Category Archives: MEMS

by Neha K. Choksi, SmallTech Consulting LLC

February 8, 2010 – Historically, the microfluidics industry has been challenged to achieve a strong return on investment. With the exception of inkjet printing, a key killer application has yet to be identified. This leaves many wondering whether the field has true potential or whether reality is masked in hype. Dr. Holger Becker, co-founder and CSO of microfluidic ChipShop GmbH, shared insights and perspective gained from his nearly 20 years in the industry with the Bay Area MEMS Journal Club on January 28, 2010. 

The interest in microfluidics gained steam in the early 1990s with the idea of microTas (micro total analysis systems). But by 2005, many investors became disenchanted with the field because much of their investment had not paid off. Thanks to a better understanding of what microfluidics can do, microfluidics is gaining back its popularity — but with wiser and more open eyes.

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Despite his optimism for the industry, Becker encourages realistic expectations for product development. Even with the advances in simulation capability, multiple design iterations should be anticipated. However, in the last few years alone, process know-how has increased significantly. The resistance to adoption is another huge, usually unanticipated hurdle. Microfluidics offers its advantages, but convincing users to switch from existing technologies can be challenging. One pathway to address their reluctance is to make microfluidic systems compatible with existing technology. For example, microfluidic ChipShop has created off-the-shelf items of the same form factor as lab slides, or that can be used with an adapter frame for a microtiter plate format, enabling users to interface with standard laboratory automation. 

To create a successful product, Becker emphasizes the need to assemble the right development team. Because of the multidisciplinary nature of the field, the team must include expertise in microfluidics, materials, manufacturability, and a strong understanding of the application. A common mistake that developers make, according to Becker, is spending 80% of their focus on the front-end — when in reality, 80% of the production cost is often back-end processing. Including manufacturing conversations in early stages is critical to the product’s overall feasibility.

Another avoidable pitfall is changing the technology in the middle of production, deviating from that of the initial design. A change in technology, whether it is material, design, or processing, can have large implications on the performance of the device. To ensure that lessons learned during the initial design phase can be transferrable to production, Becker advises that the prototypes be made in a scalable, production-compatible technology.

The opportunities

By being cognizant of the potential pitfalls and acting accordingly, a product developer has many opportunities for success. Becker predicts that market entry is likely to be successful in high-end application niches such as cancer diagnostics. Other opportunities such as food and water diagnostics and veterinary medicine may have lower barriers for entry and the potential for large volume economics. Interest in microfluidics is emerging as a potential key enabler for other products in addition to possible end-user applications.

In addition to direct prospects in microfluidics, Becker sees opportunities to support the field. In many cases, the application does not require the large volumes that the automotive, mobile device, and printing applications offer. Therefore, there is a need for cost-effective, yet flexible manufacturing techniques. Choosing the optimal material is also difficult. A huge variety of polymers are available, but a consolidated standardized database that lists all the particular characteristics that a designer may need would be a very useful tool. Because the material selection is so vast, literature tends to focus on a few "favorite" materials with which the industry is already familiar or experienced, but may, or may not, be optimal for the application. Production worthy quality control process improvements are also necessary in order to reduce screening cycle time of the complex devices that microfluidics entail.

With the right multidisciplinary team, planning for manufacturability, and vigilance towards understanding the application and its barriers to entry, microfluidics has a bright future. In Becker’s words: "Microfluidics has, after following a typical high-tech market acceptance curve with ups and downs, emerged as a true enabler for a multitude of products in the analytical and life science industry. It has taken longer than anticipated, but the light we finally see at the end of the tunnel is definitely not that of an oncoming train."


Neha K. Choksi is a founding member of SmallTech Consulting, LLC, 325 Sharon Park Drive #632, Menlo Park, CA 94025, e-mail [email protected], www.SmallTechConsulting.com.

February 1, 2010 – Like sister electronics/device industries, MEMS suffered through a lousy early 2009 but managed to make it somewhat respectable for the full year — thanks to a handful of key applications that are pushing into "major commoditization" for high-volume markets, according to an overview by iSuppli.

Like the overall semiconductor industry (and most others), the first quarter of 2009 was lousy for sales of MEMS devices, and despite an improving climate through the rest of the year, sales finished the year down about 8.6% from the prior year, to about $600M. Taken with a decline in 2008 as well, the MEMS industry shed about $1.2B in revenue.

Hardest hit among MEMS sectors is, as has been tracked, the auto sector, which saw shipments plummet 20% in 2009. Cars were among the worst-hit industries in the economic meltdown, and since each car incorporates multiple sensors, this was magnified to the MEMS auto sensor sector as well. Other end-use sectors took a beating, from consumer applications (printers and projectors) to industrial applications (instrumentation, oil/gas exploration, health usage monitoring).

While MEMS shipments sales declined, shipments actually rose by about 10% in 2009, which reflects "major commoditization" for the technology in areas such as consumer electronics and particularly mobile phones, according to iSuppli’s Richard Dixon, in a statement. Among the brighter spots for MEMS in 2009:

  • Accelerometers. Cell phones are now "recognized as the primary driver of MEMS sensor sales," noted Dixon. Of the 1000 new phones iSuppli examined in 2009, 27% of them had an accelerometer on board (vs. 11% in 2008). Accelerometer prices fell much faster than anticipated, which helped widen their consumption, he noted (and even too much, oversaturating the market for Nintendo Wii controllers). Big winners here include suppliers STMicroelectronics and Bosch Sensortec. (Another MEMS technology that broke into use for cell phones: Microvision’s MEMS scanning laser technology, offered through Vodaphone’s Nokia N97, for the Spanish market, Dixon points out.)
  • MEMS microphones. Commoditization is also the story with MEMS microphones, which compete on price with incumbent and inexpensive microphone technology, Dixon notes. MEMS microphone technology was "disproportionally" hurt by the rapid decline of Motorola, an early adopter of the technology, but it’s also been helped by incorporation into Apple’s new fifth-generation iPod nano. Knowles is still "the 1000 lb. gorilla" in MEMS microphones, but ST and Bosch are making plays into this market, seeking ways to bring new work into their 200mm MEMS fabs — Bosch through its acquisition of Akustica, and ST by partnering with Omron.
  • DLP. Another bright spot in 2009 for MEMS devices was the pico projector, which can operate either piggybacked on a cell phone or as a compact standalone unit. Samsung offered the first of these devices domestically in early 2009, with LG joining the game in late 2009. Both of them use Texas Instruments’ digital light processing (DLP) technology.
  • Gyroscopes. These made big leaps in 2009, with gaming in the Nintendo Wii MotionPlus plug-in addition to its controller offering advanced motion gaming. Beneficiary of this was InvenSense, though STMicro also is laying out a range of consumer gyroscopes in 2010, "which is sure to speed adoption for gaming in mobile platforms in future," Dixon notes.

 

(February 1, 2010) CHICAGO — ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.

The assets disclose cost-efficient wafer-level semiconductor packaging techniques applicable to high-power and high-frequency applications, including LED, MEMS, and optical communications component packaging. Key technologies of this portfolio include high-current-carrying through-wafer interconnects (through-silicon via — TSV), which enable wafer-level surface mount (SMT) chip-size packaging (WLPCSP). WLPCSP can improve manufacturability by reducing costs, increase performance, enable reduced component size, and improve product scalability.

The patents also include a high-power/brightness LED packaging solution that offers excellent thermal performance in a highly manufacturable platform and MEMS packaging technology that features flux-less hermetic sealing on the wafer level with controlled internal package atmosphere. Several of the technologies included in this portfolio have been developed to the production phase and the related know-how is included.

“Hymite is pleased with the general acceptance of its unique technology in the market – major players in high speed communications, high-power LEDs and MEMS have already engaged Hymite on developing unique products,” stated Christian Tang-Jespersen, Hymite president and CEO.

To learn more about the patents available for sale in this portfolio, contact ICAP Ocean Tomo at (866) 779-8363 or at [email protected]. ICAP Ocean Tomo is the intellectual property brokerage division of ICAP, an interdealer broker and provider of post trade services. The Group matches buyers and sellers in the wholesale markets in interest rates, credit, commodities, foreign exchange, emerging markets, equities and equity derivatives through voice and electronic networks. ICAP is also the source of global market information and research for professionals in the international financial markets. For more information, visit www.icap.com.

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(January 26, 2010) ATLANTA, GA — Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.

Viscom equips its inspection systems with a comprehensive portfolio of algorithms to record geometric values during wirebond inspection. For gold wire bonds with diameters less than 25 µm, the Viscom VHR module’s special illumination enhances geometric features. The VHR module’s resolution of approximately 3 µm per pixel produces standard deviations in wedge widths of 1 µm.

Every change in the bond process can be discovered and any negative trend can be corrected immediately. With this method, Viscom also meets the automotive industry’s requirements of a maximum width tolerance of a few micrometers at 3 σ.

The tool benefits customers with high volume production requirements, as well as small- to mid-volume manufacturers in industries such as aerospace, aviation or medical electronics.

These measurement tools are available for all Viscom wire bond inspections. With help from the statistical process control VPC, measurement data can be pulled up at a moment’s notice and intervention limits defined.

For more information, visit http://www.viscom.com

Articles from Viscom:

Through-wafer Inspection for MEMS Devices 
Completely Inspecting New Packages
Viscom Opens Applications and Training Center in Mexico

January 11, 2010 – Researchers at McMaster University in Canada have developed a way to direct microscopic-sized worms along a microchannel device using an electric field, seen as a step toward high-throughput microscreening devices for drug discovery.

The research, described in the Jan. 21 issue of Lab on A Chip, involves the nematode C. elegans, widely used in biomed research because of its similar proteins and molecules to those in humans. Typically the critters are manipulated in mediums of petri dishes, 96-well plates, or pneumatically controlled microfluidic devices. In the new work, the researchers guided the worms forward and in reverse inside a microchannel with an electric field ("electrotaxis"). Current practices observe worms under a microscope as they move randomly or in a direction forced by pressure; the new method lets the worms move in a more "natural" motion. Also among the findings was an observation that the worms’ response to electrotaxis was dependent on age and neuronal development — this, they say, allows for large numbers of worms to be sorted and handled in an automated manner.

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The movement of worms in an electric field. (a) The application of +8 Vcm-1 electric field (E) caused an animal (724μm long) to move with the speed of 308μm s-1 to the right towards the cathode. (b) At a lower field strength in a reverse direction (-3 Vcm-1) the animal (847.5μm long) moved with a speed of 342μm s-1 to the left towards the cathode. Dark thick arrows illustrate the worm’s position. Scale bars are 1mm. (Source: McMaster University)

Implications for the work include more cost-effective ways of conduct rapid screening of tens of thousands of chemicals for drug candidate identification. Also, researchers can further study how neurons respond to electricity, and learn to fabricate new devices to handle and manipulate large numbers of worms.

"This is the first time that worms have been stimulated to move in a micro-channel device in a very precise and directed way," said Bhagwati Gupta, assistant professor of biology, in a statement. "It will allow researchers to study in real time how a proposed drug affects neurons and muscles that control motion of a live specimen."

From the abstract:

In this work, we demonstrate that the electric field can be used as a powerful stimulus to control movement of worms in a microfluidic environment. We found that this response (termed electrotaxis) is directional, fully penetrant and highly sensitive. The characterization of electrotaxis revealed that it is mediated by neuronal activity that varies with the age and size of animals. Although the speed of swimming is unaffected by changes in the electric field strength and direction, our results show that each developmental stage responds to a specific range of electric field with a specific speed. Finally, we provide evidence that the exposure to the electric field has no discernible effect on the ability of animals to survive and reproduce.

January 4, 2010 –  Silicon magnetic sensors, among the most ubiquitous types of sensors sold, will continue to see strong growth in 2010 thanks to demand from a trio of key markets, according to a report from iSuppli.

Sales of these sensors, used in everything from industrial motors (rotator positioning and control loads) to automotive (rotation speed angle and position) and low-cost consumer products, will surge from $821M in 2009 to $1.4B in 2013; that translates to about 2.8B magnetic sensor ICs and switches to 5B units. Their varying use also translates into varied costs, from 10¢ to several dollars each, notes Richard Dixon, senior analyst for MEMS and and sensors at iSuppli, in a statement.

Generally speaking, silicon-based magnetic sensors (Hall effect and magnetoresistive) are taking over for legacy technologies that can’t keep up with performance and formfactor demands, Dixon explains. "Silicon sensors are outgunning competition from potentiometers, Reed switches, and microswitches by eliminating issues with wear, by incorporating electronics on-chip for more intelligence per area, on robustness, and on cost and size," he writes. "Hall effect sensors ICs and switches largely dominate the silicon magnetic sensor IC market, but increasingly, AMR and also giant magnetoresistance (GMR) sensors are used for high-performance applications."

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Global magnetic silicon sensor forecast (US $M). (Source: iSuppli)

In autos, body and powertrain systems are areas of biggest growth potential; in the body segment alone, an average of 9.4 sensors/switches will be used by 2013, up from 6.7 in 2009. Five or more different magnetic technologies could be used, for example, in precise measurement of steering wheel angle and safety systems. In electronics, switches are used for noting when appliance doors or computing/camera cases are opened and shut. In other consumer products, linear sensors and switches monitor fluid levels in drug delivery systems and even automatic coffee dispensers.

One key emerging application is electronic compass functionality in GPS-equipped mobile phones, which relies on 3-axis silicon magnetometers. Look for these types of devices to account for a third of all magnetic sensors by 2013, vs. just 10% in 2008.

Currently, top vendors for magnetic sensors are Asahi Kasei Microsystems and Allegro, who dominate the market for magnetic sensors used in low-cost switches for consumer applications, PCs and notebooks, Dixon notes (AKM snatched the top spot thanks to its exposure to those electronic compasses). Other players including Micronas, Infineon, and NXP, eyeing emerging markets in those compasses as well as rotation sensors in car engines. Newer entrants include Sensitec — which is levering older asymmetric magnetoresistance (AMR) technology from an IBM plant — and austriamicrosystems.

December 18, 2009 – HP expects its latest inertial MEMS sensing technology to enable new classes of applications. One that has attracted attention is bridge monitoring.

Environmental and engineering consulting services company CH2M Hill has had a more than 20-year relationship with HP Labs (Palo Alto, CA) and HP Technology Development (Corvallis, OR), and is working with HP to develop at least one or two "champion" applications for HP’s technology, according to Michael O’Halloran, director of technology I&AT. "The ability to measure minute amounts of movement and doing so independently — i.e., being able to track location independent of satellites and other means of transmission — is especially attractive to the kinds of projects in which CH2M Hill is involved," he told Small Times.

Conventional bridge monitoring is time-consuming, labor intensive, and not particularly revealing, so a device that could precisely monitor the structure could be quite revealing, noted O’Halloran. Depending on the bridge, visual inspection is done every one or two years; every four or five years, a very detailed visual inspection is done with someone crawling all over the bridge looking for signs of failure, he explained. "Some states are beginning to use analytical instrumentation in addition to visual inspection, but visual inspection is still the traditional method used," he said.

CH2M Hill is actively seeking partnerships with states to develop monitoring algorithms and obtain data that hopefully will indicate monitors that can yield data at least comparable to current methods. Conventional sensing systems use costly instruments that are also costly to install, have to be hardwired, and do not have a very wide range, O’Halloran added. "We’re hoping the HP technology will expand the range at which the instrument looks and lower the cost of installation," he said. "If we can’t get the cost down, then it can’t be effectively deployed in a large application." CH2M Hill believes there is already some evidence to suggest that HP’s new technology will work.

With much of the infrastructure in the US built during the Eisenhower administration, it is critical to develop a logical way to prioritize allocation of repair and replacement funds. If HP’s sensing technology could be developed for monitoring such structures, it would be a way to address the prioritization challenge, according to O’Halloran.

December 14, 2009 – At this year’s International Electron Devices Meeting (IEDM), IMEC and partners TNO (a Netherlands-based research group) and the Holst Center (IMECTNO joint center set up in 2005), disclosed their latest work in creating a MEMS-based piezoelectric energy harvesting device with record power generation, and a "world-first" organic transponder circuit with bit rate of 50kbits/s, nearing requirements for Electronic Product Coding (EPC) standards.

New mark in MEMS piezoelectric energy harvesting

Micromachined devices to harvest energy from vibrations typically operate in a range of 150-1000Hz, ideally used to convert energy from vibrations in machines, engines, and other industrial appliances. Their tiny size also makes them useful for powering miniaturized autonomous sensor nodes.

In work within the Holst Center’s program on micropower generation and storage, IMEC researchers created a temperature sensor that can wirelessly and autonomously transmit data — a wafer-level-packaged MEMS-based harvester, generating a record 85µW electrical power from vibrations. The harvester is a Si mass suspended on a beam, built used CMOS-compatible MEMS processes on 6" silicon wafers. Changing the dimensions of the beam and mass can modify the harvester’s resonance frequency for any value in the 150-1200Hz range.

Among the achievements IMEC noted in its work:

– Aluminum nitride is used instead of lead zirconate titanate as the piezoelectric material; AlN enables more favorable materials parameters and ease of processing, e.g. up to 3× faster deposition and better composition control due to AlN’s stoichiometric nature.
– A wafer-scale process was developed to protect the piezoelectric devices in a package: glass covers coated with an adhesive, vacuum-bonded on top and bottom of the process wafer, and diced. Power output was shown to increase significantly using a vacuum package vs. packaging in atmospheric pressure.

The harvester was connected to a wireless temperature sensor built from off-the-shelf components. After power optimization, the sensor’s energy consumption was reduced from 1.5mW to ~10µW, a three-orders-of-magnitude improvement. Subjected to vibrations at 353Hz at 0.64g (a realistic amplitude) the system generated sufficient power to measure and transmit environmental temperature to a base station with 15sec interval.


Fully autonomous wireless temperature sensor powered by a vibrational energy harvester. (Source: IMEC)

The achievement proves the feasibility of building fully autonomous energy harvesters for industrial applications, IMEC says. Once it is developed to maturity (by industry, not IMEC or Holst), the technology could power sensors for applications such as tire-pressure monitoring systems (TPMS) and predictive maintenance of moving or rotating machine parts.

 

"World’s first" 50kbit/s organic transponder

Another declaration at IEDM was the debut from IMEC, TNO, and Holst of the world’s first organic transponder circuit with 50kbits/sec bit rate, which approaches requirements for Electronic Product Coding (EPC) standards, which support the use of radio-frequency identification (RFID).

Flexible circuits are attractive for both manufacturing as well as final products in applications such as plastic RFID tags, but would need to adhere to EPC specs for item-level tagging, which requires 50kb/s bit rate. The Holst Center, wtih IMEC and TNO, have developed an 8-bit flexible transponder circuit on foil using pentacene as the semiconductor material and a high-k gate dielectric. The device’s current drive extends well beyond previous efforts with 1-2kbits/s bitrates, pushing all the way to >50kbits/s data rate, "which compares favorably" with such EPC specs.

RFID is already being used in high-volume logistics applications, e.g. pallet-level logistics; the next step is to use EPC tags at the package level, and eventually on individual items (item-level tagging). Organic electronic technology offers the promise of, and is being explored to be used for, high-volume and low-cost manufacturing of simple electronic circuits. "The new results demonstrate that the technology is now on the way to reach EPC compatibility," IMEC said in a statement.

December 3, 2009 – Scottish foundry Semefab says it is investing £6.6M (US $11M) in a new wafer fab for frontend processing of MEMS structures.

The CMOS3 site will house a 1200 m2 Class 100 cleanroom capable of fabricating 0.5μm structures; combined with the company’s existing MEMS2 fab, it will offer full 150mm wafer flow for integrating CMOS and MEMS technologies (a 4" flow is already operational). Official opening is slated for June 2010.

Construction is already ahead of schedule, with the structural steel mezzanine already completed, according to Ewing Thomson, project director of Merit Merrell Technology, which was contracted to handle cleanroom construction and equipment installation.

Funds for the new site come from capital investment from Scottish Enterprise and the Technology Strategy Board.

by Debra Vogler, senior technical editor, Solid State Technology/Advanced Packaging

November 30, 2009 – Presentations at this year’s International Symposium on Microelectronics (IMAPS, San Jose, Nov. 1-5) included discussion of TSV/3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked multi-chip package (MCP) for a MEMS variable capacitor and control IC chip.

EV Group addresses TSV/3D integration challenges

EV Group’s Thorsten Matthias presented that company’s solutions for through-silicon via (TSV)/3D integration. Matthias presented data showing that temporary bonding to a carrier wafer, thinning, backside processing, and subsequent debonding were qualified for several different process flows (session #WA5, paper #1).

Though Cu-Cu thermo-compression wafer bonding has shown promise for very high TSV density face-to-face integration applications, the researchers found that fusion bonding, with its cost-of-ownership advantages, is very attractive compared to metal-metal bonding. Among the other advantages of fusion bonding noted by Matthias are: high alignment accuracy (because misalignment due to thermal expansion of the wafers is eliminated); high-throughput; and the ability to be inspected after pre-bonding prior to final annealing.

The main challenges of using fusion bonding according to the researchers are sensitivity to particles, and surface roughness. An integrated cleaning module addresses the problem of particles, and the surface micro-roughness requirement of 0.5-2nm can be met with advanced CMP technology.

The surface pre-processing step used by the group, called "LowTemp" plasma activation, modifies the wafer surface in such a way that the annealing temperature can be reduced to a range of 200-400°C. According to EV Group, such plasma activation enables the usage of fusion wafer bonding for 3D integration.

Alignment accuracy for the group’s research was verified using the EVG SmartView NT Aligner (see figure below).

Alignment results with the EVG SmartView NT Aligner (400 alignments). (Source: EV Group)

Toshiba’s packaging technology for stacked MCP with MEMS and control ICs

Also at this year’s IMAPS, Toshiba’s Mitsuyoshi Endo reported on a wafer-level packaging (WLP) encapsulation process and a stacked multi-chip package (MCP) for an electrostatically actuated MEMS variable capacitor, and the control IC chip, respectively (session #TA5, paper #1).

Because a MEMS variable capacitor needs to be operated in a dry atmosphere (to avoid voltage shifts), and it is known that movable electrodes (in a MEMS capacitor) vibrate in a vacuum, the researchers needed a process that enabled the capacitor to be operated under atmospheric pressure. These were the motivating factors to develop a WLP encapsulation structure with hybrid thin-film (four thin-film layers) using standard backend-of-line (BEOL) LSI technologies. The first layer (SiO) is the cap layer; the second layer (polymer) is the plug layer; the third layer is the moisture barrier (SiN); and the fourth layer, formed in the polymer, protects the entire encapsulation from subsequent MCP processes.

The motivation for development of a stacked MCP for the control IC chip (that provides the actuation voltage to the MEMS capacitor) was to find a fabrication process compatible with the MEMS capacitor structure, because the control chip was to be integrated into the WLP package. Endo noted that although the fabrication process of the stacked MCP is based on a conventional packaging process, some of the processes had to be optimized to handle the fragile WLP encapsulation. The researchers therefore optimized a stacked MCP process, having also decided that chip-scale or system-on-chip (SoC) packages would be difficult to integrate with the MEMS chip.

Based on the reliability testing data (temperature cycling, accelerated moisture resistance, and moisture/reflow sensitivity), the researchers concluded that neither voids nor cracks were present in the MCP. Normal operation of the MEMS variable capacitor was confirmed up to 85% relative humidity.