Category Archives: MEMS

The Optical Channel Monitor (OCM) for DWDM networks supports 88 channels with options to cover 96, and is suitable for either 50 or 100 GHz channel plans. Its wavelength range is customizable, covering both C and L band applications and any combination of 10 and 40 Gbit optical channels. The OCM is voltage-controlled and can scan continuously with a scan speed of 250 ms, or hold a particular park state position.
DiCon Fiberoptics
Richmond, CA
www.diconfiberoptics.com

More Products

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PRESS RELEASE

DiCon Fiberoptics Releases New Optical Channel Monitor Ideal for DWDM Networks

Richmond, CA—DiCon Fiberoptics is pleased to present its new Optical Channel Monitor (OCM) for use in DWDM networks. Based on DiCon’s MEMS Tunable Filter, the Optical Channel Monitor offers superior optical performance and features proven MEMS durability and reliability.

DiCon’s Optical Channel Monitor supports a standard 88 channels with options to cover 96, and is suitable for either 50 or 100 GHz channel plans. Its wavelength range is customizable, covering both C and L band applications and any combination of 10 and 40G bit optical channels. The OCM is voltage controlled and can scan continuously with a scan speed of 250 ms or hold a particular park state position.

“With the growth of Reconfigurable Optical Networks, our Optical Channel Monitors provide a highly reliable, durable and low-cost monitoring solution for our customers,” said Jarlath McElroy, DiCon’s Director of Sales. “Featuring a compact 70mm x 106mm x 10.8mm footprint, customers have the option of integrating a 1xN MEMS Fiber Optic Switch to provide the flexibility of monitoring up to 12 separate points in a network node without changing the form factor.”

The Optical Channel Monitor is an optical subsystem that scans DWDM networks and reports the power of each channel in real time. Feedback from the Optical Channel Monitor can be used to optimize power levels, identify performance drift, and verify system functionality. An extension of DiCon’s proven MEMS product line, the Optical Channel Monitor offers the same durability, repeatability, and stability as DiCon’s MEMS Tunable Filter,1xN Fiber Optic Switch, and Variable Optical Attenuator.

For more information about DiCon’s optical channel monitor, please visit www.diconfiberoptics.com/products/optical_channel_monitor.php.

Posted by Lee Mather

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by Laura Peters, contributing editor

IEDM Previews:
How strain can protect devices from ESD
SEMATECH tipping III-V MOSFET, FinFET, and resistive RAM
TSMC anneal for gate-last HKMG process
Imec IEDM presentations to cover More than Moore, ITRS
When do TSV stresses affect device operation?
Multi-threshold-voltage flexibility in FDSOI
CMOS imager works from light to night
Carbon nanotube vias approach production densities
IBM Alliance simplifies pFET HKMG
IM Flash details 25nm NAND

October 22, 2010 – Traditional CMOS image sensors based on silicon are limited to imaging in the visible and near infrared (IR) spectrum. But for homeland security, automotive safety and other applications that rely on detection of the earth’s natural "night glow," extension into the short-wave IR (SWIR) band is needed.

Researchers from NoblePeak Vision Corp. (Wakefield, MA), will explain how they integrated a low-noise, high quantum-efficiency germanium (Ge) photodiode into a 10μm-pitch VGA-compatible CMOS sensor at the upcoming International Electron Devices Meeting (IEDM, 12/6-8 in San Francisco, CA). The CMOS sensor absorbs light from visible to 1.6μm, enabling high-resolution night imaging under moonless conditions. According to the research team, this is the first large-scale integration of single-crystal germanium (Ge) diodes into a silicon imager.

To date, one challenge in building quality Ge-on-Si diodes has been the high thermal budget associated with reducing Ge dislocation densities caused by the Ge/Si lattice mismatch of 4%. Using a high aspect (AR) ratio connection between the germanium and silicon, the NoblePeak process induces in-plane tension, which extends the absorption band edge of the germanium, helping the sensor to capture night glow at peaks of 1.3μm and 1.6μm. Based on a standard 0.18μm CMOS foundry flow, process details are shown in Figure 1. The team packaged the imagers with a thermoelectric cooler (-80°C) and incorporated them into a compact camera.

Figure 1. Ge diode integration flow. a) CMOS-to-contact formation; b) deposit Ge well dielectric, pattern Ge well and high AR Si seeding stem to form dual cavity; c) grow Si epi, CMP, form n and p regions in Ge by ion implant, deposit Ge interlayer dielectric; d) form Ge contact and stacked contact to CMOS, standard BEOL, microlens formation. (Source: NoblePeak)

Pixel quantum efficiency (QE) is defined as the electrons collected by the circuitry relative to photons incident on the pixel. The group found that QE was a function of fill factor and reflections in the dielectric stack, losses to the silicon substrate or dielectric, and quality of the metallization pattern. Packaged testing of devices revealed a pixel QE of 44% at 1.3μm at full VGA resolution and 32% at half resolution (Figure 2).

Diode dark current (i.e., leakage current) measured at wafer probe at -45°C was 25 fA/pixel. The team traced the primary leakage mechanism to traps within the space-charge region of the diode.

For SWIR imaging, an alternative is a room-temperature InGaAs SWIR sensor for military applications. However, this approach requires integration with a long-wavelength thermal sensor for full bandwidth coverage. Another image sensor option, which allows extension into the near-IR, involves copper indium gallium selenide (CIGS)-on-CMOS for automotive and security applications.

Figure 2. Pixel quantum efficiency and dark current. Wafer probe results show median pixel quantum efficiency and dark current of all pixels in each VGA imager measured at full and half-resolution. Optical power was 3μW/cm2. (Source: NoblePeak)


(October 20, 2010) — When NASA wanted to look for water on the moon, it used a MEMS-enabled near-IR portable spectrometer. At the MEMS Technology Summit, Steve Senturia, Professor of Electrical Engineering, Emeritus. MIT, and the former chairman and CTO at Polychromix (purchased by Thermo Fisher Scientific in June 2010), presented details about the Phazir spectrometer NASA used.

Podcast: Download or Play Now

Having just been notified by NASA that results from the 2009 finding will be published in the 10/22/10 issue of Science, Senturia discusses the project in a podcast interview at the MEMS Technology Summit (taking place October 19-20 at Stanford University) with Debra Vogler, senior technical editor.

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(October 20, 2010) — Imec Taiwan signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec Taiwan Innovation Centre (ITIC). ITIC’s goal is to expedite applied research projects with industry and academia that will result in electronic designs, components and technology solutions. The new R&D centre will focus on a variety of innovative applications in bioelectronics, MEMS and "green" electronics that are enabled through 3D system/package co-design and system-level evaluation.

The business plan for ITIC forecasts a growth of its research staff to 40+ over 3 years. ITIC is launched with the signing today of an agreement between imec Taiwan and the Institute for Information Industry (III) on behalf of the Taiwanese MOEA. ITIC is financed by imec Taiwan and will be co-funded by the Taiwanese MOEA as a "Multinational Innovative R&D Centre" under MOEA subsidy for the Project of Encouraging Foreign Enterprise Establishing Research and Development Center in Taiwan. The worldwide impact of the Taiwanese semiconductor and consumer electronics industry is unequivocal, and there is an increasing intention of the stakeholders to move up the value chain by entering key innovation areas, say imec representatives. Consequently, Taiwan is an important market for a nanoelectronics R&D centre such as imec. ITIC, being imec’s local R&D centre in Taiwan, will facilitate and intensify the collaboration between imec and the Taiwanese industry and academia.

"The creation of ITIC, two years after having established a representation office in Hsinchu, Taiwan, is essential in our continued efforts to create value for our current and future partners in Taiwan, to leverage our global partnerships, and to actively interact with the Taiwanese ecosystem," said Luc Van den hove, CEO and president of imec and member of the Board of imec Taiwan. "An R&D initiative such as ITIC will intensify imec’s interaction with the local semiconductor and system-level companies and academia."

"As a semiconductor innovative applications centre, ITIC will support the upward shift in Taiwan’s technology value chain and contribute to the realization of Taiwan’s strategic Innovation Plan. It will accelerate open innovation that will result in locally owned IP in the area of intelligent electronics," says Jung-Chiou Hwang, Vice Minister of Economic Affairs, adding that the imec center might attract foreign (European) investment in Taiwan-based high technology as well.

Imec performs world-leading research in nanoelectronics. Further information on imec can be found at www.imec.be.

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(October 19, 2010) — Francesco Doddo, Roberto Condorelli, Roberto De Nuccio, STMicroelectronics (NYSE:STM), acknowledge the benefits and upsides of solar photovoltaic (PV) installations. However, safety and security concerns have accompanied photovoltaic installations from the start. Among the MEMS applications in the solar market are vibration analysis and anti-theft and include residential inverters, inverters mounted on poles, and solar street lighting. With PV installations on the rise globally, the authors look at various MEMS applications in this renewable energy system.

Vibration analysis for earthquake detection and wind monitoring

When solar PV is located in a seismic zone, earthquake forces must be considered; additionally, oscillations caused by the wind have to be taken in to account when the solar system is located in hurricane zones.

In the case of grid-connected systems (i.e., residential inverters, inverters mounted on poles, solar street lighting), earthquake and hurricane events increase the risks of fire, arc generation, and electrocution. At this time, every solar system should be disconnected from the grid.

In contrast, for off-grid systems such as battery-powered solar LED street lights, during an earthquake, the solar LED should be turned on with maximum power — working as emergency lights to ensure a population’s safety and avoid panic. In both cases, MEMS accelerometers are an efficient tool to monitor the solar panel vibrations due to wind or to earthquakes.

 
Figure 1. a) FFT analysis; and b) instantaneous accelerations plot. 

Figure 1 contains photos taken using the graphical user interface (GUI) of an evaluation board that features a 3-axis ±8g smart digital accelerometer. Figures 1 and 2 show the fast-Fourier transform (FFT) calculation and the instantaneous accelerations plot along the three axes of the accelerometer [1,2]. Combining the interrupt functionalities, the sleep-to-wake and the low-power mode allows the application to have a fast and efficient vibration detection and vibration analysis.

 
Figure 2. A STEVAL-MKI022V1 evaluations board.

In a typical vibration analysis application, the digital accelerometer may be configured to work in low-power mode and generate an inertial wake-up interrupt signal accordingly to a programmed acceleration event along the enabled axes. Thanks to the sleep-to-wake function in conjunction with the low-power mode, the device, even if asleep, continues sensing acceleration and generating interrupt requests.

When the acceleration on one of the axes overcomes a user-programmed threshold, the sleep-to-wake function is activated, and the accelerometer is able to automatically wake-up as soon as the interrupt event has been detected, increasing the output data rate and bandwidth. With this feature, the system may be efficiently switched from low-power mode to full performance depending on user-selectable positioning and acceleration events, thus ensuring power saving and flexibility. Depending on the level of complexity requested by the application, the acceleration data can be sent to a host microcontroller (i.e., 32bit STM32L or 8bit STM8L low power ST MCUs) through the on-board SPI interface.

Tilt detection for anti-theft or safe maintenance

When solar installations are located in remote places — solar pole installations, solar farms — an anti-theft system is useful to avoid the risk of theft. MEMS accelerometers can be used for tilt detection to detect a change in the installation angle. In a similar way, tilt detection can help users understand if the solar panel has been removed from its original location (i.e., for maintenance); this information can be used to put the system in a safe condition, i.e., trough electronic switch off the line (Fig. 3).

 
Figure 3. a) Tilt measurement; b and c) the installation angle change during a theft or maintenance action.

The accelerometer measures the gravity vector projection on the sensing axis. The amplitude of the sensed acceleration changes as the sine of the angle α between the sensitive axis and the horizontal plane. With a 3-axis accelerometer, the user can use the Z axis to combine with the X and Y axes for tilt sensing, to improve tilt sensitivity and accuracy over 360° of rotation (Fig. 4) [3].

 

 
Figure 4. Tilt sensitivity of a 3-axis accelerometer, and b/c) an example of tilt sensing using an evaluation board that uses a 3-axis accelerometer, and the associated GUI.

References:
1. ST Microelectronics’ MEMS Website page: http://www.st.com/mems
2. MEMS Evalboards: http://www.st.com/stonline/products/families/evaluation_boards/steval-mki022v1.htm
3. Tilt measurement Application Note: http://www.st.com/stonline/products/literature/an/17289.pdf

Francesco Doddo holds a degree from Università degli Studi di Messina and is market development engineer at STMicroelectronics, Lexington, Massachusetts, USA, www.st.com. The article was co-authored by Roberto Condorelli and Roberto De Nuccio, also of STMicroelectronics.

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(October 15, 2010) — Micro electro mechanical systems (MEMS) are perceived as being simple mechanical devices manufactured on 6-inch or smaller wafers, via mature semiconductor fab technology. Recently, MEMS devices have experienced high growth rates in consumer products, and the MEMS potential extends into safety and automotive apps. Semico’s bloggers Joanne Itow and Tony Massimini say foundries and EDA/IP vendors are salivating over the revenue growth potential for MEMS development.

In their latest blog post, Itow, managing director; and Massimini, chief of technology at Semico, say that MEMS are the current "fab filler," just as CMOS image sensors were in 2003. But with applications across the total spectrum of electronics — from screen rotation on cell phones to safety sensors on industrial transportation — MEMS have the potential to be more.

Read the blog for more MEMS analysis and information about Coventor’s latest EDA tool partnership with Cadence: http://www.mapmodel.com/index.php/2010/10/12/mems-small-moves-result-in-big-potential/ 

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(October 13, 2010) — Coventor Inc., software supplier for developing micro-electromechanical systems (MEMS), released the latest version of its MEMS+ design suite. The new release, MEMS + 2.0, includes tight integration and simulation within the widely used Simulink environment from MathWorks.

This support builds on the company’s existing integration with the Virtuoso IC design system from Cadence Design Systems (also enhanced in this release) to provide designers with an efficient, integrated environment for incorporating MEMS into traditional IC and system-on-chip (SoC) design methodologies.

In addition to the more unified and complete MEMS+IC design flow enabled by MEMS+, the latest release improves simulation performance within the Cadence environment and expands the library of 3D MEMS building blocks available to enable a wider variety of MEMS-based applications. Additional features in the tool’s user interface improve the ease of design creation and re-use within the product as well.

With the newest version of MEMS+, designers can use the same parameterized behavioral model created in the MEMS+ environment for simulations in both the Simulink and Cadence Virtuoso environments. MEMS engineers can now simulate their MEMS design in the familiar Simulink environment, optimize parameters, and hand off automatically generated behavioral models to their counterparts in the system architecture and IC design domains.

System architects can then easily incorporate MEMS in algorithmic-level simulations that span software, firmware, digital logic and analog circuits, while IC designers can incorporate MEMS in implementation-level simulations as well as physical design. Through the integration, all groups work from a single MEMS design representation in MEMS+. As with the Virtuoso integration there is no programming, just the creation of the MEMS design in the intuitive 3D user interface provided by MEMS+.

MEMS+ 2.0 includes an expanded version of Coventor’s extensive library of MEMS building blocks for accelerometers, gyroscopes, display mirrors, resonators, pressure sensors and RF switches. The 2.0 library version offers enhancements particularly for designing and simulating the flexible structures that occur in inertial sensors, microphones, and energy harvesting devices.

Traditionally, to support algorithmic design in Simulink as well as implementation-level design in Cadence Virtuoso, a MEMS designer would manually create and hand off separate behavioral models for MATLAB and Virtuoso. The process of keeping different models in sync with the evolving MEMS design is complex; it must be done manually and, to avoid errors, requires time-consuming re-validation of the models. The Coventor MEMS+ parametric design format provides a new standard that facilitates communication between the various tools in a complete IC flow. Using MEMS+ for design entry, MEMS designers can develop and maintain a single design source and automatically generate schematic symbols and simulation models for the Simulink and Cadence Virtuoso environments. In addition, MEMS+ can export 3D solid models for verification of the detailed MEMS behavior with finite element analysis. The single design source assures that all models are in sync.

“This an elegant way to connect and manage the very specific 3D design information required for MEMS design within Simulink, which can address behavioral modeling and functional correctness. Both MEMS designers and IC designers can benefit from this integration, with IC designers being shielded from the complexity of the physics of MEMS but still able to simulate them in the context of the system,” said Jim Tung , MathWorks Fellow. “Our goal with MEMS+ has always been to develop a structured methodology that is familiar to traditional IC designers and allow them to easily incorporate MEMS devices into their flows. This support for Simulink makes MEMS+ even more accessible to MEMS designers and adds an important system-level capability that extends the value of MEMS+ to the functional definition stage,” said Mike Jamiolkowski, CEO of Coventor.

The MEMS+ platform and the included library of parametric MEMS building blocks provides MEMS designers with the ability to perform custom parameterization of all design aspects, including variations due to the manufacturing process, ambient environment, or geometric dimensions of the design itself. Each parameter can be defined as a value, a variable, or an algebraic expression.

Designers can then import MEMS+ designs into Simulink or the Virtuoso Parts Library using a simple import interface. The MEMS system designer confirms the device performance by running simulations directly in the Simulink environment. All simulation results can be loaded back into the MEMS+ system and animated in the tool’s 3-D canvas.

MEMS+ Version 2.0 is available now on Windows 32- and 64-bit OS as well as Linux. It is available through the Coventor sales channel. Pricing begins at under $30,000.

The MEMS+ product suite anchors Coventor’s strategy for “bringing MEMS to the mainstream.” The strategy focuses on removing the traditional barriers to developing and integrating MEMS — time, cost, complexity — particularly for traditional IC designers not familiar with the nuances of MEMS. In addition to the MEMS+ platform itself, Coventor is working to enable a complete ecosystem for MEMS development through collaboration with foundries, complementary tool suppliers, IP and library developers, as well as fabless IC companies looking to leverage the MEMS opportunity. More information is available at http://www.coventor.com.

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A MEMS optical switch made with multimode, 50 µm core fiber is now available in a single fiber-optic switch device. Its compact, 25 × 16 × 8.5 mm housing consumes less than 170 mW of electrical power. Port count can be specified from 1 × 2 to 1 × 8, and can be controlled via either TTL or I2C. Other configurations and special fiber types are also available.
DiCon Fiberoptics
Richmond, CA
www.diconfiberoptics.com

 

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PRESS RELEASE

DiCon Fiberoptics Announces 1×8 50um Multi-mode Optical Switch in a Single Device

DiCon Fiberoptics is pleased to announce that a MEMS optical switch made with multimode 50um core fiber is now available with a port count of up to 1×8 in a single fiber optic switch device. This allows multi-mode optical switch systems requiring higher port counts, primarily used in military and defense applications, to be reduced in overall weight, size, and power requirements.

“As weight, space, and power consumption are critical features in military systems, the higher port count of our multi-mode MEMS 1×8 fiber optic switch will give some of our military and defense customers a lighter, more compact solution,” said Robert Schleicher, the Vice President of Product Development. “We can offer these as OEM components, build them into compact switch modules that incorporate a small number of switches, or integrate them into complete military grade solutions. Typical applications include secure switching or video distribution.”

DiCon’s MEMS technology, as featured in the 1×8 multi-mode optical switch, is fully proven, with hundreds of thousands of MEMS devices shipped. Based on a platform that has been qualified to Telcordia GR-1221 (equivalent to certain methods from MIL-STD-883), these fiber optic switches have passed billions of toggling cycles and survive high levels of shock & vibration, temperature cycling, damp heat, dry heat, and other adverse conditions, making them ideal for military and avionic customers.

Packaged in a compact housing, the 1×8 optical switch is only 25mm x 16mm x 8.5mm in size and consumes less than 170mW of electrical power. The port count can be specified anywhere from 1×2 up to 1×8, and can be controlled via either TTL or I2C. In addition to the standard switch configurations, other configurations and special fiber types are also available.

For more information about the multi-mode MEMS 1×8 fiber optic switch, please visit www.diconfiberoptics.com/products/scd0122/0122e.pdf.

Posted by Lee Mather, republished for Small Times with permission from Laser Focus World

(October 11, 2010 – Marketwire) — Integrated Sensing Systems Inc. (ISSYS) has completed its 2010 manufacturing expansion project, adding 5,400 square feet to its existing facility in Ypsilanti, MI. The expansion is dedicated to high-quality manufacturing of system-level products based on ISSYS MEMS chips that are fabricated in its current cleanroom facility. The expansion began in late 2009.

The ISSYS expansion includes assembly lines, production laboratories, clean assembly/packaging rooms and calibration areas for both medical and industrial products. The new floor space also includes a combination cleanroom and Faraday cage for final assembly and calibration area with capacity for over 10,000 units/year of ISSYS’ wireless, batteryless medical implants.

"ISSYS’ MEMS cleanroom facility has the capacity to produce several thousand MEMS chips. The expansion area allows ISSYS to manufacture system-level products based on these enabling MEMS chips. These products include wireless, batteryless, sensing implants (applications include congestive heart failure and traumatic brain injuries), and industrial fluidic devices such as the FC10 methanol concentration sensor, FuelSense, MassSense, and UL-approved density and flow meters," said Dr. Nader Najafi, ISSYS president and CEO.

This new manufacturing site will allow ISSYS to ramp up the production of its MEMS-based microdensity sensors and eventually the MicroCoriolis mass flow meters. The latest product, the FuelSense density meter, is gaining traction in the monitoring of fuel and petrochemical quality, fuel custody transfer, fuel type and fuel blending markets, taking over share from density meters based on steel resonating tubes. Phase I expansion accommodates production of over 10,000 industrial units per year.

ISSYS provides advanced MEMS technologies for industrial, medical devices, microfluidic and scientific analytical sensing applications. For more information, visit: http://www.mems-issys.com/

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(October 6, 2010) — This complete review of the inertial sensor market 2009-2015, provided by Yole Developpement, includes the market for high-performance sensing products, technologies currently available, IMU prices and penetration, key companies, and more information.

High-performance motion sensing is gaining interest in many industries. In the military & aerospace areas, the use of inertial measurement units (IMUs) and other systems based on high-performance gyroscopes has been widespread for navigation, flight control or stabilization functions for decades. Today, we see many industrial and healthcare applications emerging, driven by the possibility to integrate new functionality at low cost, mostly thanks to the recent developments in MEMS accelerometer and gyroscope technology.

The market for IMUs is estimated to be $1.55B in 2009, dominated by defense and aerospace applications. Yole sees this market growing at a 9% annual growth rate, to reach $2.60B in 2015. Industrial, commercial naval, and offshore applications will be the most dynamic with 16.5% yearly growth, when the aerospace and defense markets will be limited to a 5.5% and 6.8% annual growth.

Several technologies are currently on the market, RLG and FOG-based systems being the most widespread and still benefiting from progresses in photonics. However, the recent and rapid development of tactical-grade MEMS gyroscope technologies has the largest impact on the market landscape and on the competition. It is crucial for the companies involved in those markets to invest in the right technologies and partners, depending on the end-markets which are targeted. Different strategies are observed: some companies carefully invest in selected technologies like the market leader Honeywell, while others love all inertial technologies, like Northrop Grumman.

MEMS industrial and tactical-grade type of sensors is the most dynamic technology. Yole sees the market growing from $361.8M in 2009 to $604.6M in 2015 for single MEMS accelerometers and gyroscopes or assembly of MEMS accelerometers/gyroscopes. However many technical and commercial challenges are predicted for the players involved in MEMS: how to guarantee a high level of vacuum for keeping high performance over the years, how to bring down the costs when most of the applications are in the 100 or 1000 unit range per year, why is it so important to avoid export restrictions like ITAR, what are the best business partners to enter new markets which are sometimes captive.

The recent availability of tactical-grade MEMS IMUs is clearly attractive for a wide range of applications. Indeed many applications will find interest in low-cost devices while it also opens new market opportunities such as precision guided munitions or small size UAVs. This explains why nearly each major IMU manufacturer has a MEMS technology today, although the status of developments is not the same for all players.

This report is more than a simple update of the “IMU market 2007-2012” report. The involvement of Yole Developpement on the high-end inertial market has continued to grow in the last couple of years, with discussions with key companies involved in the field all over the world and participation in many conferences. Although this market remains very complex to monitor, with a wide range of technologies, applications and players, Yole has been able to make a few modifications since the last version to be closer to the reality when it comes to IMU prices, penetration, number of systems in each vehicle, and market shares. Moreover a complete analysis of the impact of MEMS technology and on the geographic description of the market (including the dynamic Asian and Israeli markets) has been included. Yole also had the chance to have Mike Perlmutter, who has more than 30 years of experience in the inertial navigation industry, provide an important contribution to this report.

Report outline:

  • Gyroscope technologies: DTG, RLG, FOG, HRG, Quartz, MEMS
  • Accelerometer technologies: Electromechanical pendulous type, Piezo, MEMS
  • Level of performance: Industrial, tactical, inertial navigation and strategic grade
  • Worldwide market metrics: 2009 – 2015 market ($M, M units, ASP)
  • 2009 market shares
  • 150+ companies cited in the report
  • Report is a 300+ slides PowerPoint presentation
  • Excel datasheet included
  • 20+ key applications for IMUs are described: Civil aircrafts, General aviation, Civil helicopters, Space satellites, Spacecrafts & skyrockets, Civil & paramilitary UAVs, Military fighters, Military transport aircrafts, Defense UAVs, Military & special mission helicopters, Missiles, Guided munitions, Combatant ships, Armored vehicles, Soldier equipment, Commercial ships, Underwater vehicles: AUVs, ROVs & submarines, Oil drilling, Trains, Healthcare & sport, Antenna stabilization & pointing, Mapping instruments…
  • 15+ applications described for MEMS accelerometers: Pacemakers, Blood pressure monitoring, Physical activity monitoring, Seismic sensors – Geophones, Inclinometers, Antenna stabilization, Vibration monitoring, Directional drilling & borehole survey, Mapping instruments, Model helicopters & high end toys, UAVs flight control, Aircraft backup instruments, Cockpit instrumentation/AHRS, Missile Guidance, Precision Guided Munitions, Bombs & Rockets, Armored vehicles, Military training systems…
  • 15+ applications described for MEMS gyroscopes: Human motion capture, Physical activity monitoring, Antenna Stabilization, Directional drilling & borehole survey, Camera stabilization, Model helicopters and high-end toys, UAVs flight control, Backup instruments, Cockpit instrumentation, Missile Guidance, Precision Guided Munitions, Bombs & Rockets, Platform stabilization, Military training systems, Agriculture…

The objectives of this report are:

  • To provide market data on high performance Inertial Measurement Units and MEMS accelerometers/gyroscopes: key market metrics & dynamics
  • Unit shipments, revenues and average selling price
  • Market shares for each category of application
  • Industrial, tactical, inertial navigation and strategic grade sensors are taken into account
  • To provide application focus on key existing markets and most promising emerging ones
  • Architecture of the systems, functions that are used, new features and specification requirements
  • Insight about future technology trends & challenges
  • Pricing analysis and expected evolution
  • To provide a deep understanding of inertial sensor value chain, level of integration & players
  • Quasi-exhaustive list of sensor manufacturers worldwide with technology offer
  • List of key integrators worldwide
  • Analysis on the new players and potential new entrants with MEMS technology

High-performance accelerometers and gyroscope suppliers can use this report to understand the system level technology trends and requirements for each application, evaluate market potential for components depending on performance and technology, understand the differentiated value of your products and technologies, identify new business opportunities and partners, and monitor and benchmark your competitor’s advancements. IMU module and AHRS or INS suppliers can evaluate the market potential of their product portfolio, define diversification strategies on new applications, find the best technologies to integrate and the best suppliers depending on target markets, identify new business opportunities and partners, and have an exhaustive analysis of the competition on a broad range of IMU field. MEMS material, equipment, or foundry/packaging service suppliers can identify new business opportunities and prospects, understand the level of activity of your customers, and understand what are the applications that will drive the volumes in 2015. Integrators of inertial solutions (INS, AHRS, sensors…) can find the best technologies to integrate and the best suppliers depending on your target markets, understand what will be the future applications to develop by taking benefit on the recent advances in inertial technologies, note financial & strategic investors, understand the structure and value chain of the high-end inertial industry, estimate the potential of new devices such as tactical-grade MEMS gyroscopes, and get the list of main key players and emerging start-ups of this industry worldwide.

Companies in this report include Agiltron, AIMS – Zetiq Development, Airbus & ATR, Al Cielo, American GNC, Analog Devices, Applanix, Ascension, ASM (Automation Sensorik Messtechnik), Astrium, Atlantic Inertial Systems, Autoflug, Azimuth, BAE, Bejing Aerospace, Boeing, Cape Peninsula University of Technology, CASC: China Aerospace, Clymer Tech, Cobham, Colibrys, Comac, Corrsys-Datron , Crossbow, CSRI Elektropribor, Daihen, Dassault Aviation, Denel, Diehl BGT Defence, Doosan DST, EADS Astrium, Elbit Elop, Elbit Systems, Endevco, Eurocopter, Expertisa, Fanuc, Finmecannica, Fitzoptika, Freescale, Fugro, Fuji, GE Energy, GEM elettronica, General Dynamics, Genesys, Georgia Tech, Gladiator technology, G-nius, Goodrich, Hindustan Aeronautics Limited (HAL) – Edgewood Technologies, Hitachi, Honeywell, Horiba, HP, Hyundai Rotem, IAI Tamam, IGI mbH, i-mar, IMEGO, Imperial College London, India Space Research Organization (ISRO), Inertial Science, Innalabs, InterSense, ION, ISNAV, Israel Aerospace Industries, Israel Military Industries, IXSEA, JAE – Japan Aviation Electronics Industry, John Deere, Kawasaki heavy industries, Kearfott, Kinemetrics Inc, Kionix, Kongsberg, KVH, L3 Communication, LITEF, Lockheed Martin, Loral, Lumedyne Technologies, Matra, MBDA, Melexis, Memsense, Michigan Aerospace Corp., Micro Infinity, Microbotics , MicroInfinity, MicroPilot , Microstrain, Movea, Nera Networks, Nexter, NG Italia – Lital, Northrop Grummann, NovAtel, Omni Instr., O-Navi, Onera, Optolink, Orbit Technology Group, PCB Piezo, Physical Logic, Poogsan FNS, Pruftechnik, Qinetiq, Rada, Rafael, Ramsys, Raytheon, Raytheon Anschütz, Rheinmetall, Rockwell Collins, Roketsan, RUAG, Saab, Sagem, Sandia National Laboratories, SBG Systems, Schlumberger, SDI: Seven Dimension Information Corp, Selex, Sensonor, SensorDynamics, Sensorex, SensR, Sercel, Sherbone Sensors , Silicon Audio, Silicon Design, Silicon Sensing Systems SSS, Southern Methodist University, Stockholm Precision Tools, Summit Instruments, Symphony Acoustics, Syowa Sokki, Systron Donner Industrial, Taïwan National Space Organization (NSPO), Teknol, Tethers Unlimited, Thales, Tokimec, Tronics, Vigor Technology, VTI, Watson Industries, Xi’an Chinastar, XSens, Yaskawa Electric, Yishay Sensors, and more.

The report can be found at http://www.i-micronews.com/reports/IMU-High-Performance-Inertial-MEMS-2011/160/

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