously supplied by SPTS and which are already operational in CEA-Leti’s MEMS and packaging lines.

“The co-integration of MEMS and CMOS has the potential to create a new family of sensors with improved performance,” said Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “The Monarch 300 uses our patented Primaxx vapor HF etch technology and is capable of processing thirteen 300mm wafers simultaneously. NEMS and MEMS are at the core of CEA-Leti’s activities, and we are pleased to be able to supply this highly valued partner with additional capability to support its 300mm MEMS program.”

Marie-Noëlle Semeria, CEO of Leti and President of the Nanoelec RTI board, commented: “MEMS devices co-integrated with CMOS help Leti achieve a long-standing goal of enabling smaller and more powerful sensors and actuators, without exceeding power budgets.”

“After characterizing the performance of a number of competing vapor HF etch methodologies, we selected SPTS’ Primaxx reduced-pressure, dry technology because it extends our existing process capability significantly and offers enhanced compatibility with materials of interest. Leti intends to lead the way in developing MEMS devices on 300mm formats, and to achieve this we are partnering with industry leaders such as SPTS, who have the specialist process knowledge needed to transfer our 300mm MEMS developments to high-volume production,” added Fabrice Geiger, Head of the Silicon Technologies Division of CEA-Leti.

SPTS and CEA-Leti entered into a two-year agreement that will encompass full performance characterization and process optimization of both the 200mm and 300mm vapor HF process modules. This collaboration will further extend the long-standing relationship between these partners who already collaborate on the development and optimization of a range of etch and deposition processes for next-generation 3D high-aspect-ratio through-silicon-via (TSV) solutions.

Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of Things will nearly double, reaching $124.5 billion in the final year of this decade, according to IC Insights’ new 2016 edition of its IC Market Drivers report.  During that same timeframe, new connections to the Internet of Things (IoT) will grow from about 1.7 billion in 2015 to nearly 3.1 billion in 2019 (Figure 1), based on the forecast in the new 450-page report, which examines emerging and major end-use applications fueling demand for ICs.

Figure 1

Figure 1

The new IC Market Drivers report shows about 30.0 billion Internet connections are expected to be in place worldwide in 2020, with 85% of those attachments being to web-enabled “things”—meaning a wide range of commercial, industrial, and consumer systems, distributed sensors, vehicles, and other connected objects—and 15% for electronics used by humans to communicate, download and receive streams of data files, and search for online information.  It was the opposite of that in 2000, with 85% of 488 million Internet connections providing human users with online access to the World Wide Web and the remaining 15% serving embedded systems, remote sensing and measurements, control, and machine-to-machine communications.

Strong double-digit increases in the Internet of Things market will drive up IC sales in IoT applications by a compound annual growth rate (CAGR) of 15.9% between 2015 and 2019 to about $19.4 billion in the final year of this decade (Figure 2), according to the new report.  IoT applications will also fuel strong sales growth in optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D), which are projected to rise by a CAGR of 26.0% between 2015 and 2019 to $11.6 billion in four years.  The new IC Market Drivers report shows microcontrollers and system-on-chip microprocessors topping integrated circuit sales growth with a CAGR of 22.3% in the next four years, followed by memories at 19.8%, application specific standard products (ASSPs) at 16.4%, and analog ICs at an annual growth rate of 12.7%.

Figure 2

Figure 2

In the 2014-2019 forecast period of the IC Market Drivers report, wearable systems are projected to be the fastest growing IoT application with sales increasing by a CAGR of 59.0%, thanks in great part to a 440% surge in 2015 due to the launch of Apple’s first smartwatches in 2Q15.  Sales of IoT-connected wearable systems are expected to reach $15.2 billion in 2019 compared to $1.5 billion in 2014 and about $8.1 billion in 2015.

Meanwhile, connected vehicles (passenger cars and light trucks) are expected to be the second fastest market category for IoT technology with revenues growing by a CAGR of 31.5% between 2014 and 2019 to $5.3 billion in the final year of this decade.

At last week’s IEEE International Electron Devices Meeting 2015, nanoelectronics research center imec, KU Leuven, and Neuro-Electronics Research Flanders (NERF, set up by VIB/KU Leuven and imec) presented a set of silicon neural probes that combine 12 monolithically integrated optrodes using a CMOS compatible process. The probes enable optical stimulation and electronic detection of individual neurons, based on optogenetics techniques. They pave the way to a greater understanding of the brain and towards novel treatments for brain disorders such as Alzheimer’s, schizophrenia, autism, and epilepsy.

The enormous burden that brain disorders pose on affected individuals and health care systems calls for new ways to prevent, treat and cure these diseases. Currently available devices for recording neural activity to study the functioning of the brain typically have a limited number of electrical channels. Additionally, the brain is composed of many genetically and functionally distinct neuron types, and conventional probes cannot disambiguate recorded electrical signals with respect to their source. Imec’s and KU Leuven’s novel neural probes tackle these challenges, set a path towards greater understanding of the brain, and enable novel treatment options for brain disorders.

Imec’s and KU Leuven’s novel probes combine electronics and photonics to perform extremely sensitive measurements. The fully integrated implantable neural microsystems have advanced capabilities to detect, process and interpret neural data at a cellular scale. The systems feature a very high density of electrodes and nanophotonic circuits (optrodes). Such optrodes are used to optically stimulate single neurons using optogenetics, a technology in which neurons are genetically modified to make them light-sensitive and thus susceptible to stimulation through light pulses.

This research is supported by the Agency for Innovation by Science and Technology in Flanders (IWT) through the OptoBrain project.

Probe tip with activated light output

Probe tip with activated light output

SEMI projects that worldwide sales of new semiconductor manufacturing equipment will decrease 0.6 percent to $37.3 billion in 2015, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.  In 2016, nominal positive growth is expected, resulting in a global market increase of 1.4 percent.

The SEMI Year-end Forecast predicts that wafer processing equipment, the largest product segment by dollar value, is anticipated to increase 0.7 percent in 2015 to total $29.5 billion. The “Other Front End” category (fab facilities, mask/reticle, and wafer manufacturing equipment) is expected to increase 20.6 percent in 2015. The forecast predicts that the market for assembly and packaging equipment will decrease by 16.4 percent to $2.6 billion in 2015 and that the market for semiconductor test equipment is forecast to decrease by 7.4 percent, totaling $3.3 billion this year.

For 2015, Taiwan, South Korea, North America, remain the largest spending regions, with investments in Japan approaching North American levels.  SEMI forecasts that in 2016, equipment sales in Europe will climb to $3.4 billion (63.1 percent increase over 2015). After a 13 percent contraction for Europe in 2015, GLOBALFOUNDRIES, Infineon, Intel, and STMicroelectronics are all expected to significantly accelerate fab equipment spending in 2016, resulting in strong growth in the region in 2016.  In Rest of World, essentially Southeast Asia, sales will reach $2.5 billion (25.7 percent increase), the China market will total $5.3 billion (9.1 percent increase), and North America equipment spending will reach $5.9 billion (6.1 percent increase). The equipment markets in Japan, Korea, and Taiwan are expected to contract in 2016.

The following results are given in terms of market size in billions of U.S. dollars:

Year_End_image_600px

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Year-end Forecast, which provides an outlook for the semiconductor equipment market.

SEMICON Japan 2015, an exhibition in Asia for semiconductor manufacturing and related processing technology, opens tomorrow at Tokyo Big Sight. The exposition and conference offers the latest in technology and innovations for the microelectronics industry, including emerging opportunities in the new World of IoT (Internet of Things). SEMICON Japan (December 16-18) registration is now open for both the exhibition and conference programs.

Japan is uniquely positioned to support the IoT revolution with its large 200mm fab capacity, diverse product mix and leadership in markets such as MCUs, automotive, power devices, sensors and LEDs. SEMICON Japan 2015 connects the players and companies enabling the world of IoT by facilitating communications and partnerships across the microelectronics industry.

Highlights at SEMICON Japan include:

  • The SuperTHEATER at Tokyo Big Sight will offer the Opening Ceremony at 9:40 a.m. Wednesday, and nine forums in three days featuring speakers from: Amazon, Cisco Systems, Fujitsu, Google,Hitachi, IBM, Intel, KLA-Tencor, Micron Technology, Microsoft, Nissan Motors, Rakuten, Renesas Electronics, Sony, Tata Consultancy Services, Toshiba, TSMC, and more.
  • Held in conjunction with SEMICON Japan, WORLD OF IOT, a “show-within-a-show”, offers a platform where semiconductor manufacturing technology intersects with IoT applications. The 65 exhibitors include Amazon Web Services, Dassault Systems, Fujitsu, Hitachi, IBM Research-Tokyo, Intel, Siemens, Tesla Motors, Toshiba Healthcare, Toyota Motors, and more.
  • Two theme pavilions – Sustainable Manufacturing Pavilion, providing solutions focused on sustainability for 200mm technologies, and Manufacturing Innovation Pavilion, showcasing innovations for developing higher performing, faster and lower-cost semiconductor devices – are adjacent in East Hall 1.
  • Showcasing startup pitch presentations and exhibits from early-stage companies, the INNOVATION VILLAGE connects 13 emerging companies with investors and prospective technology partners.

Osamu Nakamura, president of SEMI Japan, said “With the building momentum from the IoT revolution, the Japan semiconductor industry is poised to take advantage of growth within the Japan supply chain. I welcome all of you from the global semiconductor industry to learn about the innovations that will support this growth as you visit the exhibition and participate in the conferences at SEMICON Japan.”

For more information on SEMICON Japan, visit www.semiconjapan.org/en/.

The total production value of electronic systems is forecast to decrease 2% in 2015 to an estimated $1,423 billion, marking only the fourth time in history that the systems market registers a decline (previous years were 2001, 2002, and 2009).  Total electronic system sales are forecast to reach $1,614 billion in 2019, which represents a compound annual growth rate (CAGR) of 2.1% from $1,454 billion in 2014.  Figure 1 compares the relative market sizes and projected growth rates of nine major systems segments covered in IC Insights’ recently released 2016 edition of its IC Market Drivers report.  These nine market categories represented approximately 70% of the estimated total production value of all electronic systems in 2015.

cellphone ic sales

Figure 1

 

Among individual end-use systems covered in detail in the 2016 IC Market Drivers report, cellphones expanded their lead over standard personal computers (desktops and notebooks) as the largest electronic systems market in 2015 after overtaking PCs for the first time in 2013.  Cellphones accounted for 18% of total electronics systems sales ($262.2 billion) versus about 13% for standard PCs ($187.4 billion) in 2015. Cellular phone sales are projected to rise by a CAGR of 2.9% in the 2014-2019 period, while standard PC revenues are expected to slump by an annual rate of -1.7%, partly due to longer upgrade cycles for standard PCs, the influx of tablet computers into the mix of computing platforms, and the growing use of smartphones to access the Internet.

The Internet of Things system market is forecast to show the highest average annual growth rate (21%) through 2019.  Aside from this one high-flying market, however, no other system category is forecast to average annual growth of more than 7%.  In fact, the standard PC, tablet, and game console system markets are forecast to decline through 2019.

Using a new procedure researchers at the Technical University of Munich (TUM) and the Ludwig Maximillians University of Munich (LMU) can now produce extremely thin and robust, yet highly porous semiconductor layers. A very promising material – for small, light-weight, flexible solar cells, for example, or electrodes improving the performance of rechargeable batteries.

Filled with suitable organic polymers the highly porous germanium nanofilm becomes a hybrid solar cell. Because the germanium nanostructure forms an inverse opal-structure, the material shimmers like opal. Credit: Andreas Battenberg / TUM

Filled with suitable organic polymers the highly porous germanium nanofilm becomes a hybrid solar cell. Because the germanium nanostructure forms an inverse opal-structure, the material shimmers like opal. Credit: Andreas Battenberg / TUM

The coating on the wafer that Professor Thomas Fässler, chair of Inorganic Chemistry with a Focus on Novel Materials at TU Munich, holds in his hands shimmers like an opal. And it has amazing properties: It is hard as a crystal, exceptionally thin and – since it is highly porous – light as a feather.

By integrating suitable organic polymers into the pores of the material, the scientists can custom tailor the electrical properties of the ensuing hybrid material. The design not only saves space, it also creates large interface surfaces that improve overall effectiveness.

“You can imagine our raw material as a porous scaffold with a structure akin to a honeycomb. The walls comprise inorganic, semiconducting germanium, which can produce and store electric charges. Since the honeycomb walls are extremely thin, charges can flow along short paths,” explains Fässler.

The new design: bottom-up instead of top-down

But, to transform brittle, hard germanium into a flexible and porous layer the researchers had to apply a few tricks. Traditionally, etching processes are used to structure the surface of germanium. However, this top-down approach is difficult to control on an atomic level. The new procedure solves this problem.

Together with his team, Fässler established a synthesis methodology to fabricate the desired structures very precisely and reproducibly. The raw material is germanium with atoms arranged in clusters of nine. Since these clusters are electrically charged, they repel each other as long as they are dissolved. Netting only takes place when the solvent is evaporated.

This can be easily achieved by applying heat of 500 °C or it can be chemically induced, by adding germanium chloride, for example. By using other chlorides like phosphorous chloride the germanium structures can be easily doped. This allows the researchers to directly adjust the properties of the resulting nanomaterials in a very targeted manner.

Tiny synthetic beads as nanotemplates

To give the germanium clusters the desired porous structure, the LMU researcher Dr. Dina Fattakhova-Rohlfing has developed a methodology to enable nanostructuring: Tiny polymer beads form three-dimensional templates in an initial step.

In the next step, the germanium-cluster solution fills the gaps between the beads. As soon as stable germanium networks have formed on the surface of the tiny beads, the templates are removed by applying heat. What remains is the highly porous nanofilm.

The deployed polymer beads have a diameter of 50 to 200 nanometers and form an opal structure. The germanium scaffold that emerges on the surface acts as a negative mold – an inverse opal structure is formed. Thus, the nanolayers shimmer like an opal.

“The porous germanium alone has unique optical and electrical properties that many energy relevant applications can profit from,” says LMU researcher Dr. Dina Fattakhova-Rohlfing, who, in collaboration with Fässler, developed the material. “Beyond that, we can fill the pores with a wide variety of functional materials, thereby creating a broad range of novel hybrid materials.”

Nanolayers pave the road to portable photovoltaic solutions

“When combined with polymers, porous germanium structures are suitable for the development of a new generation of stable, extremely light-weight and flexible solar cells that can charge mobile phones, cameras and laptops while on the road,” explains the physicist Peter Müller-Buschbaum, professor of functional materials at TU Munich.

Manufacturers around the world are on the lookout for light-weight and robust materials to use in portable solar cells. To date they have used primarily organic compounds, which are sensitive and have relatively short lifetimes. Heat and light decompose the polymers and cause the performance to degrade. Here, the thin but robust germanium hybrid layers provide a real alternative.

Nanolayers for new battery systems

Next, the researchers want to use the new technology to manufacture highly porous silicon layers. The layers are currently being tested as anodes for rechargeable batteries. They could conceivably replace the graphite layers currently used in batteries to improve their capacity.