Category Archives: MEMS

(October 29, 2010 – BUSINESS WIRE) — VTI Technologies, Micro-Electro-Mechanical Systems (MEMS) supplier, is now taking a new direction and expanding into the consumer electronics segment. VTI is already the market leader in low-g sensors for the automotive industry, as well as in ultra-low power sensors for the medical implantable market.

The consumer MEMS market is booming as motion control becomes more and more standard in user-interface applications, such as mobile phones, gaming devices and TV remote controllers. Especially interesting is the gyroscope market. In 2008, iSuppli predicted VTI’s move to consumer apps.

In 2009, VTI was the first MEMS company to adopt Wafer Level Packaging (WLP) in a small and low power consuming three-axis acceleration sensor, the CMA3000. Now, the same technology is being applied to gyros. The new VTI consumer gyro, which will be introduced at the Electronica 2010 fair in Munich, is superior in terms of size, power consumption and performance compared to products on the market today. "We are now leveraging our expertise in high performance MEMS and intend to bring out products targeting the consumer segment that will challenge the current market offering," said Markku Hirvonen, president and CEO of VTI.

According to Hirvonen, another very interesting focus area is Silicon MEMS timing devices. “There is an enormous opportunity for MEMS-based timing and frequency control devices. The challenge has been to overcome issues related to accuracy and stability. We believe we have made a major technological breakthrough in this field,” Hirvonen continues.

The new direction also affects the company’s manufacturing strategy, as the new markets will require even greater flexibility and cost efficiency. “Our manufacturing strategy can be described as a hybrid model. We are utilizing our own fabrication for Automotive and Medical products, as well as for R&D purposes, and mass producing our high volume consumer products utilizing an outsourced supply chain. In this way we are getting the best of both worlds,” Hirvonen says.

VTI Technologies is a supplier of acceleration, inclination and angular motion sensor solutions for transportation, medical, instrument and consumer electronics applications. VTI develops and produces silicon-based capacitive sensors using its proprietary 3D MEMS (Micro Electro-Mechanical System) technology. For more information, please visit www.vtitechnologies.com.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(October 29, 2010) — At the MEMS Technology Summit (10/19-10/20/10, Stanford University), Peter Hartwell, Distinguished Technologist at HP Labs, discussed the company’s sensor strategy — called CeNSE (central nervous system for the earth) — with Debra Vogler, senior technical editor. In this podcast interview, Hartwell describes how HP has been leveraging its inkjet cartridge technology and high-volume manufacturing to tackle the need for distributed wireless sensing networks, in particular, sensing in harsh environments. By harnessing the compute power in “the cloud,” the large amounts of data generated from wireless sensors provides the information required to monitor infrastructure.

Podcast: Download or Play Now

In his presentation at the conference, Hartwell also did an interesting back-of-the-envelope calculation that illustrated just how challenging it is for MEMS component manufacturers to make a profit, given that the technology has become commoditized. Essentially, the revenues generated at the system integrator stage and up to the service provider are orders of magnitude larger than those seen by a MEMS device manufacturer. In his example, a MEMS device manufacturer might realize $30 million in revenues, while the systems integrator would see $2.2 billion in revenue; but the service provider might see $25 billion in revenue. Going forward, funding models will have to take this commoditization factor into account.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

MEMS-traps-to-avoid-ST-Micro


October 29, 2010

(October 29, 2010) — Reporting from the MEMS Technology Summit (10/19-10/20/10, Stanford University), Debra Vogler, senior technical editor, spoke with Benedetto Vigna, Group VP, GM, MEMS, Sensors and High Performance Analog Division at STMicroelectronics.

Podcast: Download or Play Now

In his podcast interview, Vigna described what he calls MEMS "traps" — ways of thinking about MEMS that hold back the industry and slow its growth. He advises against "falling in love with the chip" or the technology; instead, the industry should fall in love with applications.

Looking ahead, Vigna sees the industry metamorphosing from its current era of consumerization to what he calls "personalization," i.e., sensors in/on/around the body.

More interviews from the MEMS Technology Summit 2010:

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(October 28, 2010) — As the use of motion sensors in various consumer electronic devices is expanding quickly, the industry competitive landscape is significantly changing. This is most apparent with MEMS gyroscopes. The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS gyroscopes is still gaming. In a $418 million consumer gyroscope market in 2010, gaming represents a market segment of $162 million, according to Yole Développement.

Yole Développement will release a new report dedicated to the worldwide consumer electronics industry next month. This market & technological analysis will include competitive landscape, market data, technological challenges analysis, and more.

More than 50 million Motion Plus controllers (which integrate InvenSense and Epson gyroscopes) have been sold since their launch in June 2009. However  this is just a start, since new motion sensing solutions with MEMS gyroscope are now being released on the market. In September 2010, the Sony Move game controller was launched. It integrates 9 degrees of freedom with the use of accelerometers, gyroscopes and compass. It uses complex sensor fusion algorithms creating more precise gestures recognition, and more immersive gaming experiences. And now, Nintendo is planning to add motion sensing features in portable game stations, by integrating accelerometers and gyroscopes in 3DS, to be released in February 2011.

Yole Développement believes 2 gyroscope industry providers will benefit from these changes:

  • According to Yole Développement’s information, the 2-axis gyro in the Move controller is from Sony. Sony is a newcomer in the MEMS gyroscope landscape: Sony has developed a 2-axis solution that is now integrated in all its DSCs except high-end products since 2009. Those parts are also sold to a few other DSC manufacturers in Japan, and are now integrated in the PS3 Move game controller, which means that Sony now has a very large gyro market share. Sony Computer Entertainment may have a second source for this 2-axis gyroscope but Yole Développement believes that Sony gyroscopes are used in majority.
  • Panasonic has recently launched its 3-axis gyroscope and is actively promoting it in the gaming and mobile phone industry. Yole Développement expects Panasonic 3-axis gyroscopes to be integrated in the future Nintendo 3DS.

Competition is gaining intensity as the gaming gyroscope market is becoming increasingly attractive. Established players (ST, Epson Toyocom, InvenSense) are also pushing hard to introduce 3-axis gyroscopes into this market while new large players such as Kionix and Bosch Sensortec are expected to enter this market. It is possible that a unique 3-axis gyro could  replace the 2-axis gryo + single axis gryo of the Motion Plus controller.

Current integrations of several types of sensors open the way for even more technology or capability. Yole Développement forecasts an increase in market traction for MEMS IMUs within one or two generation of products, provided that the cost of such packages becomes more attractive compared to the simple addition of accelerometer and gyroscope discrete sensors.

Market and technology trends dedicated to the worldwide consumer electronics industry will be presented in the next report: “Motion Sensor Market for Consumer & Mobile Applications” by Yole Développement. Under this study, the company analyzes the latest technology challenges for numerous applications — mobile phones, tablets, cameras, game controllers, remote controls — and describes the competitive landscape. What are the current solutions? What will be tomorrow’s technologies? What are the market’s needs?

Laurent Robin, Market Analyst at Yole Développement, explains the structure of this industry and announces key market data. The “Motion Sensor Market for Consumer & Mobile Applications” report includes detailed analysis on the following MEMS solutions: accelerometers, gyroscopes, electronic compass, combo sensors.

The report will be available in November 2010. For more information about this report, contact Yole Développement at www.yole.fr.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(October 27, 2010) — Roger Grace, Janusz Bryzek, and Sverre Horntvedt were among the MEMS industry executives, entrepreneurs, and experts that spoke with ElectroIQ at the recent MEMS Technology Summit at Stanford University. They share a reflection on the past 25 years of MEMS, and insights into where MEMS will go in the next 25.

Changing with the technology, competing outside MEMS arena
Sverre Horntvedt, president, CEO, and co-founder of Sensonor Technologies, speaks with Debra Vogler, senior technical editor, in this podcast interview. He describes the company’s interesting journey from its leading position in automotive MEMS applications, to its current focus on high-precision MEMS in applications for which the competitors’ technologies are non-MEMS-based. Podcast: Download or Play Now

>1 trillion MEMS devices in the next 10 years
MEMS Technology Summit co-organizer and industry pioneer, Janusz Bryzek of Jyve Inc., absorbed many lessons in the first 25 years of MEMS development. "Manufacturing MEMS is not a trivial job," said Bryzek. But as the infrastructure is improving, “It’s easier to get products to the market if you follow what the industry has developed, and not try to reinvent new manufacturing processes.” He discusses a MEMS roadmap in his interview with Vogler. Podcast: Download or Play Now

Focus shift to value-add system models
Roger Grace, Roger Grace Associates, wants to see MEMS apps shift from component-focused to system integration. This will help MEMS grow in the future, he says. Grace talks with Vogler about re-inventing technologies for lucrative applications, and profits in the MEMS sector. Podcast: Download or Play Now

Other interviews from the MEMS Technology Summit

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(October 27, 2010) — Fabless audio chip company Wolfson Microelectronics plc (LSE: WLF.L) launched its next-generation digital silicon micro-electro-mechanical-systems (MEMS) microphones, the WM7210 and the WM7220. The digital MEMS are manufactured with Wolfson’s CMOS/MEMS membrane design, similar to the company’s analog MEMS microphones.

The WM7210 and the WM7220 complement Wolfson’s family of analog MEMS microphones. Based on Wolfson’s proprietary CMOS/MEMS membrane technology, the new digital devices deliver high reliability and performance, and can withstand the high temperatures needed for automated flow solder assembly, which can damage conventional microphones.

Wolfson’s digital MEMS microphones combine low power consumption, excellent audio capture, signal-to-noise (SNR) ratio of 59dB -Top port, low total harmonic distortion (THD) at high sound pressure levels, and a miniature low-profile package, suiting applications including mobile phones, PCs, portable media players, digital still cameras, and navigation devices. Audio is again becoming a differentiator in low- and high-tier consumer electronics devices, said Ron Schaeffer, audio hub product manager at WFL.L.

The WM7210 and WM7220 also help save battery life with ultra low sleep mode power consumption.  When the clock delivered to the microphone drops below a specified frequency, the microphones automatically power down into a sleep mode consuming just 2.5 micro amps.

Each microphone incorporates a high-performance ADC, which outputs a single bit Pulse Density Modulated (PDM) format audio data stream, while the microphone output can be defined for left or right configuration allowing for applications requiring stereo operation. The package is designed to accommodate various porting requests.

The WM7210 is available in a 4 x 3 x 1mm thin package design, priced at $1.83 in 1K volume, while the WM7220 is available in a 4.72 x 3.76 x 1.25mm, priced at $1.83 in 1K volume.

Wolfson entered the MEMS market with the acquisition of Oligon in January 2007. iSuppli noted their venture into the MEMS space, stating that this “factor will accelerate the penetration of MEMS microphones in the 2009-2012 timeframe.” Schaeffer noted with the digital MEMS launch that, “Complexity of audio capture and playback, across various platforms, and often in challenging environments, is leading to the integration of multiple (up to 8) microphones into a single smartphone, for example.” MEMS offer a more robust microphone chip, and are seeing adoption across major OEMs, he added, saying that product designers want drop-in package solutions from large-scale suppliers.

Wolfson Microelectronics supplies high-performance, mixed-signal semiconductor solutions to the consumer electronics market.Wolfson Microelectronics plc is listed on the London stock exchange (LSE: WLF.L).  For more information about Wolfson Microelectronics, visit: http://www.wolfsonmicro.com 

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(October 26, 2010) — Steven Walsh, the Albert Franklin Black Professor of Entrepreneurship at the University of New Mexico, recently spoke about the lessons learned from 25 years of MEMS technology, educating attendees of the MEMS Technology Summit (10/19-10/20/10, Stanford University).

Podcast: Download or Play Now

In a podcast interview with Debra Vogler, senior technical editor, Walsh summarizes the 5 major commercialization hurdles MEMS companies face, whether in a disruptive, discontinuous-based product paradigm or a sustaining, continuous-based product paradigm. In the first case, a company must have at least a 10% improvement in cost and at least a 2-3× improvement in some other parameter. For a sustaining technology, you can go with an ~2× improvement and you have to make it better, faster, cheaper. Another decision point: do you have the funds, can you develop the product yourself, and you have to decide whether to go fabless. He also offers specific advice for the entrepreneurial team.

He ends his interview with a recitation of BioMEMS devices that are in exciting stages of development, including a MEMS needle that eliminates the need for a stabilization agent in vaccines, optical solutions that aid vision, and targeted cancer therapies.

Additional podcast interviews from MEMS Technology Summit:

MEMS cantilevers enable better MEMS sensors: Chat with Beth Pruitt, Stanford

Nanotechnology promises have gone unfulfilled, says Stanford prof

Water on the moon? NASA MEMS-based Phazir spectrometer chat with Steve Senturia

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(October 26, 2010) — Nanoplas, supplier of HDRF plasma processing equipment for MEMS, 3D through-silicon via (TSV), IC packaging and III-V compounds, introduced a fully automatic dry-processing batch system for high-volume 200mm production. The DSB 9000A is based on Nanoplas’s High Density Radical Flux (HDRF) technology.

The DSB 9000A performs key production steps in microelectronic manufacturing, including removal of Bosch-process polymers, residues and photoresist from 80-250°C; isotropic etching of organic sacrificial layers; and pre-wafer bonding activation.

The DSB 9000A outperforms conventional radio-frequency (RF) plasma and microwave systems, while greatly reducing the risk of surface damage, said Gilles Baujon, CEO of Nanoplas. With 100 percent gas disassociation, the DSB 9000A ICP source produces free-radical concentration levels of up to 1,000 times greater than conventional plasma sources, thus providing enhanced process performance, including higher cleaning performance for high aspect ratio structures. The system’s proprietary technology eliminates the charging effects and UV radiation normally associated with conventional plasma, allowing stiction-free processing and low-temperature operation.

HDRF offers 3 modes of operation covering a wide range of processes, from ultra-sensitive surface cleaning to removal of non-reactive residues. Typical throughput for photoresist stripping is 60-70 WPH, and greater than 100 WPH, per process module, for post-Bosch cleaning and surface activation.

Nanoplas is an innovator of specialized production solutions that deliver low-cost, green alternatives for treating wafer surfaces in next-generation devices, advanced MEMS, 3D TSVs, advanced packaging, power ICs, optoelectronic components and III-V compounds. Visit www.nanoplas.eu for more information.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

(October 25, 2010) — Thomas Kenny, Ph.D., Professor of Mechanical Engineering at Stanford University, told attendees of the MEMS Technology Summit (10/19-10/20/10, Stanford University) that nanotechnology promises have gone unfulfilled. “If we define a technology as the ability to make something exactly the way we want it, over and over, we do not have this capability at the nanoscale for many structures,” said Kenny. He also argues that the MEMS industry is undergoing an identity shift, if not an identity crisis.

Podcast: Download or Play Now

In a podcast interview with Debra Vogler, senior technical editor, ElectroIQ, Kenny discusses DARPA’s Tip-Based Nanofabrication (TBN) Program, which is a response to the need for localized control over environments and position and all other characteristics of a nanostructure. The TBN program (Kenny is the program manager) opens up the possibility for site-specific growth of nanotubes and nanowires. He says we need complete control of repeatability in nanoscale manufacturing, at best. Our goal is to make things that are different, on purpose, he says.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(October 25, 2010) — MEMS cantilevers are the force and displacement sensor backbone of all of the MEMS sensors in our cars, cell phones, and other products. The basic cantilever can be manipulated to serve cutting-edge research applications in bio mechanics and other fields, says Beth Pruitt, Assistant Professor of Mechanical Engineering at Stanford University, speaking at the MEMS Technology Summit (10/19-10/20/10, Stanford University). She speaks with Debra Vogler, senior technical editor, ElectroIQ.

Podcast: Download or Play Now

MEMS cantilevers have become a key enabler in science and consumer, aerospace, and automotive applications. Some applications include a novel scanning probe, cantilever-based chemical sensing, and mechano-transduction at the cell and organism level. 

Pruitt notes that Stanford takes a "MEMS inside" approach to research — posing a question that can be uniquely solved by MEMS. MEMS cantilevers are improved with medical, physical, and other research needs in mind. Pruitt discusses the merits of cantilevers as well as funding opportunities that leverage these useful mechanisms.

Other research chats from the MEMS Technology Summit 2010:

 NASA LCROSS project: Steve Senturia discusses the MEMS-enabled Phazir

Thomas Kenny, Stanford, on DARPA Tip-based nanofabrication program