Category Archives: MEMS

July 23, 2012 – PRNewswire — Goodrich Corporation (NYSE:GR) added 46,00sq.ft. to its high-tech manufacturing facility in Burnsville, MN, with advanced production, design and development areas for micro electro mechanical systems (MEMS).

The facility is home to about 1,275 employees, part of Goodrich’s Sensors and Integrated Systems business, which employs approximately 4,200 people worldwide.

At the expanded Burnsville facility’s ribbon cutting ceremony, Goodrich chairman, president and chief executive officer Marshall Larsen joined Minnesota Gov. Mark Dayton, U.S. Senator Amy Klobuchar, City of Burnsville Mayor Elizabeth Kautz, and other officials, marking the opening with a facility tour. Also attending the ceremony were Commissioner of the Minnesota Department of Employment and Economic Development (DEED) Mark Phillips, Minnesota Senator Dan Hall, Minnesota Representative Pam Myhra, Minnesota Speaker of the House Kurt Zellers and a bi-partisan delegation of other legislators. Approximately 180 Goodrich employees joined as well.

The MEMS sensors produced at Burnsville will be used in the company’s commercial and military aerospace sensor-based products and systems. The 300,000sq.ft. campus hosts manufacturing and office space, and is also home to a new icing wind tunnel for advanced aerospace product development and testing. Primary products produced at the facility include advanced air data systems, cockpit data management systems, and various sensors and sensor-based products for commercial and military aerospace applications.

Goodrich Corporation is a global supplier of systems and services to the aerospace and defense industries. For more information, visit http://www.goodrich.com.

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July 20, 2012 — Aerotech’s Sensor Fusion is a 3U data acquisition device integrated with the company’s Automation 3200 (A3200) motion controller to provide precise time alignment of motion and data acquisition functions. Integrating the data acquisition into the motion control platform keeps costs lower, with quick and easy configuration and setup for shorter development time, according to Aerotech.

Also read: You make MEMS. Should you make sensor fusion software?

Sensor Fusion accepts up to four SF cards. Data collection is synchronized across all cards so there is never a need to align data after collection. Data collection, configuration, and analysis are done using the A3200’s extensive set of software tools, so there is no additional software required.

SF cards are available for digital input and output, analog input and output, encoder input, and PSO output. Each card can be used in the Sensor Fusion, in any configuration. Both high-power digital output cards and high-resolution analog output cards are offered. With no parameters to manage and no difficult setup to go through, switching cards from one system to another is easy. Breakout blocks make accessing each of the inputs and outputs simple, while the use of standard D-connectors on each card allows users to make their cables from common parts.

Setup, data recording, and data playback can be done through .NET, C, LabVIEW, MATLAB, or Aerotech’s own AeroBasic programming language. All inputs and outputs can be managed graphically through our I/O Manager utility that is part of the Motion Composer in the A3200 software suite. By managing data acquisition directly from the same library or interface used to program motion control, there is less time spent managing separate environments. Once data is collected it can be graphed in the Digital Scope or exported to other data manipulation packages. Sensor Fusion connects to the A3200 Motion Network via Firewire and can be run with or without any A3200 motion control devices.

Sensor Fusion has all of the position synchronized output (PSO) functionality from our standard motion controller product lines. Single, double, and triple PSO are available. Coupling data playback with Aerotech’s traditional PSO functionality allows users to control up to 96 digital outputs or 48 analog outputs for precision control of multiple devices from one positioning system.

Sensor Fusion is available in three different mounting configurations – desktop, rack mount and panel mount. The desktop version is standard and comes with integrated side handles and non-skid feet. The rack-mount version is designed for any standard 3U rack. Both the rack- and panel-mount relocate the power input to the proper side of the machine for the configuration. These flexible configurations allow you to easily move Sensor Fusion from one system to the next or fix permanently in a console or system weldment.

Learn more at www.aerotech.com.

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July 20, 2012 — Micro electro mechanical systems (MEMS) must be characterized during device development. Polytec asserts that advanced optical measurement techniques are necessary for characterization, as electrical tests can check functionality, but not all physical properties.

Polytec has released a white paper on the topic: “Optical Measurement Techniques for Dynamic Characterization of MEMS Devices.” It details the state-of-the-art optical measurement capabilities available for full field dynamic response and surface topography measurements of MEMS devices.

One capability that Polytec offers, laser Doppler vibrometry, enables real-time dynamic response measurements with resolution down to the picometer level and frequency bandwidth to 24MHz. The white paper details characterization studies that exemplify use of this technology for micro mirror array, pressure sensor, cantilever beam and accelerometer MEMS designs.
Download the full paper at: http://www.polytec.com/int/applications/micro-nano-technology/

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July 19, 2012 — Sensor Platforms Inc.’s FreeMotion library of software algorithms and middleware for sensor fusion now supports all major mobile microprocessors. The library supports all sensors used in smartphones and tablets, and Sensor Platforms asserts that supporting the mobile microprocessors “allows mobile device designers and application developers to improve product performance and reduce platform fragmentation, while providing sourcing independence, maintaining sensor calibration, and optimizing power consumption to prolong battery life.”

“Delivering platform software means, in part, that we consider the variations not only in sensor components, but the design skews in our customers’ portfolios, the variations in their manufacturing process, and the diverse user environments that can impact overall performance,” said Ian Chen, EVP, Sensor Platforms.

Supported microprocessors include:

32-bit embedded processors such as ARM’s Cortex-M, Atmel’s AVR and Freescale’s ColdFire families used as sensor hubs; and 64-bit application processors such as Intel’s Atom, nVidia’s Tegra, Qualcomm’s Snapdragon, and TI’s OMAP processors used in smartphones and tablets.

Supported sensors include:

Accelerometers, magnetometers, gyroscopes and barometers from Aichi Steel, AKM, Bosch, Freescale, Honeywell, InvenSense, Kionix, MEMSIC, ST Microelectronics and Yamaha.

Sensor Platforms’ library uses the same code base whether it is implemented as a software module running on an application processor, or as firmware embedded in a sensor hub, to help minimize OEMs’ verification and support efforts across their product offerings, which often include different hardware architectures.

The FreeMotion library provides the sophisticated intelligence needed to combine and process data from various sensors and microprocessors — sensor fusion — installed in smartphones and tablets, in order to interpret the users’ movements and situations, and infer their intents. The library brings sensor fusion across the entire suite of alternative sensors and microprocessors on the market, enabling second sourcing for designs. With reliable sampling and ongoing cross-calibration and magnetic anomaly mitigation, the FreeMotion library maintains sensor calibration. Its proprietary algorithms help optimize battery life by providing an automatic gyroscope throttle and other controls.

Sensor Platforms licenses algorithmic software and platforms that enable mobile consumer applications to better serve the users. Learn more at www.sensorplatforms.com.

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July 18, 2012 — Purdue University researchers have demonstrated self-calibrating micro electro mechanical systems (MEMS), which enable higher accuracy for existing and new MEMS applications.

“Each MEMS device is slightly different due to variations that occur in manufacturing,” said Jason Vaughn Clark, an assistant professor of electrical and computer engineering and mechanical engineering at Purdue University, explaining the value of self calibration. Microstructure geometry, stiffness, and mass all influence performance, and can vary MEMS device to MEMS device. Conventional MEMS test methods are impractical and expensive, with unknown accuracy and large uncertainty, Clark added.

Clark developed the self-calibration theory, then demonstrated the device alongside doctoral student Fengyuan Li, validating the thesis.

Figure. A self-calibratable MEMS. SOURCE: Purdue University Birck Nanotechnology Center image/Jason Vaughn Clark.

The self-calibrating technology makes it possible to accurately measure displacement on a scale of micrometers to less than a nanometer. “Quantities like velocity, acceleration, force, stiffness, frequency, and mass can be related to displacement,” said Clark.

The heart of the self-calibrating MEMS are two gaps of differing size, electrostatic sensors and comb drives with meshing fingers drawn toward each other when a voltage is applied, and returned to their original position when the voltage is turned off. The comb drives measure the change in capacitance while gauging the distances of the two gaps built into the device. The fine measurements reveal the difference between the device’s designed layout and the actual dimensions.

"Once you learn the difference between layout and fabrication, you have calibrated the device," Clark said. "Many MEMS designs with comb drives can be easily modified to implement our technology."

The new self-calibratable MEMS could eliminate or reduce the need for rigorous factory calibration on high-accuracy MEMS for navigation or other applications,  Clark said, estimating up to 30% of manufacturing costs relate to calibration.

The self-calibratable MEMS could lead to high-performance data storage technologies and advanced lithography to create next generation computer circuits and nanodevices. “A $15 chip that can fit on your fingertip…is able to measure MEMS displacements better than a $500,000 electron microscope,” as a result of self-calibration, Clark noted.

Researchers will use the new self-calibration approach to improve the accuracy of atomic force microscopes (AFMs), calibrating AFM displacement, stiffness, and force.

The group also will use a calibrated MEMS to measure the difference in gravity between different heights above the ground. The ability to measure gravity with such sensitivity could be used as a new tool for detecting underground petroleum deposits. "Conventional gravity meters can cost over $200,000," Clark said. "They consist of a large vacuum tube and a mirrored mass. Gravitational acceleration is determined by measuring the drop time of the mass in free fall. Since oil or mineral deposits have a different density than surrounding material, the local gravity is slightly different." Other applications abound.

The self-calibratable technology also could allow MEMS to recalibrate themselves after being exposed to harsh temperature changes or remaining dormant for long periods.

The work is based at the Birck Nanotechnology Center in Purdue’s Discovery Park. The research is funded by the National Science Foundation.

Findings are detailed in a paper to appear later this year in the IEEE Journal of Microelectromechanical Systems (JMEMS), “Self-Calibration for MEMS with Comb Drives: Measurement of Gap,” Fengyuan Li and Jason Vaughn Clark, Purdue University, Discovery Park, Birck Nanotechnology Center.

Abstract:

We present a practical method for measuring planar gaps of MEMS with comb drives by on-chip or off-chip electrical probing. We show that our method is practical, accurate, precise, and repeatable. The option of on-chip, postpackaged electrical measurement enables MEMS to be autonomously self-calibratable. We use the measurement of gap to determine the geometrical difference between layout and fabrication, which can lead to measurements of other properties such as displacement, force, stiffness, mass, etc. Our method consists of applying enough voltage to close two unequal gaps and measuring the resulting changes in capacitances. Many MEMS designs with comb drives can be easily modified to implement our technology. Our results are an order better than convention, and suggest means for further improvement.

Courtesy of Emil Venere and Jason Vaughn Clark at Purdue.

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July 17, 2012 – BUSINESS WIRE — Spirent Communications, which develops ways to test positioning, navigation and communications technologies, launched its new SimSENSOR sensor simulation software for micro electro mechanical systems (MEMS). The software enables R&D technicians to test sensor fusion algorithms in navigation systems that include MEMS inertial sensors and multi-GNSS.

The product supports test on algorithms with inputs from various sensors, including accelerometers, gyroscope, magnetometer, digital compass and barometric height sensors. SimSENSOR works in tandem with Spirent’s multi-GNSS constellation simulators by simulating MEMS sensor outputs on a common trajectory with the simulated GNSS signals. Trajectories made by representative human motion gestures, such as arm movements, are included with SimSENSOR. Representative MEMS noise models and errors such as bias and drift are also included and are available under user control.

Sensor fusion is increasingly used to enable new applications, such as indoor positioning, said Rahul Gupta, product manager with Spirent’s Positioning Technology business. SimSENSOR enables accelerated, lab-based R&D for sensor fusion development. Sensor fusion and device test was one of the topics of concern in the International Technology Roadmap for Semiconductors (ITRS) 2012 update at SEMICON West last week.

Spirent has extensive experience of test systems for blended GPS-inertial technology. In 2007, Spirent launched SimINERTIAL to test inertial navigation systems involving high grade GPS/inertial units suitable for military applications. SimSENSOR benefits from the experience gained by Spirent, in particular in relation to ensuring coherency and stability between GNSS and simulated sensor output streams.

Spirent Communications plc. (LSE:SPT) is a global leader in test & measurement used to test data centers, cloud computing and virtualized environments, high speed Ethernet networks and services, 3G/4G wireless networks and devices, network and application security, and positioning technologies. For more information, visit http://www.spirent.com.

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July 16, 2012 — Since the early 19th century, quartz crystals have been the core frequency reference for oscillators. However, due to the manufacturing complexity and reliability challenges posed by crystal oscillators, a great deal of work is going on in the industry and academia to find alternate frequency reference solutions. To overcome the known technical challenges for quartz crystals, including limitations on higher native frequencies, activity dips, aging, vibration sensitivity, etc., IDT recently introduced piezoelectric micro electro mechanical system (pMEMS) resonator-based oscillators. pMEMS resonators have a higher native frequency (~100 MHz) than quartz crystals and enable better-performing MEMS oscillators (sub-ps jitter), especially for high-performance communications, consumer, cloud, and industrial applications.

As part of higher reliability over quartz, MEMS oscillators demonstrate semiconductor-grade shock and vibration resistance. Standard quartz devices are fragile, since the crystal is housed within a metal or a ceramic package, allowing the crystal to be fractured by a shock of 50-100g. Manufacturers have to implement specific storage, packing, and shipping protocol for crystal devices to avoid damage. MEMS oscillators, on the other hand, sport a 50,000g shock resistance without special construction, packaging, and transportation techniques.

Figure 1. Wafer level packaged pMEMS die stacked on an IC Die in a plastic QFN package.
Figure 2. A typical quartz oscillator in a ceramic package.

Since the MEMS resonators are wafer-level packaged, these oscillators can use low-cost plastic packages, which provide an economical yet reliable timing component.

Another known issue for crystal oscillators — activity dips — can cause intermittent failures. These failures affect both the frequency and the resistance (i.e., the Q) of crystal resonators. Activity dips are usually caused by interfering modes (e.g., by high overtone flexure modes) and are strongly influenced by the crystal’s drive level and load reactance. These activity dips are not present with MEMS oscillators since the resonators are designed to suppress undesired modes over these temperature and process variations that can impair crystal-based oscillators.

pMEMS oscillators have also demonstrated aging comparable with crystal oscillators at room temperature (25°C) and significantly better aging than crystal oscillators under burn-in conditions (125°C).

Other advantages of MEMS-based products include natural compatibility with surface-mount assembly processes and short lead times; this enables suppliers and users (electronic manufacturers) to maintain a smaller device inventory with reduced risk of supply shortages.

IDT’s MEMS oscillators support low-voltage differential signaling (LVDS) and low-voltage positive emitter-coupled logic (LVPECL) outputs at frequencies of up to 625MHz, which is required in most communications, networking and high-performance computing applications.

Conclusion

There have been a lot of improvements in MEMS oscillators over the years, and the recent upgraded products, like IDT’s 4M MEMS oscillators, are ready to provide the performance and accuracy required in the high-performance communications, consumer, cloud computing, and industrial applications. In the foreseeable future, researchers, designers, and manufacturers will continue to work together to enhance the MEMS oscillators to deliver more accurate, cost-effective, and higher performance frequency reference products.

Harmeet Bhugra, managing director, Integrated Device Technology Inc., is responsible for the vision, growth and general management of the MEMS business. Bhugra holds a Bachelor of Engineering degree from University of Victoria, Canada, Masters in Systems Engineering and MBA degrees (Magna Cum Laude) from San Jose State University and Managing Technical Organization certifications from MIT.

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July 16, 2012 — Energy harvesting has great potential to power remote devices, portable electronics, or any system that is difficult to keep powered or replace batteries. Making use of ambient energy would enable virtually unlimited operation of an electronic device. The energy harvester is either the primary power source or it is used for extending battery life.

Solar, thermal, wind, kinetic, and electromagnetic energy sources can be exploited by energy harvesters. Energy harvesters have have been used for years in military and industrial applications and in remote monitoring for oil and gas industry. Now, micro electro mechanical systems (MEMS) are beginning to enable better energy harvesting products, says Semico.

Low-volume MEMS-based energy harvesters are currently available. The price for a MEMS-based technology is still too high for most large-volume applications. If energy harvesting can be scaled down to the MEMS form factor, it would not only add to the existing energy harvester sector, but open new applications in wearable electronics, personal medical devices, consumer electronics, smartphones and automotive, says Semico. While the market for MEMS-based systems is very small now, Semico sees high growth potential.

Also read: Energy-harvesting MEMS win additional NYSERDA funding

and NPL focuses on characterization of MEMS energy harvesting devices

Semico’s report, "MEMS Energy Harvesting: An Early Growing Season," examines the key players in MEMS energy harvesting, the current performance capabilities of these products, key applications that can drive the growth of MEMS energy harvesting, ways to spur growth, and the size of the MEMS energy harvester market by 2020.

Semico is a semiconductor marketing & consulting research company. Access reports and learn more at www.semico.com.

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July 16, 2012 – BUSINESS WIRE — Kionix Inc., maker of micro electro mechanica system (MEMS) accelerometers, added Paul Bryan as EVP of product management and strategy, reporting to president and CEO Greg Galvin.

Bryan was previously an executive at Microsoft, most recently leading the team responsible for Windows Phone marketing to business customers. Previously, he led product management for the Microsoft Forefront Security product line, and held senior roles in business strategy for the Office team and Worldwide Licensing and Pricing. Prior to Microsoft, Paul was a management consultant with Andersen Strategic Services. Paul holds an MBA from the Wharton Business School and a BS in Engineering from RIT, where he graduated Summa Cum Laude.

Kionix also promoted Drake Margiotta to the position of VP of sales in North America, reporting to Kenny Salky, EVP of sales and marketing. Drake joined Kionix in 2011, bringing over twenty years of experience selling cutting-edge technology products and sales management to the company. Today he leads the company’s North American sales efforts, and manages Kionix’s Silicon Valley office.

Prior to Kionix, Drake was a senior sales executive at InvenSense. Before InvenSense, Drake worked at Marvell Semiconductor, where he was responsible for business development, strategic sales, and marketing initiatives for their Tier 1 OEM customers. He has a BS in Electrical Engineering from Purdue University.

Kionix, Inc., located in Ithaca, New York, USA, is a wholly owned subsidiary of ROHM Co., Ltd. of Japan. Consumer electronics leaders worldwide utilize Kionix’s products, development tools and application support to enable motion-based gaming, user-interface functionality in mobile handsets, personal navigation and TV remote controllers, and hard-disk-drive drop protection in mobile products. Kionix’s MEMS products are further diversified into the automotive, industrial and healthcare sectors. Kionix offers one of the industry’s broadest families of MEMS devices that incorporates 3-axis accelerometers and gyroscopes along with the mixed-signal-interface integrated circuits. Kionix is ISO9001:2008 and TS16949 certified. For more information on Kionix, visit: http://www.kionix.com.

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July 16, 2012 — Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing micro electro mechanical systems (MEMS), high-brightness light-emitting diodes (HB-LED), semiconductors, and other applications.

Deposition rate for high-quality SiO2 and SiNx improved with changes to the plasma-enhanced chemical vapor deposition (PECVD) hardware, which also reduces cleaning overhead. The latest generation of Cobra ICP source improves etch rate and feature control capability.

The tool’s robotic handler optimizes processes. Combined with the system’s control and software interface, this improves diagnostics, reliability and serviceability, the company reports.

The PlasmaPro 100 is configurable with process chambers as stand-alone modules or clusters. Users can access over 6,000 process recipes through Oxford Instruments.

Oxford Instruments specializes in the design, manufacture and support of high-tech tools and systems for industry research. Learn more at www.oxford-instruments.com.

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