Category Archives: MEMS

China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.

PC shipments in 2012 to China amounted to 69 million units, exceeding the 66 million total reached by the United States. Only a year earlier in 2011, the United States was the leading global destination for PCs.

Beyond its large size, China’s PC market exhibits distinct characteristics that set it apart from the computer trade elsewhere, possessing a vast untapped rural market and unique consumer-purchasing patterns. While desktop PC shipments lagged notebooks around the world, the two PC segments were on par in China in 2012, with an even 50-50 split, as shown in the table below.

China PC shipments

“The equal share of shipments for desktops and notebooks in China is unusual, since consumers in most regions today tend to prefer more agile mobile PCs, rather than the bulky, stationary desktops,” said Peter Lin, senior analyst for compute platforms at IHS. “The relatively large percentage of desktop PC shipments in China is due to huge demand in the country’s rural areas, which account for a major segment of the country’s 1.34 billion citizens. These consumers tend to prefer the desktop form factor.”

The market will change gradually as desktop PCs face rising competition from the high value proposition presented by notebooks. Notebooks will then surpass desktops in the country by 2014, tracking more closely with the worldwide desktop-to-notebook PC ratio of 36 to 64 percent.

The desktop vs. notebook pattern of consumption in China is only one example of the distinctive hallmarks of the country’s dynamic PC market. In another indicator, China also has approximately a 50-50 proportion in consumer vs. commercial PCs, compared to the 65-35 percent ratio for the rest of the world.

A third pattern unique to the China PC market is the preferred notebook display size of 14 inches, which accounts for more than 70 percent of notebook PC shipments in the country. For the rest of the world, the 14-inch makes up less than 30 percent.

A fourth pattern of note is the attach rate of PCs with a pre-installed operating system, especially for notebooks. While mature PC markets in other parts of the world claim a 90 percent attach rate, the proportion for China comes out to lower than 50 percent, with the ratio even lower in the desktop PC market.

Despite such exclusive behavior, the China PC space shares one common trait with the worldwide PC market. Like the rest of the world, demand in China remains weak as consumers migrate to using mobile devices like cellphones. China’s PC market is projected to grow only by 3 to 4 percent this year.

Even so, a vast market opportunity continues to exist for PCs in the country, in the form of potential first-time buyers mostly residing in the countryside. The government already plans this year to invest some 40 trillion yuan—equivalent to some $6.4 trillion—to build rural infrastructure in the next 10 years, and PC original equipment manufacturers can take advantage of the initiative to build out and expand from the cities, IHS believes.

China is also on track to retain its position as the largest PC market in the world for the foreseeable future unchallenged and alone—further providing PC brands a rare opportunity for expansion, counter to the myriad travails they face in the rest of the world.

An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research. Smartphone shipments grew 38 percent year-over-year (YoY) while feature phone shipments declined 5.2% YoY. Shipments of all handsets grew 12 percent YoY in the first quarter thanks to the continued strength of the smartphone market, which achieved an all-time high of 49% shipment penetration.

“Worldwide handset and smartphone shipments exhibited classic Q1 softness,” says senior analyst Michael Morgan. “Samsung accomplished strong smartphone growth while Apple dismissed a troubling mix of slowed growth and declining margins as a sign that the older iPhone 4S was in high demand.”

Nokia handset shipments plummeted to 62 million in Q1 with smartphone shipments at a 5-year low of 6.1 million. Considering market and OEM specific conditions, BlackBerry delivered a respectable 6 million shipments, with 1 million coming from the launch of BlackBerry 10-based devices. Despite HTC’s well-designed ONE devices, shipments continued to decline 37 percent YoY to 4.8 million. LG continued its revival with 10.3 million smartphone shipments and 16.2 million handset shipments.

“The last time a major smartphone OEM showed a trend of decreasing margins combined with falling ASPs and slowing growth, BlackBerry was still on the favorable side of a large market share and revenue drop,” adds senior practice director Jeff Orr. “With major product announcements teased for Q3, Apple risks falling behind the innovation curve unless the next iPhone is more revolutionary than evolutionary.”

TSMC


April 26, 2013

TSMC

Dongbu HiTek today announced that it has begun volume production of Ambient Light Proximity Sensor (ALPS) chips for Clairpixel Co., Ltd., a Korean company specializing in single-chip image and motion sensor solutions for mobile, automotive, medical and security applications. Leveraging Dongbu HiTek’s specialized mixed-signal process, Clairpixel’s advanced ALPS chip is expected to target the growing Chinese smartphone market.

“Clairpixel’s ALPS chip highlights the system-on-chip attributes of our specialized 0.18um mixed-signal process,” said Jae Song, Dongbu HiTek EVP of marketing. “We look forward to expanding our collaboration before year end to add a color sensor function to this highly integrated chip design.” He credited the rapidly rising adoption rate of ALPS chips to their ability to extend battery life by optimizing screen brightness against ambient light. “With the addition of a color sensor, ALPS will also be able to automatically optimize color on large mobile screens while conserving battery power.”

According to recent market research from Gartner, Inc., worldwide smartphone shipments are expected to more than double from about 718 million units last year to more than1.6 billion units in 2016. Over this same period, Chinese smartphone shipments are forecast to rise from 25 percent to 33 percent of the total. Smart phone manufacturers such as Huawei and ZTE Corporation are expected to lead the expanding share of Chinese shipments. During the fourth quarter of 2012, some estimates report that Huawei shipped nearly 5 percent the worldwide total giving them the third largest market share worldwide

Dongbu HiTek Co., Ltd. specializes in developing s analog and mixed-signal processing technologies. The company processing portfolio encompasses Analog CMOS, BCDMOS, High Voltage CMOS, CMOS RF, CMOS Image Sensor (CIS), Display Driver IC (DDI), Touch Screen Controller IC and NOR Flash technologies.

About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits). The Symposia alternate between Kyoto, Japan and Honolulu, HI annually and serve as the premier mid-year gatherings to present research for the advancement of microelectronics technology and circuit development.

To foster joint interactions among device technologists and circuit/system designers, the technical programs of both Symposia will overlap for two days, and attractive joint technology-circuits focus sessions – which were successfully introduced in last year – will be held again. For a single registration fee, attendees can benefit from unique opportunities for interdisciplinary learning that cannot be replicated by other important conferences in each area.

More than 200 presentations will be given, including short courses prior to each Symposium, invited speakers addressing the industry’s most important issues, evening rump sessions spanning a range of topics at the leading edge of technology and circuit design, and a compelling luncheon talk. Also, the Symposium on VLSI Technology will be preceded by the Silicon Nanoelectronics Workshop on June 09-10, 2013 and the Spintronics Workshop on LSI in the evening of June 10, 2013.

“This year’s VLSI Technology program will highlight the breakthroughs in the evolution of SoC and More-than-Moore technologies such as advanced CMOS devices, eDRAM, new NVM’s, image sensor, and their processes (lithography, interconnects and 3D stacks), as the semiconductor industry is moving to the beyond 22nm node,” said Hitoshi Wakabayashi of Tokyo Institute of Technology, Symposium Chair of the 2013 Symposium on VLSI Technology.

“The VLSI Circuits program will present major advancements in the designs with scaled devices at and below 22nm and also with three dimensional chip stacking with TSVs, as well as more universal topics such as energy-efficient electronics, bio-medical applications, and wireline/wireless communications interfaces,” said Makoto Nagata of Kobe University, Symposium Chair of the 2013 Symposium on VLSI Circuits.

Both Symposium Chairs also expressed that: “Joint focus sessions provide excellent opportunities of close interactions among technology and circuits communities, with alignments of selected topics in a program as well as a common session room for ease of participation.”

The Agency for Science, Technology and Research (A*STAR) and Veredus Laboratories, a supplier of innovative molecular diagnostic tools, announced the launch of VereTropTM, the first biochip in the molecular diagnostics market that can identify 13 different major tropical diseases from a single blood sample.

With its high level of automation, this lab-on-chip diagnostic kit is poised to transform the quality and efficiency of testing tropical infectious diseases, including dengue fever, malaria, chikungunya and hand, foot and mouth disease, in the field.

 “Tropical diseases often reflect common symptoms like fever, and may not be accurately diagnosed early by doctors,” said Associate Professor Lisa F.P.Ng, the lead virologist in this project, from A*STAR’s Singapore Immunology Network. “This portable test kit is a rapid and reliable method to accurately test for multiple pathogenic targets from just one blood sample in a matter of hours.”

Together with Professor Laurent Renia, an expert in Malaria Immunobiology at SIgN, the team from SIgN has successfully validated the kit on patient samples in the external fields of Northern Thailand, at the Thai-Myanmar border.

 “This technology opens new possibilities for the accurate and rapid diagnostic of important infectious diseases that remain the main causes of illness in the tropics,” Professor François H Nosten, the clinical collaborator at the Oxford Clinical Unit in Mae Sot and Director of the Shoklo Malaria Research Unit said. “Its versatility and ease of use will change the approach to diagnostics at the periphery of health care system.”

Developed with infectious disease expertise from A*STAR’s SIgN, this biochip, which operates on STMicroelectronics’ Lab-on-Chip platform, was initiated between ETPL, the technology transfer arm of A*STAR and Veredus in 2009. Prior to this, Veredus had licensed diagnostic technology from A*STAR in the areas of influenza and malaria.

“Veredus and A*STAR have worked on several collaborative projects dating back to 2004,” said Dr. Rosemary Tan, CEO of Veredus Laboratories, a Singapore-based, majority owned subsidiary of STMicroelectronics. “This latest project on VereTrop Lab-on-Chip has combined the strengths and expertise of A*STAR, Veredus, and STMicroelectronics to create a powerful multiplexed molecular product that can rapidly detect and differentiate symptomatically similar tropical infectious diseases and enable timely proper treatment.”

 “After this journey of more than three years, we are glad that such a compelling technologically-advanced product with global healthcare benefits is ready to be launched to the market. Veredus is a good example of how local companies can work with A*STAR for a consistent stream of technology to develop products that can enhance their offerings and level them up to be competitive and relevant globally,” said Philip Lim, Chief Executive Officer of ETPL.

To see learn more about MEMS in medical devices, check out the Top 10 medical applications for MEMS slideshow.

When a team of University of Illinois engineers set out to grow nanowires of a compound semiconductor on top of a sheet of graphene, they did not expect to discover a new paradigm of epitaxy.

The self-assembled wires have a core of one composition and an outer layer of another, a desired trait for many advanced electronics applications. Led by professor Xiuling Li, in collaboration with professors Eric Pop and Joseph Lyding, all professors of electrical and computer engineering, the team published its findings in the journal Nano Letters.

Nanowires, tiny strings of semiconductor material, have great potential for applications in transistors, solar cells, lasers, sensors and more.

“Nanowires are really the major building blocks of future nano-devices,” said postdoctoral researcher Parsian Mohseni, first author of the study. “Nanowires are components that can be used, based on what material you grow them out of, for any functional electronics application.”

graphene nanowires
A false-color microscope image of a single nanowire, showing the InAs core and InGaAs shell. | Graphic by Parsian Mohseni

 

Li’s group uses a method called van der Waals epitaxy to grow nanowires from the bottom up on a flat substrate of semiconductor materials, such as silicon. The nanowires are made of a class of materials called III-V (three-five), compound semiconductors that hold particular promise for applications involving light, such as solar cells or lasers.

The group previously reported growing III-V nanowires on silicon. While silicon is the most widely used material in devices, it has a number of shortcomings. Now, the group has grown nanowires of the material indium gallium arsenide (InGaAs) on a sheet of graphene, a 1-atom-thick sheet of carbon with exceptional physical and conductive properties.

Thanks to its thinness, graphene is flexible, while silicon is rigid and brittle. It also conducts like a metal, allowing for direct electrical contact to the nanowires. Furthermore, it is inexpensive, flaked off from a block of graphite or grown from carbon gases.

“One of the reasons we want to grow on graphene is to stay away from thick and expensive substrates,” Mohseni said. “About 80 percent of the manufacturing cost of a conventional solar cell comes from the substrate itself. We’ve done away with that by just using graphene. Not only are there inherent cost benefits, we’re also introducing functionality that a typical substrate doesn’t have.”

The researchers pump gases containing gallium, indium and arsenic into a chamber with a graphene sheet. The nanowires self-assemble, growing by themselves into a dense carpet of vertical wires across the surface of the graphene. Other groups have grown nanowires on graphene with compound semiconductors that only have two elements, but by using three elements, the Illinois group made a unique finding: The InGaAs wires grown on graphene spontaneously segregate into an indium arsenide (InAs) core with an InGaAs shell around the outside of the wire.

“This is unexpected,” Li said. “A lot of devices require a core-shell architecture. Normally you grow the core in one growth condition and change conditions to grow the shell on the outside. This is spontaneous, done in one step. The other good thing is that since it’s a spontaneous segregation, it produces a perfect interface.”

So what causes this spontaneous core-shell structure? By coincidence, the distance between atoms in a crystal of InAs is nearly the same as the distance between whole numbers of carbon atoms in a sheet of graphene. So, when the gases are piped into the chamber and the material begins to crystallize, InAs settles into place on the graphene, a near-perfect fit, while the gallium compound settles on the outside of the wires. This was unexpected, because normally, with van der Waals epitaxy, the respective crystal structures of the material and the substrate are not supposed to matter.

“We didn’t expect it, but once we saw it, it made sense,” Mohseni said.

In addition, by tuning the ratio of gallium to indium in the semiconductor cocktail, the researchers can tune the optical and conductive properties of the nanowires.

Next, Li’s group plans to make solar cells and other optoelectronic devices with their graphene-grown nanowires. Thanks to both the wires’ ternary composition and graphene’s flexibility and conductivity, Li hopes to integrate the wires in a broad spectrum of applications.

“We basically discovered a new phenomenon that confirms that registry does count in van der Waals epitaxy,” Li said.

New research led by University of Cincinnati physics professors Howard Jackson and Leigh Smith could contribute to better ways of harnessing solar energy, more effective air quality sensors or even stronger security measures against biological weapons such as anthrax. And it all starts with something that’s 1,000 times thinner than the typical human hair – a semiconductor nanowire.

UC’s Jackson, Smith, recently graduated PhD student Melodie Fickenscher and physics doctoral student Teng Shi, as well as several colleagues from across the US and around the world recently have published the research paper “Optical, Structural and Numerical Investigations of GaAs/AlGaAs Core-Multishell Nanowire Quantum Well Tubes” in Nano Letters, a premier journal on nanoscience and nanotechnology published by the American Chemical Society. In the paper, the team reports that they’ve discovered a new structure in a semiconductor nanowire with unique properties.

“This kind of structure in the gallium arsenide/aluminum gallium arsenide system had not been achieved before,” Jackson says. “It’s new in terms of where you find the electrons and holes, and spatially it’s a new structure.”

These cross-sectional electron microscope images show a quantum well tube nanowire’s hexagonal facets and crystal quality (left), and electron concentration in its corners.

By using a thin shell called a quantum well tube and growing it – to about 4nm thick – around the nanowire core, the researchers found electrons within the nanowire were distributed in an unusual way in relation to the facets of the hexagonal tube. A close look at the corners of the tube’s facets revealed something unexpected – a high concentration of ground state electrons and holes.

“Having the faceting really matters. It changes the ballgame,” Jackson says. “Adjusting the quantum well tube width allows you to control the energy – which would have been expected – but in addition we have found that there’s a highly localized ground state at the corners which then can give rise to true quantum nanowires.”

The nanowires the team uses for its research are grown at the Australian National University in Canberra, Australia – one partner in this project that extends to disparate parts of the globe.

The team’s discovery opens a new door to further study of the fundamental physics of semiconductor nanowires. As for leading to advances in technology such as photovoltaic cells, Jackson says it’s too soon to tell because quantum nanowires are just now being explored. But in a world where hundreds of dollars’ worth of technology is packed into a 5-by-2.5 inch iPhone, it’s not hard to see how small but powerful science comes at a premium.

The team at UC is one of only about a half dozen in the US conducting competitive research in the field. It’s a relatively young discipline, too, Jackson says, and one that’s moving fast. For such innovative science, he says it’s important to have a collaborative effort. The team includes scientists from research centers in the Midwest, the West Coast and all the way Down Under: UC, Miami University of Ohio and Sandia National Laboratories in California here in the US; and Monash University and the Australian National University in Australia.

 “We’re training students in state-of-the-art techniques on state-of-the-art materials doing state-of-the-art physics,” Jackson says. “Upon completing their education here, they’re positioned to go out and make contributions of their own.”

Additional contributors to the paper are Jan Yarrison-Rice of Miami University, Oxford, Ohio; Bryan Wong of Sandia National Laboratories, Livermore, Calif.; Changlin Zheng, Peter Miller and Joanne Etheridge of Monash University, Victoria, Australia; and Qiang Gao, Shriniwas Deshpande, Hark Hoe Tan and Chennupati Jagadish of the Australian National University, Canberra, Australia.

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing. To assess these uncertainties and provide the latest information on EUV lithography, 3D transistors, 450mm wafer processing, and other challenges to preserving the pace of Moore’s Law, the leading authorities on these crucial issues will provide their insights, perspectives and predictions at SEMICON West (www.semiconwest.org), held from July 9-11 in San Francisco, Calif.  Free Registration for SEMICON West 2013 ends on  May 10 — register now: www.semiconwest.org/registration.

Although progress to take EUV lithography into the realm of high-volume manufacturing continues to be made, the readiness of source technologies, mask infrastructure and resist performance are still not known with a high degree of certainty. Until EUV Lithography is ready for high-volume manufacturing, the industry will continue to rely on double-patterning and even multiple-patterning lithography schemes using 193 immersion technology to take it beyond 22nm. How the industry will address these barriers, uncertainties and alternatives will be the focus the lithography session at SEMICON West.

The mobile market is driving the move to novel transistor architectures that offer greater performance and power benefits than traditional planar architectures. Memory and logic manufacturers are pursuing different strategies including leveraging innovations in design rules, new channel materials and processes (e.g., MOCVD) and inspection and metrology challenges.

While materials, architecture and processing technologies are undergoing revolutionary change, wafer processing platforms are also being radically transformed with a planned transition to 450mm wafers. For chip manufacturers and suppliers, this will involve increased levels of collaboration, further advancements in tool prototypes, and increased visibility into related supply chain implications.  The SEMICON West 450 Transition Forum will provide the latest updates on the status of 450 R&D, as well as a review of key technology considerations and a discussion of implications and opportunities for the supply chain.

Each of these programs will take place in the TechXPOT conference sessions on the exhibit floor.  Other TechXPOT programs include sessions on 2.5D and 3D IC Packaging, Productivity Innovation at Existing 200mm/300mm Fabs, Silicon Photonics, Lab-to-Fab Solutions, MEMS, LED Manufacturing, and Printed and Flexible Electronics.  SEMICON West will features over 50 hours of free technical, applications and business programs with the critical, need-to-know information presented by industry leaders.  .

SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. 

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.

“Tiny, intelligent MEMS sensors—more popularly known for enhancing the user experience with smartphones, tablets and video game controllers—are improving medical technology in dramatic ways. From wearable and implantable drug-delivery systems to remote patient monitoring for diabetes and heart disease, medical researchers and technologists are collaborating on new applications that will improve patients’ health and quality of life in myriad ways,” said Karen Lightman, executive director, MEMS Industry Group. “This year we are bringing M2M Forum, our annual members’ technical conference, to Cambridge, the very heart of innovation in biomedical/medical research and technology. M2M Forum gives attendees a rare glimpse into the opportunities and challenges affecting the entire MEMS supply chain as they integrate MEMS into biomedical/medical devices.”

Agenda highlights of M2M Forum 2013 include:

  • Welcome and Overview: Karen Lightman, executive director, MEMS Industry Group
  • MEMS Standardization Update: Stephen Whalley, director, Sensors, Intel Architecture Group, Intel Corporation
  • Keynote Presentation: “Medical Sensor and Sensing Technologies in the Nokia Sensing X CHALLENGE: New Materials, Medical Research and mHealth Converging Fast!”: Mark Winter, senior director, Qualcomm Tricorder XPRIZE, Nokia Sensing X CHALLENGE, XPRIZE
  • Outlook for MEMS in Digital Health”: Shane Walker, associate director at InMedica, IHS
  • The Role of MEMS in the Future of Health Care Delivery”: Mehran Mehregany, PhD, Goodrich Professor of Engineering Innovation Director, Wireless Health Program Director, Case School of Engineering
  • Microsystems for Implantable Drug Delivery”: Jeffrey Borenstein, PhD, technical director – Biomedical Engineering Center, Charles Stark Draper Laboratory
  • Panel – “Incorporating End-user Experience into MEMS-powered Design through Human Factors Engineering,” with speakers:
    • Mark Diperri (moderator), senior field applications engineer, Freescale Semiconductor
    • Asmita Khanolkar, program manager, SMC Ltd.
    • Tom O’Dwyer, technology director, Healthcare group, Analog Devices
    • Brian O’Loughlin, sales manager, IMT
    • Overcoming Challenges of Integrating MEMS into Medical Devices – from Product Development to Manufacturing”: Asmita Khanolkar, program manager, SMC Ltd.
    • Keynote Presentation: “Commercializing MEMS-enabled Products: A View from the Ivory Tower”: Martin Schmidt, PhD, associate provost and professor of Electrical Engineering, Massachusetts Institute of Technology
    • Keynote Presentation: “Fluidic MEMS”: Mehmet Toner, PhD, professor of surgery, Massachusetts General Hospital, Harvard Medical School Harvard-MIT Division of Health Sciences

MEMS Industry Group (MIG) is the trade association advancing MEMS across global markets. More than 140 companies comprise MIG, including Analog Devices, Applied Materials, ASE, Bosch, Fairchild Semiconductor, Freescale Semiconductor, GE, Honeywell, HP, Intel, InvenSense, Murata Electronics Oy, OMRON Electronic Components, Qualcomm, Sony, STMicroelectronics, Texas Instruments and ULVAC Technologies, Inc.