Category Archives: MEMS

Lattice Semiconductor Corporation today announced the iCE40 LP384 FPGA, the smallest member of its iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.

The tiny, low-power, low-cost iCE40 LP384 FPGA has a capacity of 384 LUTs; consumes 25-Microwatts static core power; comes in packages as small as 2.5mm x 2.5mm with a migration path to 2.0mm x 2.0mm; and costs less than 50 cents per unit in multi-million unit quantities.

"While system footprints continue to shrink, designers must constantly search for new ways to add more functionality so they can process more information," said Brent Przybus, senior director of Corporate and Product Marketing at Lattice Semiconductor. "The iCE40 LP384 FPGA offers the perfect architecture for capturing and processing large amounts of data at hardware speeds while using very little power and board space. It deftly handles system tasks such as managing sensor interfaces, adapting to new interface standards, and offloading the CPU without requiring fully custom-designed chips."

New applications drive hardware innovation

The exponential growth of handheld applications is creating new challenges for hardware designers. Many new applications today connect end users with data collected from a growing number of sensors that measure natural phenomena such as temperature, moisture, light, and positioning. At the same time the growing use of video is driving the deployment of new low power, display technology that not only enhances the visual experience, but does so without breaking stringent power budgets.

Moreover, small automated control units are now being used to maximize energy efficiency and security in buildings and homes by responding to light, infrared, noise, and by adjusting fans, blinds, and temperature controls. Designers of these types of equipment must find ways to shrink the size of their systems while differentiating their products from competitive market offerings.

The iCE40 LP384

The iCE40 LP384 FPGA includes the programmable logic, flexible IO, and on-chip memory necessary to process data at speeds greater than ASSPs or companion microprocessors while simultaneously reducing power consumption for an equivalent cost. Lattice also provides reference designs and application notes to accelerate development and reduce time-to-market by several months.

Development software

Lattice’s iCEcube2™ development software is a feature-rich development platform for Lattice’s iCE40 FPGAs. It integrates a free synthesis tool with Lattice’s placement and routing tools. It also includes the Aldec Active-HDL™ simulation solution, with Waveform Viewer and an RTL/gate-level mixed-language simulator.

The iCEcube2 design environment also includes key features and functions that help facilitate the design process for mobile applications. These features and functions include a project navigator, constraint editor, floorplanner, package viewer, power estimator, and static timing analyzer. Please contact your local Lattice sales representative for information on how to download a free license for Lattice iCEcube2 software for use with iCE40 LP384 FPGAs.

Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.

“As technology tries to fit more and more functionality into smaller and smaller spaces, MEMS has grown exponentially in utilization,” said Mark Zack, Digi-Key Vice President, Global Semiconductor Product. “By integrating IC and MEMS functionality, MEMSIC offers our customers a unique product to fill a growing need in their designs. We are pleased to partner with MEMSIC.”

MEMSIC designs and manufactures integrated micro-electromechanical sensors (MEMS) using a standard integrated circuit (IC) manufacturing process. The company combines proprietary thermal-based MEMS technology and advanced analog mixed-signal processing circuitry into a single chip. This allows MEMSIC to produce high-performance accelerometers and other MEMS devices at substantially lower cost than most traditional processes.

"Digi-Key is recognized by design engineers worldwide for its excellent service, and for its access to readily available components they can count on for new designs,” noted John Newton, MEMSIC Vice President of Marketing. “We are excited to be partnering with Digi-Key, and believe this agreement will significantly expand MEMSIC’s global reach to design engineers looking for the latest in sensor technology."  

Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.

The VL6180 uses a ground-breaking proximity measuring technology to offer unprecedented accuracy and reliability in calculating the distance between the smartphone and the user. Instead of estimating distance by measuring the amount of light reflected back from the object, which is significantly influenced by color and surface, the sensor precisely measures the time the light takes to travel to the nearest object and reflect back to the sensor. This “Time-of-Flight” approach ignores the amount of light reflected back and only considers the time for the light to make the return journey.

"This marks the first time that Time-of-Flight technology has been made available in a form factor small enough to integrate into the most space-constrained smartphones,” said Arnaud Laflaquière, General Manager of ST’s Imaging Division. “This technology breakthrough brings a major performance enhancement over existing proximity sensors, solving the face hang-up issues of current smartphone and also enabling new innovative ways for users to interact with their devices."

The key to ST’s patented new solution is an infra-red emitter that sends out light pulses, an ultra-fast light detector that picks up the reflected  pulses, and electronic circuitry that accurately measures the time difference between the emission of a pulse and the detection of its reflection.

Combining electronic, optical and packaging unique expertise from across the company, the VL6180 embeds both a robust ranging time-of-flight sensor and a wide dynamic ambient light sensor die, along with an infra-red emitter. Thanks to its all-in-one, ready- to-use architecture, the VL6180 is easy to integrate and saves the phone-makers long and costly optical and mechanical design optimizations.

Addressing dropped calls is not the only benefit that ST’s new technology brings to the smartphone market.  The ability to measure a reliable absolute distance from the phone to a hand or other object opens up new user interaction scenarios that phone manufacturers and app developers can rapidly exploit.

How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.

As the devices lying at the heart of computing shrink ever closer to fundamental limits, the semiconductor industry must confront the problem of what to do when conventional microprocessors simply cannot shrink any further. The bi-yearly conference, which will be attended by international representatives from industry, government and academia, should be of interest to anyone concerned about the future of semiconductor manufacturing—a $300 billion industry and a linchpin of the U.S. economy.

Highlights include the three successive keynote addresses beginning at 9 a.m., Tuesday, March 26, by Mike Mayberry, V.P. and Director of Component Research at Intel; Naga Chandrasekaran, V.P. of Process R&D at Micron; and Gyeong-Su Park, Leader of the Analytical Science Group at Samsung Advanced Institute of Technology. Also, at 8:30 a.m., Thursday, March 28, invited speaker Tom Theis of the Nanoelectronics Research Initiative will deliver an address on long-term strategies to replace today’s transistors.

The total market for open short-range wireless (SRW) technology based ICs, such as Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018, according to ABI Research. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.

“In the year where cumulative Bluetooth enabled device shipments will reach 10 billion and cumulative Wi-Fi enabled device shipments will reach 7 billion, we will also see total wireless connectivity IC shipments break through 5 billion per annum,” said Peter Cooney, practice director. “It is truly a momentous year for short-range wireless technology.”

Consumer devices such as mobile phones, laptops, media tablets, games consoles, etc. have been the major driver of SRW technology growth but as many of these devices start to peak it is newer applications such as automotive, home automation, smart energy, retail, and many more that will be the major growth drivers over the next 10 years.

SRW technologies are enabling simple, low-cost connections to be made between multitude devices and helping to make 2013 the year that the Internet of Everything (IoE) hits an inflection point and starts to become a reality. Bluetooth, Wi-Fi, and ZigBee are just a few of many technologies that will enable growth in this market, coupled with proprietary SRW, cellular, white space, and fixed communication technologies, also.

“Without interoperable short-range wireless standards the IoE will not flourish; it requires low-cost, low-power, ubiquitous technologies to create the myriad connections that will be needed,” added Cooney. “Technologies such as Bluetooth Smart (v4.0), ZigBee, and the upcoming 802.11ah standard will be key enablers for IoE.”

eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark. eMemory’s eNVM SIPs support a broad range of process platforms including logic, HV, SiGe, RF, and mixed signal throughout 0.5 microns to 40nm technology. They are widely found in mainstream consumer electronic products, such as smart phones and tablet PCs. Due to the increasing demand for hand-held smart devices, the growth in wafer production is expected to remain steady.

The sale of eMemory wafer has enjoyed double-digit growth for several years in a row. In 2012 alone, it saw growth in excess of 36% with over 1.5 million in wafer sales–a new company record. The significant increase in growth has been driven primarily by developments in its popular application areas such as power management ICs, display driver ICs and MEMS sensors. This momentum in growth in wafer production is expected to be accelerated with its additional applications in Full HD Display Driver ICs (DDI), Touch-Panel Controller ICs (TPC) and 2.4GHz RFICs this coming year. In the near future, eMemory will enter more innovative areas of applications, including Battery Gauge ICs, Near-Field Communication (NFC) ICs, CMOS-Image Sensor (CIS) ICs, single-chip Touch Display Driver Integration (TDDI) ICs and Programmable-Gamma (P-Gamma) ICs. This effort will further energize the momentum in growth, with further increased efficiency in broadening the application of SIP platform.

"2012 has been a great year for eMemory’s SIP products,” eMemory President Rich Shen pointed out. “Not only did we break wafer production records, but also we saw more than 37% growth in income from our royalty over the previous year. These achievements are the result of eMemory’s long-term dedication to eNVM SIPs and technical development, as well as our mastery of our SIP production lines and process platforms. Our outstanding sales record is a true testimony of the high level of confidence and support we have received from the clients."

eMemory’s NeoBit OTP technology in 55nm has entered into the pilot-production phase, while other OTP and MTP solutions in advanced modes such as 40nm, 28nm and 20nm are currently in the development and verification phase. eMemory offers diversified SIP production lines to meet with the product needs for having different endurance and density. eMemory’s superior technology and SIPs help customers effectively to reduce the time and costs incurred in developing products, making it the best choice for customers in looking for a partner in eNVM.

Researchers at the National Institute of Standards and Technology (NIST) have demonstrated a solid-state refrigerator that uses quantum physics in micro- and nanostructures to cool a much larger object to extremely low temperatures.

quantum solid state refrigerator from NISTNIST’s prototype solid-state refrigerator uses quantum physics in the square chip mounted on the green circuit board to cool the much larger copper platform (in the middle of the photo) below standard cryogenic temperatures. Other objects can also be attached to the platform for cooling.

What’s more, the prototype NIST refrigerator, which measures a few inches in outer dimensions, enables researchers to place any suitable object in the cooling zone and later remove and replace it, similar to an all-purpose kitchen refrigerator. The cooling power is the equivalent of a window-mounted air conditioner cooling a building the size of the Lincoln Memorial in Washington, D.C.

"It’s one of the most flabbergasting results I’ve seen," project leader Joel Ullom said. "We used quantum mechanics in a nanostructure to cool a block of copper. The copper is about a million times heavier than the refrigerating elements. This is a rare example of a nano- or microelectromechanical machine that can manipulate the macroscopic world."

The technology may offer a compact, convenient means of chilling advanced sensors below standard cryogenic temperatures—300 milliKelvin (mK), typically achieved by use of liquid helium—to enhance their performance in quantum information systems, telescope cameras, and searches for mysterious dark matter and dark energy.

As described in Applied Physics Letters, the NIST refrigerator’s cooling elements, consisting of 48 tiny sandwiches of specific materials, chilled a plate of copper, 2.5 centimeters on a side and 3 millimeters thick, from 290 mK to 256 mK. The cooling process took about 18 hours. NIST researchers expect that minor improvements will enable faster and further cooling to about 100 mK.

The cooling elements are sandwiches of a normal metal, a 1-nanometer-thick insulating layer, and a superconducting metal. When a voltage is applied, the hottest electrons "tunnel" from the normal metal through the insulator to the superconductor. The temperature in the normal metal drops dramatically and drains electronic and vibrational energy from the object being cooled.

NIST researchers previously demonstrated this basic cooling method, but are now able to cool larger objects that can be easily attached and removed. Researchers developed a micromachining process to attach the cooling elements to the copper plate, which is designed to be a stage on which other objects can be attached and cooled. Additional advances include better thermal isolation of the stage, which is suspended by strong, cold-tolerant cords.

Cooling to temperatures below 300 mK currently requires complex, large and costly apparatus. NIST researchers want to build simple, compact alternatives to make it easier to cool NIST’s advanced sensors. Researchers plan to boost the cooling power of the prototype refrigerator by adding more and higher-efficiency superconducting junctions and building a more rigid support structure.

This work is supported by the National Aeronautics and Space Administration.

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase. The SEMI World Fab Forecast also reveals that in 2013 increases for fab equipment spending will vary by technology node and that fab construction spending will increase an overall 6.7% with major spending in China. The report tracks equipment spending at over 180 facilities in 2013. 

More than 262 updates have been made since the last publication of the SEMI World Fab Forecast. Updates are based on announced spending plans, including major changes for TSMC, Samsung, Intel, SK Hynix, Globalfoundries, UMC, and for some Japanese facilities and LED facilities.  Despite these adjustments, the overall forecast for equipment spending for 2013 has remained about the same. Depending on macro-economic risk factors, possible scenarios project a range of -3% to +3% change rate for fab equipment spending in 2013; in other words, hovering around flat.

Though the overall outlook has improved some, fewer players in the market can afford the rising costs for research and development and upgrading facilities as the amount of money needed to upgrade facilities at the leading edge technologies is immense.  The World Fab Forecast report shows increases for fab equipment spending, varying by technology node.  Fab equipment spending for 17nm and below is expected to kick off in 2013 and increase by a factor of 2.4 to about $25 billion from 2013 to 2014.

Fab construction spending is now expected to increase 6.7% with construction spending to reach almost $6 billion. In 2014, however, construction project spending is expected to contract by about 18%. Construction spending is led by TSMC, with seven different projects for the year; followed by Intel. Fab construction spending in China will increase by a factor of four due to Samsung’s Mega fab in Xian.

Capacity is now forecasted to expand by just 2.8% for this year and to improve to 5.4% growth in 2014.  Excluding 2009, the years 2012 and 2013 show the lowest growth rate for new capacity over the past ten years.   However, pent-up demand is expected for some product types because capacity additions have been cut to minimum levels while chip demand keeps increasing. Capacity additions and equipment spending are expected to pick up in the second half of 2013. In 2014, at least 5% in new capacity will be added and fab equipment spending will increase by 2%. The World Fab Forecast gives detailed capacity information by industry segment and by individual company and fab.

Since the last fab database publication at the end November 2012 SEMI’s worldwide dedicated analysis team has made 262 updates to more than 210 facilities (including Opto/LED fabs) in the database. The latest edition of the World Fab Forecast lists 1,146 facilities (including 310 Opto/LED facilities), with 58 facilities starting production this year and in the near future.

The SEMI World Fab Forecast uses a bottom-up approach methodology, providing high-level summaries and graphs; and in-depth analyses of capital expenditures, capacities, technology and products by fab. Additionally, the database provides forecasts for the next 18 months by quarter. These tools are invaluable for understanding how the semiconductor manufacturing will look in 2013 and 2014, and learning more about capex for construction projects, fab equipping, technology levels, and products.

SEMI’s Worldwide Semiconductor Equipment Market Subscription (WWSEMS) data tracks only new equipment for fabs and test and assembly and packaging houses.  The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment.

PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, highly effective way to integrate complex motion sensors on mobile devices. The Sentral sensor fusion hub is the first hub designed specifically to manage sensor outputs on a low-power integrated circuit, making 9-axis motion sensing outputs both super-precise and practical to implement. Carrying top-of-the-line sensor fusion algorithms on an extremely low-power integrated circuit, Sentral eliminates the need for complex sensor configurations, calibrations and algorithm development. Further, it dramatically reduces power usage, offloading sensor fusion work from less efficient host CPUs or sensor CPUs onto an ultra-low-power IC tailor-made for sensor optimization.

This is welcome news for mobile device manufacturers, as Sentral makes the integration of 9-axis sensor systems faster and easier, and at the same time, improves the quality, reliability and utility of output from the accelerometers, gyroscope and geomagnetic sensors. Compatible with Android and Windows 8-based mobile products, Sentral delivers the most accurate (2º of heading accuracy), real-time motion-related data available.

Further, because it is designed and built specifically to meet the power needs of the mobile market, the Sentral IC is ultra-low-power and consumes less than 10% of the power used by other CPUs performing the task of sensor fusion. It maximizes battery life even for applications that need constant processing of sensor data.

Sentral makes sensor implementation more practical as well. It can support a wide variety of gyros, accels and magnetic sensors from multiple and changing vendors. This allows for separate placement of the sensors, and manufacturers are not tied to a single source or sensor type. Because it uses a mere 800mAmps of power in normal operation, it frees up valuable CPU power and battery life, and with a mere 1.6×1.6×0.5mm footprint, it takes up virtually no space.

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Toshiba Corporation today announced that it has developed an intelligent vital signs sensor module: Smart healthcare Intelligent Monitor Engine and Ecosystem with Silmee, that simultaneously senses information on key vital signs, Electric Cardio Gram, pulse, body temperature and movements, and that can deliver the data to smartphones and tablet PCs with wireless technology. Toshiba has fabricated a prototype of the sensor module that is small enough to wear, and will present and demonstrate it at the International Symposium on Medical ICT 2013, to be held at Meiji University, Tokyo, Japan on March 7.

Current healthcare cloud and services make use of already developed individual healthcare devices, such as sphygmomanometers or clinical thermometers. Such services face major challenges in achieving market penetration because the equipment is too big and handling a number of pieces of equipment it too complex.

The recently developed Silmee includes a Pseudo-SoC analog front end, a 32bit ARM processor chip and a dual mode Bluetooth bare chip in a 14.5mm x 14.5mm small package. Simply adding a few devices to the module, such as an antenna, battery and sensor heads, achieves a completely wearable vital signs sensor system. Among the chips included in the module, the flexible and compact Pseudo-SoC analog front end is a very effective approach to implementing vital signs sensors, and extends recent rapid progress in vital sign sensor technologies.

Toshiba will demonstrate a very compact prototype implementation of Silmee: a 25mm x 60mm and 10 gram patch-type able to monitor all vital signs. Toshiba will contribute to the promotion of smart personal healthcare services by deploying the module and prototype terminal in a wide variety of smart healthcare service development and field trials.

Toshiba is a diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems.