Category Archives: MEMS

(November 30, 2010) — Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, said its Electrografting (eG) technology has been validated by scientists at RTI International (RTI).

RTI, the latest third-party organization to validate eG, presented its research findings at the IEEE 3D System Integration Conference (3DIC) in Munich, Germany, in November. The paper confirmed that electrografting is a proven technology for depositing "insulator, barrier and seedlayer into high aspect ratio TSVs for 3D integration applications."

Electrografting is Alchimer’s electrochemical process that enables the growth of extremely high-quality polymer and metal thin films. The company’s deposition technology reduces overall cost of ownership for high-aspect-ratio TSV metallization by up to two-thirds compared to conventional dry processes, and shortens time to market.

The RTI study analyzed a variety of film properties, including leakage current, breakdown voltage, flat-band capacitance, and voltage. 

"The eG films in particular had effective interface trap densities in the range of 1011 per cm2, which is an excellent result that is comparable to device-grade SiO2 and high-k gate dielectrics," the study said.

Scientists in the Center for Materials and Electronic Technologies at RTI integrated electrografted layers in RTI test vehicles and exposed them to autoclave (AC) and high-temperature storage (HTS) reliability testing. The autoclave test was conducted during 96 hours under 121°C, 100% relative humidity and 2 bar absolute pressure. High-temperature storage was performed during 20 hours at 205°C.

"Both tests showed strong results with no significant difference in film performance before and after the tests," said Claudio Truzzi, Alchimer’s chief technology officer. "Alchimer’s films have been vetted by multiple third parties and have been validated as conforming with several industry-standard, package-level reliability tests."

RTI International provides research and technical expertise to governments and businesses in more than 40 countries in the areas of health and pharmaceuticals, education and training, surveys and statistics, advanced technology, international development, economic and social policy, energy and the environment, and laboratory and chemistry services.

Alchimer develops and markets chemical formulations, processes and IP for the deposition of nanometric films used in a variety of microelectronic and MEMS applications, including wafer-level interconnects and TSVs (through-silicon vias) for 3D packaging. Visit www.alchimer.com for more information.

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(November 30, 2010) — Driven by the rapid recovery in automotive production and inventory rebuilding among sensor component suppliers, the market for automotive microelectromechanical system (MEMS) sensors will expand to record size in 2010, according to market research firm iSuppli, now part of IHS Inc. (NYSE: IHS).

Marking a new high point for the industry, shipments of automotive MEMS sensors will reach 662.3 million units in 2010, up a robust 32.1% from 501.2 million units in 2009. The projected year-end levels — including replenishment of inventory pipelines that were depleted during the recession — will exceed even the pre-crisis high point in 2007 of 640 million sensors, iSuppli data research shows. iSuppli had initially expected automotive MEMS sensors to hit only 591 million units in 2010.

"The recovery in automotive MEMS shipments represents a happy turnaround from the depressed levels of 2009 when shipments cratered and reached a nadir, and the years ahead will provide additional room for expansion," said Richard Dixon, Ph.D., senior analyst for MEMS and sensors at iSuppli.

Nonetheless, growth will slow in 2011. Shipments will climb just 7.3% as the market normalizes following the exuberance in 2010. Production then will pick up again in 2012, and growth rates end up north of 13% by 2014.

New MEMS applications, markets in auto

One significant engine of automotive MEMS growth is the use of sensors in passenger cars supporting mandated safety technologies such as electronic stability control (ESC) and tire pressure monitoring systems (TPMS).

The United States and Europe have led the adoption of legislation on such safety systems, and other countries like Australia and Canada have quickly followed suit. Similar mandates are now being adopted in South Korea and are expected in Japan, accelerating overall adoption rates worldwide. The extra opportunity from both ESC and TPMS for automotive MEMS suppliers to Japan and Korea will correspond to additional revenue of some $120 million in those regions alone for the next five years, iSuppli has determined.

China will also account for a large portion of the automotive MEMS action. Compared to U.S. or European vehicles, the electronics content of low- and mid-range vehicles in China is about 50% or less, but sensor penetration will steadily increase — first in powertrain applications to reduce carbon emissions and afterward as safety sensors for additional airbags and ESC systems.

Among the new applications providing suppliers greater production opportunities for automotive MEMS sensors, the most prominent include usage of gas sensors to control air quality in the cabin; infrared thermopiles to monitor temperature; microbolometers to aid night-vision systems and MEMS oscillators to boost rear-view cameras.

Sensor fusion — using existing sensor signals with additional algorithms to satisfy new applications — will be a contentious issue, however, Dixon said. While the sales of accelerometers used to measure inclination as part of an electronic parking brake (EPB) will accelerate in Europe in the next five years, EPB prospects are also dampened by ESC systems, which already contain the 2-axis accelerometers capable of delivering the required inclination signal for parking brakes.

Other applications that will propagate the use of sensors include passenger protection systems that detect impacts by means of either accelerometers or pressure sensors located in the front bumper; as well as stop-start systems that need pressure, and other non-MEMS based measurements to supply critical data when a vehicle’s engine is turned off at a junction, Dixon said.

Consumer-oriented MEMS suppliers

iSuppli also notes that some consumer-oriented MEMS sensor suppliers are making inroads into the automotive market, widening the pool of players participating in the space.

In particular STMicroelectronics, MEMS supplier for consumer and mobile applications, so far has targeted non-safety critical applications in automotive such as car alarms and navigation. STMicro has now entered the airbag market with a high-g accelerometer. STM is expected to leverage its significant manufacturing economies of scale, which likely will lead to additional price pressures and new cost structures in the industry.

Read More in "Auto Production Recovery and Rebuilding of Inventory to Drive Record MEMS Revenue in 2010" at http://www.isuppli.com/MEMS-and-Sensors/Pages/Auto-Production-Recovery-and-Rebuilding-of-Inventory-to-Drive-Record-MEMS-Revenue-in-2010.aspx?PRX

iSuppli’s market research reports help deliver information on the status of the entire electronics value chain. iSuppli’s MEMS & Sensors market research provides up-to-date, insightful coverage of the consumer, automotive, and high-value markets for MEMS, or microelectromechanical sensors. Visit http://www.isuppli.com/Pages/Home.aspx for more information.

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(November 18, 2010 – BUSINESS WIRE) — Dan Siewiorek, Karen Lightman, Rich Duncombe, Vida Ilderem, and other speakers from the MEMS industry shared their visions for the future at the MEMS Executive Congress 2010. Following are summaries of their talks, from the "iPhone 20" lifetime smart-companion to seisic imaging developments, energy management, and more MEMS opportunities.

In Dan Siewiorek’s vision of the future, each of us will get an "iPhone 20" at birth. Powered by a wide range of microelectromechanical systems, or MEMS, this personalized mobile device will monitor your heart rate when you exercise, help the visually impaired to grocery-shop, and remember important social clues such as people’s names, phone numbers and directions. More of a “friend for life” than a smartphone, this intelligent device will help you to navigate your environment and will sustain you on a daily basis as you age. As a professor of computer science and electrical and computer engineering at Carnegie Mellon University’s Quality of Life Center, Dr. Siewiorek has unique insight into the practical applications of MEMS sensors and contextual software for mobile phones and wearable pendants. While addressing an audience of more than 180 business executives at the 6th annual MEMS Executive Congress on November 4th, Siewiorek and his fellow panelists claimed the attention of MEMS suppliers looking for new business opportunities as well as leading OEMs eager to learn more about the commercial applications of MEMS technology.

“At MEMS Executive Congress, OEMs and end users have a conversation with the MEMS industry about emerging trends and business opportunities,” said Karen Lightman, managing director of the event’s host organization, MEMS Industry Group. "During this year’s forum, market analysts shared their latest research on what’s hot and what’s not, with an eye to market growth through 2015. Industry experts in consumer electronics, quality of life/robotics, and energy dove into the short- and long-term commercial uses of MEMS. And keynote speakers from HP and Intel offered an inside look at how two top technology companies see practical applications for MEMS within their own organizations and the global IT infrastructure.”

In his opening keynote address, Rich Duncombe, strategist, Technology Development Organization, Imaging and Printing Group, HP, reflected on the business processes behind his latest disruptive technology launch: “While the creative energy behind innovation may seem like ‘magic,’ innovation at HP results from a disciplined business development process. We innovate from our core, incorporating client-focused innovation to deliver an end-to-end solution.”

HP’s latest achievement is a wireless seismic imaging system featuring one million sensor nodes based on accelerometers that are up to 1000x more sensitive than today’s consumer-centric accelerometers. Developed in collaboration with Shell, the new system uses high-resolution seismic data to locate difficult-to-find oil and gas reservoirs.

In her closing keynote address, Vida Ilderem, Ph.D., vice president of Intel Labs and director of the Integrated Platform Research Lab for Intel Corporation, wrapped up MEMS Executive Congress with some concluding thoughts: “The technology industry at large is realizing a greater mobility vision, one that encompasses mobile platforms and architectures, pervasive connectivity, context awareness and human-computer interaction.”

Identifying sensor-intensive applications such as mobile augmented reality devices and ‘personal energy systems’ for homes, offices and college campuses, Dr. Ilderem encouraged the audience to increase sensor intelligence and ease sensor integration to meet the requirements of these emerging context-aware systems.

More voices from MEMS Executive Congress
Dean Samara-Rubio, PhD, platform architect, Energy and Utilities, Intel, believes that “we need sensing, communications, data structures and analytics in order to build an integrated node to make a truly smart home that engages the homeowner. Once we integrate this sensing capability into easily managed and interpreted systems, we may begin to make inroads into smart homes and smarter commercial buildings.”

Cleo Cabuz, CTO, Life Safety, Honeywell, highlighted energy harvesting as a significant opportunity for MEMS: “With a strong portfolio of commercially-available energy harvesting devices for wireless sensors used in home and building automation, we see widespread future potential for small, low power MEMS sensors, using energy harvested from power lines, from light switches and even from gas and air flow devices.”

One of the event’s energy success stories came from Liji Huang, PhD, founder, president and CEO, Siargo Ltd. Through MEMS-flow sensing technology, Siargo’s smart gas meters have their first commercial win. Siargo has shipped its MEMS utility gas meters to more than 17 gas companies (including China Petro) since 2008. Most recently Siargo signed a strategic agreement with Asia’s largest utility gas company, Hong Kong Towngas, to further develop and deploy this technology to its more than 11 million customers.

Jungkee Lee, PhD, principal engineer, director of Telecommunication Module Lab, Samsung, astounded Congress attendees through a use of MEMS never imagined. Dr. Lee demonstrated Samsung’s Galaxy Beam mobile phone (GT-I8520) with integrated pico projector — which employs Texas Instruments DLP pico chipset. He pointed out that another DLP-based pico-projector phone, the GT-I7410, shed some light into the lives of the trapped Chilean miners, allowing them to watch soccer games and other visual content via projected images generated by the Samsung phone.

Greg Turetzky, senior marketing director, CSR, emphasized the value of MEMS as part of a whole platform: "New classes of applications that include GPS, communication and MEMS — all integrated via software — are extremely compelling. One example might be shoes featuring an embedded GPS receiver, small MEMS sensor and mobile phone transmitter. Such ‘smart’ shoes could be used to track the whereabouts of children and Alzheimer’s patients."

“We set records at MEMS Executive Congress this year, with more overall attendees and an even stronger international representation,” offered Ms. Lightman. “With top-notch keynotes and high-caliber panels, our speakers conveyed the wealth of opportunities in MEMS technology and MEMS-enabled applications. Our attendees responded with enthusiasm, engaging with speakers in formal and informal networking venues. We have truly raised the bar for our 2011 MEMS Executive Congress!”

MEMS Executive Congress is an annual event that brings together business leaders from a broad spectrum of industries: automotive, consumer goods, energy/environmental, industrial, medical and telecom. It is a unique professional forum at which executives from companies designing and manufacturing MEMS technology sit side-by-side with their end-user customers in panel discussions and networking events to exchange ideas and information about the use of MEMS in commercial applications.

Sponsors of MEMS Executive Congress 2010 included: A.M. Fitzgerald & Associates, Analog Devices, ANSYS, Bosch Sensortec, DALSA, EV Group, Freescale Semiconductor, iSuppli, Lam Research, MEMS Investor Journal, Maxim, Okmetic, Plan Optik, SPP Process Technology Systems (SPTS), SUSS MicroTec, SVTC, Tegal Corporation and Yole Développement.

MEMS Executive Congress 2010 was held November 3-4, 2010 at the InterContinental Montelucia Resort & Spa in Scottsdale, Arizona. MEMS Executive Congress 2011 will be held November 2-3, 2011 at the Monterey Plaza Hotel and Spa. For more information, please contact MIG via phone: 412/390-1644, email: [email protected] or visit MEMS Executive Congress at: www.memscongress.com.

MEMS Industry Group (MIG) is the trade association advancing MEMS across global markets. MIG enables the exchange of non-proprietary information among members; provides reliable industry data that furthers the development of technology; and works toward the greater commercial development and use of MEMS and MEMS-enabled devices. More than 100 companies comprise MIG, including Analog Devices, Applied Materials, Bosch Sensortec, Freescale Semiconductor, GE, GLOBALFOUNDRIES, Honeywell, Intel, OEM Group, Plures Technologies, Rite Track, Tecnisco and Texas Instruments. For more information, visit www.memsindustrygroup.org.

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(November 15, 2010) — Jay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, introduce how MEMS gyroscopes work and their applications, the main parameters of a MEMS gyroscope with analog or digital outputs, practical MEMS gyroscope calibration techniques, and how to test the MEMS gyroscope performance in terms of angular displacement.

The significant size reduction of multi-axis MEMS gyroscope structures and their integration with digital interface into a single package of a few square millimeters of area at an affordable cost have accelerated the penetration of MEMS gyroscopes into hand-held devices.

MEMS gyroscopes have enabled exciting applications in portable devices including optical image stabilization for camera performance improvement, user interface for additional features and ease of use, and gaming for more exciting entertainment. Further applications such as dead reckoning and GPS assistance that require high sensitivity, low noise, and low drift over temperature and time are on the horizon.

Here, we discuss the methods and techniques of quickly getting meaningful information from a MEMS gyroscope in terms of angular velocity and angular displacement measurements.

MEMS gyroscope introduction

MEMS gyroscopes are making significant progress towards high performance and low power consumption. They are mass produced at low cost with small form factor to suit the consumer electronics market.
MEMS gyroscopes use the Coriolis Effect to measure the angular rate, as shown in Figure 1.

Figure 1. Coriolis effect.

When a mass (m) is moving in direction v→ and angular rotation velocity Ω→ is applied, then the mass will experience a force in the direction of the arrow as a result of the Coriolis force. And the resulting physical displacement caused by the Coriolis force is then read from a capacitive sensing structure.

Most available MEMS gyroscopes use a tuning fork configuration. Two masses oscillate and move constantly in opposite directions (Figure 2). When angular velocity is applied, the Coriolis force on each mass also acts in opposite directions, which result in capacitance change. This differential value in capacitance is proportional to the angular velocity Ω > and is then converted into output voltage for analog gyroscopes or LSBs for digital gyroscopes.

When linear acceleration is applied to two masses, they move in the same direction. Therefore, there will be no capacitance difference detected. The gyroscope will output zero-rate level of voltage or LSBs, which shows that the MEMS gyroscopes are not sensitive to linear acceleration such as tilt, shock, or vibration.

Figure 2. When angular velocity is applied.

MEMS gyroscope applications

MEMS gyroscopes can measure angular velocity. Digital cameras use gyroscopes to detect hand rotation for image stabilization. A yaw rate gyroscope can be used in cars to activate the electronic stability control (ESC) brake system to prevent accidents from happening when the car is making a sharp turn. And a roll gyroscope can be used to activate airbags when a rollover condition happens.

A yaw rate gyroscope can be used in cars to measure the orientation to keep the car moving on a digital map when GPS signal is lost. This is called car dead-reckoning backup system.

The yaw rate gyroscope can also be used for indoor robot control.

Multiple inertial measurement units (IMUs) can be mounted on arms and legs for body tracking and monitoring.

The IMU can also be used for air mouse application, motion gaming platforms and personal navigation devices with the integration of magnetometer and GPS receiver.

Understanding the major parameters of MEMS gyroscopes

Power supply (Volts): This parameter defines the gyroscope operating DC power supply voltage range.

Power supply current (mA): This parameter defines the typical current consumption in operation mode.

Power supply current in sleep mode (mA): This parameter defines the current consumption when the gyroscope is in sleep mode.
 
Power supply current in power-down mode (uA): This parameter defines the current consumption when the gyroscope is powered down.

Full scale range (dps): This parameter defines the gyroscope measurement range.

Zero-rate level (Volts or LSBs): This parameter defines the zero rate level when there is no angular velocity applied to the gyroscope.

Sensitivity (mV/dps or dps/LSB): Sensitivity in mV/dps defines the relationship between 1dps and the analog gyroscope’s output voltage change over the zero-rate level. For digital gyroscopes, the sensitivity (dps/LSB) is the relationship between 1LSB and dps.

Sensitivity change vs. temperature (%/°C): This parameter defines when temperature changes from 25°C room temperature, how the sensitivity will change in percentage per °C.

Zero-rate level change vs. temperature (dps/°C): This parameter defines, when temperature changes from 25°C, how the zero-rate level will change per °C.

Non linearity (% FS): This parameter defines the maximum error between the gyroscope’s outputs and the best fit straight line in percentage with respect to full scale (FS) range.

System bandwidth (Hz): This parameter defines the angular velocity signal frequency from DC to the built-in bandwidth (BW) that the analog gyroscopes can measure.

Rate noise density (dps/√Hz): This parameter defines the standard resolution for both analog and digital gyroscopes that one can get from the gyroscopes’ outputs together with the BW parameter.

Self-test (mV or dps): This feature can be used to verify if the gyroscope is working properly or not without physically rotating the printed circuit board (PCB) after the gyroscope is mounted on the PCB.

Calibrating a MEMS gyroscope

Gyroscopes are usually factory tested and calibrated in terms of zero-rate level and sensitivity. However, after the gyroscope is assembled on the PCB, due to the stress, the zero-rate level and sensitivity may change slightly from the factory trimmed values.

For applications such as gaming and remote controllers, one can simply use the typical zero-rate level and sensitivity values in the datasheet to convert gyroscope measurement to angular velocities.

For more demanding applications the gyroscope needs to be calibrated for new zero-rate level and sensitivity values and other important parameters such as:

  • Misalignment (or cross-axis sensitivity)
  • Linear acceleration sensitivity or g-sensitivity
  • Long term in-run bias stability
  • Turn-on to turn-on bias stability
  • Bias and sensitivity drift over temperature
  • Getting rid of zero-rate instability

The gyroscope output can be expressed as Equation 1.

Rt = SC × (Rm – R0)     (1)

Where,
 Rt (dps): true angular rate
 Rm  (LSBs): gyroscope measurement
 R0 (LSBs): zero-rate level
 SC (dps/LSB): sensitivity

In order to compensate for turn-on to turn-on bias instability, after the gyroscope is powered on, one can collect 50 to 100 samples and then average these samples as the turn-on zero-rate level R0, assuming that the gyroscope is stationary.

Due to temperature change and measurement noise, the gyroscope readings will vary slightly when the gyroscope is stationary. It is necessary to set a threshold Rth to zero the gyroscope readings if the absolute value is within the threshold as shown in Equation 2. This will get rid of the zero-rate noise so that the angular displacement will not accumulate when the gyroscope is stationary.  

ΔR = (Rm – R0) = 0 if |(Rm – R0)| < Rth      (2)

Every time the gyroscope is stationary, one can sample 50 to 100 gyroscope datum and then average these samples as new zero-rate level R0. This will eliminate the zero rate in-run bias and small temperature change.

After the zero-rate instability has been taken care of from the above steps, then Equation (1) becomes

Rt = SC × (Rm – R0) = SC × ΔR      (3)

So the next step will be to determine the sensitivity SC in Equation 3 by using a reference system.

It should be emphasized that the MEMS gyroscope sensitivity usually is very stable over time and temperature and this calibration is needed only for high-sensitivity applications as mentioned above.

Using a rate table to determine gyroscope sensitivity

Because gyroscopes can measure the angular rate directly, the rate table is a perfect reference to calibrate the gyroscope sensitivity.

An accurate rate table includes a built-in temperature chamber and sits on a vibration isolation platform so that the rate table is not sensitive to environment vibration during calibration.

One can mount the hand-held device in an orthogonal aluminum cube or plastic box and then mount the whole system on the rate table for calibration. Control the rate table to spin at two different angular rates clockwise and counterclockwise. For multi-axis gyroscopes, put the orthogonal box at different orientation on the rate table and repeat the above process. After collecting the gyroscope raw data in different situations, the zero-rate level, sensitivity, misalignment matrix and g-sensitivity values can be determined.

Another option is a step motor spin table to calibrate the gyroscope. The spin table can be programmed and controlled by a PC. 

Using a digital compass to determine gyroscope sensitivity

The other option is to use a digital compass to calibrate the gyroscope if there is no rate table available.

Before gyroscope calibration, the digital compass needs to be calibrated for tilt compensation and operate on a table without surrounding magnetic interference field. Then combining digital compass relative heading information and gyroscope output data at constant sampling time interval, the gyroscope sensitivity can be calibrated as shown in Equation 4.

H(n) = H(1) + h × SC × n/∑/i-1 ΔR(i)      (4)

Where,
 n: samples collected
 h: sampling time interval.
 H(1): initial electronic compass heading
 H(n): the new compass heading at nth sample
 SC (dps/LSB): gyroscope sensitivity
 ΔR(i): gyroscope output data after removal of zero-rate level and dead zone at ith sample

Equation 4 can be rewritten as:

H = SC × G      (5)

Where,

Then from Equation 5, one can get the SC based on Least Square method.

SC = [GT × G]-1 × GT × H      (6)

Figure 3 shows the plot of compass relative heading change in degrees and the gyroscope angular displacement after integration in degrees.

Figure 3. Compass relative heading and gyroscope angular displacement

In Figure 3, one can see that the compass relative Heading change (red) and the gyroscope angular displacement (blue) have perfect linear relationship. By applying Equation 6, one can obtain the gyroscope sensitivity calibration parameter.

Testing a MEMS gyroscope

After gyroscope calibration, the last step is to test the performance of the gyroscope to understand how to obtain meaningful angular displacement information from the gyroscope raw data.

Test 1: When gyroscope is stationary. When gyroscope is not rotating, the gyroscope output raw data should be around the zero-rate level and the gyroscope heading after integration should be always 0°.

Test 2: When gyroscope is rotating full round clockwise. After sampling 30 to 50 samples of the gyroscope raw data as the new zero-rate level offset, rotate the gyroscope clockwise 90°, and then another 90°, till full round 360°. The plot is shown in Figure 4. The peak of each 90° rotation gyroscope raw data is different showing that the angular velocity is slower or faster. But the error of the final angular displacement is only about 0.6°.

Figure 4. Single axis gyroscope rotating full round clockwise.

Test 3: When gyroscope is rotating full round counterclockwise. After sampling 30 to 50 samples of the gyroscope raw data as the new zero-rate level offset, rotate the gyroscope counterclockwise 90°, and then another 90°, till full round 360°. In this case the angular velocity polarity is positive other than negative in Figure 4.

Conclusion

Advances in MEMS technology and processes have led to low-cost, high-performance MEMS gyroscopes with lower power consumption and smaller size, enabling new exciting applications in handheld devices.

MEMS gyroscopes are calibrated during the characterization and qualification process. They do not require re-calibration for most applications. However, for complex and demanding applications such as navigation and dead reckoning, re-calibrate the zero-rate level and sensitivity after the gyroscope is mounted on the PCB is recommended.

References
1. STMicroelectronics MEMS gyroscopes Presentation, http://www.st.com/stonline/domains/support/epresentations/memsgyroscopes/gyros.htm

2. STMicroelectronics MEMS gyroscope Portfolio: LY330ALH, L3G4200D, http://www.st.com/stonline/products/families/sensors/gyroscopes.htm

Jay Esfandyari received his Master’s degree and Ph.D. in EE from the University of Technology in Vienna and is MEMS product marketing manager at STMicroelectronics, 750 Canyon Dr., Coppell, TX, 75019; (972) 971-4969; [email protected].

Roberto De Nuccio received his Master’s degree in Telecommunication engineering in Milan / Italy and is business development manager at STMicroelectronics.

Gang Xu received his Ph. D from Shanghai Jiao Tong University and senior application engineer at STMicroelectronics.

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(November 11, 2010) — SUSS MicroTec, equipment and process supplier for the semiconductor industry and related markets, and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.

Local surface treatment prior to wafer bonding replaces standard process steps and reduces the overall cost per wafer. Selective plasma activation can be applied to a variety of MEMS, optical and solar applications using direct wafer bonding or surface modification for the creation of micro mirror arrays, micro valves, sensors or micro fluidic channels. The SELECT toolkit is an upgrade option of SUSS MicroTec’s MA/BA8 Gen3.

The patent pending technology of Fraunhofer IST is based on atmospheric pressure plasma selectively modifying the molecular level surface. Conventional surface treatment of complete wafers without selection can damage the functionality of micro components or electronics. With selective treatment it is possible to protect those sensitive areas by activating only specific parts of the wafer. Selective plasma activation is used with planar wafers as well as with topography wafers where plasma activation is provided either in the cavities or on the elevated structures.

"While selective plasma treatment in wafer bonding applications significantly reduces the post-bond anneal temperature from 1000°C down to 200°C, it also protects sensitive devices. The technology therefore increases the process window for direct bonding," said Prof. Dr. Günter Bräuer, the director of the Fraunhofer IST. "With SUSS MicroTec’s SELECT toolkit applied in both direct bonding as well as other wafer processing applications, a ground-breaking new approach seems possible for device processing in the semiconductor industry."

"Treatment of selected parts of wafers reduces the costs of producing a device through streamlining processes and increasing throughput at the same time," explained Frank Averdung, President and CEO of SUSS MicroTec AG.

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(November 10, 2010 – BUSINESS WIRE) — InvenSense Inc. released its MPU-6000 product family. The MPU-6000 MEMS motion sensing technology integrates a 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard Digital Motion Processor (DMP) capable of processing complex 9-axis sensor fusion algorithms.

The MPU-6000 family of MotionProcessors eliminates the challenges associated with selection and integration of many different motion sensors that could require signal conditioning, sensor fusion and factory calibration. It features integrated 9-axis sensor fusion algorithms that utilize an external magnetometer output through its master I2C bus to provide dead reckoning functionality. The MPU-6000 is offered in the same 4 x 4 x 0.9mm QFN package and the same pinout as the current MPU-3000 product family of integrated 3-axis gyroscopes. It also offers ease of integration and interface to various application processors through an I2C or SPI bus and its standard MotionProcessing Library (MPL) and APIs.

With increasing popularity of motion sensors in everyday consumer electronics, motion processing is quickly expanding into smart phones, tablets, TV remotes, handheld gaming devices and gaming consoles, digital still and video cameras and many other consumer products. Adoption of motion processing functions in smartphones, tablets and many other portable consumer electronic devices is promising to bring a host of new and enhanced functionalities and benefits to consumers including: precise sensing of hand jitter to improve image quality and video stability; GPS dead reckoning for vehicles and indoor pedestrian navigation and new motion-based user interfaces, augmented reality and more immersive gaming experiences to name a few. However, market adoption has been slow primarily due to a lack of available off-the-shelf solutions that could be adopted quickly and easily by OEMs. Today, developing an integrated motion sensor solution requires using various components offered by many different suppliers, adding signal conditioning, developing proprietary sensor fusion algorithms, processing overhead and resource allocation and understanding the complex IP challenges in this space, all of which adds cost and delays in adoption by end customers. 

Other recent consumer MEMS announcements

Kionix extends reach in inertial MEMS sensors, debuts gyros for consumer apps, new accelerometers

VTI expands into consumer gyros and timing devices

Although integrated 3-axis accelerometers have been around since early 2000 in consumer electronics devices and have been offered by a variety of companies, high performance consumer grade gyroscopes have presented many more technical challenges. InvenSense introduced integrated 3-axis gyroscopes last year. A key benefit of an integrated 6-axis solution on the same chip is the perfect alignment of all axes between the gyroscope and accelerometer that will eliminate costly factory calibrations that are currently required. Further, it has eliminated the need for a separate, standalone 3-axis accelerometer and is offered in the same exact package and footprint as the current 3-axis gyroscope from InvenSense. Last, the addition of a master I2C port for inputting the 3-axis compass output can allow a complete 9-axis sensor fusion using the InvenSense proprietary and patent pending DMP and MPL solution. The InvenSense MPL is a software layer that makes the integration and interfaces to an application processor a very easy task without requiring expertise in the field of motion processing.

"InvenSense, with the development of the Nasiri-Fabrication process and the building of a flexible manufacturing infrastructure, has established an enabling platform to support the integration of multiple axis of motion detection in a single chip," said JC Eloy, CEO of Yole Développement. "InvenSense is developing in parallel of the silicon device, software functions and applications software that will simplify the integration of motion processors into modules and systems, paving the way towards a larger market and wide diffusion of motion processors into consumer electronics."

InvenSense leverages its Nasiri-Fabrication platform for the product, allowing direct integration of MEMS mechanical structures and CMOS electronics at the wafer level, making it a typical fabless semiconductor supply chain. The MPU product family leverages 8" fabrication lines from world class foundries and in-house high volume test and calibration facilities in Taiwan to support the high volume requirements of the consumer marketplace. The MPU-6000 will include the company’s proprietary and patent pending DMP engine, enabling 9-axis sensor fusion and MPL APIs to deliver the only complete solution available in the market today.

The MPU-6000 includes a range of dynamic full scale capabilities at ±250dps, ±500dps, ±1000dps, and a top range of ±2,000dps for angular rate sensing and ±2g, ±4g, ±8g and ±16g for linear acceleration sensing. This permits the use of a single MotionProcessing solution to perform every possible motion application from slow motion menu selection to very fast hand gestures, all with 16-bit resolution. Rate noise performance sets the industry standard at 0.005 degrees/sec/√Hz, providing the highest-quality user experience for image stabilization, pointing and gaming applications. High-accuracy factory calibration targeting ±1% initial sensitivity reduces customer calibration requirements. The gyroscope operates at a resonant frequency above 27kHz making the MPU-6000 immune to interference from audible frequencies (20-20,000Hz) such as music, phone ringers, crowds or white noise, which becomes critical for noise sensitive applications such as image stabilization. Other industry-leading features include the 4 x 4 x 0.9mm plastic 24-pin QFN package, on-chip 16-bit ADCs, programmable digital filters, a precision clock with 2% accuracy over -40°C to +85°C, an embedded temperature sensor, programmable interrupts, and a low 5.5mA current consumption. Parts are available with I2C and SPI serial interfaces, a VDD operating range of 2.5 to 3.6V, and a VLOGIC interface voltage from 1.71 to 3.6V.

The MPU-6000 is available for immediate selected customer sampling.

InvenSense provides motion processors for the consumer electronics market. For more information visit InvenSense at http://www.invensense.com.

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(November 9, 2010 – BUSINESS WIRE) — Kionix Inc. announced a portfolio of microelectromechanical systems (MEMS) inertial sensors featuring 3 new accelerometers that set company benchmarks for low power, performance over temperature, and user programmability. Kionix also released its first two gyroscopes for mass-market consumer applications.

Just one year after its acquisition by the multi-billion dollar semiconductor supplier, ROHM Co., Ltd., Kionix is broadening its offerings for developers of consumer applications in which motion sensing, gesture recognition, drop detection, performance monitoring and location awareness are essential attributes. Congruent with Kionix’s existing portfolio, the new products support the industry’s most diverse selection of embedded algorithms and application software. They satisfy technical requirements, ease the design process for OEMs and ODMs, and leverage the company’s in-house manufacturing capabilities for volume production.

Kionix announced a pair of new gyros aimed at the consumer devices market — the dual-axis KGY12 and the tri-axis KGY13. Kionix introduced its first gyro in 2003. This new generation of gyroscopes balances current consumption and noise with excellent bias stability over temperature. "MEMS gyroscopes are making consumer-electronics history with their rapidly growing integration into a wide range of products. For Kionix, having had widespread success with accelerometers, producing gyroscopes optimized for mass-produced consumer applications was a logical next step, said Greg Galvin, president and CEO of Kionix. VTI also recently moved into the consumer gyro market.

Kionix gyros are packaged in a 5 x 5 x 0.9mm 24-pin land grid array (LGA). They feature low power consumption and 16-bit digital outputs (I2C and SPI) over a measurement range of ±2048°/sec. Analog outputs are also available in user-selectable ranges of ±128°/sec, ±256°/sec, ±512°/sec, ±1024°/sec and ±2048°/sec. Both gyros offer user-definable bandwidth and embedded temperature sensors. Targeting a global market for MEMS in consumer electronics and mobile handsets, Kionix’s portfolio of MEMS inertial sensors adds intelligence through embedded algorithms and application software, speeding the implementation of popular functions such as tap/double-tap touch, directional shake and gesture recognition in portable devices.

The Kionix accelerometer product portfolio debut includes:

  • KXTH9: A multiplexed analog tri-axis accelerometer packaged in a 3x3x0.9mm 10-pin LGA featuring:
    Analog output featuring an integrated 4-channel multiplexer that reduces system microcontroller unit (MCU) requirements to only one analog-to-digital converter (ADC) and two digital I/O’s and achieves very high data sampling rates; Factory-programmable low pass filter with option for user-defined external capacitors; Ultra-low noise density at 150 µg/√Hz typical; and low power consumption
  • KXTG9: A digital (I2C/SPI) tri-axis accelerometer packaged in a 3x3x0.9mm 10-pin LGA featuring:
    High-speed digital interface with SPI (40 MHz, 3 or 4 wire) and I2C for easy system integration, eliminating analog-to-digital converter requirements and providing direct communication with system micro-controllers; Two intelligent user-programmable application interrupts, motion and/or freefall, that can use High Pass Filtered (HPF) or Low Pass Filtered (LPF) output; Calibrated temperature measurement that can be read via the digital communication; and low power consumption
  • KXTI9: A digital (I2C) tri-axis accelerometer packaged in a 3x3x0.9mm 10-pin LGA featuring:
    Non-volatile buffer memory for acceleration signals; Enhanced integrated user-programmable orientation, tap/double-tap, and activity-monitoring algorithms; User-selectable g-range (2g, 4g, 8g) and user-selectable Output Data Rate (ODR) that can use HPF or LPF output; and low power consumption 

The KGY12 dual-axis gyro is currently sampling, as are the KXTH9, KXTG9 and KXTI9 accelerometers. Samples of the tri-axis gyro will be available next month.

Kionix Inc. is a wholly-owned subsidiary of ROHM Co. Ltd. of Japan. The Company pioneered high-aspect ratio silicon micromachining based on research originally conducted at Cornell University and offers MEMS product design, process engineering and quality manufacturing. For more information on Kionix, visit http://www.kionix.com. For additional information on ROHM, visit http://www.rohm.com.

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(November 2, 2010) — The Microelectronics Research Center (MRC), of the University of Texas at Austin (UT at Austin) has recently increased its facility capabilities by installing a Plasma-Therm VERSALINE DSE system. The addition of leading deep silicon etch technology enables process advances in MRC’s micro, nano and opto-electronics research. 

Precise silicon etching and process latitude are key elements to operate successfully in a research center environment. The deep silicon etch technology that the VERSALINE DSE provides, achieves these objectives through a combination of fast process control features and multi-step process flexibility.

Fast process control features such as patented pressure control algorithms, close mounted rapid gas switching, solid state matching networks and sensitive endpoint detection software, are joined with unmatched silicon-on-insulator (SOI) performance to deliver required high quality etch features. 

“We were extremely pleased with Plasma-Therm in terms of their installation of the DSE system and the training they provided. The tool is working as advertised,” stated Dr. Sanjay Banerjee, Director of the MRC at the University of Texas at Austin.

“Understanding our customer’s priorities and what makes them successful is a primary focus at Plasma-Therm. We realize that capital equipment is a significant portion of R&D programs and in turn we work to bring maximum value through high flexibility with all Plasma-Therm systems. Because of this, research and development in material science, optics, MEMS and microelectronics have relied on our equipment for generations,” stated Ed Ostan, executive vice president of sales & marketing at Plasma-Therm.

The University of Texas at Austin Microelectronics Research Center (MRC), funded by the National Science Foundation (NSF) through the National Nanotechnology Infrastructure Network (NNIN), is a state-of-the-art, shared-equipment, open-use facility. The laboratory serves academic, industrial and governmental researchers across the country and around the world. MRC’s lab-members come from a wide variety of disciplines, with research in areas of electronics, optics, MEMS, biology and chemistry, as well as process characterization and fabrication of more traditional electronic devices.

Plasma-Therm supplies advanced plasma process equipment that caters to various specialty markets including MEMS, solid state lighting, thin film head, photomask and compound semiconductor fab. Learn more at www.plasmatherm.com

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(November 1, 2010) — Scientists involved in the European Union’s "Smart inspection systems for high-speed and multifunctional testing of MEMS and MOEMS" (SMARTHIEHS) project are developing a new test concept based on parallel inspection of devices at wafer level using micro-optical systems. The intent is to make the testing of microelectromechanical systems (MEMS) and micro-optoelectromechanical systems (MOEMS) structures one hundred times as fast as it is now. Testing one hundred structures simultaneously will reduce the time involved from 20 minutes to less than half a minute.

Sintef is coordinating the project, in which eight European centers of expertise in micro-optics are participating. The project is already halfway to completion.

"It is the industry itself that has been asking for better and cheaper methods," says project manager Kay Gastinger of Sintef.

Interferometric detection
The scientists use a number of interferometers in the testing process. The interferometers themselves are produced using standard microtechnology processes, which makes them cost-effective.

The aim of the project is to create glass wafers that incorporate up to 100 of these interferometers and then use them to test 100 circuits on a MEMS wafer at a stroke. The scientists will be able to measure the shape, any deformations, and resonance frequencies of the MEMS structures and thus identify manufacturing faults.

"We have already produced a prototype measuring station that is capable of measuring five structures at a time," says Gastinger. "The prototype consists of lens, mirror, and beamsplitter wafers. The top wafer contains 25 microlenses, which act as tiny imaging microscopes. Small micromirrors centered on the lenses produce the interference effect."

The project is due to end in 2011, by which time the demonstrator model will have been developed into a 50-channel version in a design that can be further expanded to 100 channels.

(November 1, 2010 – BUSINESS WIRE) — GigOptix Inc. (OTCBB:GGOX), electronic and electro-optic components supplier, named Innovative Micro Technology, Inc. (IMT) as its optical chip fabrication partner. GGOX is now in the process of transferring production of its Thin Film Polymer on Silicon  (TFPS) optical modulator chips to IMT in expectation of volume production ramping in 2011.

The TFPS modulator chips are designed internally, will be manufactured at IMT using GigOptix’s proprietary electro-optical polymer material, and packaged externally by the high-volume contract manufacturer in Shenzhen, China.

GigOpitix’ proprietary TFPS technology is used in the manufacture of 40G and 100G Mach-Zehnder (MZ) optical modulator chips for telecom applications. The modulator chip fabrication process uses a production flow that is compatible with industry-standard semiconductor manufacturing techniques. GigOptix’s TFPS technology lowers power consumption by more than 20% compared with competing modulator technologies, such as Lithium Niobate, and also enables significantly smaller modulators that easily fit into industry-standard 3.5 × 4.5" form factor 300-pin transponders, according to the company.

“We are very pleased to have reached the process maturity level with our TFPS technology to partner with IMT to transfer production of our modulator chips from our internal pilot fab to the high-volume production site at IMT,” said Raluca Dinu, VP & GM of GigOptix Bothell, adding that IMT offers established, high-quality, high-volume and cost-efficient manufacturing with optical device experience. "Furthermore, we plan to bring our full family of modulator chips to production at IMT to address various modulation formats, such as 40G DPSK, 40G RZ-DQPSK and 100G DP-QPSK being demanded by the telecom communication market. These steps are in line with our stated strategy of being a fabless solutions provider."

GigOptix’ 40G DPSK LX8410 TFPS modulator is available for immediate sampling. 
 
GigOptix is a supplier of high performance electronic and electro-optic components that enable next generation 40G and 100G fiber-optic telecommunications and data-communications networks.

IMT develops and produces MEMS devices and is the largest pure-play MEMS foundry in the US. Visit the company website at http://www.imtmems.com.

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